Main control module integrated with heat dissipation module and light source device

Abstract

The utility model provides a heat dissipation module integrated master control module and light source device, the heat dissipation module and the master control module are fixed together to form an integral module, the master control module comprises a master control board (21), an optical fiber box (22), a base plate (23) and optical fibers, the master control board (21) is fixed at the upper end of the optical fiber box (22), the optical fiber box (22) is a box body with a lower opening, the side edge of the optical fiber box (22) is provided with an opening, and the optical fiber box (22) is fixed on the base plate (23). An optical fiber is placed in the middle space of the optical fiber box (22), the bottom of the optical fiber box (22) is fixed to the bottom plate (23), a notch is designed in one corner of the main control board (21) and one corner of the optical fiber box (22), and the heat dissipation module is fixedly embedded in the notch. According to the utility model, the heat dissipation module adopts an embedded design and is embedded in the gap of the master control module, so that the product size can be effectively reduced, and the overall size is small; the modular design is adopted, production and processing are convenient, and product assembling and debugging are convenient.

Description

Technical Field

[0001] This utility model belongs to the field of quantum communication equipment, specifically a main control module and a light source device with an integrated heat dissipation module. Background Technology

[0002] High-speed picosecond pulse light sources (typically with pulse frequencies of 100 kHz to 1.25 GHz and a pulse half-width of less than 60 ps) are multifunctional weakly coherent light sources. They feature ultra-narrow pulse modulation, pulse repetition frequency adjustment, and light intensity self-calibration. They are increasingly widely used in quantum key distribution (QKD) systems, single-photon detector testing, and laser ranging, and are gradually becoming an increasingly important tool in quantum communication and modern industry.

[0003] However, in practice, traditional devices have problems such as large size, unsightly appearance, and inconvenient placement. For light source devices, especially high-speed picosecond pulse light source devices, a lot of heat is generated during use. Traditional devices have low heat dissipation efficiency, and if heat dissipation cannot be done in time, it will have a significant impact on the working performance of internal components. Utility Model Content

[0004] The technical problem to be solved by this invention is how to make the main control module more compact, thereby further reducing the size of the light source device.

[0005] This utility model solves the above-mentioned technical problems through the following technical means: a main control module with an integrated heat dissipation module, wherein the heat dissipation module and the main control module are fixed together to form an integral module, the main control module includes a main control board (21), an optical fiber box (22), a base plate (23) and optical fiber, the main control board (21) is fixed on the upper end of the optical fiber box (22), the optical fiber box (22) is a box with an opening at the bottom and an opening on its side, the optical fiber is placed in the middle space of the optical fiber box (22), the bottom of the optical fiber box (22) and the base plate (23) are fixed, a notch is designed at a corner of the main control board (21) and the optical fiber box (22), and the heat dissipation module is fixedly embedded in the notch.

[0006] As a further optimized technical solution, the heat dissipation module includes a fan (32) and a fan mounting bracket (33), wherein the fan (32) is fixed to the rear side of the fan mounting bracket (33), and the fan mounting bracket (33) is fixed to the base plate (23).

[0007] As a further optimized technical solution, the fan (32) is an exhaust fan.

[0008] This utility model also provides a light source device for a main control module that adopts the integrated heat dissipation module described in any of the above schemes, including a chassis and a main control module and a heat dissipation module located inside the chassis, wherein the base plate (23) is fixed on the chassis bottom shell (14) of the chassis.

[0009] As a further optimized technical solution, the chassis includes a front panel (11), a top cover (12), a rear panel (13), and a chassis bottom shell (14), which together form an internal space.

[0010] As a further optimized technical solution, bolts (141) fix the front panel (11) to the chassis bottom shell (14) from the inside of the chassis bottom shell (14), bolts (234) fix the bottom plate (23) to the chassis bottom shell (14) from the bottom of the chassis bottom shell (14), bolts (143) fix the rear panel (13) to the chassis bottom shell (14) from the inside of the chassis bottom shell (14), the front and left and right sides of the top cover (12) are respectively clipped into the front panel (11) and the chassis bottom shell (14), and bolts (123) fix the rear panel (13) to the top cover (12) from the rear side of the rear panel (13).

[0011] As a further optimized technical solution, an acrylic plate (114) is fixed on the front side of the front panel (11). The fiber optic flange (115) and the power button (116) pass through the acrylic plate (114) and are installed in the front panel (11). The dustproof net (117) of the front panel is bonded to the corresponding position on the back of the grille (111) of the front panel (11). The status indicator light is welded to the light plate (118). The status indicator light passes through the front panel (11) and the acrylic plate (114). The light plate (118) is fixed on the corresponding position on the back of the front panel (11).

[0012] As a further optimized technical solution, the chassis bottom shell (14) is a U-shaped bottom shell with openings at the top and front and rear. Grilles are provided on the left and right side plates of the chassis bottom shell (14). Side dustproof nets (144) and side blind plates (145) are respectively bonded to the inside of the grilles on the left and right side plates of the chassis bottom shell (14).

[0013] As a further optimized technical solution, a grille (132) is opened on the right side of the rear panel (13) as an air outlet, a grille (111) is opened on the left side of the front panel (11) and a grille is opened on the left side of the chassis bottom shell (14) as the first air inlet and the second air inlet, respectively, and the heat dissipation module is located inside the air outlet.

[0014] As a further optimized technical solution, the main control board (21) is provided with a power chip, a laser and an FPGA control chip. The power chip is placed in the area near the second air inlet and the rear panel (13), and the laser and the FPGA control chip are placed in the center of the main control board (21).

[0015] The advantages of this utility model are:

[0016] 1. The heat dissipation module of this utility model adopts an embedded design, which is embedded in the notch of the main control module, effectively reducing the product volume and making the overall size of the machine small;

[0017] 2. The modular design integrates the main control module and the heat dissipation module into a single module, facilitating production, processing, product assembly, and debugging.

[0018] 3. The product features a concealed bolt design, with no bolts on the top, front, or sides. The bolts on the outside of the chassis are mainly located on the rear and bottom sides, resulting in a better overall aesthetic appearance.

[0019] 4. The light source device of this utility model is designed with a heat dissipation air duct and a fan as an exhaust fan. The laser and FPGA devices, which are greatly affected by temperature, are placed in the position with the largest air volume to dissipate heat in time. The power chip is placed in the position where the air volume flows to remove the heat of the power chip. Through the air intake on the front panel and the left side of the chassis, and the exhaust fan, the hot air inside the chassis can be extracted to keep the overall temperature of the main control board evenly distributed and avoid local overheating, which can effectively improve the heat dissipation efficiency. Attached Figure Description

[0020] Figure 1 This is an exploded view of the light source device according to an embodiment of this utility model;

[0021] Figure 2 This is a schematic diagram of the heat dissipation design of the light source device according to an embodiment of this utility model;

[0022] Figure 3 This is a temperature distribution diagram of the heating element on the main control board of the light source device in an embodiment of this utility model at an ambient temperature of 20°C. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] It should be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this disclosure.

[0025] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0026] The light source device proposed in this solution, such as Figure 1 As shown, it includes the chassis, main control module, and heat dissipation module.

[0027] The chassis includes a front panel 11, a top cover 12, a rear panel 13, and a chassis bottom shell 14. The front panel 11, the top cover 12, the rear panel 13, and the chassis bottom shell 14 together form an internal space, in which the main control module and the heat dissipation module are placed.

[0028] The front panel 11 has a grille 111 on the left side, which serves as the first air intake of the chassis. Several first mounting holes 112 and second mounting holes 113 are opened on the right side of the grille 111 on the front panel 11. An acrylic plate 114 is pasted on the front panel 11. Several third mounting holes and fourth mounting holes are opened on the acrylic plate 114 at the positions corresponding to the first mounting holes 112 and second mounting holes 113. The fiber optic flange 115 and the power button 116 are installed in the corresponding first mounting holes 112 of the front panel 11 after passing through the third mounting holes of the acrylic plate 114 with their own threaded nuts. The dustproof mesh 117 of the front panel is pasted on the corresponding position on the back of the grille 111 of the front panel 11. The status indicator light is soldered to the light plate 118 through the pins. After the status indicator light passes through the second mounting holes 113 of the front panel 11 and the fourth mounting holes of the acrylic plate 114, the light plate 118 is fixed to the corresponding position on the back of the front panel 11 by two bolts 1182. Three screw holes are opened on the front panel 11.

[0029] Two screw holes are provided on the rear side of the top cover 12. Two bolts 123 pass through the rear side of the rear panel 13 and are screwed into the screw holes on the rear side of the top cover 12, thereby fixing the top cover 12 and the rear panel 13.

[0030] Three screw holes are provided on the rear panel 13, and a grille 132 is provided on the right side of the rear panel 13 as an air outlet for the chassis.

[0031] The chassis bottom shell 14 is a U-shaped shell with openings at the top and front and rear. Through holes are provided at the front and rear of the bottom plate. Bolts 141 and 143 are passed through the corresponding through holes and screwed into the screw holes at the bottom of the front panel 11 and rear panel 13, respectively, to fix the front panel 11 and rear panel 13 to the front and rear sides of the chassis bottom shell 14. Grilles are provided on the left and right side panels of the chassis bottom shell 14. Side dust filters 144 and side blind plates 145 are respectively adhered to the inside of the grilles on the left and right side panels of the chassis bottom shell 14. The grille on the left side panel of the chassis bottom shell 14 serves as the second air inlet for the chassis.

[0032] The main control module includes a main control board 21, an optical fiber box 22, a base plate 23, and optical fibers (not shown in the figure). The main control board 21 is fixed to the upper end of the optical fiber box 22 by eight bolts 212. The optical fiber box 22 is a box with an opening at the bottom and openings on its sides for introducing optical fibers from the main control board 21. The central space of the optical fiber box 22 is used to coil the optical fibers from the main control board 21. The edges of the optical fiber box 22 and the base plate 23 are connected and fixed by several bolts 223 to fix the position of the optical fibers and prevent them from being exposed. Four screw holes are opened at the four corners of the bottom of the base plate 23. Four bolts 234 are passed through the corresponding through holes of the chassis bottom shell 14 and screwed into the screw holes at the bottom of the base plate 23 to fix the base plate 23 to the chassis bottom shell 14.

[0033] As those skilled in the art will know, there is no limit to the number of mounting holes and screw holes, or the specific number of bolts, as long as the purpose of installation can be achieved.

[0034] The main control board 21 contains a power chip, a laser, and an FPGA control chip, all of which are areas with high heat dissipation. To meet the heat dissipation requirements, the power chip is placed at the second air inlet on the left side of the chassis, while the laser and FPGA control chip are placed in the center of the main control board 21. The specific airflow design is described in the heat dissipation design section below.

[0035] The heat dissipation module includes a fan 32 and a fan mounting bracket 33. Four through holes are provided at the four front corners of the fan mounting bracket 33. Four bolts 334 pass through these through holes and are screwed into the corresponding screw holes of the fan 32, thus fixing the fan 32 to the fan mounting bracket 33. The heat dissipation module adopts an embedded design, with the fan 32 embedded in the notch between the main control board 21 and the fiber optic box 22. Specifically, a rectangular notch is designed on the right rear side of the main control board 21 and the fiber optic box 22, providing space for installing the fan 32 and the fan mounting bracket 33. Bolts 233 pass through the through holes in the bottom of the base plate 23 and are screwed into the screw holes at the bottom of the fan mounting bracket 33, thus fixing the fan mounting bracket 33 with the fan 32 to the base plate 23. This overall structural design effectively increases the space utilization of the entire chassis and reduces the overall length and width of the chassis.

[0036] like Figure 2 As shown, the heat dissipation design is as follows: fan 32 is the exhaust fan, the right side grille 132 of the rear panel 13 is the exhaust vent, the left side grille 111 of the front panel 11 and the left side grille of the chassis bottom 14 are the first and second air inlets, respectively. Cool air flows in from the first and second air inlets, passes through the main control board 21, and is then drawn out by the fan 32 to the exhaust vent, ensuring airflow over the entire main control board 21. The area near the first and second air inlets of the main control board 21 has the highest airflow, and the main heat-generating components are placed in this area, including the laser and the FPGA control chip. Located in the middle of the main control board 21, the FPGA control chip and laser are significantly affected by temperature. Excessive temperature rise can affect the overall performance of the product and shorten the lifespan of the FPGA control chip and laser. Therefore, ensuring effective heat dissipation in this area is paramount. Through airflow design, air entering from both the first and second air inlets flows through this area, maximizing airflow and effectively removing heat generated by these two components. Heat sinks are added to the main heat-generating components to further aid heat dissipation, maintaining a uniform temperature distribution across the main control board 21 and preventing localized overheating. Additionally, the power chip is placed near the second air inlet and the rear panel 13 area. This area has sufficient airflow to prevent excessive temperature rise in the power chip, and since the power chip itself has a relatively high junction temperature, effective heat dissipation ensures its performance and lifespan.

[0037] This design employs a concealed bolt system: the front panel 11 is fixed to the chassis bottom shell 14 from the inside using bolts 141, the internal heat dissipation module is fixed to the base plate 23, and the base plate 23 is fixed to the chassis bottom shell 14 from the bottom using bolts 234. The rear panel 13 is fixed to the chassis bottom shell 14 from the inside using bolts 143. Finally, the front and left / right sides of the top cover 12 are respectively clipped onto the front panel 11 and the chassis bottom shell 14, and then fixed to the rear panel 13 using bolts 123. The entire machine has no bolts on the top, front, and sides, resulting in an aesthetically pleasing design.

[0038] The installation steps for the light source device proposed in this solution are as follows:

[0039] First, attach the side blind plate 145 to the right side grille of the chassis bottom shell 14, and attach the side dustproof mesh 144 to the grille of the left side panel of the chassis bottom shell 14. Then, connect the main control board 21 to the fiber optic box 22 with bolts 212, and coil the fiber optic cable on the main control board 21 inside the fiber optic box 22. Then, fix the fiber optic box 22 and the base plate 23 together with bolts 223. Next, fix the fan 32 to the fan mounting bracket 33 with bolts 334. Then, insert the fan 32 and the fan mounting bracket 33 into the notch of the main control board 21 and the fiber optic box 22, and fix them to the base plate 23 with bolts 233. At this time, the main control board 21, the fiber optic box 22, the base plate 23, the fan 32 and the fan mounting bracket 33 are fixed together to form an integral module. Finally, connect the base plate 23 and the chassis bottom shell 14 together with bolts 234 to complete the internal module assembly of the product.

[0040] Then, the acrylic sheet 114 is glued to the outside of the front panel 11. The fiber optic flange 115 and the power button 116 are installed and fixed in the corresponding holes of the front panel 11 after passing through the acrylic sheet 114 with their own threaded nuts. The dustproof mesh 117 of the front panel is glued to the corresponding position on the back of the grille 111 of the front panel 11. The status indicator light passes through the front panel 11 and the acrylic sheet 114 and is fixed to the corresponding position on the back of the front panel 11 with bolts 1182. Then, the front panel 11 is fixed to the front side of the chassis bottom shell 14 with bolts 141. Then, the rear panel 13 is fixed to the rear side of the chassis bottom shell 14 with bolts 143. Finally, the front and left and right sides of the top cover 12 are clipped into the inside of the front panel 11 and the chassis bottom shell 14, and the top cover 12 is fixed to the rear panel 13 with bolts 123 to complete the assembly.

[0041] pass Figure 3 The simulation results show that the airflow distribution on the main control board is uniform, with no eddies or areas that the airflow cannot reach. The maximum temperature of the heat-generating components on the main control board is 37.148℃, the maximum surface temperature of the main control board is 35.7℃, and the maximum temperature rise of the chip does not exceed 20℃, indicating excellent heat dissipation.

[0042] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A main control module with an integrated heat dissipation module, characterized in that: The heat dissipation module is fixed together with the main control module to form an integrated module. The main control module includes a main control board (21), an optical fiber box (22), a base plate (23), and optical fibers. The main control board (21) is fixed on the upper end of the optical fiber box (22). The optical fiber box (22) is a box with an opening at the bottom and an opening on its side. Optical fibers are placed in the middle space of the optical fiber box (22). The bottom of the optical fiber box (22) is fixed to the base plate (23). A notch is designed at one corner of the main control board (21) and the optical fiber box (22). The heat dissipation module is fixedly embedded in the notch.

2. The main control module of the integrated heat dissipation module as described in claim 1, characterized in that: The heat dissipation module includes a fan (32) and a fan mounting bracket (33). The fan (32) is fixed to the rear side of the fan mounting bracket (33), and the fan mounting bracket (33) is fixed to the base plate (23).

3. The main control module of the integrated heat dissipation module as described in claim 2, characterized in that: The fan (32) is an exhaust fan.

4. A light source device having a main control module comprising an integrated heat dissipation module as described in any one of claims 1-3, characterized in that: It includes a chassis and a main control module and a heat dissipation module located inside the chassis. The base plate (23) is fixed on the chassis bottom shell (14) of the chassis.

5. The light source device as described in claim 4, characterized in that: The chassis includes a front panel (11), a top cover (12), a rear panel (13), and a chassis bottom shell (14). The front panel (11), the top cover (12), the rear panel (13), and the chassis bottom shell (14) together form an internal space.

6. The light source device as described in claim 5, characterized in that: Bolt (141) fixes the front panel (11) to the chassis bottom shell (14) from the inside of the chassis bottom shell (14). Bolt (234) fixes the bottom plate (23) to the chassis bottom shell (14) from the bottom of the chassis bottom shell (14). Bolt (143) fixes the rear panel (13) to the chassis bottom shell (14) from the inside of the chassis bottom shell (14). The front and left and right sides of the top cover (12) are respectively clipped into the front panel (11) and the chassis bottom shell (14). Bolt (123) fixes the rear panel (13) to the top cover (12) from the rear side of the rear panel (13).

7. The light source device as described in claim 5, characterized in that: An acrylic plate (114) is fixed to the front side of the front panel (11). The fiber optic flange (115) and the power button (116) pass through the acrylic plate (114) and are installed in the front panel (11). The dustproof net (117) of the front panel is glued to the corresponding position on the back of the grille (111) of the front panel (11). The status indicator light is welded to the light plate (118). The status indicator light passes through the front panel (11) and the acrylic plate (114). The light plate (118) is fixed to the corresponding position on the back of the front panel (11).

8. A light source device as described in claim 5, characterized in that: The chassis bottom shell (14) is a U-shaped bottom shell with openings at the top and front and rear. Grilles are provided on the left and right side plates of the chassis bottom shell (14). Side dustproof nets (144) and side blind plates (145) are respectively attached to the inside of the grilles on the left and right side plates of the chassis bottom shell (14).

9. A light source device as described in claim 5, characterized in that: The rear panel (13) has a grille (132) on the right side as an air outlet, the front panel (11) has a grille (111) on the left side and the chassis bottom shell (14) has a grille on the left side as the first air inlet and the second air inlet, respectively, and the heat dissipation module is located inside the air outlet.

10. A light source device as described in claim 9, characterized in that: The main control board (21) is equipped with a power chip, a laser and an FPGA control chip. The power chip is placed in the area near the second air inlet and the rear panel (13), and the laser and the FPGA control chip are placed in the center of the main control board (21).

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