Tilting mechanism and tool for plasma cleaning of IGBT (Insulated Gate Bipolar Translator) module

Abstract

The utility model relates to the technical field of IGBT (Insulated Gate Bipolar Transistor) preparation, in particular to an inclined mechanism and a tool for plasma cleaning of an IGBT module, which comprises a support component, a clamping component, a clamping component and a clamping component, and the adjusting assembly is arranged between the bottom plate and the clamping plate and comprises an adjusting piece arranged on the clamping plate and a limiting piece arranged on the bottom plate and movably connected with the adjusting piece. The plasma cleaning machine has the advantages that the supporting assembly and the adjusting assembly are arranged, a plurality of IGBT modules can be placed on the plasma cleaning machine, the IGBT modules can be placed in the plasma cleaning machine in an inclined angle, the surfaces of the IGBT modules can be cleaned, and the cleaning effect is kept consistent.

Description

Technical Field

[0001] This utility model relates to the field of IGBT manufacturing technology, and in particular to a tilting mechanism and a tooling for plasma cleaning of IGBT modules. Background Technology

[0002] Plasma, like solids, liquids, and gases, is a state of matter, also known as the fourth state of matter. Applying sufficient energy to a gas to ionize it creates plasma. The "active" components of plasma include ions, electrons, active functional groups, excited-state nuclides (metastable states), and photons. Plasma cleaners utilize the properties of these active components to treat sample surfaces, achieving purposes such as cleaning, modification, and photoresist ashing.

[0003] For example, in IGBT module packaging, plasma cleaners are typically used to clean the surface of the IGBT module. In a vacuum chamber, a radio frequency power supply generates high-energy, disordered plasma under certain pressure. This plasma bombards the surface of the product being cleaned, achieving the cleaning purpose. However, plasma cleaning processes usually involve placing the product directly into the plasma cleaner, making it difficult to maintain consistent cleaning results. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] In view of the problem of poor surface cleaning effect of IGBT modules in the above or existing technologies, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a tilting mechanism.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a tilting mechanism, which includes a support assembly, a base plate, and a clamping plate rotatably connected to the base plate; and an adjustment assembly, which is disposed between the base plate and the clamping plate, including an adjustment member disposed on the clamping plate and a limiting member disposed on the base plate and movably connected to the adjustment member.

[0008] As a preferred embodiment of the tilting mechanism of this utility model, the adjusting member includes a positioning groove disposed on one side of the bottom end of the clamping plate, and a slot disposed on the inner wall of the positioning groove.

[0009] As an optimal scheme of the tilting mechanism of the utility model, wherein: the limiting piece includes the limiting slot arranged on the bottom plate, and the limiting rod rotatably arranged in the limiting slot; wherein, the end of the limiting rod is movably connected with the clamping groove.

[0010] As an optimal scheme of the tilting mechanism of the utility model, wherein: the bottom plate is provided with the mounting slot, and the clamping plate is arranged in the mounting slot.

[0011] As an optimal scheme of the tilting mechanism of the utility model, wherein: the clamping plate and the bottom plate have a certain included angle.

[0012] As an optimal scheme of the tilting mechanism of the utility model, wherein: the top end of the limiting rod is provided with the anti-skid pad.

[0013] The utility model discloses the beneficial effect: the utility model discloses a support assembly and adjusting assembly can be placed several IGBT modules, so that IGBT module is placed in the plasma cleaning machine with the angle of inclination, so that the IGBT module surface can be cleaned, and the cleaning effect remains consistent.

[0014] In view of the actual use process, there is still the problem of how to make the IGBT module cleaning effect consistent.

[0015] To solve the above technical problems, the utility model also provides the following technical scheme: a tool for IGBT module plasma cleaning includes tilting mechanism, and, fixing assembly, the fixing assembly is arranged at the top of the clamping plate, and includes the fixing piece arranged on the clamping plate not less than two groups.

[0016] As an optimal scheme of the tool for IGBT module plasma cleaning of the utility model, wherein: the fixing piece includes the fixing slot arranged on the clamping plate, and the fixing clamp arranged in the fixing slot and matched with the fixing slot.

[0017] As an optimal scheme of the tool for IGBT module plasma cleaning of the utility model, wherein: the four around of the fixing clamp are provided with the buffer block.

[0018] The utility model discloses the beneficial effect: through setting fixing assembly, can fix IGBT module on support assembly and adjusting assembly, so that several IGBT modules can keep an angle, so that the plasma wind can be blown to each tool, so that the cleaning effect of the several IGBT modules placed remains consistent. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings. Among them:

[0020] Figure 1 It is a schematic view of the structure of the present application as a whole.

[0021] Figure 2 It is an exploded view of the present application.

[0022] Figure 3 It is a schematic view of the structure of the clamping plate in the present application.

[0023] Figure 4 It is a state use view of the clamping plate in the present application.

[0024] Figure 5 It is a side view of Figure 4 .

[0025] Figure 6 It is a schematic view of the structure of the fixed clamp in the present application. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purpose, features and advantages of the present application more obvious, the specific embodiments of the present application will be described in detail in conjunction with the drawings of the specification.

[0027] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0028] Secondly, the "one embodiment" or "embodiment" referred to herein means that the specific features, structures or characteristics can be included in at least one implementation of the present application. In this specification, "in one embodiment" does not mean the same embodiment, nor is it an independent or alternative embodiment.

[0029] Embodiment 1

[0030] Referring to Figure 1For the first embodiment of the utility model, the embodiment provides a tilting mechanism which can keep IGBT modules at the same angle, which comprises a supporting assembly 100 and an adjusting assembly 200, the angle of the supporting assembly 100 is adjusted by setting the adjusting assembly 200, the supporting assembly 100 is used for placing tooling, the angle of the IGBT modules placed in the plasma machine is adjusted by adjusting the angle of the supporting assembly 100, when the plasma wind in the plasma machine blows from left to right, the surface of the IGBT module 7 can be blown.

[0031] Specifically, the supporting assembly 100 comprises a bottom plate 101 and a clamping plate 102 rotationally connected with the bottom plate 101; the bottom plate 101 is in contact with the inner bottom surface of the plasma machine and is used for supporting the clamping plate 102; the clamping plate 102 can be used for placing multiple IGBT modules.

[0032] Further, the adjusting assembly 200 is arranged between the bottom plate 101 and the clamping plate 102 and comprises an adjusting piece 201 arranged on the clamping plate 102 and a limiting piece 202 arranged on the bottom plate 101 and movably connected with the adjusting piece 201. The adjusting piece 201 and the limiting piece 202 are used for adjusting the angle of the clamping plate 102, the angle of the clamping plate 102 can be adjusted according to the size of the IGBT module, so that the surface of the IGBT module mounted on the clamping plate 102 can be bombarded by the plasma, thereby keeping the cleaning effect of all the IGBT modules placed on the clamping plate 102 consistent.

[0033] Operation process: when used, the IGBT module to be cleaned is placed on the clamping plate 102, then the clamping plate 102 is rotated upward, the clamping plate 102 is fixed at a certain angle by the adjusting piece 201 and the limiting piece 202, and then the whole is placed in the plasma cleaning machine for cleaning.

[0034] In summary, by setting the supporting assembly 100 and the adjusting assembly 200, the IGBT modules can be placed in the plasma cleaning machine in order and at a certain angle, so that the whole surface of the IGBT module can be bombarded by the plasma, and the cleaning effect of the multiple IGBT modules is kept consistent.

[0035] Embodiment 2

[0036] Reference Figures 2-4 For the second embodiment of the utility model, different from the previous embodiment, the embodiment provides further optimization of the tilting mechanism, solves the problem of how to keep the tooling at a cleaning angle, which comprises the adjusting piece 201 comprising a positioning groove 201a arranged at one side of the bottom end of the clamping plate 102 and a clamping groove 201b arranged on the inner wall of the positioning groove 201a. The inner bottom end of the positioning groove 201a is provided with multiple clamping grooves 201b.

[0037] Specifically, the limiting piece 202 includes a limiting groove 202a arranged on the bottom plate 101, and a limiting rod 202b rotatably arranged in the limiting groove 202a; wherein the end of the limiting rod 202b is movably connected with the clamping groove 201b. The top end of the limiting rod 202b is provided with an anti-skid pad 202b-1. The limiting rod 202b is rotatably arranged in the limiting groove 202a on the bottom plate 101, and a connecting rod is arranged on the inner side of the limiting groove 202a close to the bottom end, which is used to limit the position of the limiting rod 202b, so that the limiting rod 202b does not rotate downward, but only rotates upward. The limiting rod 202b rotates upward, and the free end of the limiting rod 202b is clamped into the clamping groove 201b, so as to fix the clamping plate 102. The top end of the limiting rod 202b is provided with an anti-skid pad 202b-1, which can make the connection between the limiting rod 202b and the clamping groove 201b more stable.

[0038] Further, the bottom plate 101 is provided with a mounting groove 101a, and the mounting groove 101a is internally provided with the clamping plate 102. The mounting groove 101a on the bottom plate 101 is used to accommodate the clamping plate 102.

[0039] Still further, the clamping plate 102 and the bottom plate 101 have a certain included angle. The angle of the clamping plate 102 can be adjusted to different angles, and the free end of the limiting rod 202b is connected with different clamping grooves 201b in the inner part of the positioning groove 201a, so that the clamping plate 102 can be fixed at different angles.

[0040] Operation process: when in use, the IGBT module is placed on the surface of the clamping plate 102, and then the clamping plate 102 is rotated to a certain angle, and then the limiting rod 202b is rotated to clamp the limiting rod 202b into the clamping groove 201b at the bottom end of the clamping plate 102. When it is necessary to adjust the angle of the clamping plate 102, the limiting rod 202b is clamped into another clamping groove 201b at the bottom end of the clamping plate 102.

[0041] In summary, by setting the adjusting piece 201 and the limiting piece 202 to adjust the angle of the clamping plate 102, the corners of the surface of the IGBT module on the clamping plate 102 can be bombarded by plasma, so as to ensure the cleaning effect of the IGBT module.

[0042] Example 3

[0043] Reference Figures 5-6For the third embodiment of the utility model, different from the previous embodiment, the embodiment provides a tool for IGBT module plasma cleaning, solves the problem of how to make the tool maintain the same cleaning effect, and comprises a fixing assembly 300, the fixing assembly 300 is arranged at the top end of the clamping plate 102, and comprises no less than two groups of fixing pieces 301 arranged on the clamping plate 102.The fixing piece 301 is used for fixing the IGBT module on the clamping plate 102.

[0044] Specifically, the fixing piece 301 comprises a fixing groove 301a arranged on the clamping plate 102 and a fixing clamp 301b arranged inside the fixing groove 301a and matched with the fixing groove 301a.The IGBT module is installed in the fixing groove 301a through the fixing clamp 301b; the fixing clamp 301b is sleeved to the periphery of the plate of the IGBT module.In the utility model, the fixing clamp 301 is made of rubber material, and different sizes of IGBT modules can be fixed in the fixing groove 301a.

[0045] Further, the fixing clamp 301b is provided with a buffer block 301b-1 around it.The buffer block 301b-1 is thick, and since the fixing clamp 301 is made of rubber material, the thickness of the buffer block 301b-1 can be adjusted, so that different sizes of IGBT modules can be fixed in the fixing groove 301a.

[0046] Operation process: when in use, the fixing clamp 301b is sleeved to the periphery of the plate of the IGBT module, and then the whole is placed in the fixing groove 301a.The plurality of IGBT modules to be cleaned are installed in different fixing grooves 301a on the clamping plate 102, the IGBT modules can be fixed through the fixing clamp 301b, and the position of the IGBT modules can be adjusted conveniently, so that the cleaning effect of the IGBT modules is guaranteed.

[0047] In summary, by arranging the fixing assembly 300, the IGBT module can be fixed and adjusted conveniently, and the IGBT module can be cleaned by plasma.

[0048] It is important to note that the construction and arrangement of the application shown in the various exemplary embodiments is illustrative only. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review the present disclosure will readily appreciate that many modifications can be made to the embodiments without departing from the spirit and scope of the application as described in the claims. For example, the order in which steps are performed can be changed, or other steps can be added, omitted, or modified. Accordingly, all such modifications are intended to be included within the scope of the present application. The application is meant to encompass all techniques and structures that are the same as or similar to those described in this disclosure, and alternatives and modifications that are apparent to those skilled in the art are intended to be encompassed by the present claims. The claims should not be limited to the embodiments set forth in the specific written description and the drawings, but can include any other embodiments that fall within the scope of the present application as defined by the claims.

[0049] Furthermore, in order to provide a concise description of the exemplary embodiments, not all features of an actual implementation can be described.

[0050] It is understood that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions can be made. Such development efforts can inevitably lead to modifications, not all of which can be wholly incorporated into this disclosure. Moreover, it will be appreciated that the development of an actual implementation is a complex and time-consuming process that would not be reasonable in to capture in complete detail in this disclosure. The detailed description is, therefore, not to be taken in a literal sense, and the specific implementation described is meant to be illustrative only and not limiting as to the scope of the present application.

[0051] It should be noted that the above examples are intended to be illustrative only and not limiting of the technical solutions of the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application, and all such modifications or replacements should be included in the scope of the claims of the present application.

Claims

1. A tilting mechanism, characterized by: Including, The support assembly (100) comprises a bottom plate (101) and a clamping plate (102) rotationally connected with the bottom plate (101); and The adjusting assembly (200) is arranged between the bottom plate (101) and the clamping plate (102) and comprises an adjusting piece (201) arranged on the clamping plate (102) and a limiting piece (202) arranged on the bottom plate (101) and movably connected with the adjusting piece (201).

2. The tilting mechanism of claim 1, wherein: The adjusting piece (201) comprises a positioning groove (201a) arranged on one side of the bottom end of the clamping plate (102) and a clamping groove (201b) arranged on the inner wall of the positioning groove (201a).

3. The tilting mechanism of claim 2, wherein: The limiting piece (202) comprises a limiting groove (202a) arranged on the bottom plate (101) and a limiting rod (202b) rotationally arranged in the limiting groove (202a). The end of the limiting rod (202b) is movably connected with the clamping groove (201b).

4. The tilting mechanism of claim 2, wherein: The bottom plate (101) is provided with a mounting groove (101a), and the mounting groove (101a) is internally provided with the clamping plate (102).

5. The tilting mechanism of claim 2, wherein: The clamping plate (102) and the bottom plate (101) have an included angle.

6. The tilting mechanism of claim 3, wherein: The top end of the limiting rod (202b) is provided with an anti-skid pad (202b-1).

7. A tooling for IGBT module plasma cleaning, characterized in that: The inclination mechanism comprises the support assembly (100), the adjusting assembly (200) and the fixing assembly (300). The fixing assembly (300) is arranged at the top end of the clamping plate (102) and comprises not less than two groups of fixing pieces (301) arranged on the clamping plate (102).

8. The tooling for plasma cleaning of IGBT modules of claim 7, wherein: The fixing piece (301) comprises a fixing groove (301a) arranged on the clamping plate (102) and a fixing clamp (301b) arranged in the fixing groove (301a) and matched with the fixing groove (301a).

9. The tooling for plasma cleaning of IGBT modules of claim 8, wherein: The periphery of the fixing clamp (301b) is provided with a buffer block (301b-1).

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