Machine room heat dissipation system
By optimizing the design of the air guide plate and air duct, the problem of 5G baseband unit short circuit due to moisture in high humidity environment was solved, achieving uniform heat dissipation and equipment stability, and extending equipment life.
Patent Information
- Application Number
- CN202423098612.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-16
AI Technical Summary
In existing technologies, 5G baseband units in computer rooms are prone to moisture damage and short circuits in high humidity environments, which leads to a shortened equipment lifespan and serious uneven heat dissipation problems.
The design incorporates air guide plates and ductwork, including angled air guide plates, main ducts, and secondary ducts. Combined with variable diameter joints and fans, it optimizes the airflow path, ensures uniform heat dissipation for each 5G baseband unit, and protects the equipment with heat pipes and insect nets.
It effectively reduces the risk of equipment overheating, improves heat dissipation efficiency, extends equipment life, ensures equipment stability and durability, and avoids equipment failure.
Smart Images
Figure CN223652561U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer system technology, and more specifically, to a computer room heat dissipation system. Background Technology
[0002] Currently, large-scale computer systems, such as servers and storage devices, are often housed in computer rooms. These devices typically generate a significant amount of heat during operation. Existing technology usually involves installing ventilation fans on the computer room walls to exchange indoor and outdoor air and cool the room. However, when outdoor air humidity is high, the computer room cannot effectively dry the air, causing the equipment to become damp, prone to short circuits and damage, and shortening its lifespan. Utility Model Content
[0003] In view of this, the present invention provides a data center heat dissipation system, which aims to improve the heat dissipation problem of 5G baseband units and extend the service life of 5G baseband units.
[0004] To achieve the above objectives, the present invention adopts the following technical solution:
[0005] A data center cooling system, characterized in that the data center cooling system includes a 5G baseband unit, a cabinet, and an air duct, wherein:
[0006] The cabinet includes a front panel and a back panel. The front panel includes an air inlet, and the back panel includes an air outlet. The cabinet contains a mounting box and an air guide plate. The mounting box is a cuboid structure and is vertically mounted on a mounting bracket in the cabinet. The 5G baseband unit is installed inside the mounting box. The air guide plate is horizontally positioned at the top and bottom of the mounting box and guides the air from the inlet to the outlet.
[0007] The air guide plate includes a first air guide plate and a second air guide plate. The first air guide plate is placed at the upper end of the cabinet, and the second air guide plate is placed at the lower end of the cabinet. The first air guide plate is tilted upwards, and the second air guide plate is tilted downwards.
[0008] One end of the duct is connected to the air outlet, and the other end is connected to the fan.
[0009] The air duct includes a main air duct and a secondary air duct. The number of secondary air ducts is the same as the number of 5G baseband units, and each secondary air duct corresponds to a 5G baseband unit. The diameter of the main air duct is larger than the diameter of the secondary air duct. One end of the secondary air duct is connected to the air outlet, and the other end of the secondary air duct is connected to one end of the main air duct. The other end of the main air duct is connected to the fan.
[0010] The main air duct is connected to the fan via a reducing joint. The diameter of the first end of the reducing joint is the same as the diameter of the main air duct, and the diameter of the second end of the reducing joint is the same as the diameter of the fan duct. The diameter of the second end of the reducing joint is larger than the diameter of the first end of the reducing joint.
[0011] Optionally, adjacent secondary air ducts are connected by connecting flanges, and each secondary air duct is equipped with a heat collection box at the end furthest from the main air duct.
[0012] Optionally, the main air duct and the auxiliary air duct are connected by a connecting flange, and a shock-absorbing flexible hose is also installed between the main air duct and the fan.
[0013] Optionally, the mounting bracket is a beam structure and is horizontally installed inside the cabinet via slide rails.
[0014] Optionally, a heat pipe is connected to the other end of the fan, and an insect-proof net is vertically installed inside the heat pipe.
[0015] Optionally, the air outlet is equipped with a fan, including a temperature regulating fan, which is fixed to the air outlet by a bracket or mounting hole.
[0016] Optionally, the socket also includes a standard panel, which is fixed to the empty space in the socket via mounting holes.
[0017] Compared with the prior art, the computer room heat dissipation system provided by this utility model achieves at least the following beneficial effects:
[0018] First, the air guides direct the cool air entering from the front panel inlet to the area around the enclosure for equipment cooling, and finally exhaust the hot air through the rack's outlet. The cool air flows along the enclosure, absorbing the heat generated by the 5G baseband unit, thus achieving effective heat dissipation. The angled design of the first and second air guides directs airflow, making the air movement within the rack more natural, avoiding air stagnation and heat accumulation, and effectively reducing the risk of equipment overheating.
[0019] Furthermore, the duct configuration further optimizes airflow paths. Each secondary duct corresponds to a 5G baseband unit, ensuring sufficient airflow for heat dissipation and preventing uneven heat dissipation caused by multiple 5G baseband units sharing the same secondary duct. Additionally, the main duct diameter is larger than the secondary duct diameter, guaranteeing that the main duct can simultaneously accommodate airflow from multiple secondary ducts. This achieves a smooth transition of airflow between the main and secondary ducts, resulting in a more balanced fan load, reduced fan burden, and improved fan efficiency.
[0020] The fan is connected to the main air duct by a reducing connector. The first end of the reducing connector has the same diameter as the main air duct, while the second end matches the diameter of the fan duct. The diameter of the second end is larger than that of the first end, which further helps to smoothly transition the airflow, reduce airflow friction and loss, and improve the working efficiency of the fan and the heat dissipation performance of the entire computer room heat dissipation system.
[0021] The above configuration ensures the data center's cooling system offers excellent equipment stability and a long service life. Through efficient heat dissipation design, the temperature of the 5G baseband unit and other data center equipment is kept within a safe range, preventing equipment failure or performance degradation caused by overheating, thereby improving equipment stability and durability.
[0022] Of course, any product implementing this utility model does not necessarily need to achieve all of the above technical effects at the same time.
[0023] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. Attached Figure Description
[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present invention and, together with their description, serve to explain the principles of the present invention.
[0025] Figure 1 This is a schematic diagram of the structure of the computer room heat dissipation system provided by this utility model;
[0026] Figure 2 This is a schematic diagram of the structure of the insertion box provided by this utility model;
[0027] Figure 3 This is a schematic diagram of the airflow direction of the computer room heat dissipation system provided by this utility model;
[0028] Figure 4 This is a schematic diagram of the structure of the mounting bracket provided by this utility model;
[0029] Figure 5 This is a schematic diagram of the structure of the first air guide plate and the second air guide plate provided by this utility model;
[0030] Figure 6 This is a schematic diagram of the insect-proof net provided by this utility model.
[0031] In the picture:
[0032] 1. Cabinet, 2. Air duct, 3. Fan, 4. Reducing joint, 5. Connecting flange, 6. Heat collection box, 7. Vibration damping hose, 8. Heat conduction pipe, 9. Insect screen, 11. Insert box, 12. Air guide plate, 13. Mounting bracket, 14. Air inlet, 15. Air outlet, 121. First air guide plate, 122. Second air guide plate, 21. Main air duct, 22. Secondary air duct, 41. First end, 42. Second end. Detailed Implementation
[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present invention.
[0034] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.
[0035] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.
[0036] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0037] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0038] Example 1
[0039] Reference Figures 1 to 5 , Figure 1 This is a schematic diagram of the structure of the computer room heat dissipation system provided by this utility model; Figure 2 This is a schematic diagram of the structure of the insertion box provided by this utility model; Figure 3 This is a schematic diagram of the airflow direction of the computer room heat dissipation system provided by this utility model; Figure 4 This is a schematic diagram of the structure of the mounting bracket provided by this utility model; Figure 5 This is a schematic diagram of the structure of the first air guide plate and the second air guide plate provided by this utility model.
[0040] like Figure 1 As shown, the data center cooling system provided by this utility model includes a 5G baseband unit (not shown), a cabinet 1, and an air duct 2, wherein:
[0041] The cabinet 1 includes a front door panel (not shown) and a back panel (not shown). The front door panel includes an air inlet 14, and the back panel includes an air outlet 15. The cabinet 1 is equipped with a socket 11 and an air guide plate 12. The socket 11 is a cuboid structure and is vertically mounted on a mounting bracket 13 in the cabinet 1. The 5G baseband unit is installed inside the socket 11. The air guide plate 12 is horizontally positioned at the upper and lower ends of the socket 11 and guides the air from the air inlet 14 to be discharged from the top of the socket 11 to the air outlet 15.
[0042] It should be understood that the air inlet 14 on the front panel can be used to introduce cool air into the cabinet 1, and the air outlet 15 on the back panel can be used to expel hot air from the cabinet 1. Thus, the arrangement of the air inlet 14 and the air outlet 15 can form an airflow channel inside the cabinet 1, which helps the computer room cooling system dissipate heat.
[0043] For example, such as Figure 2 As shown, the insertion box 11 has a cuboid structure and is vertically mounted on the mounting bracket 13 in the rack 1, facilitating stable fixation and space utilization. Furthermore, the 5G baseband unit is installed inside the insertion box 11, which in particular protects the 5G baseband unit and facilitates modular management. In other words, the insertion box 11 not only protects the 5G baseband unit from external environmental influences (such as dust or physical damage) but also facilitates its disassembly and maintenance. Moreover, the vertical mounting of the insertion box 11 in the rack 1 also allows for airflow guidance via the air guide plate 12. Specifically, the insertion box 11 is fixed vertically to the mounting bracket 13, allowing airflow to enter from the bottom and exit from the top. This enables the airflow to absorb the heat generated by the 5G baseband unit within the insertion box 11 during its flow. Finally, the hot air is exhausted from the rack 1 through the air outlet 15 on the back panel.
[0044] For example, the air guide plate 12 is horizontally installed at the upper and lower ends of the enclosure 11, that is, arranged around the enclosure 11. Thus, the air guide plate 12 can guide the cold air entering from the air inlet 14 of the front door panel to the area around the enclosure 11 for equipment cooling, and finally exhaust the hot air through the air outlet 15 of the cabinet 1. The cold air flows along the enclosure 11, effectively dissipating heat by absorbing the heat generated by the 5G baseband unit.
[0045] For example, such as Figure 3 As shown, cold air enters the interior of the cabinet 1 through the air inlet 14 on the front door panel, and flows through the interior and surrounding area of the socket 11 under the guidance of the air guide plate 12. This allows the airflow to absorb the heat generated by the 5G baseband unit in the socket 11 during the flow process. Finally, the hot air is discharged from the cabinet 1 through the air outlet 15 on the back panel.
[0046] For example, such as Figure 4As shown, the mounting bracket 13 can be a frame structure used to fix the insertion box 11, allowing it to be vertically installed inside the cabinet 1. Furthermore, the mounting bracket 13 can be connected to the cabinet 1 by bolts, welding, or clips, thereby giving the mounting bracket 13 good stability. In addition, the insertion box 11 can be installed on the mounting bracket 13 via slide rails or slots, facilitating insertion, removal, and maintenance; this utility model does not limit this aspect.
[0047] For example, the mounting bracket 13 may include a through hole or opening in the vertical direction, thereby avoiding obstruction of the airflow flowing in from the bottom of the housing 11 and out from the top of the housing 11, and maintaining airflow to ensure smooth cooling airflow.
[0048] For example, the mounting bracket 13 can be made of stainless steel or carbon steel, and this utility model does not limit it, thereby not only meeting the strength requirements, but also having a certain degree of corrosion resistance.
[0049] For example, the air guide plate 12 can be made of engineering plastics (such as ABS, PC, PA, etc.) or composite materials (such as carbon fiber reinforced plastics). This utility model does not limit this, thereby enabling the air guide plate 12 to meet the characteristics of being lightweight, rigid, and resistant to high temperature and chemical corrosion.
[0050] Furthermore, such as Figure 5 As shown, the air guide plate 12 includes a first air guide plate 121 and a second air guide plate 122. The first air guide plate 121 is placed at the upper end of the cabinet 1, and the second air guide plate 122 is placed at the lower end of the cabinet 1. The plate body of the first air guide plate 121 is inclined upward, and the plate body of the second air guide plate 122 is inclined downward.
[0051] It should be understood that the first air guide plate 121 is angled upwards, i.e., towards the air outlet 15 of the cabinet 1. This allows the hot air at the top of the enclosure 11 to rise naturally and be guided by the angle of the first air guide plate 121 to be concentrated and discharged towards the air outlet 15 on the back panel of the cabinet 1, thereby reducing the stagnation and turbulent flow of hot air at the top of the cabinet 1. The second air guide plate 122 is angled downwards, i.e., towards the air inlet 14 of the front door panel of the cabinet 1. This guides the cold air introduced by the air inlet 14 of the front door panel of the cabinet 1 to the lower part of the enclosure 11, ensuring that the cold air flows over all the equipment surfaces inside the enclosure 11, preventing the cold air from diffusing at the bottom of the cabinet 1, and improving the utilization efficiency of the cold air.
[0052] One end of the air duct 2 is connected to the air outlet 15, and the other end of the air duct 2 is connected to the fan 3. Thus, the air outlet 15 can provide driving force to the air duct 2, generating a strong airflow, and the fan 3 can draw in the airflow delivered by the main air duct 21 from the outside, realizing the transmission of airflow.
[0053] The air duct 2 includes a main air duct 21 and a secondary air duct 22. The number of secondary air ducts 22 is the same as the number of 5G baseband units, and each secondary air duct 22 corresponds to a 5G baseband unit. The diameter of the main air duct 21 is larger than the diameter of the secondary air duct 22. One end of the secondary air duct 22 is connected to the air outlet 15, and the other end of the secondary air duct 22 is connected to one end of the main air duct 21. The other end of the main air duct 21 is connected to the fan 3.
[0054] The main air duct 21 is connected to the fan 3 through a reducing joint 4. The diameter of the first end 41 of the reducing joint 4 is the same as the diameter of the main air duct 21, and the diameter of the second end 42 of the reducing joint 4 is the same as the diameter of the fan 3 duct. The diameter of the second end 42 of the reducing joint 4 is greater than the diameter of the first end 41 of the reducing joint 4.
[0055] Each 5G baseband unit has its own dedicated secondary air duct 22, ensuring that the cooling airflow transmitted by the secondary air duct 22 accurately covers the 5G baseband unit without wasting cooling resources. Furthermore, it avoids uneven airflow coverage or insufficient heat dissipation in certain areas of the 5G baseband unit. Moreover, the diameter of the main air duct 21 is larger than that of the secondary air ducts 22, allowing the main air duct 21 to simultaneously accommodate the hot airflow transmitted from multiple secondary air ducts 22 and efficiently transfer it to the fan 3, which then vents it outdoors, improving the heat dissipation efficiency of the data center's cooling system.
[0056] A reducing coupling is a pipe connection device used to connect pipes or equipment of different diameters. Its core function is to achieve a smooth transition in diameter, ensuring stable flow of fluid (gas or liquid) in the piping system and reducing turbulence, pressure loss, or noise that may be caused by sudden changes in diameter.
[0057] It should be noted that the present invention does not limit the structure of the reducing joint 4, such as whether it is conical or stepped. Furthermore, the material of the reducing joint 4 may include, but is not limited to, metal reducing joints (such as carbon steel, stainless steel, aluminum alloy, etc.) and plastic reducing joints (such as PVC, PP, etc.). Further, the reducing joint 4 can be connected to the main air duct 21 and the fan 4 by welding, threads, or other methods, and the present invention does not limit this connection.
[0058] Compared with the prior art, the computer room heat dissipation system provided by this utility model achieves at least the following beneficial effects:
[0059] First, the air guide plate 12 guides the cool air entering from the air inlet 14 of the front door panel to the area around the enclosure 11 for equipment cooling, and finally exhausts the hot air through the air outlet 15 of the cabinet 1. The cool air flows along the enclosure 11, absorbing the heat generated by the 5G baseband unit, thus achieving effective heat dissipation. The angled design of the first air guide plate 121 and the second air guide plate 122 guides airflow, making the airflow within the cabinet 1 more natural, avoiding air stagnation and heat accumulation, and effectively reducing the risk of equipment overheating.
[0060] Furthermore, the configuration of air duct 2 further optimizes the airflow path. The secondary air duct 22 corresponds to each 5G baseband unit, ensuring sufficient airflow for heat dissipation and preventing uneven heat dissipation caused by multiple 5G baseband units sharing the same secondary air duct 22. Additionally, the diameter of the main air duct 21 is larger than that of the secondary air duct 22, ensuring that the main air duct 21 can simultaneously accommodate the airflow from multiple secondary air ducts 22. This achieves a smooth transition of airflow between the main air duct 21 and the multiple secondary air ducts 22, resulting in a more balanced load on the fan 3, reducing the burden on the fan 3, and thus improving the working efficiency of the fan 3.
[0061] The fan 3 is connected to the main air duct 21 by a reducing connector 4. The first end 41 of the reducing connector 4 has the same diameter as the main air duct 21, while the second end 42 matches the diameter of the fan 3 duct. The diameter of the second end 41 is larger than that of the first end 42, which further helps to smoothly transition the airflow, reduce airflow friction and loss, and improve the working efficiency of the fan 3 and the heat dissipation performance of the entire computer room heat dissipation system.
[0062] The above configuration ensures the data center's cooling system offers excellent equipment stability and a long service life. Through efficient heat dissipation design, the temperature of the 5G baseband unit and other data center equipment is kept within a safe range, preventing equipment failure or performance degradation caused by overheating, thereby improving equipment stability and durability.
[0063] Example 2
[0064] Based on the above embodiments, the computer room heat dissipation system provided in this application may further include the following structure:
[0065] Optionally, adjacent secondary air ducts 22 are connected by connecting flanges 5, and each secondary air duct 22 is provided with a heat collection box 6 at the end away from the main air duct 21.
[0066] For example, the connecting flange 5 is a pipe connector with a disc-shaped structure, which can connect adjacent secondary air ducts 22 by means of bolts, gaskets, etc., thus achieving a reliable connection between the secondary air ducts 22. The connecting flange 5 can be made of metal or plastic, and this invention does not limit this. By providing the connecting flange 5, the installation and disassembly of the secondary air ducts 22 can be facilitated, and a firm connection between the secondary air ducts 22 can be ensured, preventing loosening due to vibration or airflow pressure. At the same time, it provides reliable airtightness, preventing airflow leakage or external pollutants from entering the secondary air ducts 22.
[0067] For example, the heat collector 6 is located at the end of the secondary air duct 22 away from the main air duct 21, and can be used to collect and distribute heat. The heat collector 6 can be made of metal (such as stainless steel or aluminum alloy), thus providing good heat resistance and sealing. Furthermore, the heat collector 6 can centrally process the hot air delivered from the secondary air duct 22, improving heat utilization efficiency. This allows the centrally collected hot air to be transported through the secondary air duct 22 to the main air duct 21, and then through the main air duct 21 to the fan 3, and finally to the outside, thereby achieving heat dissipation for the computer room cooling system.
[0068] Optionally, the main air duct 21 and the secondary air duct 22 are connected by a connecting flange 5, and a shock-absorbing flexible hose 7 is also provided between the main air duct 21 and the fan 3.
[0069] For example, the main air duct 21 and multiple secondary air ducts 22 can be connected via the connecting flange 5 to form a complete airflow delivery network. The connecting flange 5 facilitates the disassembly and reassembly of the main air duct 21 and the multiple secondary air ducts 22, making later maintenance and adjustments easier. Furthermore, a sealing gasket can be installed on the connecting flange 5 to ensure that no airflow leakage occurs at the connection between the main air duct 21 and the secondary air ducts 22.
[0070] For example, the vibration-damping hose 7 can be used to absorb vibrations, buffer noise, and improve equipment stability. It should be understood that the fan 3 will generate vibrations due to its high-speed rotation during operation, and these vibrations may be transmitted to other equipment through the main air duct 21, thus affecting the stability of the computer room's cooling system. Because the vibration-damping hose 7 has a flexible structure, it can effectively absorb the vibrations generated by the fan 3 during operation, preventing them from being transmitted to the main air duct 21 and downstream equipment. Furthermore, the vibrations of the fan 3 during operation can induce resonance, thereby generating noise. The flexible material (such as rubber or fabric) of the vibration-damping hose 7 can reduce noise transmission. In addition, the rigid connection between the fan 3 and the main air duct 21 may loosen or be damaged due to vibration. Therefore, the flexible connection of the vibration-damping hose 7 can avoid the problems of a rigid connection between the fan 3 and the main air duct 21, improving the lifespan and stability of the connection.
[0071] For example, the material of the shock-absorbing hose 7 includes rubber, silicone, stainless steel braided mesh, etc., and this utility model does not limit it in this regard.
[0072] By using a connecting flange 5 to connect the main air duct 21 and the secondary air duct 22, and by adding a shock-absorbing flexible hose 7 between the main air duct 21 and the fan 3, the computer room heat dissipation system has both high sealing performance and shock resistance, which can not only improve the heat dissipation efficiency of the computer room heat dissipation system, but also extend the service life of the equipment.
[0073] Optionally, the mounting bracket 13 is a beam structure and is horizontally installed inside the cabinet 1 via a slide rail.
[0074] For example, the mounting bracket 13 is a beam structure, which provides robust support and can bear the weight of the fixed enclosure 11 and the 5G baseband unit, preventing deformation or damage due to uneven stress. Furthermore, the beam structure has a small cross-sectional area, providing reliable support within a limited space without occupying additional space in the cabinet 1. Moreover, the mounting bracket 13 is horizontally mounted inside the cabinet 1 via slide rails, thereby providing flexible adjustment and mobility of the mounting bracket 13 in the horizontal direction.
[0075] For example, the material of the mounting bracket 13 may include steel, aluminum alloy, and composite materials, etc., and this utility model does not limit it in this regard.
[0076] Optionally, the other end of the fan 3 is connected to a heat pipe 8, and an insect-proof net 9 is vertically installed inside the heat pipe 8.
[0077] For example, the heat pipe 8 can effectively transfer heat from inside the fan 3 to the outside through the high thermal conductivity of the inner wall material and the airflow circulation within the pipe. The material of the heat pipe 8 includes aluminum, stainless steel, copper, etc., and this invention does not limit this to any particular material, thereby enabling the heat pipe 8 to have excellent thermal conductivity and durability.
[0078] For example, please refer to Figure 6 , Figure 6 This is a schematic diagram of the insect-proof net provided by this utility model. (See attached diagram.) Figure 6 As shown, an insect-proof net 9 is vertically installed inside the heat pipe 8. The insect-proof net 9 has a mesh structure and is vertically installed to cover the entire inside of the heat pipe 8 without affecting the airflow. In addition, the insect-proof net 9 can effectively prevent insects, dust and other small foreign objects from entering the equipment through the heat pipe 8, thus avoiding affecting the normal operation of the fan 3 or other internal components.
[0079] For example, the insect net 9 can be made of high temperature resistant and corrosion resistant materials, such as metal mesh or plastic mesh, etc. This utility model does not limit it in this way.
[0080] Optionally, the air outlet 15 is provided with a fan (not shown), including a temperature regulating fan, which is fixed to the air outlet 15 by a bracket or mounting hole.
[0081] It should be understood that fans can improve the heat dissipation efficiency of equipment by forcing airflow. Therefore, installing a fan at the air outlet 15 can enhance the airflow effect and further optimize heat dissipation performance.
[0082] For example, the fan includes a temperature-regulating fan, which is an intelligent cooling device that automatically adjusts its speed according to temperature changes. Specifically, the temperature-regulating fan integrates a temperature sensor. When it detects an increase in temperature, the fan automatically speeds up to enhance heat dissipation. When it detects a decrease in temperature, the fan speed slows down to reduce energy consumption and noise.
[0083] For example, the temperature-regulating fan is fixed to the air outlet 15 via a bracket or mounting holes. The bracket is used to securely mount the temperature-regulating fan at the air outlet 15, and the bracket can be made of metal or high-strength plastic, etc., for durability. Alternatively, the temperature-regulating fan can be directly fixed to the frame or panel of the air outlet 15 using bolts; this invention does not limit this method.
[0084] Optionally, the insertion box 11 also includes a standard panel (not shown), which is fixed to the empty space of the insertion box 11 through mounting holes.
[0085] For example, a standard panel is a flat panel assembly designed to specific specifications, which may be made of metal or high-strength plastic, and can be fixed to the empty space in the insertion box 11 through mounting holes to close the empty space in the insertion box 11.
[0086] It should be understood that if the empty spaces within socket 11 are not sealed, it will cause turbulent airflow inside the equipment, resulting in incomplete exhaust of hot air, which will accumulate inside socket 11 and affect the equipment's lifespan. Therefore, setting up a standard panel to tightly seal the empty spaces ensures the effectiveness of the airflow path, thereby improving heat dissipation efficiency.
[0087] Although specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.
Claims
1. A computer room heat dissipation system, characterized in that, The data center cooling system includes 5G baseband units, server racks, and air ducts, wherein: The cabinet includes a front panel and a back panel. The front panel includes an air inlet, and the back panel includes an air outlet. The cabinet contains a mounting box and an air guide plate. The mounting box is a cuboid structure and is vertically mounted on a mounting bracket in the cabinet. The 5G baseband unit is installed inside the mounting box. The air guide plate is horizontally positioned at the top and bottom of the mounting box and guides the air from the air inlet to the air outlet. The air guide plate includes a first air guide plate and a second air guide plate. The first air guide plate is placed at the upper end of the cabinet, and the second air guide plate is placed at the lower end of the cabinet. The first air guide plate is inclined upwards, and the second air guide plate is inclined downwards. One end of the air duct is connected to the air outlet, and the other end of the air duct is connected to the fan; The air duct includes a main air duct and a secondary air duct. The number of secondary air ducts is the same as the number of 5G baseband units, and each secondary air duct corresponds to a 5G baseband unit. The diameter of the main air duct is larger than the diameter of the secondary air duct. One end of the secondary air duct is connected to the air outlet, and the other end of the secondary air duct is connected to one end of the main air duct. The other end of the main air duct is connected to the fan. The main air duct is connected to the fan via a reducing joint. The diameter of the first end of the reducing joint is the same as the diameter of the main air duct, and the diameter of the second end of the reducing joint is the same as the diameter of the fan duct. The diameter of the second end of the reducing joint is larger than the diameter of the first end of the reducing joint.
2. The computer room heat dissipation system according to claim 1, characterized in that, The adjacent secondary air ducts are connected by connecting flanges, and each secondary air duct is equipped with a heat collection box at the end away from the main air duct.
3. The computer room heat dissipation system according to claim 1, characterized in that, The main air duct and the auxiliary air duct are connected by a connecting flange, and a shock-absorbing flexible hose is also provided between the main air duct and the fan.
4. The computer room heat dissipation system according to claim 1, characterized in that, The mounting bracket is a beam structure and is horizontally installed inside the cabinet via slide rails.
5. The computer room heat dissipation system according to claim 1, characterized in that, The other end of the fan is connected to a heat pipe, and an insect-proof net is vertically installed inside the heat pipe.
6. The computer room heat dissipation system according to claim 1, characterized in that, The air outlet is equipped with a fan, which includes a temperature regulating fan. The temperature regulating fan is fixed at the air outlet by a bracket or mounting hole.
7. The computer room heat dissipation system according to claim 1, characterized in that, The insertion box also includes a standard panel, which is fixed in the empty space of the insertion box through mounting holes.