Jig for semiconductor packaging base brazing
By designing a fixture for semiconductor packaging bases, and utilizing a combination of pressure plates, positioning plates, and limiting blocks, the problems of flowability and expansion coefficient differences during high-temperature welding of microcrystalline glass and metal were solved, achieving a stable and reliable welding effect.
Patent Information
- Application Number
- CN202422516184.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-17
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-10-17
AI Technical Summary
When microcrystalline glass is welded to metal at high temperatures, it has high flowability, making it difficult to form a reliable seal. In addition, the difference in expansion coefficients is large, which easily leads to welding defects.
Design a fixture including a pressure plate, a positioning plate, and a limiting block. The fixture positions and limits the microcrystalline glass ring through multiple positioning points and limiting structures, ensuring that excessive flow does not occur during brazing and improving welding reliability.
Stable welding of microcrystalline glass and metal has been achieved, reducing welding defects and improving sealing efficiency and aesthetics.
Smart Images
Figure CN223656196U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor manufacturing especially relates to a jig for semiconductor package base brazing. BACKGROUND
[0002] Compared with general ceramic and glass, the microcrystalline glass has better strength, wear resistance, electrical insulation and hardness, and has been widely applied with excellent performance and characteristics. When applied in some specific fields, the microcrystalline glass needs to be welded with metal at high temperature to manufacture a semiconductor package base, but compared with black ceramic products, the microcrystalline glass has higher flowability at high temperature, and it is difficult to form reliable sealing, and the expansion coefficient difference between the microcrystalline glass and most metals is large, so it is non-matching welding, and the stress at the welding position is large, and defects are easy to produce. Therefore, in order to realize the high-temperature brazing of the microcrystalline glass and the metal, a stable and safe positioning device needs to be provided. SUMMARY
[0003] The utility model relates to a jig for semiconductor package base brazing.
[0004] The technical scheme for realizing the purpose of the utility model is: a jig for brazing of a semiconductor packaging base, which comprises a pressing plate and a positioning plate that are buckled to each other, the semiconductor packaging base comprises a first microcrystalline glass ring, a second microcrystalline glass ring and a lead frame, two groups of lead groups are symmetrically arranged in the lead frame, the first microcrystalline glass ring and the second microcrystalline glass ring are located between the two groups of lead groups, the first microcrystalline glass ring is stacked above the second microcrystalline glass ring, one end of the lead group is horizontally fixed on the lead frame, the other end of the lead group is bent upwards along the side surface of the second microcrystalline glass ring to form a bending part and is then clamped between the first microcrystalline glass ring and the second microcrystalline glass ring; a plurality of first limiting seats for placing the semiconductor packaging base are arranged on the upper surface of the positioning plate at intervals, a first positioning block is arranged on each of the two ends of the length direction of the lead frame on the first limiting seat, two second positioning blocks are further arranged between the two first positioning blocks, the two second positioning blocks are oppositely arranged and are parallel to the first positioning blocks, a limiting space of the second microcrystalline glass ring is formed between the two second positioning blocks, and the height of the second positioning block is limited so as not to interfere with the lead group; a plurality of second limiting seats are arranged on the opposite surfaces of the pressing plate and the positioning plate at intervals, each second limiting seat corresponds to each first limiting seat one by one, each second limiting seat comprises a first recessed groove for limiting the lead frame, the first recessed groove is matched with the outer contour of the lead frame, a second recessed groove for limiting the periphery of the two bending parts is arranged in the middle of the first recessed groove, two third positioning blocks are symmetrically arranged in the middle of the second recessed groove, a limiting space of the outer wall of the first microcrystalline glass ring and the second microcrystalline glass ring is formed between the two third positioning blocks, and a through hole penetrating through the pressing plate is arranged in the center of the second recessed groove.
[0005] Further, the jig further comprises a limiting block embedded in the first microcrystalline glass ring and the second microcrystalline glass ring, the thickness of the limiting block is greater than the sum of the thicknesses of the first microcrystalline glass ring and the second microcrystalline glass ring, and a third recessed groove for limiting the limiting block is arranged in the middle of the second recessed groove. The limiting block effectively limits the inner cavity of the product and effectively plasticizes the inner cavity of the product, thereby limiting the excessive flow of the microcrystalline glass during brazing.
[0006] Further, the first positioning blocks adjacent to each other are integrated.
[0007] The jig has simple structure and is easy to process, and multiple positioning points are designed, so that reliable welding can be formed while effectively positioning and plasticizing the microcrystalline glass product, and the sealing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS
[0008] Figure 1The structure schematic view of the semiconductor packaging base is shown in the embodiment of the utility model.
[0009] Figure 2 The assembly structure schematic view of the jig for brazing the semiconductor packaging base is shown in the embodiment of the utility model.
[0010] Figure 3 For Figure 2 The enlarged structure schematic view of the A part in the middle is shown.
[0011] Figure 4 The structure schematic view of the pressing plate is shown in the embodiment of the utility model.
[0012] Figure 5 For Figure 4 The enlarged structure schematic view of the B part in the middle is shown. Specific implementation
[0013] The preferred embodiment of the utility model is described in detail below in combination with the drawings.
[0014] Figure 1 The structure schematic view of the semiconductor packaging base 10 is shown in the embodiment, which comprises a first microcrystalline glass ring 101, a second microcrystalline glass ring 102 and a lead frame 103, two groups of lead groups 104 are symmetrically arranged in the lead frame 103, the first microcrystalline glass ring 101 and the second microcrystalline glass ring 102 are located between the two groups of lead groups 104, the first microcrystalline glass ring 101 is stacked above the second microcrystalline glass ring 102, one end of the lead group 104 is horizontally fixed on the lead frame 103, the other end of the lead group 104 is clamped between the first microcrystalline glass ring 101 and the second microcrystalline glass ring 102 after being bent upwards along the side surface of the second microcrystalline glass ring 102 to form a bending part 1041; the upper surface of the first microcrystalline glass ring 101 and the bottom surface of the second microcrystalline glass ring 102 are both attached with a to-be-brazed kovar metal 105.
[0015] As Figures 2 to 5As shown, a jig for soldering semiconductor package base includes a pressing plate 1, a positioning plate 2 and a limiting block 3, the pressing plate 1 and the positioning plate 2 are buckled with each other. The upper surface of the positioning plate 2 is provided with a plurality of first limiting seats 21 for placing the semiconductor package base 10, the first limiting seat 21 is provided with a first limiting block 211 at the length direction of the lead frame 103, two second limiting blocks 212 are further provided between the two first limiting blocks 211, the two second limiting blocks 212 are oppositely arranged and parallel to the first limiting block 211, the limiting space of the second microcrystalline glass ring 102 is formed between the two second limiting blocks 212, the height of the second limiting block 212 is limited so as not to interfere with the lead group 104; the limiting block 3 is embedded in the first microcrystalline glass ring 101 and the second microcrystalline glass ring 102, the thickness of the limiting block 3 is greater than the sum of the thicknesses of the first microcrystalline glass ring 101 and the second microcrystalline glass ring 102; a plurality of second limiting seats 11 are provided on the opposite surfaces of the pressing plate 1 and the positioning plate 2, each second limiting seat 11 corresponds to each first limiting seat 21, each second limiting seat 11 includes a first recess 111 for limiting the lead frame, the first recess 111 is matched with the outer contour of the lead frame 103, a second recess 112 is formed in the middle of the first recess 111 for limiting the periphery of the two bending parts 1041, two third limiting blocks 113 are symmetrically arranged in the middle of the second recess 112, the limiting space of the outer wall of the first microcrystalline glass ring 101 and the second microcrystalline glass ring 102 is formed between the two third limiting blocks 113; a third recess 114 is formed in the middle of the second recess 112 for limiting the limiting block 3, a through hole 115 is formed in the center of the third recess 114.
[0016] In use, the semiconductor package base 10 is placed on the first limiting seat 21, the second limiting block 212 is located below the bending part 1041, then the limiting block 3 is buckled into the center of the first microcrystalline glass ring 101 and the second microcrystalline glass ring 102, then the pressing plate 1 and the positioning plate 2 are buckled, the length direction of the lead frame 104 is located in the first recess 114, and the limiting block 3 is embedded in the third recess 114.
[0017] The jig realized by the embodiment is used for positioning the product from the upper side, increasing the pressure on the product during soldering, reducing the generation of holes, and increasing the aesthetic appearance of the product; the limiting block effectively limits the inner cavity of the product, effectively plasticizes the inner cavity of the product, and limits the excessive flow of microcrystalline glass during soldering; the positioning plate can inlay the limiting block, and can also position the lead frame and lead group parts of the product, thereby reducing the assembly difficulty.
[0018] The third sink and limiting block described in this utility model are provided as needed. Adding the third sink and limiting block helps the fixture to limit the semiconductor packaging base in all directions, ensuring the welding effect.
[0019] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent process transformations made using the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A fixture for brazing semiconductor package substrates, characterized in that: It includes interlocking pressure plates and positioning plates. The semiconductor packaging base includes a first microcrystalline glass ring, a second microcrystalline glass ring, and a lead frame. Two sets of lead groups are symmetrically arranged within the lead frame. The first microcrystalline glass ring and the second microcrystalline glass ring are located between the two sets of lead groups. The first microcrystalline glass ring is stacked on top of the second microcrystalline glass ring. One end of each lead group is horizontally fixed to the lead frame, and the other end of each lead group is bent upward along the side of the second microcrystalline glass ring to form a bend and then clamped between the first and second microcrystalline glass rings. The upper surface of the positioning plate is provided with several first limiting seats for placing the semiconductor packaging base. A first positioning block is provided at each end of the first limiting seat along the length direction of the lead frame. Two second positioning blocks are also provided between two first positioning blocks. The second positioning blocks are arranged opposite to each other and parallel to the first positioning block. A limiting space for the second microcrystalline glass ring is formed between the two second positioning blocks. The height of the second positioning blocks is limited to not interfering with the lead assembly. Several second limiting seats are spaced apart on the surface of the pressure plate and the positioning plate. Each second limiting seat corresponds to each first limiting seat. Each second limiting seat includes a first recess for limiting the lead frame. The first recess is adapted to the outer contour of the lead frame. A second recess is opened in the middle of the first recess for limiting the periphery of the two bends. Two third positioning blocks are symmetrically arranged in the middle of the second recess. A limiting space for the outer wall of the first microcrystalline glass ring and the second microcrystalline glass ring is formed between the two third positioning blocks. A through hole penetrating the pressure plate is opened in the center of the second recess.
2. The fixture for brazing semiconductor package substrates according to claim 1, characterized in that: The fixture further includes a limiting block embedded in the first microcrystalline glass ring and the second microcrystalline glass ring. The thickness of the limiting block is greater than the sum of the thicknesses of the first microcrystalline glass ring and the second microcrystalline glass ring. A third sink is provided in the middle of the second sink for limiting the limiting block.
3. The fixture for brazing semiconductor package substrates according to claim 1, characterized in that: The adjacent first positioning blocks are connected as one unit.