Novel diamond water-cooling heat dissipation device
By using diamond as the heat dissipation medium in the water-cooled heat dissipation device, and combining it with the design of flow channels and baffles, the problem of poor heat dissipation in the prior art is solved, and a highly efficient and stable heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202520240351.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-02-17
AI Technical Summary
Existing heat dissipation devices have poor heat dissipation performance. In particular, as the temperature rises, the thermal conductivity of the copper heat dissipation medium decreases and it is prone to oxidation, which affects the heat dissipation effect.
Using diamond as the heat dissipation medium and combined with a water cooling system, the high thermal conductivity and chemical inertness of diamond are utilized by setting up flow channels, slots, cooling tanks and annular flow channels in the water cooling plate and water tank, and combined with baffles to improve heat dissipation efficiency.
It improves heat dissipation speed and stability, ensuring that electronic components maintain stable heat dissipation in harsh environments, avoiding the influence of chemical reactions, and enhancing the overall efficiency of the heat dissipation device.
Smart Images
Figure CN223652591U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation device technology, and more specifically, to a novel diamond water-cooled heat dissipation device. Background Technology
[0002] A heat dissipation device is a device or component used to control the temperature of an object and prevent it from degrading in performance, shortening its lifespan, or even being damaged due to overheating. Heat dissipation devices play a crucial role in many fields involving energy conversion and electronic operation. Modern electronic devices such as computer CPUs, GPUs, and mobile phone processors generate a lot of heat during operation. If the heat cannot be dissipated in time, it will lead to a decrease in processor performance, resulting in lag, crashes, and other phenomena. Prolonged high temperatures will also shorten the lifespan of the processor. Heat dissipation devices ensure the stable operation of electronic devices by removing heat in a timely manner.
[0003] In existing technologies, common heat dissipation devices typically have a thermally conductive medium at the contact surface with electronic components. Heat from the electronic components is transferred to the heat dissipation device body via thermal conduction. However, commercially available heat dissipation media are generally made of copper, which is chemically reactive. Its thermal conductivity decreases as temperature increases, and it also reacts with oxygen in the air to form an oxide layer, further hindering heat dissipation. Therefore, inventing a novel diamond water-cooled heat dissipation device to solve these problems has become a pressing issue for those skilled in the art. Utility Model Content
[0004] To overcome the above shortcomings, this utility model provides a novel diamond water-cooled heat dissipation device, which aims to solve the problem of poor heat dissipation effect of common heat dissipation devices.
[0005] This utility model is implemented as follows:
[0006] This utility model provides a novel diamond water-cooled heat dissipation device, including a water tank and a water-cooling plate disposed on the water tank, and also includes multiple diamonds installed on the water tank. An inlet pipe and an outlet pipe are respectively installed on the inner wall of one end of the water tank, and two connecting grooves are opened on the upper side wall of the water tank.
[0007] The water-cooled plate has multiple slots, the bottom side of the water-cooled plate is fixedly connected to the upper side wall of the water tank, an annular flow channel is formed on one side of the water-cooled plate, multiple connecting channels are formed on the side wall of the annular flow channel, multiple cooling grooves are formed on the inner wall of the water-cooled plate near the slots, and through grooves are formed between the cooling grooves.
[0008] Preferably, the nine diamonds are fixedly connected at equal intervals on the upper surface of the water tank in a 3x3 grid pattern, the inner wall of the slot is inserted into the outer wall of the diamond, and the slot and the diamond are filled with sealant.
[0009] Preferably, the two connecting slots are respectively connected to the annular flow channel and the connecting channel, and the two connecting slots are respectively used for the input and output of the cooling medium in the water-cooled plate flow channel.
[0010] Preferably, the multiple connecting channels and the multiple outermost cooling tanks are interconnected, and the cooling tanks are interconnected through through slots.
[0011] Preferably, the diamond exposed in the cooling tank has several grooves on its surrounding sidewalls.
[0012] Preferably, a baffle plate is fixedly connected to the inner wall of the cooling tank on the side away from the diamond, and there is a gap between the upper and lower ends of the baffle plate and the cooling tank.
[0013] The beneficial effects of this utility model are:
[0014] By forming flow channels within the water-cooled plate, the cooling medium circulates within these channels. Diamond carries away the heat generated by the electronic components, maintaining their normal operating temperature. Diamond's extremely high thermal conductivity efficiently conducts heat, significantly increasing heat dissipation speed. Its chemical inertness makes it resistant to chemical reactions with most substances, allowing it to remain stable in harsh environments and providing consistent heat dissipation. Grooves on the diamond's sidewalls increase the contact area between the cooling medium and the diamond surface, enhancing overall heat dissipation. Baffles on the inner wall of the cooling tank further accelerate the overall heat transfer efficiency of the cooling medium, further improving the overall heat dissipation effect. Attached Figure Description
[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of a novel diamond water-cooled heat dissipation device provided by an embodiment of this utility model;
[0017] Figure 2 This is an exploded view of the structure of a novel diamond water-cooled heat dissipation device provided by an embodiment of this utility model;
[0018] Figure 3 This invention provides a novel diamond water-cooled heat dissipation device. Figure 2 Enlarged view of the structure of region A in the middle;
[0019] Figure 4 This is a partial half-sectional view of a novel diamond water-cooled heat dissipation device provided by an embodiment of this utility model;
[0020] Figure 5 This is a half-sectional view of the overall structure of a novel diamond water-cooled heat dissipation device provided by an embodiment of this utility model;
[0021] Figure 6 This invention provides a novel diamond water-cooled heat dissipation device. Figure 5 Enlarged view of the structure of region B in the middle;
[0022] Figure 7 This is a cross-sectional view of the overall structure of a novel diamond water-cooled heat dissipation device provided by an embodiment of this utility model;
[0023] Figure 8 This invention provides a novel diamond water-cooled heat dissipation device. Figure 7 Enlarged view of the structure of region C in the middle.
[0024] In the diagram: 1. Water tank; 11. Inlet pipe; 12. Outlet pipe; 13. Connecting groove; 2. Diamond; 21. Groove; 3. Water-cooled plate; 31. Slot; 32. Annular flow channel; 33. Connecting channel; 34. Cooling tank; 35. Through groove; 36. Baffle plate. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0026] Example, refer to Figures 1-7 A novel diamond water-cooled heat dissipation device includes a water tank 1 and a water-cooling plate 3 installed on the water tank 1, as well as multiple diamonds 2 installed on the water tank 1. An inlet pipe 11 and an outlet pipe 12 are respectively installed on the inner wall of one end of the water tank 1, and two connecting grooves 13 are opened on the upper side wall of the water tank 1.
[0027] The water-cooled plate 3 has multiple slots 31. The bottom side of the water-cooled plate 3 is fixedly connected to the upper side wall of the water tank 1. An annular flow channel 32 is formed on one side of the water-cooled plate 3. Multiple connecting channels 33 are formed on the side wall of the annular flow channel 32. Multiple cooling grooves 34 are formed on the inner wall of the water-cooled plate 3 near the slots 31. Through grooves 35 are formed between the cooling grooves 34.
[0028] Furthermore, nine diamonds 2 are equidistantly fixed on the upper surface of the water tank 1 in a 3x3 grid pattern. The inner wall of the slot 31 is inserted into the outer wall of the diamond 2. The slot 31 and the diamond 2 are filled with sealant. Two connecting slots 13 are respectively connected to the annular flow channel 32 and the connecting channel 33. The two connecting slots 13 are respectively used for the input and output of the cooling medium in the flow channel of the water-cooled plate 3. Multiple connecting channels 33 are interconnected with the multiple outermost cooling tanks 34. The cooling tanks 34 are interconnected through through slots 35.
[0029] It should be noted that: the water tank 1 is filled with cooling medium. The cooling medium enters the flow channel in the upper water-cooled plate 3 through a connecting channel 13, and at the same time, the cooling medium re-enters the water tank 1 through another connecting channel 13. With the cooperation of the inlet pipe 11 and the outlet pipe 12, the cooling medium circulates in the flow channel. The cooling medium enters the cooling tank 34 with the cooperation of the annular flow channel 32 and the connecting channel 33. Under the action of the through channel 35, the cooling medium completely fills multiple cooling tanks 34 and contacts and flows with the side walls of multiple diamonds 2. The heat generated by the electronic components at the upper end of the diamonds 2 is transferred to the diamonds 2. Then, the cooling medium absorbs the heat of the diamonds 2 and discharges the cooling medium carrying heat out of the water-cooled plate 3 through a connecting channel 13, thereby maintaining the normal operating temperature of the electronic components. The extremely high thermal conductivity of the diamonds 2 can efficiently conduct heat, greatly improving the heat dissipation speed. At the same time, the chemical inertness of the diamonds 2 makes them less likely to react with most substances, allowing them to remain stable in various harsh environments, thus providing a stable heat dissipation effect.
[0030] Furthermore, the diamond 2 is exposed in the cooling tank 34 and has several grooves 21 on its four sides. A baffle 36 is fixedly connected to the inner wall of the cooling tank 34 away from the diamond 2. There is a gap between the upper and lower ends of the baffle 36 and the cooling tank 34.
[0031] It should be noted that the grooves 21 on the sidewall of the diamond 2 can increase the contact area between the cooling medium and the surface of the diamond 2, allowing the diamond 2 to have more contact with the cooling medium for heat transfer within a fixed time, thus improving the overall heat dissipation effect. At the same time, the fluid at the grooves 21 will cause convection and local turbulence, further improving the heat dissipation efficiency. The baffles 36 set on the inner wall of the cooling tank 34 collide with the cooling medium as they pass through, thereby changing the flow rate of the medium and disturbing the surrounding area, causing more interaction and mixing between the media, changing the original regular laminar flow to turbulent flow, and causing the cooling medium to generate convection. The cooling medium near the sidewall of the diamond 2 will quickly mix with the low-temperature cooling medium in the main body, accelerating the heat transfer and preventing the cooling medium near the sidewall of the diamond 2 from being too hot while the cooling medium away from the sidewall of the diamond 2 is too cold, thereby improving the overall heat transfer efficiency of the cooling medium and further improving the overall heat dissipation effect.
[0032] The working principle of this novel diamond water-cooled heat dissipation device:
[0033] The water tank 1 is filled with cooling medium. The cooling medium enters the flow channel in the upper water-cooled plate 3 through a connecting channel 13, and at the same time, it re-enters the water tank 1 through another connecting channel 13. With the cooperation of the inlet pipe 11 and the outlet pipe 12, the cooling medium circulates in the flow channel. The cooling medium enters the cooling tank 34 with the cooperation of the annular flow channel 32 and the connecting channel 33. Under the action of the through channel 35, the cooling medium completely fills the multiple cooling tanks 34 and comes into contact with the side walls of the multiple diamonds 2. The heat generated by the electronic components at the upper end of the diamonds 2 is transferred to the diamonds 2. The cooling medium then absorbs the heat from the diamonds 2 and discharges the cooling medium carrying the heat from the water-cooled plate 3 through a connecting channel 13, thereby maintaining the normal operating temperature of the electronic components. The extremely high thermal conductivity of the diamonds 2 can efficiently conduct heat, greatly improving the heat dissipation speed. At the same time, the chemical inertness of the diamonds 2 makes them less likely to react with most substances, allowing them to remain stable in various harsh environments, thus providing a stable heat dissipation effect.
[0034] It should be noted that the specific model and specifications of the motor need to be selected and determined based on the actual specifications of the device. The specific selection and calculation method adopts the existing technology in this field, so it will not be described in detail here.
[0035] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A novel diamond water-cooled heat dissipation device, comprising a water tank (1) and a water-cooling plate (3) disposed on the water tank (1), characterized in that, It also includes multiple diamonds (2) installed on the water tank (1), and an inlet pipe (11) and an outlet pipe (12) are respectively installed on the inner wall of one end of the water tank (1). Two connecting grooves (13) are opened on the upper side wall of the water tank (1). The water-cooled plate (3) has multiple slots (31) and the bottom side of the water-cooled plate (3) is fixedly connected to the upper side wall of the water tank (1). An annular flow channel (32) is provided on one side of the water-cooled plate (3). Multiple connecting channels (33) are provided on the side wall of the annular flow channel (32). Multiple cooling grooves (34) are provided on the inner wall of the water-cooled plate (3) near the slots (31). Through grooves (35) are provided between the cooling grooves (34).
2. The novel diamond water-cooled heat dissipation device according to claim 1, characterized in that, Nine diamonds (2) are fixedly connected at equal intervals on the upper surface of the water tank (1) in a nine-square grid. The inner wall of the slot (31) and the outer wall of the diamond (2) are inserted into each other. The slot (31) and the diamond (2) are filled with sealant.
3. The novel diamond water-cooled heat dissipation device according to claim 2, characterized in that, The two connecting slots (13) are respectively connected to the annular flow channel (32) and the connecting channel (33), and the two connecting slots (13) are respectively used for the input and output of the cooling medium in the flow channel of the water-cooled plate (3).
4. A novel diamond water-cooled heat dissipation device according to claim 3, characterized in that, The multiple connecting channels (33) and the multiple outermost cooling tanks (34) are interconnected, and the cooling tanks (34) are interconnected through through slots (35).
5. A novel diamond water-cooled heat dissipation device according to claim 1, characterized in that, The diamond (2) exposed in the cooling tank (34) has several grooves (21) on its four sides.
6. A novel diamond water-cooled heat dissipation device according to claim 5, characterized in that, A baffle plate (36) is fixedly connected to the inner wall of the cooling tank (34) away from the diamond (2), and there is a gap between the upper and lower ends of the baffle plate (36) and the cooling tank (34).