Pot

Abstract

The utility model provides a pot. Wherein the side wall of the cookware is provided with a containing cavity, the containing cavity is filled with a heat-conducting medium, a rough structure is arranged on the wall face, making contact with the containing cavity, of the side wall, and a non-stick coating is arranged on the rough structure. According to the cookware, the temperature of the side wall of the cookware can be kept within a proper temperature range, so that the cooking function of the cookware can be guaranteed, meanwhile, cooked food is not prone to carbonization on the side wall of the cookware, the easy-to-clean performance of the cookware is guaranteed, and the taste of the cooked food is optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of kitchen utensils, and particularly relates to a pot. BACKGROUND

[0002] In the traditional pot manufacturing industry, a common practice is to use a single material to make the pot. Under the influence of conduction and radiation of the heat source at the bottom, the temperature of the wall of the pot will continue to rise, and may even exceed 300 DEG C. When cooking food, food or oil is easy to splash and adhere to the wall. Once the wall temperature reaches 200 DEG C or above, the food will carbonize, which not only affects the taste of the food, but also greatly increases the difficulty of cleaning the pot.

[0003] Therefore, developing a new type of pot to ensure the easy-to-clean property of the pot and the taste of the cooked food is still a problem to be solved. SUMMARY

[0004] Therefore, the utility model discloses a pot which can prevent the cooked food from carbonizing on the wall, so as to solve the problem that the food or oil is easy to splash and adhere to the wall of the pot in the cooking process, and the wall is difficult to clean due to high temperature carbonization.

[0005] The first aspect of the utility model discloses a pot, wherein the side wall of the pot has a containing cavity, and a heat-conducting medium is filled in the containing cavity; and a rough structure is arranged on the wall surface of the side wall in contact with the containing cavity, and a non-stick coating is arranged on the rough structure.

[0006] The temperature of the side wall of the pot can be maintained within a suitable temperature range, so that the cooked food is not easy to carbonize on the side wall of the pot while ensuring the cooking function of the pot, the easy-to-clean property of the pot is ensured, and the taste of the cooked food is optimized.

[0007] In some embodiments, the side wall comprises an inner wall and an outer wall, the outer wall is outside the inner wall, and the containing cavity is formed between the inner wall and the outer wall.

[0008] In these embodiments, the closed containing cavity enclosed by the inner wall and the outer wall can facilitate the manufacture of the structure of the containing cavity, and the average diameter of the inner wall and the outer wall can be set to easily form a containing cavity with the required size.

[0009] In some embodiments, the pot comprises a bottom wall connected or integrally formed with the side wall, the lower end of the outer wall is connected with the bottom wall, and the upper end of the outer wall is in direct contact with the inner wall at the upper edge of the inner wall, so as to form the containing cavity between the inner wall and the outer wall.

[0010] In these embodiments, by connecting or integrally forming the inner wall with the bottom wall, a rough shape of the pot can be formed, and then on the basis of this, the outer wall is arranged on the inner wall to form a pot with a containing cavity in the side wall, thereby simplifying the manufacturing of the pot.

[0011] In some embodiments, the pot is a frying pan, the height of the pot is H, the outer wall is directly connected with the corresponding area of the inner wall at the position of the side wall corresponding to 1 / 3H from the bottom wall, and is directly connected with the corresponding area of the inner wall at the position of the side wall corresponding to 9 / 10H from the bottom wall; or, the pot is a wok, the inner wall is directly connected with the corresponding area of the outer wall at the position close to the bottom wall of the pot, or the inner wall is directly connected with the bottom wall and is directly connected with the corresponding area of the inner wall at the position of the side wall corresponding to 7 / 10H from the bottom wall.

[0012] In these embodiments, by arranging the connecting position of the upper end and the lower end of the outer wall, a containing cavity is arranged on the non-food material contact area inside the pot, and a heat-conducting medium is filled in the containing cavity, which can reduce the possibility of carbonization of food materials and the like adhering to the side wall of the pot without affecting the normal cooking function of the pot, thereby improving the easy-to-clean ability of the pot.

[0013] In some embodiments, the containing cavity extends from the side wall area corresponding to the position of 1 / 3H from the bottom wall of the pot to the side wall area corresponding to the position of 9 / 10H from the bottom wall of the pot; or, the containing cavity extends from the side wall area directly connected with the bottom wall of the pot to the side wall area corresponding to the position of 7 / 10H from the bottom wall of the pot.

[0014] In these embodiments, by arranging the containing cavity on the non-food material contact area inside the pot and filling the heat-conducting medium in the containing cavity, the possibility of carbonization of food materials and the like adhering to the side wall of the pot can be reduced without affecting the normal cooking function of the pot, thereby improving the easy-to-clean ability of the pot.

[0015] In some embodiments, the heat-conducting medium is a liquid medium with a boiling point of 180-220°C, and filling the liquid medium in the containing cavity can achieve the purpose of controlling the temperature of the side wall of the pot. In addition, the liquid medium changes between liquid and gaseous states, and when the liquid medium is heated to the boiling point, it begins to vaporize and changes from liquid to gas. During the phase change, the volume of the medium changes, but due to the compressibility of gas, this volume change can be effectively buffered and improved. This means that during the heating of the pot, even if the liquid medium undergoes a phase change, the pressure change inside the side wall will not be too drastic, thereby effectively avoiding deformation or damage of the pot due to uneven pressure. In addition, the use of liquid medium is easy to fill into the containing cavity, relatively simple, without the need for complex manufacturing processes and larger opening sizes for injecting the heat-conducting medium.

[0016] In some embodiments, the heat-conductive medium comprises polysiloxane, ester, alcohol or water. Polysiloxane, ester and alcohol are high-boiling organic solutions, which can ensure stable heat transfer during cooking, especially at high temperature, while meeting the food safety requirements of the pot. Water as a heat-conductive medium not only provides stable temperature control, but also is more economical and easy to control the cost of the pot.

[0017] In some embodiments, the polysiloxane comprises polymethylsiloxane. Polymethylsiloxane as a heat-conductive medium can ensure uniform distribution of heat during cooking by taking advantage of its excellent temperature resistance, stable heat conduction and low viscosity. Ester includes butyl lactate, and alcohol includes propylene glycol. These materials are non-toxic and harmless, and can meet the boiling point requirements of the heat-conductive medium.

[0018] In some embodiments, the non-stick coating comprises a polytetrafluoroethylene coating, a polyether sulfone coating, a silicone coating or a ceramic coating. These non-stick coatings have low surface tension, so that the heat-conductive medium in the containing cavity is not easy to spread out, which can ensure the heat absorption rate of the heat-conductive medium, so that the side wall of the pot remains in a suitable temperature range during use.

[0019] In some embodiments, the thickness of the non-stick coating is 5-15 microns. An appropriate thickness of the non-stick coating can ensure the integrity of the non-stick coating on the rough structure, on the other hand, can avoid excessive thickness to weaken the adhesion between the non-stick coating and the side wall, increase the risk of falling off, and can avoid excessive thickness to increase the manufacturing cost.

[0020] In some embodiments, the volume of the containing cavity accounts for 30-40% of the volume of the side wall, and the injection amount of the heat-conductive medium accounts for 20-50% of the volume of the containing cavity.

[0021] In these embodiments, by setting a suitable volume of the containing cavity, the existence of the containing cavity can be avoided to affect the overall strength of the pot. Filling a suitable amount of heat-conductive medium in the containing cavity, on the one hand, is adapted to the actual cooking time, which not only can reduce the possibility of carbonization of the adhered food materials of the side wall of the pot, improve the easy-to-clean ability of the pot, but also can avoid affecting the normal cooking function of the pot. On the other hand, it can reserve a certain volume for the phase change of the heat-conductive medium, thereby avoiding deformation of the pot due to volume change.

[0022] Specifically, the accommodating cavity has a volume of 40-120 cubic centimeters, wherein a required amount of heat-conducting medium can be filled in, so that the temperature of the side wall of the pot can be kept within a proper range, i.e. the normal cooking function is not affected, and the pot is not easy to carbonize the food material during cooking, so that the taste of the cooked food material can be ensured. In addition, the injection amount of the heat-conducting medium is proper, so that the volume change of the heat-conducting medium during the phase change process will not cause the deformation of the pot.

[0023] In some embodiments, the accommodating cavity is arranged around the circumference of the pot, so that the stability and uniformity of each area on the circumferential side wall can be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0024] The above and other objects and features of the present application will become more apparent from the following description of embodiments taken in conjunction with the accompanying drawings, in which:

[0025] Figure 1 is a sectional structure schematic view of a pot according to the first embodiment of the present application;

[0026] Figure 2 is Figure 1 is an enlarged structure schematic view of position I in FIG. 1;

[0027] Figure 3 is another sectional structure schematic view of a pot according to the first embodiment of the present application;

[0028] Figure 4 is a sectional structure schematic view of a pot according to the second embodiment of the present application;

[0029] Figure 5 is Figure 4 is an enlarged structure schematic view of position J in FIG. 2;

[0030] Figure 6 is a sectional structure schematic view of a pot according to the second embodiment of the present application.

[0031] SYMBOL EXPLANATION

[0032] 10, side wall; 11, inner wall; 12, outer wall; 13, accommodating cavity; 20, bottom wall; 30, heat-conducting medium. DETAILED DESCRIPTION

[0033] The following detailed description is presented to aid the reader in gaining a comprehensive understanding of the methods, apparatuses, and / or systems described herein. However, various changes, modifications, and equivalents can be used, and thus particular embodiments described herein are not intended as being limiting as there are many different ways to implement the methods, apparatuses, and / or systems described herein. For example, the order in which operations are described is not intended to be limiting unless otherwise specified. Moreover, descriptions of features in terms of being performed in serial order are not intended to be limiting as parallel order can be possible unless specifically stated otherwise. Additionally, descriptions of features in terms of being performed or produced by a single device can be intended to be implemented by a single device, or by a single set of devices, unless otherwise specified. Furthermore, for ease of understanding, the description is divided into several parts, but the division into parts is not to be understood as implying that the described parts are mutually exclusive.

[0034] The features described herein can be implemented in different ways depending upon the particular application, the explicit teaching provided herein, and / or the implicit understanding of those skilled in the relevant art(s). Various modifications and changes can be made thereto without departing from the spirit and scope of the description, which is to be understood from the foregoing description and illustrated examples.

[0035] As used herein, the term "and / or" includes any one of the associated listed items, as well as any combination of any two or more of the associated listed items.

[0036] Although terms such as "first", "second", and "third" can be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Instead, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, the first element, the first component, the first region, the first layer or the first section referred to in the examples described herein can also be referred to as the second element, the second component, the second region, the second layer or the second section without departing from the teachings of the examples.

[0037] In the description, when an element such as a layer, a region, or a substrate is referred to as being "on" another element, "connected to" or "mounted to" another element, it can be directly on, directly connected to, or directly mounted to the other element, or one or more other elements can be interposed therebetween. In contrast, when an element is referred to as being "directly on", "directly connected to", or "directly mounted to" another element, no other elements are interposed therebetween.

[0038] The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "has", "having" as used herein, are specifically intended to be construed as specifying the presence of stated features, numbers, operations, components, elements, or combinations thereof, but not precluding the presence or addition of one or more other features, numbers, operations, components, elements, or combinations thereof.

[0039] The terms "upper", "lower", "inner", "outer" and the like used in the present disclosure are defined based on the orientation of the cookware in the normal use state. This definition will help the reader or user to clearly understand the relative position relationship of each component and function, and should not be understood as a limitation of the present disclosure.

[0040] Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs when used in the present disclosure. Unless specifically defined otherwise in this disclosure, terms such as those defined in a generally used dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and should not be interpreted ideally or too formally.

[0041] In addition, in the description of the examples, when it is considered that the detailed description of the related components or functions known will cause the ambiguous interpretation of the present disclosure, such detailed description will be omitted.

[0042] The cookware according to the embodiments of the present disclosure will be described below in conjunction with Figure 1 and Figure 6 .

[0043] According to the embodiments of the present disclosure, a cookware is provided, wherein, as shown in Figures 1 to 6 , the side wall 10 of the cookware has a containing cavity 13, and the containing cavity 13 is filled with a heat-conducting medium 30. Wherein, the side wall 10 is provided with a rough structure on the wall surface in contact with the containing cavity 13, and the rough structure is provided with a non-stick coating.

[0044] According to the pot provided by the utility model, the side wall 10 is formed with a containing cavity 13, and the containing cavity 13 is filled with a heat conducting medium 30, and the wall surface of the side wall 10 opposite to the containing cavity 13 is provided with a rough structure, and the rough structure is provided with a non-stick coating, when the bottom wall 20 of the pot is heated in use, part of the heat will be directly absorbed by the internal food materials for the cooking process. Another part of the heat will be transmitted to the containing cavity 13. At this time, the heat conducting medium 30 in the containing cavity 13 changes phase under the action of heat, like an intelligent temperature regulating valve, effectively balancing the temperature of the side wall 10 of the pot, preventing the temperature of the side wall 10 from being too high, thereby avoiding the carbonization of food due to high temperature, protecting the nutrition and taste of the food materials. In addition, the rough structure with the non-stick coating can prevent the heat conducting medium 30 from freely spreading on the wall surface of the side wall 10 opposite to the containing cavity 13, slow down the heat absorption rate of the heat conducting medium 30, and ensure that the wall temperature does not decrease too much due to the rapid heat absorption of the heat conducting medium 30, thereby ensuring the appropriate temperature environment required for cooking food.

[0045] In summary, the pot of the utility model can keep the temperature of the side wall of the pot within a suitable temperature range, so that the food cooked in the pot is not easy to carbonize on the side wall 10 of the pot, ensuring the easy cleaning performance of the pot and optimizing the taste of the cooked food.

[0046] According to the present application, the side wall 10 of the pot is a hollow double-layer structure, and the bottom wall 20 of the pot is a solid structure. Specifically, the side wall 10 includes an inner wall 11 and an outer wall 12 (also referred to as an inner layer and an outer layer), and the outer wall 12 is outside the inner wall 11 to form a closed containing cavity 13 between the inner wall 11 and the outer wall 12.

[0047] In these embodiments, the closed containing cavity 13 formed by the inner wall 11 and the outer wall 12 can facilitate the manufacture of the structure of the containing cavity 13, and the average diameter of the inner wall 11 and the outer wall 12 can be set to easily form a containing cavity of the required size.

[0048] In the embodiments of the present application, the pot with the double-layered structure and the hollow sidewall 10 can be formed in various ways. For example, the inner wall 11 and the outer wall 12 can be manufactured separately through a metal stamping or stretching process, and then the inner wall 11 and the outer wall 12 are nested and fixed together through, for example, welding, riveting or adhesive, to form a closed sidewall with a hollow structure. Alternatively, the inner wall 11 and the outer wall 12 can be formed simultaneously through a casting process using a special mold. During the casting process, a gap is ensured between the two layers to form a hollow structure. In addition, one of the inner wall 11 and the outer wall 12 can be formed in advance in an integrated manner with the bottom wall 20 to form a pot body with a bottom and a side, and then the other of the inner wall 11 and the outer wall 12 is connected to the pot body with a bottom and a side. Hereinafter, the pot with the double-layered structure and the sidewall 10 will be described in detail with this as an example.

[0049] In some embodiments, the pot includes a bottom wall 20 connected or formed integrally with the sidewall 10, the lower end of the outer wall 12 is directly connected with the bottom wall 20, or is in direct contact with the inner wall 11 near the bottom wall 20, and the upper end of the outer wall 12 is in direct contact with the inner wall 11 at the upper edge of the inner wall 11, so that the outer wall 12 is fixed outside the inner wall 11, and the containing cavity 13 is formed between the inner wall 11 and the outer wall 12.

[0050] In these embodiments, by connecting or forming the inner wall 11 and the bottom wall 20 integrally, the rough shape of the pot can be formed, and then the outer wall 12 is arranged on the inner wall 11 to form the pot with the containing cavity 13 in the sidewall, thereby simplifying the manufacturing of the pot.

[0051] According to the first embodiment of the present application, the pot is a wok with a height H, and the food material contact area of the wok mainly includes the bottom wall and the area of the corresponding sidewall 10 at a distance of 1 / 3H from the bottom wall, so the containing cavity 13 filled with the heat-conducting medium 30 is arranged in the area of the corresponding sidewall 10 above 1 / 3H. In this way, the arrangement of the heat-conducting medium 30 does not affect the heat transfer from the bottom wall 20 to the food material contact area, so that carbonization of the food material on the sidewall 10 due to excessive temperature can be prevented, and the stability of the cooking temperature can be ensured.

[0052] In some embodiments, in the case of a wok, the height of the wok is H, the outer wall 12 is directly connected to the corresponding area of the inner wall 11 at a position on the side wall 10 corresponding to 1 / 3H from the bottom wall, and is directly connected to the corresponding area of the inner wall 11 at a position on the side wall 10 corresponding to 9 / 10H from the bottom wall. It can also be understood that the accommodation cavity 13 starts from a portion of the side wall 10 corresponding to about 1 / 3H from the bottom wall, and extends upward to a position on the side wall 10 corresponding to 9 / 10H from the bottom wall. In this way, the side wall 10 above the food contact area can be completely covered, and these areas of the side wall 10 are areas prone to carbonized food, and in the case of the accommodation cavity 13 being filled with the heat-conducting medium 30, the temperature of these areas can be ensured to inhibit food carbonization.

[0053] According to the second embodiment of the present application, the wok is a frying pan, and the food contact area of the frying pan type is the bottom wall 20, so arranging the accommodation cavity 13 containing the heat-conducting medium 30 on most of the area of the side wall 10 can help control the temperature of the side wall 10.

[0054] Specifically, the inner wall 11 is directly connected to the corresponding area of the outer wall 12 at a position close to the bottom wall 20 of the wok, or the inner wall 11 is directly connected to the bottom wall 20 and is connected to the corresponding area of the outer wall 12 at a position of the side wall 10 corresponding to the lip of the wok, so that the outer wall 12 is fixed to the outside of the inner wall 11 and the accommodation cavity 13 is formed between the inner wall 11 and the outer wall 12.

[0055] Further, on the frying pan type, the inner wall 11 is directly connected to the corresponding area of the outer wall 12 at a position close to the bottom wall 20 of the wok, or the inner wall 11 is directly connected to the bottom wall 20 and is directly connected to the corresponding area of the inner wall 11 at a position on the side wall 10 corresponding to 7 / 10H from the bottom wall. It can also be understood that the accommodation cavity 13 starts from the area immediately adjacent to the bottom wall 20 and extends upward until reaching a position on the side wall 10 corresponding to 7 / 10H from the bottom wall.

[0056] It should be noted that some woks include a turned-up edge, and the connection between the upper end of the inner wall 11 and the outer wall 12 can be located at the lower end of the turned-up edge or can cover the area corresponding to the turned-up edge.

[0057] According to the present application, the specific shape of the accommodation cavity 13 is generally annular in cross-section and is arranged in the side wall 10 of the wok around the circumferential direction of the wok, which can ensure the stability and uniformity of each area of the side wall 10 in the circumferential direction. In the present application, the inner wall 11 is generally formed in a ring shape, the outer wall 12 is generally formed in a ring shape, the outer wall 12 is sleeved on the outside of the inner wall 11, and has a predetermined distance from the inner wall 11 to form the accommodation cavity 13 between the inner wall 11 and the outer wall 12.

[0058] According to this application, for a wok, the receiving cavity 13 extends from the region of the side wall 10 corresponding to a position 1 / 3H from the bottom wall of the wok to the region of the side wall 10 corresponding to a position 9 / 10H from the bottom wall of the wok. In other words, the receiving cavity 13 extends from the region of the side wall 10 corresponding to a position 1 / 3H from the bottom wall of the wok to the region of the side wall 10 corresponding to a position 9 / 10H from the bottom wall of the wok. For a frying pan, the receiving cavity 13 extends from the region of the side wall 10 directly connected to the bottom wall 20 of the wok (i.e., the position of the side wall near the bottom wall) to the region of the side wall 10 corresponding to a position 7 / 10H from the bottom wall of the wok.

[0059] In these embodiments, these areas are non-food contact areas inside the cookware, and also areas where food or oil is easily splashed during cooking. Receiving cavities 13 are provided in the corresponding locations of these areas, and the receiving cavities 13 are filled with a heat-conducting medium 30. This reduces the possibility of carbonization of food adhering to the side wall 10 of the cookware without affecting the normal cooking function of the cookware, thereby improving the cookware's ease of cleaning.

[0060] According to this utility model, the cookware also includes an outward-turned edge, and the receiving cavity 13 extends to the inner part corresponding to the outward-turned edge. In this way, the heat-conducting medium 30 in the receiving cavity 13 will rise upward and approach the outward-turned edge of the cookware when it vaporizes. Since the outward-turned edge is far away from the bottom wall 20 of the cookware, it can be maintained at a relatively low temperature. Thus, the heat-conducting medium 30 flowing through the outward-turned edge will condense upon encountering cold and flow back to the bottom of the receiving cavity 13 to continue circulating, so that the side wall 10 of the cookware is kept in a suitable temperature range during cooking.

[0061] like Figures 1 to 3 As shown, the height of the pot is H, and the receiving cavity 13 is formed between the area of ​​the side wall 10 corresponding to the position 1 / 3H away from the bottom wall of the pot and the area of ​​the side wall 10 corresponding to the position 9 / 10H away from the bottom wall of the pot.

[0062] like Figures 4 to 6 As shown, the receiving cavity 13 is formed between a position 1 / 9H from the bottom wall and a position 8 / 9H from the bottom wall on the side wall 10.

[0063] In some embodiments, the heat conducting medium 30 is a liquid medium, in particular, a high-boiling-point liquid medium. Filling the liquid medium in the accommodating cavity 13 can achieve the purpose of temperature control of the side wall 10 of the pot. In addition, the liquid medium can change between liquid and gaseous states. When the liquid medium is heated to its boiling point, it will start to vaporize and change from liquid to gas. During the phase change, the volume of the medium changes, but due to the compressibility of the gas, this volume change can be effectively buffered and improved. This means that during the heating of the pot, even if the liquid medium undergoes a phase change, the pressure change inside the side wall will not be too drastic, thereby effectively avoiding deformation or damage of the pot due to uneven pressure. In addition, using a liquid medium is easy to fill into the accommodating cavity, relatively simple, without the need for complex manufacturing processes and larger opening sizes for injecting the heat conducting medium.

[0064] In actual use, the area closer to the bottom of the pot is more easily affected by heat conduction and heat radiation, and vice versa. That is, the temperature of the side wall area closer to the bottom wall of the pot is higher.

[0065] According to the present application, a high-boiling liquid is used as the heat conducting medium 30, which will only boil at a relatively high temperature. The liquid will continue to absorb heat and increase in temperature before reaching its boiling point, thus helping to maintain a stable temperature range in the cooking process. Specifically, when the temperature of the side wall 10 is lower than the boiling point of the high-boiling liquid, the heat conducting medium 30 near the bottom of the containing cavity 13 will continue to absorb heat from the bottom wall 20 and increase in temperature. In this way, it can ensure a gradual increase in the internal temperature of the pot, providing a stable heat source for cooking food. When the temperature of the side wall 10 reaches the boiling point of the heat conducting medium 30, the heat conducting medium 30 begins to boil, and the heat conducting medium 30 changes from a liquid state to a gaseous state, part of the heat is converted into mechanical energy for the movement of the heat conducting medium. During the vaporization process, the temperature of the heat conducting medium 30 remains constant, thereby enabling the side wall 10 of the pot to maintain a constant temperature within a suitable range during cooking. The gas generated in the containing cavity 13 due to vaporization will form a gas pressure difference inside the containing cavity 13, causing the gas to continuously flow and transfer heat from high-temperature areas to low-temperature areas, thereby making the temperature of the entire wall more uniform. When the high-temperature gas comes into contact with the mouth of the pot or other low-temperature areas, the gas will quickly condense back into a liquid. The heat released during this process is used to heat other parts of the side wall, thereby improving the temperature uniformity of the entire side wall 10 of the pot. In addition, the liquid formed by the condensation of the high-temperature gas flows along the inner wall of the containing cavity 13 to the heat conducting medium 30 at the bottom of the containing cavity 13, thereby ensuring a continuous supply of heat during cooking and helping to maintain the uniformity and stability of the internal temperature of the pot. Furthermore, since the containing cavity 13 is closed, the gas pressure inside the containing cavity 13 will gradually increase as the vaporization process progresses, causing the boiling point of the heat conducting medium 30 to decrease. This means that during the use of the pot, the heat conducting medium 30 will be in a state of continuous micro-boiling, which will help to further distribute the heat uniformly and maintain the temperature of the side wall 10 of the pot within a suitable range.

[0066] As an example, a liquid medium with a boiling point of 180-220°C at normal temperature and pressure can be selected as the heat conducting medium 30. After being heated, the heat conducting medium 30 can change from a liquid state to a gaseous state, absorbing a large amount of heat, thereby effectively regulating the temperature distribution of the side wall 10 of the pot.

[0067] In some embodiments, the heat conducting medium 30 includes polysiloxane, ester, alcohol, or water. Using polysiloxane, ester, alcohol, or other high-boiling organic solutions as the heat conducting medium 30 can ensure stable heat transfer during cooking, especially during high-temperature cooking, while meeting the food safety requirements of the pot. Using water as the heat conducting medium 30 not only provides stable temperature control, but also is more economical and easy to control the cost of the pot.

[0068] In some embodiments, the polysiloxane comprises polymethylsiloxane, which, as the heat conducting medium 30, can ensure the uniform distribution of heat during cooking by virtue of its excellent temperature resistance, stable heat conduction and low viscosity. The ester comprises butyl lactate, and the alcohol comprises propylene glycol. These materials are non-toxic and harmless, and can meet the boiling point requirement of the heat conducting medium 30.

[0069] In these embodiments, it has been proved by repeated tests that the polymethylsiloxane, butyl lactate and propylene glycol, etc. as the heat conducting medium 30 can stabilize the side wall 10 of the pot within the range of 220-250℃. In this way, the food material, etc. attached to the side wall 10 of the pot can not be carbonized without affecting the normal cooking function of the pot, thereby improving the easy-to-clean ability of the pot.

[0070] In some embodiments, the volume of the containing cavity 13 accounts for 30%-40% of the volume of the side wall 10, and the injection amount of the heat conducting medium accounts for 20%-50% of the volume of the containing cavity.

[0071] In these embodiments, by setting the containing cavity 13 with a suitable volume, the existence of the containing cavity 13 can be avoided to affect the overall strength of the pot. By filling the containing cavity 13 with a suitable amount of the heat conducting medium 30, on the one hand, the carbonization of the food material, etc. adhered to the side wall 10 of the pot can be reduced, the easy-to-clean ability of the pot can be improved, and the normal cooking function of the pot can be avoided to be affected. On the other hand, a certain volume can be reserved for the phase change of the heat conducting medium 30, so that the deformation of the pot caused by the volume change can be avoided.

[0072] As an example, in terms of a conventional pot, the volume of the containing cavity 13 is 40-120 cubic centimeters, and the injection amount of the heat conducting medium 30 accounts for 20%-50% of the volume of the containing cavity 13, so that the temperature of the side wall of the pot can be maintained within a suitable range, i.e. without affecting the normal cooking function, and the food material can not be easily carbonized during cooking, so that the taste of the cooked food material can be ensured. In addition, the injection amount of the heat conducting medium 30 is suitable, so that the volume change of the heat conducting medium during the phase change process can not cause the deformation of the pot.

[0073] According to the present application, the rough structure can be obtained by sanding treatment or spraying treatment.

[0074] In some exemplary embodiments, in order to obtain the rough structure, the inner wall 11 and the outer wall 12 of the pot can be subjected to sandblasting treatment. Specifically, abrasive materials such as corundum and glass beads are sprayed at high speed to the surface of the inner wall 11 and the outer wall 12 by using compressed air, so that the surface of the material is formed with the required roughness by the sandblasting treatment through the impact and cutting action.

[0075] In some exemplary embodiments, in order to obtain the rough structure, a porous structure spray layer (also referred to as a capillary structure layer) can also be sprayed on the wall surface corresponding to the inner wall 11 and the outer wall 12. For example, a coating material such as metal or ceramic can be used, and the coating material is sprayed onto the wall surface corresponding to the inner wall 11 and the outer wall 12 by a specific spraying process such as plasma spraying, thermal spraying, etc. The porous structure spray layer has good capillary effect, can more effectively absorb and disperse heat, and at the same time increases the roughness of the material surface, increases the contact area between the food and the pot, and optimizes the cooking effect.

[0076] Here, it should be noted that the non-stick coating is formed on the rough structure, and in the case where the non-stick coating is formed by a liquid coating, the liquid coating will also fill into the porous structure of the rough structure, so that the non-stick coating as a whole also presents a certain concave-convex, increases the specific surface area of the non-stick layer, ensures the heat absorption speed of the heat conducting medium 30 during the cooking process of the pot, so that the temperature of the side wall 10 of the pot is guaranteed.

[0077] In these embodiments, the rough structure with a specific roughness is formed on the inner wall 11 and the outer wall 12 of the pot by sanding treatment or spraying treatment, etc., which makes a preparation for the combination of the non-stick coating, and can further strengthen the effect of low surface tension of the non-stick coating, which is beneficial to control the heat absorption speed of the heat conducting medium 30 in the containing cavity 13.

[0078] In some embodiments, the roughness Ra of the rough structure is 5-10 microns, preferably 5-7 microns; the roughness Rz of the rough structure is 20-60 microns, preferably 34-52 microns; and the roughness Rpc of the rough structure is 80-240 per centimeter, preferably 124-151 per centimeter. The rough structure with the roughness as above can make a preparation for the formation of the non-stick coating, and further strengthen the effect of low surface tension of the non-stick coating, which is beneficial to control the uniformity of the heat absorption speed of the heat conducting medium 30.

[0079] According to the present application, the non-stick coating includes a polytetrafluoroethylene coating, a polyether sulfone coating, a silicone coating or a ceramic coating, which has low surface tension, so that the heat conducting medium 30 in the containing cavity 13 is not easy to spread, and the heat absorption rate of the heat conducting medium 30 can be ensured, so that the side wall 10 of the pot remains in a suitable temperature range during use.

[0080] In some embodiments, the thickness of the non-stick coating is 5-15 microns, preferably 6-9 microns. The non-stick coating with an appropriate thickness can ensure the integrity of the non-stick coating on the rough structure, avoid weakening the adhesion between the non-stick coating and the side wall 10 due to excessive thickness, increase the risk of falling off, and avoid increasing the manufacturing cost due to excessive thickness.

[0081] According to the utility model, provide a kind of manufacturing method of pot, comprising:

[0082] Step S101, provide inner wall 11 and outer wall 12, wherein, inner wall 11 and outer wall 12 are reserved with injection entrance, and the side wall 10 of the facing side wall of inner wall 11 and outer wall 12 has rough structure, and rough structure is equipped with non-stick coating.

[0083] Step S102, outer wall 12 is set in the outside of inner wall 11, and the both are welded respectively at upper end, lower end, here, welding strength can be greater than 1.59N / mm 2 , preferably, 1.59N / mm 2 -3.18N / mm 2 . So as to form the containment cavity 13 of firm welding between inner wall 11 and outer wall 12, high boiling point solution is injected into containment cavity 13, to form the pot according to the application.

[0084] In the present application, by the combination of capillary structure and low surface tension coating, the heat conduction efficiency is reduced, so that the temperature of the side wall 10 of the pot is kept in a relatively stable range. Using high boiling point, non-toxic and environmentally friendly solution, the safety and health of cooking process are ensured.

[0085] Although the embodiments of the utility model have been described in detail above, those skilled in the art can make various modifications and changes to the embodiments of the utility model without departing from the spirit and scope of the utility model. However, it should be understood that these modifications and changes will still fall within the spirit and scope of the embodiments of the utility model as defined by the claims.

Claims

1. A pan, characterized in that The side wall (10) of the pot has a containing cavity (13) filled with a heat-conducting medium (30); The side wall (10) is provided with a rough structure on the wall surface in contact with the containing cavity (13), and the rough structure is provided with a non-stick coating.

2. The pan of claim 1, wherein The side wall (10) comprises an inner wall (11) and an outer wall (12), the outer wall (12) is outside the inner wall (11), and the containing cavity (13) is formed between the inner wall (11) and the outer wall (12).

3. The pan of claim 2, wherein The pot comprises a bottom wall (20) connected or integrally formed with the side wall (10), the lower end of the outer wall (12) is connected with the bottom wall (20), and the upper end of the outer wall (12) is directly connected with the inner wall (11) at the upper edge of the inner wall (11), so as to form the containing cavity (13) between the inner wall (11) and the outer wall (12).

4. The pan of claim 3, wherein The pot is a frying pan, the height of the pot is H, the outer wall (12) is directly connected with the corresponding area of the inner wall (11) at the position of 1 / 3H of the corresponding side wall (10) from the bottom wall (20), and is directly connected with the corresponding area of the inner wall (11) at the position of 9 / 10H of the corresponding side wall (10) from the bottom wall (20); or, The pot is a frying pan, the inner wall (11) is directly connected with the corresponding area of the outer wall (12) at the position close to the bottom wall (20) of the pot, or the inner wall (11) is directly connected with the bottom wall (20), and is directly connected with the corresponding area of the inner wall (11) at the position of 7 / 10H of the corresponding side wall (10) from the bottom wall (20).

5. The pan of claim 1, wherein The containing cavity (13) extends from the area of 1 / 3H of the corresponding side wall (10) from the bottom wall (20) to the area of 9 / 10H of the corresponding side wall (10) from the bottom wall (20) of the pot; or, The containing cavity (13) extends from the area of the side wall (10) directly connected with the bottom wall (20) of the pot to the area of 7 / 10H of the corresponding side wall (10) from the bottom wall (20) of the pot.

6. The pan of claim 1, wherein The heat-conducting medium (30) is a liquid medium with a boiling point of 180-220℃.

7. The pan of claim 1, wherein The heat-conducting medium (30) comprises polysiloxane, ester, alcohol or water.

8. The pan of claim 7, wherein The polysiloxane comprises polymethylsiloxane, the ester comprises butyl lactate, and the alcohol comprises propylene glycol.

9. The pan of claim 1, wherein The non-stick coating comprises a polytetrafluoroethylene coating, a polyether sulfone coating, a silicone coating or a ceramic coating.

10. The pan of claim 1, wherein The thickness of the non-stick coating is 5-15 microns.

11. The pan of claim 1, wherein The volume of the containing cavity (13) accounts for 30-40% of the volume of the side wall (10), and the injection amount of the heat-conducting medium (30) accounts for 20-50% of the volume of the containing cavity (13).

12. The pan of claim 11, wherein, The volume of the containing cavity (13) is 40-120 cubic centimeters.

13. The pan of any one of claims 1 to 12, wherein, The containing cavity (13) is arranged around the circumference of the pot.

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