Circuit board structure and socket structure

Abstract

The utility model provides a circuit board structure and a socket structure, the circuit board structure comprises a circuit board, the circuit board is provided with a first surface, the first surface is provided with at least one first bonding pad, and when there are a plurality of first bonding pads, the first bonding pads are arranged at intervals according to a preset state; the circuit board is provided with via holes in the centers of the first bonding pads so as to form annular bonding pads at the first bonding pads, and the via holes are in one-to-one correspondence with the first bonding pads; the radius of the annular bonding pad is larger than 0.3 mm, and the annular bonding pad can be used for being connected with the welding face of the male socket and the welding face of the female socket in an attached mode. The radius of the annular bonding pad is larger than 0.3 mm, and the area of the bonding pad is increased, so that when the male socket and the female socket are welded to a circuit board, the use amount of soldering paste can be increased, it can be guaranteed that sufficient soldering paste exists between the welding face and the annular bonding pad, the attachment face of the soldering paste is increased, and the welding quality of the male socket and the female socket is improved. The conditions of non-welding, insufficient welding and the like between the male and female sockets and the circuit board are avoided, and the connection reliability of the circuit board and the male and female sockets is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to circuit board technical field especially relates to a circuit board structure and socket structure. BACKGROUND

[0002] The socket structure includes male and female sockets and a circuit board, wherein the circuit board is provided with pads, and a via hole is formed at a position corresponding to the pads, the male and female sockets can be inserted into the via hole, thereby realizing the electrical connection of the male and female sockets and the circuit board. However, in the related art, the capacity of the solder paste on the pads is limited due to the area of the pads, and when the male and female sockets are inserted into the via hole, the pins of the male and female sockets will bring the solder paste on the pads into the via hole, so that the actual solder paste left on the pads is very little, which may cause the male and female sockets to be not welded or to be poorly welded, and is not conducive to the circuit connection of the male and female sockets and the circuit board. SUMMARY

[0003] The technical purpose of the utility model is to provide a circuit board structure and socket structure, which aims to solve the technical problem that the socket structure in the related art may cause the male and female sockets to be not welded or to be poorly welded, and is not conducive to the circuit connection of the male and female sockets and the circuit board.

[0004] To solve the above technical problem, the utility model is implemented as follows: a circuit board structure and socket structure, comprising a circuit board, a first surface of the circuit board, the first surface is provided with at least one first pad, and when there are multiple first pads, each first pad is arranged at intervals according to a preset state; a via hole is formed at the center of the first pad to form an annular pad at the first pad, and the via hole and the first pad are one-to-one corresponding; the radius of the annular pad is greater than 0.3mm, and the annular pad can be used for bonding connection with the welding surface of the male and female sockets.

[0005] Further, in some embodiments, the first surface is provided with five first pads, wherein four first pads are arranged in a square array, and the other first pad is located at the center of the square array.

[0006] Further, in some embodiments, the radius of the annular pad is 0.3mm

[0007] Further, in some embodiments, the first surface is provided with three first pads distributed at intervals along a first direction.

[0008] The first surface is provided with four first pads, and the four first pads are arranged in a square array.

[0009] Further, in some embodiments, the radius of the annular pad is 0.5mm~0.65mm.

[0010] Further, in some embodiments, the circuit board has a second surface opposite to the first surface along the thickness direction, and the second surface is provided with at least one second pad, and the second pad can be used for mounting a circuit element.

[0011] Further, in some embodiments, the second surface is provided with a second pad opposite to the first pad, the first pad and the second pad correspond one by one, and the via penetrates the first surface and the second surface.

[0012] Further, in some embodiments, along the thickness direction, the center point of the second pad and the center point of the first pad are on the same straight line.

[0013] Further, in some embodiments, a socket structure includes a male and female socket and a circuit board structure as described above, the male and female socket includes at least one welding surface and at least one pin, the welding surface and the pin correspond one by one; the pin is inserted into the via, the pin and the via correspond one by one, and the welding surface is connected to the annular pad by the solder paste, and the welding surface and the annular pad correspond one by one.

[0014] Compared with the related art, the circuit board structure in the utility model has the beneficial effects that:

[0015] In the utility model, the first surface of the circuit board is provided with the first pad, the via is arranged at the center of the first pad, so that the first pad is changed into the annular pad; and when there are multiple first pads, the multiple first pads can be adaptively and spacedly arranged according to the distribution of the multiple pins of the male and female socket, so that when there is only a single annular pad, the circuit board can be used for electrically connecting with the male and female socket with a single pin, at this time, the single pin is inserted into the via, and the welding surface of the male and female socket is connected to the annular pad; when there are multiple annular pads, the circuit board can be used for connecting with the male and female socket with multiple pins, at this time, the pin is inserted into the via, and the welding surface of the male and female socket is connected to the annular pad, and the pin and the via correspond one by one, and the welding surface and the annular pad correspond one by one. In addition, the radius of the annular pad is greater than 0.3mm, so compared with the conventional annular pad with a radius of only 0.3mm, the area of the pad is increased in the utility model, so when the male and female socket is welded to the circuit board, the amount of solder paste can be increased, so that finally, the pin has the solder paste, and the welding surface and the annular pad also have sufficient solder paste, that is, the attachment surface of the solder paste is increased, so that the situation that the male and female socket and the circuit board are not welded or are not properly welded is avoided, and the connection reliability of the circuit board and the male and female socket is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0017] Fig. 1 is a structural schematic diagram of the circuit board structure in the first perspective view in the embodiments of the present application.

[0018] Fig. 2 is a structural schematic diagram of the circuit board structure in the second perspective view in the embodiments of the present application.

[0019] In the drawings, the reference signs represent: 1, first surface; 2, first pad; 3, via hole; 4, second surface; 5, second pad. DETAILED DESCRIPTION

[0020] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0021] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0022] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0023] Please refer toFigs. 1-2 The utility model embodiment provides a kind of circuit board structure, including circuit board, circuit board has first surface 1, first surface 1 is provided with at least one first pad 2, and, when there are multiple first pad 2, each first pad 2 is spaced according to preset state;Circuit board is provided with via 3 at the center of first pad 2, to form annular pad at first pad 2, via 3 and first pad 2 one-to-one correspondence;The radius of annular pad is greater than 0.3mm, and annular pad can be used to be connected with the welding surface of male and female socket.

[0024] In the utility model embodiment, the first surface 1 of the circuit board is provided with the first pad 2, and the via 3 is arranged at the center of the first pad 2, so that the first pad 2 is changed into the annular pad. When there are multiple first pads 2, the multiple first pads 2 can be adaptively spaced according to the distribution of the multiple pins of the male and female socket. Therefore, when there is only a single annular pad, the circuit board can be used for electrically connecting with the male and female socket of a single pin. At this time, the single pin is inserted into the via 3, and the welding surface of the male and female socket is connected with the annular pad. When there are multiple annular pads, the circuit board can be used for connecting with the male and female socket of multiple pins. At this time, the pins are inserted into the vias 3, and the welding surface of the male and female socket is connected with the annular pads. In addition, the radius of the annular pad is greater than 0.3mm. Compared with the conventional annular pad with a radius of only 0.3mm, the area of the pad is increased in the utility model embodiment. Therefore, when the male and female socket is welded to the circuit board, the amount of solder paste can be increased, so that sufficient solder paste is ensured between the welding surface and the annular pad, that is, the attachment surface of the solder paste is increased, and the situation of incomplete welding or virtual welding between the male and female socket and the circuit board is avoided, thereby improving the connection reliability of the circuit board and the male and female socket.

[0025] For example, the solder paste can be tin paste, that is, the electrical connection between the circuit board and the male and female socket is realized by soldering.

[0026] Further, in some specific embodiments, the first surface 1 is provided with five first pads 2, four of which are arranged in a square array, and the other first pad 2 is located at the center of the square array.

[0027] Specifically, the first surface 1 can have five first pads 2, four of which fall into the four corners of the square, and the other one falls into the intersection of the diagonal lines of the square. In this way, the circuit board can be suitable for a five-pin male or female socket, and the five first pads 2 and the five pins of the male or female socket one-to-one correspondence. In addition, the five first pads 2 are all provided with through holes 3, that is, five annular pads can be formed on the circuit board, and the five-pin male or female socket has five welding surfaces, so that the five annular pads and the five welding surfaces one-to-one correspondence. In this way, the pins can be inserted into the through holes 3, and the welding surfaces can be welded with the annular pads, so that the electrical connection between the circuit board and the five-pin male or female socket can be realized.

[0028] Further, the radius of the annular pad is 0.3mm

[0029] Specifically, the radius of the annular pad can be 0.31mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.78mm, etc. In this way, by increasing the area of the pad, the amount of solder paste can be increased when the male or female socket is welded to the circuit board, so that there is finally sufficient solder paste between the pins and the annular pads, that is, the attachment surface of the solder paste is increased, avoiding the existence of un-welding, virtual welding, etc. between the male or female socket and the circuit board, and improving the connection reliability of the circuit board and the male or female socket. In addition, when the radius of the annular pad is less than or equal to 0.78mm, it can be suitable for the embodiment of five annular pads distribution, which can prevent the central annular pad and the annular pad around from being connected together.

[0030] In addition, it can be understood that the radius of the annular pad is equal to the radius of the first pad 2 minus the radius of the through hole 3. In some embodiments, the radius of the through hole 3 is usually 0.7mm to adapt to the size of the socket pin, so that the radius of the first pad 2 can be 1mm

[0031] Further, in some specific embodiments, the first surface 1 is provided with three first pads 2 distributed along the first direction.

[0032] Specifically, in the male and female sockets, besides the five-pin male and female sockets, three-pin male and female sockets can also be included, thus, by arranging three first pads 2 on the first surface 1 of the circuit board, three through holes 3 and three annular pads are obtained, so that the circuit board in this embodiment can be electrically connected with the three-pin male and female sockets. In addition, it can be understood that the circuit board can have a square structure, and the first direction can be the length direction or the width direction of the circuit board or a direction parallel to the diagonal.

[0033] Further, in some specific embodiments, the first surface 1 is provided with four first pads 2, and the four first pads 2 are arranged in a square array. Similarly, in the male and female sockets, four-pin male and female sockets can also be included, thus, by arranging four first pads 2 on the first surface 1 of the circuit board, and the arrangement of the four first pads 2 can be adapted to the arrangement direction of the four pins, so that the circuit board has four through holes 3 corresponding to the four pins and four annular pads corresponding to the four soldering surfaces, thereby enabling the circuit board in this embodiment to be electrically connected with the four-pin male and female sockets.

[0034] Further, in some embodiments, the radius of the annular pad is 0.5mm-0.65mm.

[0035] Specifically, the radius of the annular pad can be 0.5mm, 0.52mm, 0.55mm, 0.58mm, 0.6mm, 0.62mm, 0.65mm, etc. In this way, the pad area can be increased, the amount of solder paste can be increased, the male and female sockets and the circuit board can be stably soldered, and the waste of solder paste can also be avoided, the soldering liquid can be saved, and the cost can be reduced.

[0036] In addition, it can be understood that the radius of the annular pad is equal to the radius of the first pad 2 minus the radius of the through hole 3. In some embodiments, the radius of the through hole 3 is usually 0.7mm to adapt to the size of the socket pin, so that the radius of the first pad 2 can be 1.2mm-1.35mm. For example, the radius of the first pad 2 can be 1.2mm, 1.22mm, 1.25mm, 1.28mm, 1.3mm, 1.32mm, 1.35mm, etc.

[0037] Further, in some embodiments, the circuit board has a second surface 4 opposite to the first surface 1 in the thickness direction, and the second surface 4 is provided with at least one second pad 5, which can be used for mounting circuit elements.

[0038] Specifically, the circuit board has a first surface 1 and a second surface 4 arranged oppositely, and the second surface 4 can be provided with second pads 5, so that the circuit elements can be mounted on the pads of the second surface 4 of the circuit board, so that the circuit board can not only be inserted into the male and female sockets, but also other circuit elements can be arranged on the side of the circuit board away from the male and female sockets, increasing the utilization rate of the surface of the circuit board; and since it is a mounting process, the machine mounting method can be used to avoid problems such as soldering distortion and pin missing welding caused by manual soldering, improve product qualification rate, save labor cost and improve efficiency.

[0039] Understandably, the second pads 5 can be set according to the conventional pad radius size.

[0040] Further, in some embodiments, the second surface 4 is provided with second pads 5 arranged oppositely to the first pads 2, the first pads 2 and the second pads 5 correspond one by one, and the via holes 3 penetrate the first surface 1 and the second surface 4.

[0041] Specifically, the first surface 1 is the front surface, and the second surface 4 is the back surface. For example, the front surface of the circuit board can be spaced apart and distributed with two first pads 2, which are first sub-pads and second sub-pads, respectively. On the back surface of the circuit board, a second pad 5 can be provided at a position corresponding to the first sub-pad, so that the projection of the second pad 5 on the front surface in the thickness direction at least partially falls on the first sub-pad. At a position corresponding to the second sub-pad, the back surface of the circuit board can also be provided with a second pad 5, which will not be described here.

[0042] In addition, the via hole 3 penetrates the first surface 1 and the second surface 4, that is, the via hole 3 is a through hole. That is, the via hole 3 is displayed on the second surface 4, since the circuit element is mounted on the second pad 5, so that the solder paste can be prevented from being brought into the via hole 3 by the circuit element from the second pad 5, thereby preventing the solder paste on the second pad 5 from being insufficient. In addition, during assembly, the circuit element can be mounted on the second pad 5 through the solder paste, then the via hole 3 is formed by drilling, and finally the male and female sockets are welded to the first pads 2. In this way, the via hole is not drilled when the circuit element is welded to the second pad 5, so that the solder paste on the second pad 5 can be further prevented from entering the via hole 3.

[0043] In addition, the reflow soldering equipment can be used for welding, so that the consistency and qualification of welding can be increased.

[0044] Understandably, for example, the front surface of the circuit board can be spaced apart and distributed with two first pads 2, which are first sub-pads and second sub-pads, respectively. On the back surface of the circuit board, a second pad 5 can be provided at a position corresponding to the first sub-pad, but at the position of the second sub-pad, the back surface of the circuit board can not be provided with a second pad 5. At this time, the via hole 3 corresponding to the second sub-pad can be a blind hole.

[0045] Further, in some embodiments, the center point of the second pad 5 is on the same line with the center point of the first pad 2 along the thickness direction.

[0046] Specifically, the center point of the first pad 2, i.e. the center point of the via 3, is corresponding to the center point of the second pad 5, thereby facilitating the circuit connection and making the structure of the circuit board neat and aligned.

[0047] In some specific embodiments, the first surface 1 of the circuit board is provided with five first pads 2, and the second surface 4 of the circuit board is provided with five second pads 5 corresponding to the first pads 2, the first pads 2 and the second pads 5 are one-to-one corresponding, and the center point of the first pad 2 and the center point of the second pad 5 are on the same line along the thickness direction.

[0048] Further, in some embodiments, a socket structure includes a male and female socket and a circuit board structure, the male and female socket includes at least one soldering surface and at least one pin, the soldering surface and the pin are one-to-one corresponding; the pin is inserted into the via 3, the pin and the via 3 are one-to-one corresponding, and the soldering surface is connected to the annular pad by the solder paste, the soldering surface and the annular pad are one-to-one corresponding.

[0049] Specifically, the male and female socket can include a single-pin male and female socket and a multi-pin male and female socket, and the circuit board can be provided with one first pad 2 and a plurality of first pads 2 corresponding to the male and female socket. The first surface 1 of the circuit board is provided with the first pad 2, and the via 3 is formed at the center of the first pad 2, so that the first pad 2 is changed into an annular pad; and when there are a plurality of first pads 2, the plurality of first pads 2 can be adaptively spaced according to the distribution of the plurality of pins of the male and female socket, so that when there is only a single annular pad, the circuit board can be electrically connected with the single-pin male and female socket, at this time the single pin is inserted into the via 3, and the soldering surface of the male and female socket and the annular pad are connected by the solder paste; when there are a plurality of annular pads, the circuit board can be connected with the multi-pin male and female socket, at this time the pin is inserted into the via 3, and the soldering surface of the male and female socket and the annular pad are connected by the solder paste, and the pin and the via 3 are one-to-one corresponding, and the soldering surface and the annular pad are one-to-one corresponding. In addition, the radius of the annular pad is greater than 0.3mm, so compared with the conventional annular pad with a radius of only 0.3mm, the area of the pad is increased, so that the amount of solder paste can be increased when the male and female socket is soldered to the circuit board, so that sufficient solder paste can be finally ensured between the pin and the soldering surface and the annular pad, i.e. the attachment area of the solder paste is increased, thereby avoiding the situation that the male and female socket and the circuit board are not soldered or are poorly soldered, and improving the connection reliability of the circuit board and the male and female socket.

[0050] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0051] The above is the description of the technical scheme provided by the utility model. For those skilled in the art, according to the idea of the utility model embodiment, there will be changes in the specific implementation and application range, and the content of the specification should not be understood as a limitation of the utility model.

Claims

1. A circuit board structure, characterized by, The circuit board has a first surface provided with at least one first pad, and when there are multiple first pads, each first pad is arranged at a preset interval. The circuit board is provided with a via hole at the center of the first pad to form a ring-shaped pad at the first pad, and the via hole and the first pad correspond to each other; the radius of the ring-shaped pad is greater than 0.3 mm, and the ring-shaped pad can be used for bonding connection with the welding surface of the male and female sockets.

2. The circuit board structure according to claim 1, characterized by The first surface is provided with five first pads, four of which are arranged in a square array, and the other first pad is located at the center of the square array.

3. The circuit board structure according to claim 2, characterized by The radius of the ring-shaped pad is 0.3 mm < r ≤ 0.78 mm.

4. The circuit board structure according to claim 1, characterized by The first surface is provided with three first pads distributed at intervals along a first direction.

5. The circuit board structure of claim 1, wherein The first surface is provided with four first pads arranged in a square array.

6. The circuit board structure of claim 1, wherein The radius of the ring-shaped pad is 0.5 mm ~ 0.65 mm.

7. The circuit board structure of claim 1, wherein The circuit board has a second surface opposite to the first surface in the thickness direction, and the second surface is provided with at least one second pad, and the second pad can be used for mounting a circuit element.

8. The circuit board structure according to claim 7, characterized by The second surface is provided with a second pad opposite to the first pad, and the first pad and the second pad correspond to each other, and the via hole penetrates the first surface and the second surface.

9. The circuit board structure according to claim 8, characterized in that, In the thickness direction, the center point of the second pad and the center point of the first pad are on the same straight line.

10. A socket structure, characterized by comprising: The male and female sockets include at least one welding surface and at least one pin, and the welding surface and the pin correspond to each other; the pin penetrates the via hole, and the pin and the via hole correspond to each other; the welding surface is bonded and connected to the ring-shaped pad through the solder paste, and the welding surface and the ring-shaped pad correspond to each other.

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