Heat dissipation structure of high-power-density power supply module

Abstract

The utility model relates to the technical field of aviation power supply heat dissipation, in particular to a high-power-density power supply module heat dissipation structure. According to the technical scheme, a first electrical element and a second electrical element are installed on an aluminum substrate, a potting shell is arranged on the outer side of the first electrical element, potting glue is poured between the potting shell and the first electrical element to form sealing and assist in heat dissipation, a control panel is installed above the aluminum substrate, and the first electrical element and the second electrical element are electrically connected with the control panel. A heat dissipation pressing plate is installed above the control panel, the heat dissipation pressing plate not only plays a role in reinforcing the structure, but also blocks and seals the open end of the potting shell to prevent dust and moisture from invading, meanwhile, the heat dissipation pressing plate serves as an additional heat dissipation layer to improve the overall heat dissipation efficiency, and the heat dissipation pressing plate blocks and seals the open end of the potting shell. According to the utility model, effective heat dissipation of the high-power-density power supply module is realized, the reliability and stability of the power supply module are improved, and the power supply module is suitable for aviation and other fields requiring high-reliability and high-performance power supply systems.

Description

TECHNICAL FIELD

[0001] The utility model relates to aviation power supply heat dissipation technical field, concretely relates to a high power density power module heat dissipation structure. BACKGROUND

[0002] The main heat generating devices of the high-power power conversion module are power switch tube devices, inductors and transformer magnetic devices, etc. Under the condition of excessive current, the switch tube, inductor and transformer generate a large amount of heat, and the ratio of surface area to volume is small, so it is difficult to dissipate heat, and heat accumulation is easy to occur, which affects the surrounding devices. Considering the environmental adaptability requirements of the aviation secondary power conversion product, the equipment fails due to the overheating protection and device overheating damage caused by the unsatisfied design of the high-power density power module heat dissipation.

[0003] After searching, the patent with patent announcement number CN202210870581.9 discloses a self-cooling aviation power supply. Although the device can dissipate heat for the aviation power supply body inside the fixed bin under the action of the motor and the first blade by setting the heat dissipation mechanism, the device cannot dissipate heat for the high-heat-generating elements inside the power supply. Since the heat dissipation mechanism cannot cool the high-heat-generating elements inside the power supply, the overall heat dissipation efficiency may be affected. If the high-heat-generating elements cannot be effectively cooled, the overall temperature may rise, which may affect the performance and service life of the aviation power supply. UTILITY MODEL CONTENTS

[0004] In view of the deficiencies of the prior art, the utility model provides a high-power density power module heat dissipation structure, which solves the problems raised in the background art.

[0005] The technical problem solved by the utility model is as follows:

[0006] A high-power density power module heat dissipation structure, comprising an aluminum substrate, a first electrical element and a second electrical element are installed on the aluminum substrate,

[0007] The outer side of the first electrical element is provided with a potting shell, potting glue is filled between the potting shell and the first electrical element, a control panel is installed above the aluminum substrate, a heat dissipation press plate is installed above the control panel, and the heat dissipation press plate seals the opening end of the potting shell.

[0008] On the basis of the above technical scheme, the utility model can also be improved as follows.

[0009] Further, the aluminum substrate is surface-tacked with high-heat-generating devices, and the high-heat-generating devices include the first electrical element and the second electrical element.

[0010] The beneficial effects of the above further scheme are:

[0011] By directly soldering the high-heat devices on the aluminum substrate, the high thermal conductivity of the aluminum substrate can be fully utilized to achieve rapid heat conduction and dissipation. This design helps to improve the heat dissipation efficiency, reduce the working temperature of the device, thereby prolonging the service life of the device and improving the reliability of the system.

[0012] Further, the first electrical element includes an inductor and a transformer.

[0013] The beneficial effects of the above further scheme are:

[0014] Inductors and transformers are common heat-generating elements in power modules. By using them as the first electrical element and directly soldering them on the aluminum substrate, heat dissipation can be more effective. This design helps to reduce performance degradation and failure rate caused by overheating, and improves the overall performance of the power module.

[0015] Further, the second electrical element includes a MOS tube and a rectifier diode, and the MOS tube and the rectifier diode are respectively mounted with a first heat sink and a second heat sink.

[0016] The beneficial effects of the above further scheme are:

[0017] MOS tubes and rectifier diodes are also relatively serious heat-generating devices. By mounting heat sinks on them respectively, the heat dissipation area can be further increased, and the heat dissipation efficiency can be improved. This design helps to ensure that the MOS tube and the rectifier diode can work stably under high power density, and reduces damage caused by overheating.

[0018] Further, the control board is soldered on the upper surface of the smaller heat-generating devices.

[0019] The beneficial effects of the above further scheme are:

[0020] Soldering smaller heat-generating devices on the control board can achieve effective isolation and separate management of heat. This design helps to reduce the accumulation of heat on the control board, reduce the working temperature of the control board, and improve the stability and reliability of the control board.

[0021] Further, the first electrical element is surrounded by the potting shell, and then the first electrical element is filled with potting glue, and the coil heat of the first electrical element is conducted to the heat dissipation press plate and the aluminum substrate through the potting glue, and the heat is dissipated bidirectionally.

[0022] The beneficial effects of the above further scheme are:

[0023] The use of the potting shell and the potting glue not only provides electrical isolation and mechanical protection, but also conducts the heat generated by the first electrical element to the heat dissipation press plate and the aluminum substrate through the potting glue, realizing bidirectional conduction and dissipation of heat. This design helps to further improve the heat dissipation efficiency, reduce the working temperature of the first electrical element, and thus improve the reliability and stability of the entire power module. At the same time, the use of the potting shell and the potting glue also enhances the durability and electrical performance of the system.

[0024] The utility model provides a kind of high power density power module heat dissipation structure. It has the following beneficial effects:

[0025] By using the aluminum substrate as the heat dissipation base, the heat generated by the heating elements can be effectively conducted away due to its good heat conduction performance. The devices with serious heating (such as the first electrical element and the second electrical element) are subjected to targeted heat dissipation through specific heat dissipation design (such as potting glue, first heat dissipation strip and second heat dissipation strip), ensuring that the heat can be quickly conducted and dissipated.

[0026] The first electrical element is designed with a potting shell and potting glue, which not only provides electrical isolation and mechanical protection, but also conducts heat to the heat dissipation press plate and the aluminum substrate through the potting glue, realizing bidirectional conduction and heat dissipation of heat. The MOS tube and the rectifier diode on the second electrical element are respectively installed with the first heat dissipation strip and the second heat dissipation strip, further enhancing the heat dissipation effect.

[0027] The devices with serious heating and the devices with less heating are respectively installed on the aluminum substrate and the control board, and the effective isolation and separate management of heat are realized through layered design. The setting of the heat dissipation press plate not only blocks the opening end of the potting shell, but also serves as an additional heat dissipation layer, further improving the overall heat dissipation efficiency.

[0028] The efficient heat dissipation design helps to reduce the working temperature of the electrical elements, reduce the performance degradation and failure rate caused by overheating, and thus improve the reliability and stability of the entire power module. The use of the potting shell and the potting glue also provides additional electrical protection and mechanical strength, enhancing the durability of the system. BRIEF DESCRIPTION OF DRAWINGS

[0029] The drawings described herein are used to provide further understanding of the utility model and form part of the present application. The schematic embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute undue limitation on the utility model.

[0030] In the drawings:

[0031] Figure 1 It is the front view appearance schematic drawing of the utility model;

[0032] Figure 2 It is the appearance schematic drawing of the aluminum substrate of the utility model with control board.

[0033] Figure 3 A schematic diagram showing the appearance of the aluminum substrate of this utility model with a potting shell, a first heat sink, and a second heat sink installed.

[0034] Figure 4 This is a schematic diagram of the main appearance of the aluminum substrate of this utility model.

[0035] The attached diagram lists the components represented by each number as follows:

[0036] 1. Encapsulation shell; 2. Heat dissipation plate; 3. Aluminum substrate; 4. Control board; 5. Encapsulating adhesive; 6. First electrical component; 7. First heat dissipation strip; 8. Second heat dissipation strip; 9. Second electrical component. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] Please see Figures 1 to 4 As shown, the embodiments provided by this utility model are as follows: Example

[0039] A high-power-density power module heat dissipation structure includes an aluminum substrate 3, on which a first electrical component 6 and a second electrical component 9 are mounted. A control board 4 is mounted on top of the aluminum substrate 3. Components that generate significant heat, including the first electrical component 6 and the second electrical component 9, are surface-mounted on the aluminum substrate 3. By directly surface-mounting these components onto the aluminum substrate 3, the high thermal conductivity of the aluminum substrate 3 can be fully utilized to achieve rapid heat conduction and dissipation. This design helps improve heat dissipation efficiency, reduce the operating temperature of the components, thereby extending the lifespan of the components and improving system reliability. Components that generate less heat are surface-mounted on the control board 4. Surface-mounting these less heat-generating components onto the control board 4 allows for effective heat isolation and separate management. This design helps reduce heat accumulation on the control board 4, lowers its operating temperature, and thus improves the stability and reliability of the control board 4. Example

[0040] To increase the heat dissipation efficiency of the first electrical component 6 and the second electrical component 9, for example, such as Figures 1 to 4As shown, this utility model also includes: a first electrical component 6 comprising an inductor and a transformer. Inductors and transformers are common heat-generating components in power modules. Using them as the first electrical component 6 and directly soldering them onto the aluminum substrate 3 can more effectively dissipate heat. This design helps reduce performance degradation and failure rate caused by overheating, and improves the overall performance of the power module. A potting shell 1 is provided on the outside of the first electrical component 6, and potting compound 5 is injected between the potting shell 1 and the first electrical component 6. A second electrical component 9 comprises a MOSFET and a rectifier diode, and a first heat sink 7 and a second heat sink 8 are respectively mounted on the MOSFET and the rectifier diode. MOSFETs and rectifier diodes are also devices that generate significant heat. By mounting heat sinks on them respectively, the heat dissipation area can be further increased, and the heat dissipation efficiency can be improved. This design helps ensure stable operation of the MOSFETs and rectifier diodes under high power density, reducing damage caused by overheating. A heat sink 2 is mounted on top of the control board 4, sealing the opening of the potting shell 1. The potting shell 1 surrounds the first electrical component 6, and then potting the first electrical component 6 with potting compound 5. This allows the heat from the coil of the first electrical component 6 to be conducted through the potting compound 5 to the heat sink 2 and the aluminum substrate 3, achieving bidirectional heat dissipation. The use of the potting shell 1 and potting compound 5 not only provides electrical isolation and mechanical protection but also conducts the heat generated by the first electrical component 6 to the heat sink 2 and the aluminum substrate 3 through the potting compound 5, achieving bidirectional heat conduction and dissipation. This design helps further improve heat dissipation efficiency, reduce the operating temperature of the first electrical component 6, and thus improve the reliability and stability of the entire power module. Simultaneously, the use of the potting shell 1 and potting compound 5 also enhances the system's durability and electrical performance.

[0041] Working principle:

[0042] The aluminum substrate 3 serves as the foundation of the entire heat dissipation device and possesses excellent thermal conductivity. Components that generate significant heat (such as inductors, transformers, MOSFETs, and rectifier diodes) are soldered or directly mounted on the aluminum substrate 3, and the heat generated is rapidly conducted through the aluminum substrate 3. The first electrical component 6 (including inductors and transformers) is surrounded by the potting shell 1 and forms a heat conduction path with the heat dissipation plate 2 and the aluminum substrate 3 through the potting compound 5.

[0043] The potting compound 5 not only serves to fix and electrically isolate the components, but also effectively conducts the heat generated by the first electrical component 6 to the heat sink 2 and the aluminum substrate 3. The second electrical component 9 (including a MOSFET and a rectifier diode) is equipped with a first heat sink 7 and a second heat sink 8, respectively. These heat sinks improve heat conduction efficiency by increasing the heat dissipation area and the contact area with air.

[0044] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0045] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A heat dissipation structure for a high power density power module, comprising an aluminum substrate (3), wherein a first electrical component (6) and a second electrical component (9) are mounted on the aluminum substrate (3), characterized in that: The first electrical component (6) is provided with a potting shell (1) on its outer side. A potting compound (5) is injected between the potting shell (1) and the first electrical component (6). A control board (4) is installed above the aluminum substrate (3). A heat dissipation plate (2) is installed above the control board (4). The heat dissipation plate (2) seals the opening end of the potting shell (1).

2. The heat dissipation structure for a high power density power module according to claim 1, characterized in that: The aluminum substrate (3) is surface-mounted with devices that generate significant heat, including a first electrical component (6) and a second electrical component (9).

3. The heat dissipation structure for a high power density power module according to claim 2, characterized in that: The first electrical component (6) includes an inductor and a transformer.

4. The heat dissipation structure for a high power density power module according to claim 2, characterized in that: The second electrical component (9) includes a MOSFET and a rectifier diode, and a first heat sink (7) and a second heat sink (8) are respectively mounted on the MOSFET and the rectifier diode.

5. The heat dissipation structure for a high power density power module according to claim 1, characterized in that: The components with low heat generation are soldered onto the surface of the control board (4).

6. The heat dissipation structure for a high power density power module according to claim 1, characterized in that: The potting shell (1) surrounds the first electrical component (6) and then pots the first electrical component (6) with potting glue (5), thereby conducting the coil heat of the first electrical component (6) to the heat dissipation plate (2) and the aluminum substrate (3) through the potting glue (5) for bidirectional heat dissipation.

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