Circuit board structure capable of reducing heat production

Abstract

The utility model discloses a circuit board structure capable of reducing heat production, which comprises a circuit board body, a current concentration area is arranged on the circuit board body, the current concentration area is electrically connected with a conductive heat dissipation piece, and the conductive heat dissipation piece is used for reducing the current density of the current concentration area so as to reduce the heat production. According to the utility model, through the current dispersion and heat dissipation effects of the conductive heat dissipation member, the current density of the current concentration area is effectively reduced, so that the heat production amount of the area is significantly reduced, and the circuit board can be maintained to operate at a proper temperature. The reduction of the current density and heat production is beneficial to reducing the power loss and prolonging the service life of the element, and meanwhile, the risk of performance reduction or element damage caused by overheating is reduced, so that the performance and stability of the whole electronic equipment are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, more specifically, relate to a circuit board structure of reducing heat production. BACKGROUND

[0002] In today's rapidly changing electronic technology era, as the core component of electronic devices, printed circuit boards (PCB) are undergoing unprecedented changes. With the continuous improvement of intelligentization and portability demand, the miniaturization and high-density trend of printed circuit boards is becoming more and more prominent. This change not only promotes the development of electronic devices in a more compact and lightweight direction, but also greatly improves its integration and functional diversity. However, this trend has also brought many challenges to the design and production of printed circuit boards.

[0003] With the increasingly close layout of components on printed circuit boards, the current density has also increased significantly. High current density not only means higher power loss, but also brings more serious heat problems. In the limited printed circuit board space, the accumulation of a large amount of heat not only affects the stable operation of electronic devices, but also may accelerate the aging of components, and even directly lead to performance degradation or component damage.

[0004] Therefore, how to effectively solve the heat dissipation problem of printed circuit boards while maintaining the miniaturization and high-density of printed circuit boards has become a technical problem to be solved in the current electronic field. SUMMARY

[0005] In order to solve or alleviate the problem of heat dissipation difficulty of existing high-density circuit board, the utility model provides a circuit board structure of reducing heat production.

[0006] The technical scheme of the utility model is as follows:

[0007] A circuit board structure for reducing heat production, comprising a circuit board body, a current concentration area is provided on the circuit board body, and a conductive heat dissipation piece is electrically connected to the current concentration area, the conductive heat dissipation piece is used to reduce the current density of the current concentration area to reduce heat production.

[0008] The conductive heat dissipation piece and the circuit board body are welded together in the circuit board structure for reducing heat production.

[0009] Further, the welding surface of the conductive heat dissipation piece is provided with a welding plating layer.

[0010] Further, the welding plating layer is made of tin.

[0011] The conductive heat dissipation piece of the circuit board structure for reducing heat production is made of copper or copper alloy.

[0012] The edge of the conductive heat-dissipation piece is provided with a transition arc surface.

[0013] The overall thickness of the conductive heat-dissipation piece is uniform.

[0014] The conductive heat-dissipation piece comprises a main body, which is located between the circuit board body and the components.

[0015] Further, a gap is provided between the main body and the components.

[0016] The conductive heat-dissipation piece comprises an extension part, which extends to the component-free area of the circuit board body.

[0017] The utility model has the advantages that the current dispersion and heat dissipation of the conductive heat-dissipation piece effectively reduce the current density of the current concentration area, thereby significantly reducing the heat generation of the area, which helps to maintain the circuit board at a proper temperature. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description.

[0019] Figure 1 It is a top view of the utility model;

[0020] Figure 2 It is a bottom view of the utility model;

[0021] Figure 3 It is an exploded view of a partial structure of the utility model;

[0022] Figure 4 It is a sectional view of a partial structure of the utility model;

[0023] Figure 5 It is a structure view of a conductive heat-dissipation piece in the utility model.

[0024] Wherein, the figure each reference sign: 1, circuit board body;2, conductive heat sink;201, main body;202, extension;203, transition arc surface;3, component;4, gap. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects of the utility model to be solved more clearly, the utility model is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and not to limit the utility model.

[0026] It should be noted that when a component is referred to as "fixed" or "set" or "connected" to another component, it can be directly or indirectly located on the other component. The terms "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or position based on the orientation or position shown in the drawings, and are only for convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" and the like are only used for the purpose of convenience, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "multiple" is two or more, unless otherwise specifically limited. The meaning of "several" is one or more, unless otherwise specifically limited.

[0027] As Figures 1 to 3 shown, the utility model discloses a kind of line board structures of reducing heat production, including circuit board body 1, current concentration area is equipped on circuit board body 1, current concentration area is electrically connected with conductive heat sink 2, and conductive heat sink 2 is used to reduce current concentration area current density to reduce heat production.

[0028] On circuit board body 1, according to the need of circuit design, current concentration area is divided, and current concentration area is generally the area of device layout, these areas are usually the position of higher current density, larger heat output.In current concentration area, by welding or pressure bonding process, conductive heat sink 2 is electrically connected with conductive layer on circuit board body 1.Conductive heat sink 2 is made of material with high electrical conductivity and excellent heat conduction performance, such as copper alloy or special alloy.

[0029] When current passes through circuit board body 1, conductive heat sink 2 reduces the resistance of current concentration area, and reduces the current density of current concentration area.Meanwhile, due to the good heat conduction of conductive heat sink 2, heat generated can be quickly conducted to the external environment, realizing effective heat dissipation.

[0030] In this embodiment, the current dispersion and heat dissipation of the conductive heat dissipation member 2 effectively reduces the current density of the current concentration area, thereby reducing the heat generation of this area, which helps to maintain the circuit board body 1 at a suitable temperature. Reducing current density and heat generation helps to reduce power loss, prolong component life, and reduce the risk of performance degradation or component damage due to overheating, thereby improving the performance and stability of the entire electronic device. In addition, this structure makes the hardware designer more flexible in the design of the circuit board, allowing for the optimization of current distribution and heat dissipation through the rational arrangement of the conductive heat dissipation member 2 while maintaining miniaturization and high density.

[0031] In a preferred example, the conductive heat dissipation member 2 is welded to the circuit board body 1, and the circuit board body 1 is exposed to copper at the welding location.

[0032] The welding surface of the conductive heat dissipation member 2 is provided with a welding plating layer.

[0033] The material of the welding plating layer is tin.

[0034] On the welding surface of the conductive heat dissipation member 2, a layer of welding plating layer is formed by tin spraying, electroplating or chemical plating. In this example, the material of the welding plating layer is tin, because tin has good welding performance and conductivity. The tin spraying process uniformly deposits tiny tin particles on the welding surface by controlling parameters such as tin ion concentration, temperature and pH value in the plating solution, and using a special spraying device, forming a dense and uniform welding plating layer. The use of the tin spraying process allows the conductive heat dissipation member 2 to uniformly adhere to the welding plating layer. The conductive heat dissipation member 2 treated by the tin spraying process improves the welding performance of the welding surface. At this time, the conductive heat dissipation member 2 can be connected to the circuit board body 1 by processes such as wave soldering and reflow soldering.

[0035] In this embodiment, the welding plating layer improves the welding performance of the conductive heat dissipation member 2. During welding, the tin plating layer can quickly form a strong intermetallic compound with the copper or other metal layer on the circuit board body 1, ensuring reliable connection between the conductive heat dissipation member 2 and the circuit board body 1. At the same time, the welding plating layer also improves the heat dissipation efficiency. The tin plating layer has good thermal conductivity, which can quickly conduct the heat on the circuit board body 1 to the conductive heat dissipation member 2, thereby accelerating the dissipation of heat. In addition, this structure can ensure stable connection between the conductive heat dissipation member 2 and the circuit board body 1, reduce the risk of component failure due to poor welding, and help improve the stability and reliability of the entire electronic device.

[0036] In a preferred example, the material of the conductive heat dissipation member 2 is copper or copper alloy.

[0037] In this embodiment, copper and its alloys not only have excellent electrical conductivity, which can ensure efficient transmission of current and reduce heat generated due to resistance, but also have excellent thermal conductivity, which can quickly conduct the generated heat from the current concentration area to a wider area or directly to the external environment, thereby effectively reducing the overall temperature of the circuit board. In addition, copper and copper alloys have high strength and corrosion resistance, which can ensure the stability and reliability of the conductive heat dissipation piece 2 during long-term use.

[0038] As shown in Figure 5 , in a preferred example, the conductive heat dissipation piece 2 is provided with a transition arc surface 203 at the edge turning part.

[0039] The overall thickness of the conductive heat dissipation piece 2 is uniform.

[0040] In this embodiment, the provision of the transition arc surface 203 can reduce the concentration of current at the edge turning part of the conductive heat dissipation piece 2, thereby reducing heat generation in this area. At the same time, the uniformity of the overall thickness ensures that the heat conduction efficiency of the conductive heat dissipation piece 2 during heat dissipation remains consistent, avoiding local overheating due to uneven thickness.

[0041] As shown in Figures 3 to 5 , in a preferred example, the conductive heat dissipation piece 2 includes a main body 201, which is located between the circuit board body 1 and the component 3.

[0042] A gap 4 is provided between the main body 201 and the component 3.

[0043] Specifically, the conductive heat dissipation piece 2 is arranged between the magnetic core and the circuit board body, and the circuit board body is provided with a magnetic core and a conductive heat dissipation piece 2 on both sides, the magnetic cores on both sides are symmetrically arranged, and the conductive heat dissipation pieces 2 are also symmetrically arranged.

[0044] In this embodiment, the main body 201 of the conductive heat dissipation piece 2 is located between the circuit board body 1 and the component 3, making full use of limited space resources and improving space utilization. In addition, through the gap 4 provided between the main body 201 and the component 3, good air circulation is ensured. The conductive heat dissipation piece 2 absorbs and conducts heat from the current concentration area, exchanges heat with the outside through the gap 4, facilitates heat dissipation, ensures the overall heat dissipation performance of the circuit board, and ensures the stable operation of the electronic equipment. In addition, the gap 4 can prevent the conductive heat dissipation piece 2 from being in electrical contact with the component 3, preventing problems such as circuit short circuit, signal interference, or damage to the component 3.

[0045] As shown in Figure 5 , in a preferred example, the conductive heat dissipation piece 2 includes an extension 202, which extends to the device-free area of the circuit board body 1.

[0046] In the embodiment, the extension 202 is arranged to expand the heat dissipation area, so that the heat dissipation member can more effectively absorb and dissipate the heat from the circuit board body 1. In addition, the extension 202 is arranged in the device-free area, avoiding interference with other electronic elements, so that the overall layout of the electronic device is compact, and the heat dissipation performance is excellent.

[0047] In actual application, the shape and thickness of the conductive heat dissipation member 2 are set according to the specific structure of the circuit board body 1 and the heat dissipation requirement. If the heat dissipation requirement is high, a thicker conductive heat dissipation member 2 with a larger extension 202 is used.

[0048] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board structure for reducing heat generation, characterized in that, The circuit board includes a circuit board body, on which a current concentration area is provided. The current concentration area is electrically connected to a conductive heat sink, which is used to reduce the current density in the current concentration area to reduce heat generation.

2. The circuit board structure for reducing heat generation according to claim 1, characterized in that, The conductive heat sink is welded to the circuit board body.

3. A circuit board structure for reducing heat generation according to claim 2, characterized in that, The welding surface of the conductive heat sink is provided with a welding plating layer.

4. A circuit board structure for reducing heat generation according to claim 3, characterized in that, The welding coating material is tin.

5. A circuit board structure for reducing heat generation according to claim 1, characterized in that, The conductive heat sink is made of copper or a copper alloy.

6. A circuit board structure for reducing heat generation according to claim 1, characterized in that, The conductive heat sink has a transition arc surface at the edge turning point.

7. A circuit board structure for reducing heat generation according to claim 1, characterized in that, The conductive heat sink has a uniform thickness.

8. A circuit board structure for reducing heat generation according to claim 1, characterized in that, The conductive heat sink includes a main body, which is located between the circuit board body and the components.

9. A circuit board structure for reducing heat generation according to claim 8, characterized in that, A gap is provided between the main body and the components.

10. A circuit board structure for reducing heat generation according to claim 1, characterized in that, The conductive heat sink includes an extension that extends to a component-free area of ​​the circuit board body.

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