Power tube assembly and charger

Abstract

The utility model relates to a power tube assembly and a charger. The power tube assembly comprises a circuit board; the plurality of power tubes are arranged on the board surface of the circuit board; the support is provided with a plurality of partition plates, the partition plates divide the support into a plurality of containing spaces, the support is arranged on the board face of the circuit board, and the power tubes are located in the corresponding containing spaces respectively; the insulation sheet is arranged on the support and covers the opening positions of the multiple containing spaces, heat conduction layers are arranged on the two sides of the insulation sheet respectively, and the heat conduction layers are used for filling gaps in the two sides of the insulation sheet. According to the utility model, the technical problems of low integration level of the power tube on the circuit board, low installation efficiency of the power tube and poor heat dissipation effect are solved.

Description

Technical Field

[0001] This utility model relates to the field of power component heat dissipation technology, and in particular to a power transistor assembly and a charger. Background Technology

[0002] As a crucial component of new energy vehicles, the charger utilizes numerous MOSFET and IGBT semiconductor power transistors. These power transistors are soldered onto a printed circuit board, and the charging and discharging of the battery system is achieved by switching the circuitry on the printed circuit board.

[0003] During operation, the switching and conduction losses of the power transistor will cause it to generate heat, which needs to be dissipated to ensure the normal operation of the circuit. This is an important problem that needs to be solved in the design of chargers.

[0004] A traditional power transistor mounting and heat dissipation structure involves screwing the power transistor in the vehicle power supply directly through a hole in the transistor to press it firmly against the heat sink. However, due to the large number of power transistors used in vehicle power supplies and their dense arrangement, this method of installing them by directly inserting screws through holes in the transistors is labor-intensive and extremely inefficient. Furthermore, screws penetrating the transistors damage their integrity, affecting their insulation and withstand voltage performance, potentially causing transistor failure and resulting in verification malfunctions in the vehicle power supply.

[0005] Another traditional power transistor mounting and heat dissipation structure involves installing a cap on the power transistor in the vehicle power supply for insulation, pre-assembling the power transistor's retaining spring to the housing, and then assembling the power transistor upside down between the housing and the retaining spring. Finally, the retaining spring is tightened to press the power transistor firmly against the heat dissipation housing. However, this upside-down assembly method is not only difficult to install (because the assembly process is blind, it is hard to detect assembly abnormalities), but also carries the risk of the cap falling off, reducing product reliability. Furthermore, the pre-assembled retaining spring needs to be tightened after the printed circuit board (PCB) is assembled, requiring pre-drilled openings on the PCB for tightening, thus necessitating a larger PCB area and reducing power density.

[0006] There is currently no effective solution to the problems of low integration density of power transistors on circuit boards, low installation efficiency of power transistors, and poor heat dissipation in related technologies.

[0007] Therefore, this utility model proposes a power transistor assembly and a charger to overcome at least one of the above-mentioned technical problems. Utility Model Content

[0008] The purpose of this invention is to provide a power transistor assembly that integrates multiple power transistors into one power transistor assembly, thereby improving integration and installation efficiency.

[0009] Another objective of this invention is to provide a charger in which the power transistor assembly is arranged on the side wall of the casing, making full use of the height space of the charger, thereby reducing the size of the charger and increasing the power density.

[0010] The objective of this utility model can be achieved by the following solutions:

[0011] This utility model provides a power transistor assembly, the power transistor assembly comprising:

[0012] Circuit board;

[0013] Multiple power transistors are disposed on the surface of the circuit board;

[0014] A bracket having multiple partitions that divide the bracket into multiple accommodating spaces, the bracket being disposed on the surface of the circuit board, and multiple power transistors being respectively located within their respective accommodating spaces;

[0015] An insulating sheet is disposed on the bracket and covers the openings of the plurality of accommodating spaces. A heat-conducting layer is disposed on both sides of the insulating sheet, and the heat-conducting layer is used to fill the gaps on both sides of the insulating sheet.

[0016] In a preferred embodiment of the present invention, the thermal conductive layer includes a first thermal conductive layer, which is located between the insulating sheet and the plurality of power transistors, and the first thermal conductive layer is in contact with the outer wall of the plurality of power transistors so as to fill the gap between the insulating sheet and the plurality of power transistors through the first thermal conductive layer.

[0017] In a preferred embodiment of the present invention, the thermal conductive layer includes a second thermal conductive layer, which is located between the insulating sheet and the housing for mounting the power transistor assembly, and the second thermal conductive layer is in contact with the outer wall of the housing to fill the gap between the insulating sheet and the housing.

[0018] In a preferred embodiment of the present invention, the first thermally conductive layer and / or the second thermally conductive layer are thermally conductive silicone grease layers or thermally conductive gel layers.

[0019] In a preferred embodiment of the present invention, the circuit board has a plurality of positioning holes, and the bracket has a plurality of positioning protrusions that align and cooperate with the plurality of positioning holes, and the plurality of positioning protrusions are inserted into the corresponding positioning holes.

[0020] In a preferred embodiment of the present invention, the edge of the circuit board has a plurality of connection pins for connection to the main power circuit board;

[0021] And / or, the edge of the circuit board has multiple positioning feet for connection to the housing on which the power transistor assembly is mounted.

[0022] In a preferred embodiment of this utility model, the insulating sheet is a ceramic insulating sheet; and / or, the bracket is a plastic bracket.

[0023] This utility model provides a charger, the charger comprising:

[0024] At least one of the aforementioned power transistor components;

[0025] The housing has the power transistor assembly mounted on its side wall, and the interior of the housing has cooling channels for the flow of cooling medium.

[0026] The main power circuit board is disposed on the housing and connected to the circuit board in the power transistor assembly.

[0027] In a preferred embodiment of the present invention, the charger further includes a mounting spring, one end of which is fixed to the bottom wall of the housing, and the other end of which abuts against the side of the circuit board opposite to the power transistor, so that the power transistor assembly is tightly attached to the side wall of the housing.

[0028] In a preferred embodiment of the present invention, the mounting spring is fixed to the bottom wall of the housing by a first fastener.

[0029] In a preferred embodiment of the present invention, the housing is provided with a plurality of positioning protrusions, the positioning protrusions having mounting holes, and a plurality of positioning pins on the circuit board being inserted into the corresponding mounting holes.

[0030] In a preferred embodiment of the present invention, a positioning post is provided on the bottom wall of the housing, and a through hole is provided on the mounting spring. When the mounting spring is installed in place, the positioning post is located in the through hole.

[0031] In a preferred embodiment of the present invention, the power transistor assembly is fixed to the side wall of the housing by a second fastener, and the power transistor assembly is made to be tightly attached to the side wall of the housing.

[0032] Based on the above, the features and advantages of the power transistor assembly and charger of this utility model are:

[0033] Multiple power transistors are integrated and mounted on the surface of a circuit board, with a bracket on the board. The power transistors are located in multiple accommodating spaces formed by the bracket, thus separating the multiple power transistors. This achieves both integration of multiple power transistors and ensures the independence of each power transistor. During assembly, the integrated power transistors can be installed together on the housing, eliminating the need to screw each power transistor to the housing individually. This improves the installation efficiency of the power transistors and the production efficiency of the charger, while reducing production costs. Attached Figure Description

[0034] The following figures are intended only to illustrate and explain the present invention and do not limit the scope of the present invention. Wherein:

[0035] Figure 1 This is one of the exploded views of the power transistor assembly of this utility model;

[0036] Figure 2 This is the second exploded view of the power transistor assembly of this utility model;

[0037] Figure 3 This is a front view of the power transistor assembly of this utility model;

[0038] Figure 4 for Figure 3 Cross-sectional view at position AA;

[0039] Figure 5 for Figure 4 A magnified view of a portion of position B in the middle;

[0040] Figure 6 This is one of the schematic diagrams showing the installation position of the power transistor assembly of this utility model;

[0041] Figure 7 This is the second schematic diagram showing the installation position of the power transistor assembly of this utility model;

[0042] Figure 8 This is a front cross-sectional view of the mounting position of the power transistor assembly of this utility model;

[0043] Figure 9 This is the third schematic diagram showing the installation position of the power transistor assembly of this utility model.

[0044] The reference numerals in the accompanying drawings of this utility model are:

[0045] 1. Circuit board; 101. Positioning hole;

[0046] 102. Connecting pin; 103. Positioning pin;

[0047] 2. Power transistor; 3. Bracket;

[0048] 301. Partition; 302. Accommodation space;

[0049] 303. Positioning protrusions; 4. Insulating sheet;

[0050] 5. Thermally conductive layer; 501. First thermally conductive layer;

[0051] 502, Second thermal conductive layer; 10, Power transistor assembly;

[0052] 20. Housing; 2001. Cooling flow channel;

[0053] 2002, Positioning bump; 2003, Positioning pin;

[0054] 30. Install the spring clip; 40. First fastener;

[0055] 50. Second fastener; 60. Main power circuit board. Detailed Implementation

[0056] The technical solution of this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that these embodiments are only used to illustrate this utility model and are not intended to limit the scope of this utility model. After reading this utility model, any modifications of this utility model in various equivalent forms by those skilled in the art will fall within the scope defined by the appended claims.

[0057] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0059] Implementation Method 1

[0060] like Figures 1 to 9As shown, this utility model provides a power transistor assembly, which includes: a circuit board 1; multiple power transistors 2, which are surface-mounted to the surface of the circuit board 1; a bracket 3, which has multiple partitions 301 that divide the bracket 3 into multiple accommodating spaces 302, the positions of the multiple accommodating spaces 302 corresponding one-to-one with the positions of the multiple power transistors 2 on the circuit board 1; an insulating sheet 4, which is disposed on the bracket 3 and covers the openings of the multiple accommodating spaces 302 (the openings are the open areas on the side of the bracket 3 opposite to the circuit board 1 after the bracket 3 is connected to the surface of the circuit board 1, which can communicate with the accommodating spaces 302); and heat-conducting layers 5 are respectively provided on both sides of the insulating sheet 4 to fill the gaps on both sides of the insulating sheet 4.

[0061] In this invention, multiple power transistors 2 are integrated and disposed on the surface of a circuit board 1, and a bracket 3 is provided on the surface of the circuit board 1. The multiple power transistors 2 are respectively located in multiple accommodating spaces 302 formed on the bracket 3, thereby separating the multiple power transistors 2. This achieves both the integration of multiple power transistors 2 and ensures the independence of each power transistor 2. During the assembly process, the integrated multiple power transistors 2 can be installed together on the housing 20 of the charger, that is, the assembled power transistor assembly 10 is directly installed on the housing 20 of the charger, eliminating the need to screw and fix each power transistor 2 to the housing 20 separately. This improves the installation efficiency of the power transistors 2 and the production efficiency of the charger, and reduces production costs.

[0062] In one optional embodiment of this utility model, such as Figure 1 , Figure 2 , Figure 4 As shown, the circuit board 1 has multiple positioning holes 101, and the bracket 3 has multiple positioning protrusions 303 that align with the multiple positioning holes 101. By inserting the multiple positioning protrusions 303 into the corresponding positioning holes 101, the bracket 3 can be detachably installed on the surface of the circuit board 1. The positioning holes 101 and positioning protrusions 303 play a role in fixing and positioning the bracket 3.

[0063] Specifically, the bracket 3 may include a ring-shaped main frame and multiple partitions 301 located within the main frame. Different shapes and sizes of partitions 301 are arranged according to the distribution positions of the multiple power transistors 2 on the circuit board 1. The purpose is to create multiple accommodating spaces 302 within the ring-shaped main frame through the arrangement of the multiple partitions 301, with the positions of the multiple accommodating spaces 302 corresponding to the distribution positions of the multiple power transistors 2. After the bracket 3 is installed with the circuit board 1, the multiple power transistors 2 are precisely located within their respective accommodating spaces 302. Figure 1As shown, when the number of power tubes is four and they are arranged in two rows side by side, the bracket 3 can be set in a "field" shape, that is, the four accommodating spaces 302 are also distributed in a "field" shape, so as to meet the requirement that multiple accommodating spaces 302 cooperate with multiple power tubes 2 respectively. As Figure 2 shown, when the number of power tubes is four and they are arranged in a row, the bracket 3 can be set in a "one" shape, that is, the four accommodating spaces 302 are spaced apart in a length direction, so as to meet the requirement that multiple accommodating spaces 302 cooperate with multiple power tubes 2 respectively. Of course, it should be noted that in the present invention, the shape of the main frame, the number, shape, length, and specific setting position of the partition 301 are not limited, and the formed bracket 3 can separate multiple power tubes 2 preset on the circuit board 1.

[0064] In the present invention, the bracket 3 is a plastic bracket, that is, the bracket 3 is made of plastic. The plastic bracket can play a good role in insulation and heat transfer, improve the heat transfer and heat dissipation effects, and can avoid the occurrence of dangerous situations such as accidental electric shock to personnel.

[0065] In the present invention, the insulating sheet 4 is a ceramic insulating sheet, that is, the insulating sheet 4 is made of ceramic, and the ceramic insulating sheet plays a role in insulation and heat transfer. Among them, the shape and size of the ceramic insulating sheet can be set according to the shape and size of the bracket 3, as long as the ceramic insulating sheet can cover the opening positions of multiple accommodating spaces 302.

[0066] In an optional embodiment of the present invention, as Figure 1 、 Figure 2 、 Figure 4 、 Figure 5 shown, the heat-conducting layer 5 includes a first heat-conducting layer 501, the first heat-conducting layer 501 is located between the insulating sheet 4 and multiple power tubes 2, and the first heat-conducting layer 501 is in contact with the outer walls of multiple power tubes 2, so as to fill the gap between the insulating sheet 4 and multiple power tubes 2 through the first heat-conducting layer 501. Among them, the first heat-conducting layer 501 can be a heat-conducting silicone grease layer or a heat-conducting gel layer, that is, the first heat-conducting layer 501 is formed by heat-conducting silicone grease or heat-conducting gel to fill the gap between the insulating sheet 4 and multiple power tubes 2, and the insulating sheet 4 and multiple power tubes 2 can be fixed through the setting of heat-conducting silicone grease or heat-conducting gel.

[0067] In another optional embodiment of the present invention, as Figure 1 、 Figure 2 、 Figure 4 、and Figure 5As shown, the thermally conductive layer 5 further includes a second thermally conductive layer 502. The second thermally conductive layer 502 is located between the insulating sheet 4 and the housing 20 for mounting the power transistor assembly, and the second thermally conductive layer 502 is in contact with the outer wall of the housing 20, thereby filling the gap between the insulating sheet 4 and the housing 20. The second thermally conductive layer 502 can be a thermally conductive grease layer or a thermally conductive gel layer; that is, the second thermally conductive layer 502 is formed by thermally conductive grease or thermally conductive gel to fill the gap between the insulating sheet 4 and the housing 20.

[0068] With the power transistor assembly 10 installed in the housing 20, the cooperation of the first thermal conductive layer 501 and the second thermal conductive layer 502 can fill the microscopic gaps between the power transistor 2, the insulating sheet 4 and the housing 20, thereby ensuring the stability of heat transfer and improving the heat dissipation capacity of the power transistor 2.

[0069] In one optional embodiment of this utility model, such as Figures 1 to 3 As shown, the top edge of the circuit board 1 has multiple connection pins 102, which can be used to connect the circuit board 1 to the main power circuit board 60 of the charger during assembly. Additionally, the bottom edge of the circuit board 1 has multiple positioning feet 103 for connecting to the housing 20 where the power transistor assembly 10 is mounted. These positioning feet 103 connect the circuit board 1 to the housing 20 of the charger, thus positioning and fixing the power transistor assembly 10.

[0070] The circuit board 1 in this invention is an FR-4 substrate. By using an FR-4 substrate instead of the aluminum substrate commonly used in the prior art, the advantages of multilayer printed circuit boards can be fully utilized to rationally arrange multiple power transistors 2 and corresponding control circuits, thereby saving space. The insulation of the FR-4 substrate can meet the insulation requirements between external structural components and power transistor assembly 10. Moreover, by connecting pins 102, the connector between the power circuit board 60 and the main power circuit board 60 can be saved, reducing costs and facilitating installation.

[0071] In this invention, the internal wiring of the circuit board 1 can be used to connect and combine multiple power transistors 2. After combining, the multiple power transistors 2 are soldered to the circuit board 1 through PIN plugs, which reduces the number of solder points on the circuit board 1 and is beneficial to the wiring design on the circuit board 1. In addition, the FR-4 substrate can be used for internal wiring and can play a role in electromagnetic shielding.

[0072] The features and advantages of this utility model's power transistor assembly are:

[0073] This power transistor assembly integrates multiple power transistors 2. During the assembly process, the integrated power transistors 2 can be installed together on the charger housing 20. That is, the assembled power transistor assembly 10 is directly installed on the charger housing 20, eliminating the need to screw each power transistor 2 onto the housing 20 separately. This improves the installation efficiency of the power transistors 2 and the production efficiency of the charger, while reducing production costs.

[0074] Implementation Method 2

[0075] like Figures 6 to 9 As shown, the present invention provides a charger, which includes: at least one of the above-mentioned power transistor assembly 10; a housing 20, wherein the power transistor assembly 10 is mounted on the side wall of the housing 20, and a cooling channel 2001 for supplying cooling medium is formed inside the housing 20; and a main power circuit board 60, which is disposed on the housing 20 and connected to the circuit board 1 in the power transistor assembly 10.

[0076] The charger of this utility model has the power tube assembly 10 vertically arranged on the side wall of the housing 20, making full use of the height space of the charger to arrange the power tube 2, thereby reducing the size of the charger and increasing the power density.

[0077] In this utility model, two installation methods can be used to fix the power tube assembly 10 to the side wall of the housing 20.

[0078] The installation method of power transistor assembly 10 is as follows: Figure 6 and Figure 8 As shown, the charger also includes a mounting spring 30. The bottom end of the mounting spring 30 is fixed to the bottom wall of the housing 20. The top end of the mounting spring 30 is bent relative to its bottom end and abuts against the side of the circuit board 1 opposite to the power transistor 2. This presses the power transistor assembly 10 tightly against the side wall of the housing 20, ensuring that the second heat-conducting layer 502 in the power transistor assembly 10 is fully attached to the side wall of the housing 20, thereby fixing the power transistor assembly 10. Through the full contact between the power transistor assembly 10 and the side wall of the housing 20, and the internal cooling channel 2001 of the housing 20, the heat generated by the power transistor 2 can be transferred through the side wall of the housing 20 to the cooling channel 2001 and carried away by the cooling medium (such as flowing air) of the cooling channel 2001, thus achieving rapid heat dissipation.

[0079] Furthermore, such as Figure 6 and Figure 8 As shown, the bottom end of the mounting spring 30 can be fixed to the bottom wall of the housing 20 by the first fastener 40. The first fastener 40 can be, but is not limited to, a fastening screw.

[0080] Furthermore, such as Figure 6 and Figure 8As shown, a plurality of positioning protrusions 2002 are provided on the bottom of the housing 20. The top of the positioning protrusions 2002 has mounting holes. The plurality of mounting holes correspond one-to-one with the plurality of positioning pins 103 on the circuit board 1. The plurality of positioning pins 103 on the circuit board 1 are inserted into the corresponding mounting holes, thereby further positioning and fixing the power transistor assembly 10 on the housing 20.

[0081] Furthermore, such as Figure 6 and Figure 8 As shown, a positioning post 2003 is provided on the bottom wall of the housing 20, and the bottom end of the mounting spring 30 has a through hole. When the mounting spring 30 is installed in place, the positioning post 2003 is located in the through hole, thereby achieving the purpose of positioning the mounting spring 30.

[0082] The second installation method for power transistor assembly 10 is as follows: Figure 7 and Figure 8 As shown, the power transistor assembly 10 is directly fixed to the side wall of the housing 20 by the second fastener 50, thereby pressing and fixing the power transistor assembly 10 to the side wall of the housing 20, ensuring that the second heat-conducting layer 502 in the power transistor assembly 10 is fully in contact with the side wall of the housing 20. Due to the full contact between the power transistor assembly 10 and the side wall of the housing 20, and the internal cooling channel 2001 of the housing 20, the heat generated by the power transistor 2 can be transferred through the side wall of the housing 20 to the cooling channel 2001, and carried away by the cooling medium (such as flowing air) in the cooling channel 2001, thereby achieving rapid heat dissipation. The second fastener 50 can be, but is not limited to, a screw.

[0083] Furthermore, such as Figure 8 As shown, a plurality of positioning protrusions 2002 are provided on the bottom of the housing 20. The top of the positioning protrusions 2002 has mounting holes. The plurality of mounting holes correspond one-to-one with the plurality of positioning pins 103 on the circuit board 1. The plurality of positioning pins 103 on the circuit board 1 are inserted into the corresponding mounting holes, thereby further positioning and fixing the power transistor assembly 10 on the housing 20.

[0084] In this invention, when multiple power transistor assemblies 10 need to be installed on the housing 20, the multiple power transistor assemblies 10 can all be fixed using the first installation method described above, by means of mounting springs 30, or they can all be fixed using the second installation method described above, by means of screws. Of course, the appropriate installation method can be selected according to the installation situation.

[0085] In one optional embodiment of this utility model, such as Figure 9 As shown, the main power circuit board 60 is located on the top of the housing 20, and the circuit board 1 in the power tube assembly 10 is connected to the main power circuit board 60 through multiple connection pins 102 at the top edge.

[0086] The charger of this utility model can be, but is not limited to, an on-board charger (i.e., an on-board power supply).

[0087] The features and advantages of this charger are:

[0088] 1. The power transistor assembly can be installed by means of spring clip 30 and / or screw fixing. Before installing the main power circuit board 60, multiple power transistors 2 can be integrated and pressed and attached to the housing 20 for rapid heat dissipation. There is no need to reserve openings for assembly on the circuit board 1, which improves the power density of the vehicle charger.

[0089] Second, in this charger, the power transistor assembly 10 is vertically arranged on the side wall of the housing 20, making full use of the height space of the charger to arrange the power transistor 2, thereby reducing the size of the charger and increasing the power density.

[0090] It should be noted that in the description of this application, the terms "first," "second," etc., are used only for descriptive purposes and to distinguish similar objects; there is no order between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more.

[0091] The various embodiments described in this specification are presented in a progressive manner. The same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0092] The above are merely a few embodiments of this utility model. Although the embodiments disclosed in this utility model are as described above, the content is only for the purpose of facilitating understanding of this utility model and is not intended to limit this utility model. Any person skilled in the art to which this utility model pertains may make any modifications and changes in the form and details of the embodiments without departing from the spirit and scope disclosed in this utility model. However, the patent protection scope of this utility model shall still be determined by the scope defined in the appended claims.

Claims

1. A power transistor assembly, characterized in that, The power transistor assembly includes: Circuit board; Multiple power transistors are disposed on the surface of the circuit board; The bracket has multiple partitions that divide the bracket into multiple accommodating spaces. The bracket is disposed on the surface of the circuit board, and the multiple power transistors are respectively located in the corresponding accommodating spaces. An insulating sheet is disposed on the bracket and covers the openings of the plurality of accommodating spaces. A heat-conducting layer is disposed on both sides of the insulating sheet, and the heat-conducting layer is used to fill the gaps on both sides of the insulating sheet.

2. The power transistor assembly as claimed in claim 1, characterized in that, The thermally conductive layer includes a first thermally conductive layer, which is located between the insulating sheet and the plurality of power transistors, and the first thermally conductive layer is in contact with the outer wall of the plurality of power transistors to fill the gap between the insulating sheet and the plurality of power transistors.

3. The power transistor assembly as described in claim 2, characterized in that, The thermally conductive layer includes a second thermally conductive layer located between the insulating sheet and the housing for mounting the power transistor assembly, and the second thermally conductive layer is in contact with the outer wall of the housing to fill the gap between the insulating sheet and the housing.

4. The power transistor assembly as described in claim 3, characterized in that, The first thermally conductive layer and / or the second thermally conductive layer are thermally conductive silicone grease layers or thermally conductive gel layers.

5. The power transistor assembly as claimed in claim 1, characterized in that, The circuit board has multiple positioning holes, and the bracket has multiple positioning protrusions that align with the multiple positioning holes. The multiple positioning protrusions are inserted into the corresponding positioning holes.

6. The power transistor assembly as claimed in claim 1, characterized in that, The edge of the circuit board has multiple connection pins for connection to the main power circuit board; And / or, the edge of the circuit board has multiple positioning feet for connection to the housing on which the power transistor assembly is mounted.

7. The power transistor assembly as claimed in claim 1, characterized in that, The insulating sheet is a ceramic insulating sheet; and / or, the bracket is a plastic bracket.

8. A charger, characterized in that, The charger includes: At least one power transistor assembly according to any one of claims 1 to 7; The housing has the power transistor assembly mounted on its side wall, and the interior of the housing has cooling channels for the flow of cooling medium. The main power circuit board is disposed on the housing and connected to the circuit board in the power transistor assembly.

9. The charger as described in claim 8, characterized in that, The charger also includes a mounting spring, one end of which is fixed to the bottom wall of the housing, and the other end of which abuts against the side of the circuit board opposite to the power transistor, so that the power transistor assembly is in close contact with the side wall of the housing.

10. The charger as described in claim 9, characterized in that, The mounting spring is fixed to the bottom wall of the housing by a first fastener.

11. The charger as described in claim 9, characterized in that, The housing is provided with a plurality of positioning protrusions, and the positioning protrusions have mounting holes. The plurality of positioning pins on the circuit board are inserted into the corresponding mounting holes.

12. The charger as described in claim 11, characterized in that, The bottom wall of the housing is provided with a positioning post, and the mounting spring has a through hole. When the mounting spring is installed in place, the positioning post is located in the through hole.

13. The charger as described in claim 8, characterized in that, The power transistor assembly is secured to the side wall of the housing using a second fastener, ensuring that the power transistor assembly is tightly fitted against the side wall of the housing.

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