Radiator module capable of improving heat dissipation effect

Abstract

The utility model discloses a radiator module capable of improving heat dissipation effect, which comprises at least one heat dissipation fin group used for heat conduction, at least one heat dissipation pipe penetrating through the heat dissipation fin group, and a vapor chamber arranged on one side of the heat dissipation fin group and used for being in contact with an electronic element for heat conduction. One side of the vapor chamber is provided with a fan used for blowing air to the electronic element, and the bottom of the vapor chamber is at least provided with a heat dissipation air guide groove corresponding to the fan and used for guiding heat dissipation air to the electronic element. The small fan is additionally arranged on the side edge of the vapor chamber, air is blown to the electronic element through the fan, the heat dissipation air guide grooves are formed in the bottom of the vapor chamber, and large heat dissipation air generated by the fan is guided to the electronic element through the heat dissipation air guide grooves, so that heat generated by the electronic element is directly taken away, the heat dissipation efficiency can be greatly improved, and the heat dissipation effect of the electronic element is improved. And the influence of the heat conduction performance of the heat dissipation fin group and the vapor chamber on heat dissipation can be reduced, and the service life and the operation performance stability of electronic components are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator technical field especially point to a radiator module of promoting heat dissipation effect. BACKGROUND

[0002] In modern electronic products, especially high-performance graphics cards, the design of the radiator is particularly important. This is because electronic devices generate a large amount of heat when they are working, especially in high-load operations such as graphics processing and complex computing tasks. The main reason for generating heat is the power consumption of the components. When current passes through semiconductor materials, resistance will cause part of the electrical energy to be converted into heat energy. If the heat cannot be dissipated in time, the temperature rise will cause the performance of the components to decline, and even damage.

[0003] Currently, the traditional cooling methods mainly include air cooling, liquid cooling and heat pipe cooling. Air cooling relies on fans to remove heat from the surface of electronic components, which is a widely used and cost-effective method, but it often has the problem of insufficient cooling efficiency in high-performance products; liquid cooling removes heat through liquid circulation, which is more efficient and has lower noise, but the structure is complex, the cost is high and leakage prevention measures are required; heat pipe cooling uses materials with good thermal conductivity to quickly transfer heat to the heat sink area, but it is limited by the upper limit of heat pipe design. Especially in high-performance graphics cards, as the computing power increases, the heat generated rapidly rises. If the cooling system cannot quickly reduce the temperature, the graphics card will reduce the frequency to protect itself, resulting in performance degradation.

[0004] For example: China patent authorized announcement number CN 101605442B's radiator, in the technical scheme disclosed in this patent, the radiator is mainly used for cooling the circuit board, the radiator includes a base, a radiator, a fan, and a cover. When working, the base and the circuit board are fixed to the circuit board by the fixing member, the bottom surface of the base can contact one or more electronic components, and the heat conduction effect can be enhanced by applying heat-conducting glue between the bottom surface of the base and the top surface of the electronic components. Insulating film can be placed between the radiator and the circuit board to provide insulation and cushioning. Since the heat pipe is a high-efficiency heat-conducting plate-shaped heat pipe, the heat generated by the electronic components can be absorbed by the heat pipe and quickly and evenly distributed throughout the heat pipe. The heat is conducted to the entire radiator, and finally the airflow generated by the fan passes through the airflow channel in the radiator to quickly remove the heat, thereby achieving the effect of quickly cooling the electronic components.

[0005] As described in the above patent, since the heat dissipation devices on the market are all using the airflow generated by the fan to blow through the heat sink or the heat conductor to take away the heat, the heat dissipation efficiency is largely dependent on the heat conductivity of the heat sink or the heat conductor, when the heat conductivity of the heat sink or the heat conductor is reduced due to dust accumulation or other reasons, the electronic components are prone to instantaneous high temperature, which leads to the performance degradation or damage of the electronic components, therefore, ensuring the continuous and stable heat dissipation of the electronic components is an important factor for maintaining the performance of the electronic products and improving the service life.

[0006] Therefore, the present inventors propose the following technical solutions. Content of the utility model:

[0007] The utility model discloses a heat dissipation device module that improves heat dissipation effect.

[0008] In order to solve the above technical problems, the utility model adopts the following technical scheme: a heat dissipation device module that improves heat dissipation effect, comprising: a heat plate, one side of the heat plate is provided with a fan for blowing air to electronic components, and the bottom of the heat plate is provided with at least one heat dissipation air guide groove corresponding to the fan for guiding heat dissipation air to the electronic components.

[0009] Further, in the above technical scheme, a wind guide cover plate is further installed on the heat plate, the wind guide cover plate is in a frame type and has a hollow middle part corresponding to the electronic components, and one side of the wind guide cover plate is covered between the air outlet of the fan and the heat dissipation air guide groove.

[0010] Further, in the above technical scheme, the fan is obliquely arranged on the side edge of the heat plate, the air outlet of the fan is provided with a wind baffle plate obliquely extending to the end of the heat dissipation air guide groove, and one side of the wind guide cover plate is covered on the wind baffle plate.

[0011] Further, in the above technical scheme, a plurality of first positioning columns for positioning the wind guide cover plate are arranged on the heat plate, a plurality of first positioning holes for the first positioning columns to pass through are arranged on the wind guide cover plate, and a plurality of first flap parts abutting against the side edge of the heat plate are formed by bending one side of the wind guide cover plate.

[0012] Further, in the above technical scheme, the heat plate is a copper plate, and a heat conduction member is further arranged on the side of the heat plate, the heat conduction member is a stamping flap, and at least two second positioning columns for fixing the PCB of the electronic components are arranged on the heat conduction member.

[0013] Further, in the above technical scheme, at least one heat dissipation fin group for heat conduction and a plurality of heat dissipation pipes penetrating through the heat dissipation fin group are further arranged, wherein the heat plate is arranged on one side of the heat dissipation fin group and is used for contacting and conducting heat with the electronic components, the heat dissipation pipe is located between the heat dissipation fin group and the heat plate, and is flush and abuttingly contacted with the end surface of the heat plate.

[0014] Further in the above technical solutions, the two heat dissipation fin groups are connected and fixed by the connecting plate, and the heat dissipation pipe penetrates through the two heat dissipation fin groups.

[0015] Further in the above technical solutions, the heat dissipation fin group is provided with a first heat conduction surface at the contact area with the vapor chamber, the fins in the heat dissipation fin group are perpendicular to the first heat conduction surface, the heat dissipation pipe penetrates through the first heat conduction surface, and a plurality of U-shaped grooves penetrating through the first heat conduction surface and used for positioning the heat dissipation pipe are arranged on the heat dissipation fin group.

[0016] Further in the above technical solutions, the two connecting plates are arranged in parallel and connected with the two heat dissipation fin groups by welding, and the two connecting plates are located on the two sides of the heat dissipation fin group, respectively.

[0017] Further in the above technical solutions, the vapor chamber and the heat conduction member are stamping parts, and the two side surfaces are uneven; the fins on the bottom surface of the heat dissipation fin group are uneven, so as to match the contact surfaces with different unevenness on the vapor chamber and the heat conduction member, the contact areas between the fins and the vapor chamber and the heat conduction member are provided with heat conduction surfaces, the fins on the top surface of the heat dissipation fin group are flat, and are fixed with the connecting plate by welding.

[0018] After the above technical solutions are adopted, the utility model has the following beneficial effects compared with the prior art: in the utility model, a small fan is additionally arranged on the side of the vapor chamber, the fan blows air to the electronic element, a plurality of heat dissipation air guide grooves are arranged on the bottom of the vapor chamber, the heat dissipation air guide grooves guide the air generated by the fan to the electronic element, so that the heat generated by the electronic element is directly taken away, which not only greatly improves the heat dissipation efficiency, but also reduces the influence of the heat conduction performance of the heat dissipation fin group and the vapor chamber on heat dissipation, avoids the high temperature of the electronic element caused by the change of the heat conduction performance of the heat dissipation fin group and the vapor chamber in the long-term use process, and improves the service life and operation performance stability of the electronic element. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is the installation schematic view of the vapor chamber in the utility model;

[0020] Figure 2 is the position relationship schematic view of the fan and the electronic element in the utility model;

[0021] Figure 3 is the position relationship schematic view of the fan and the vapor chamber in the utility model;

[0022] Figure 4 is the use state reference of the utility model Figure 1 ;

[0023] Figure 5 This is a reference for the usage status of this utility model. Figure 2 ;

[0024] Figure 6 This is a reference for the usage status of this utility model. Figure 3 . Detailed implementation method:

[0025] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0026] In this embodiment, fan A is located on one side of heat dissipation fin assembly 1 and is fixed to heat dissipation fin assembly 1 by a bracket 9. When the length of heat dissipation fin assembly 1 is long, multiple fans A can be installed side by side on the bracket 9.

[0027] See Figures 1 to 6 As shown, a heat sink module for improving heat dissipation includes at least one heat sink fin assembly 1 for heat conduction, at least one heat sink pipe 2 penetrating the heat sink fin assembly 1, and a heat spreader plate 4 disposed on one side of the heat sink fin assembly 1 for contacting and conducting heat with electronic components 3. A fan 7 for blowing air to electronic components 3 is disposed on one side of the heat spreader plate 4, and at least one corresponding fan 7 is disposed at the bottom of the heat spreader plate 4 for guiding the heat dissipation air to the heat dissipation duct 41 on the electronic components 3. A small fan 7 is added to the side of the heat spreader 4 to blow air onto the electronic component 3. Multiple heat dissipation ducts 41 are set at the bottom of the heat spreader 4. The heat dissipation ducts 41 guide the large amount of heat dissipation air generated by the fan 7 to the electronic component 3, thereby directly removing the heat generated by the electronic component 3. This not only greatly improves the heat dissipation efficiency, but also reduces the impact of the thermal conductivity of the heat dissipation fin assembly 1 and the heat spreader 4 on heat dissipation. It avoids the high temperature of the electronic component 3 caused by changes in the thermal conductivity of the heat dissipation fin assembly 1 and the heat spreader 4 during long-term use, thereby improving the service life and operational stability of the electronic component 3.

[0028] A wind guide cover 8 is also installed on the heat spreader 4. The wind guide cover 8 is frame-shaped with a central opening corresponding to the electronic component 3, and one side of the wind guide cover 8 covers the space between the air outlet of the fan 7 and the heat dissipation duct 41. The fan 7 is inclinedly disposed on the side of the heat spreader 4, and the air outlet of the fan 7 is provided with a baffle plate 70 that extends inclinedly to the end of the heat dissipation duct 41, and one side of the wind guide cover 8 covers the baffle plate 70. The heat spreader 4 is provided with a plurality of first positioning posts 42 for positioning the wind guide cover 8, and the wind guide cover 8 is provided with a plurality of first positioning holes 81 for the first positioning posts 42 to pass through, and the side of the wind guide cover 8 is bent to form a plurality of first folded plate portions 82 that press against the side of the heat spreader 4. The wind guide cover 8 is made of aluminum or copper and can contact the electronic component 3 for heat conduction.

[0029] In the embodiment, the bottom of the heat plate 4 is provided with two heat dissipation air guide grooves 41, the heat dissipation air blown by the fan 7 is guided into the two heat dissipation air guide grooves 41 through the inclined arrangement of the air baffle 70, and the fan 7 is arranged on one side of the heat plate 4, which is beneficial to the layout of the air baffle 70 and reduces the number of the air baffles 7. Secondly, the heat dissipation air guide cover plates 8 are arranged on the heat plate 4 to cover the two ends of the heat dissipation air guide grooves 41, and the heat dissipation air blown by the fan 7 can be directly blown into the heat dissipation air guide grooves 41 through the heat dissipation air guide cover plates 8.

[0030] The heat plate 4 is a copper plate, and the heat plate 4 is further provided with a heat conduction piece 5 on the side, the heat conduction piece 5 is a stamping folded plate, and at least two second positioning columns 51 for fixing the PCB 30 of the electronic element 3 are arranged on the heat conduction piece 5. The heat dissipation pipes 2 are arranged in an array, and the heat dissipation pipes 2 are located between the heat dissipation fin groups 1 and the heat plate 4 and are flush with the end surface of the heat plate 4. The two heat dissipation fin groups 1 are arranged side by side and are connected and fixed through the connecting plate 6, and the heat dissipation pipes 2 penetrate the two heat dissipation fin groups 1.

[0031] The contact area between the heat dissipation fin group 1 and the heat plate 4 is provided with a first heat conduction surface 11, the fins in the heat dissipation fin group 1 are perpendicular to the first heat conduction surface 11, the heat dissipation pipes 2 all penetrate the first heat conduction surface 11, and a plurality of U-shaped grooves 12 for positioning the heat dissipation pipes 2 are arranged on the heat dissipation fin group 1 and penetrate the first heat conduction surface 11. The two connecting plates 6 are arranged side by side and are connected to the two heat dissipation fin groups 1 through welding, and the two connecting plates 6 are located on the two sides of the heat dissipation fin group 1.

[0032] The heat plate 4 and the heat conduction piece 5 are both stamping parts, and the two side surfaces are uneven; the fins on the bottom surface of the heat dissipation fin group 1 are uneven, so as to match the different contact surfaces on the heat plate 4 and the heat conduction piece 5, and the contact areas between the fins and the heat plate 4 and the heat conduction piece 5 are all provided with heat conduction surfaces; the fins on the top surface of the heat dissipation fin group 1 are flat and are fixed through welding and the connecting plate 6.

[0033] In summary, in the utility model, a fan 7 is additionally arranged on the side of the heat plate 4, the heat dissipation air is blown to the electronic element 3 through the fan 7, the heat dissipation air guide grooves 41 are arranged on the bottom of the heat plate 4, so that the heat dissipation air can be directly blown to the electronic element 3, the heat generated by the electronic element 3 is taken away, and thus the direct heat dissipation of the electronic element 3 is realized, and the heat dissipation efficiency of the electronic element 3 is improved.

[0034] Of course, the above only describes specific embodiments of the utility model, and does not limit the utility model implementation range, and equivalent changes or modifications made according to the structure, features and principles described in the utility model patent application scope should be included in the utility model patent application scope.

Claims

1. A heat sink module for improving heat dissipation, comprising a heat spreader (4), characterized in that: A fan (7) for blowing air onto the electronic component (3) is provided on one side of the heat spreader (4), and at least one corresponding fan (7) is provided at the bottom of the heat spreader (4) for guiding the heat dissipation air to the heat dissipation duct (41) on the electronic component (3).

2. The heat sink module for improving heat dissipation effect according to claim 1, characterized in that: The heat spreader (4) is also equipped with an air guide cover (8), which is frame-shaped with a central open space corresponding to the electronic component (3), and one side of the air guide cover (8) covers the air outlet of the fan (7) and the heat dissipation air guide groove (41).

3. A heat sink module for improving heat dissipation effect according to claim 2, characterized in that: The fan (7) is inclinedly arranged on the side of the heat exchange plate (4). The air outlet of the fan (7) is provided with a baffle plate (70) that extends inclinedly to the end of the heat dissipation guide trough (41), and one side of the guide cover plate (8) covers the baffle plate (70).

4. A heat sink module for improving heat dissipation effect according to claim 2, characterized in that: The heat spreader (4) is provided with a plurality of first positioning posts (42) for positioning the air guide cover (8), the air guide cover (8) is provided with a plurality of first positioning holes (81) for the first positioning posts (42) to pass through, and the side of the air guide cover (8) is bent to form a plurality of first folded plate portions (82) that press against the side of the heat spreader (4).

5. A heat sink module for improving heat dissipation effect according to any one of claims 1-4, characterized in that: The heat spreader (4) is a copper plate, and a heat-conducting component (5) is provided on the side of the heat spreader (4). The heat-conducting component (5) is a stamped folding plate and is provided with at least two second positioning posts (51) for fixing the PCB board (30) of the electronic component (3).

6. A heat sink module for improving heat dissipation effect according to claim 5, characterized in that: It also includes at least one heat dissipation fin assembly (1) for heat conduction and several heat dissipation pipes (2) arranged to pass through the heat dissipation fin assembly (1). The heat dissipation plate (4) is located on one side of the heat dissipation fin assembly (1) and is used to contact and conduct heat with the electronic component (3). The heat dissipation pipe (2) is located between the heat dissipation fin assembly (1) and the heat dissipation plate (4) and is flush with and in contact with the end face of the heat dissipation plate (4).

7. A heat sink module for improving heat dissipation effect according to claim 6, characterized in that: The heat dissipation fin group (1) is arranged in two parallel rows. A connecting plate (6) is provided in front of the two heat dissipation fin groups (1) to connect and fix them, and the heat dissipation pipe (2) passes through the two heat dissipation fin groups (1).

8. A heat sink module for improving heat dissipation effect according to claim 7, characterized in that: The contact area between the heat dissipation fin group (1) and the heat dissipation plate (4) is provided with a first heat-conducting surface (11). The fins in the heat dissipation fin group (1) are perpendicular to the first heat-conducting surface (11), and the heat dissipation pipes (2) all pass through the first heat-conducting surface (11). The heat dissipation fin group (1) is provided with a plurality of U-shaped grooves (12) that pass through the first heat-conducting surface (11) and are used to position the heat dissipation pipes (2).

9. A heat sink module for improving heat dissipation effect according to claim 8, characterized in that: Two connecting plates (6) are arranged side by side and are connected to two heat dissipation fin groups (1) by welding. The two connecting plates (6) and the heat dissipation plate (4) are located on both sides of the heat dissipation fin group (1).

10. A heat sink module for improving heat dissipation effect according to claim 9, characterized in that: The heat spreader (4) and the heat conductor (5) are both stamped parts, and both sides are uneven. The fins on the bottom surface of the heat dissipation fin group (1) are uneven to match the different contact surfaces on the heat spreader (4) and the heat conductor (5). The contact areas between the fins and the heat spreader (4) and the heat conductor (5) are all provided with heat-conducting surfaces. The fins on the top surface of the heat dissipation fin group (1) are flat and are fixed to the connecting plate (6) by welding.

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