Electronic component tin immersion production equipment

Abstract

The utility model relates to electronic component tin immersion production equipment which comprises a machine table, two sets of tin grooves which are oppositely distributed are installed on the top face of the machine table, two welding-aiding assemblies which are oppositely distributed are arranged on the top face of the machine table between the two sets of tin grooves, and the welding-aiding assemblies are used for smearing soldering flux on pins of electronic components. The weld-aiding assembly comprises a liquid storage tank installed on the top face of the machine table and a movable tank connected to the top face of the liquid storage tank in a clamped mode, and a sponge body is arranged in the movable tank. According to the technical scheme, the soldering flux is injected into the liquid storage tank, flows into the movable tank and permeates into the sponge body in the movable tank, and the pins of the electronic component are immersed into the sponge body, so that the soldering flux is uniformly attached to the pins, the working efficiency of smearing the soldering flux is improved, and meanwhile, the soldering flux can be accurately smeared by observing the infiltration degree of the sponge. And a proper amount of soldering flux can be supplemented at proper time.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component processing technical field, concretely relates to a kind of electronic components tin immersion production equipment. BACKGROUND

[0002] Welding technology is the operation method that two or more than two to be welded objects are connected into a whole using solder at high temperature or high temperature, and welding technology appears with the wide application of metal, and there is a tin immersion welding in welding technology, and tin immersion welding needs to be immersed in tin and add flux, and the sequence of the two is to add flux first and then immerse in tin, so a tin immersion machine automatic flux adding device is needed when tin immersion welding, so that welding is more convenient.

[0003] The addition of flux in tin immersion welding is very important, which makes the welding more reliable, and the flux can prevent oxidation reaction and has a protective effect. The flux needs to be added continuously during welding. At present, the tin immersion machine generally uses manual flux adding method, which has the disadvantages of low work efficiency and cannot reasonably add flux according to the use of flux. UTILITY MODEL CONTENT

[0004] Therefore, the utility model aims to provide an electronic component tin immersion production equipment to solve the problems raised in the background technology.

[0005] The utility model realizes the following technical scheme:

[0006] An electronic component tin immersion production equipment includes a table, two groups of tin slots are installed on the top surface of the table in an opposite distribution, two flux assembly components are arranged on the top surface of the table between the two groups of tin slots in an opposite distribution, the flux assembly component is used for smearing flux on the pin of the electronic component, and the flux assembly component includes a liquid storage tank installed on the top surface of the table and a movable tank clamped on the top surface of the liquid storage tank.

[0007] Further, the top surface of the side wall of the liquid storage tank opposite to both sides is provided with a clamping groove, the movable tank opposite to both sides is clamped with the two clamping grooves respectively, and the sponge body is consistent with the internal space of the movable tank.

[0008] Further, a plurality of through holes are arranged on the inner wall bottom surface of the movable tank, the plurality of through holes longitudinally penetrate the inner wall bottom surface of the movable tank, the inner wall bottom surface of the movable tank is also provided with a liquid injection hole, the liquid injection hole longitudinally penetrates the inner wall bottom surface of the movable tank, the bottom surface of the liquid injection hole is connected with a liquid inlet pipe, and a one-way valve is arranged on the liquid inlet pipe.

[0009] Further, it further includes a tin immersion mechanism, the tin immersion mechanism is installed on the top surface of the frame, and the tin immersion mechanism is used for clamping the electronic component into the tin slot for tin immersion.

[0010] Further, the tin immersion mechanism comprises a movable seat, a mechanical arm and a clamping member, the movable seat is installed on the top surface of the rack, one end of the mechanical arm is connected with the movable seat, and the other end is connected with the clamping member.

[0011] Further, the clamping member comprises a mounting plate, a mounting seat and two symmetrically distributed clamping plates, the mounting plate is connected with the end of the mechanical arm away from the movable seat, the mounting plate is provided with a mounting hole, and the mounting seat is installed in the mounting hole.

[0012] Further, the bottom surface of the mounting seat is provided with a sliding groove extending along the length direction of the mounting seat, the outer sides of the two clamping plates are connected with fixing plates, one end of the fixing plate is connected with the outer side of the clamping plate, and the other end extends upwards, the top surfaces of the two fixing plates are both provided with electric sliding blocks slidingly matched with the sliding groove, and the two electric sliding blocks drive the two clamping plates to move synchronously towards or away from each other along the sliding groove.

[0013] Further, the mounting plate is provided with two first reciprocating pushing mechanisms, the bottom ends of the two first reciprocating pushing mechanisms vertically penetrate the bottom end of the mounting plate, and the bottom ends of the two first reciprocating pushing mechanisms are connected with an adsorption plate.

[0014] The electronic component tin immersion production equipment has the advantages that:

[0015] The electronic component tin immersion production equipment has the advantages that:

[0016] The other advantages, objects and features of the present application will be apparent from the following description, and to those skilled in the art, based on the examination of the following, will be apparent or can be taught from the practice of the present application. The objects and other advantages of the present application can be realized and obtained by the following description. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a perspective view of the present application;

[0018] Figure 2 It is a top view of the present application;

[0019] Figure 3 It is an explosion view of the soldering assembly of the present application;

[0020] Figure 4 It is a top view of the soldering assembly of the present application;

[0021] Figure 5 It is the internal structure schematic view of the soldering aid assembly of the utility model;

[0022] Figure 6 It is the structure schematic view of the tin immersion mechanism of the utility model;

[0023] Figure 7 It is the explosion view of the tin immersion mechanism of the utility model;

[0024] In the figure: 1, machine table; 2, tin bath;

[0025] 3, soldering aid assembly; 301, liquid storage groove; 302, movable groove; 303, clamping groove; 304, through hole; 305, liquid injection hole; 306, liquid inlet pipe; 307, one-way valve;

[0026] 4, tin immersion mechanism; 401, movable seat; 402, mechanical arm; 403, clamping member; 4031, mounting plate; 4032, mounting seat; 4033, mounting hole; 4034, clamping plate; 4035, sliding groove; 4036, fixed plate; 4037, electric sliding block; 404, first reciprocating pushing mechanism; 405, adsorption plate. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the utility model.

[0029] It should be noted that: similar signs and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0030] In the above description of this utility model, it should be noted that the terms "one side," "the other side," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Furthermore, terms such as "identical" do not imply that components must be absolutely identical; minor differences are permissible. The term "perpendicular" simply means that the positional relationship between components is more perpendicular than "parallel," not that the structure must be perfectly perpendicular; a slight tilt is acceptable.

[0032] Please see Figures 1-7 This utility model provides a technical solution: an electronic component tin-immersion production equipment, including a machine base 1, with two sets of tin baths 2 arranged oppositely on the top surface of the machine base 1, and two soldering components 3 arranged oppositely on the top surface of the machine base 1 between the two sets of tin baths 2. The soldering components 3 are used to apply flux to the pins of electronic components. The soldering components 3 include a liquid storage tank 301 installed on the top surface of the machine base 1 and a movable groove 302 snapped onto the top surface of the liquid storage tank 301. A sponge is provided in the movable groove 302.

[0033] In this technical solution, each set of solder baths 2 is equipped with two, which can alternately perform two soldering processes on electronic components. Before each soldering process, the components will come into contact with the flux absorbed by the sponge in the movable bath 302.

[0034] In use, firstly, the solder block is placed in the specially designed solder bath 2. Then, the heating program is started to heat the solder bath 2, causing the solder block to slowly melt until it is completely converted into liquid solder. Next, flux is injected into the reservoir 301. Once the reservoir 301 is full, the flux flows into the movable tank 302 and penetrates the sponge within it. Next, the electronic component is prepared for immersion soldering. Before this, a layer of flux is applied to the electronic component. Then, the electronic component is moved to the top of the movable tank 302, bringing it into contact with the flux-soaked sponge. A pressing operation is performed to ensure that the leads of the electronic component are completely immersed in the sponge, thus ensuring that the flux adheres evenly to the leads. After completing the above steps, the electronic component is removed from the sponge and quickly moved into the solder bath 2, allowing the leads to fully contact the liquid solder, completing the immersion soldering process.

[0035] The soldering flux is injected into the liquid storage tank 301, and the soldering flux flows into the movable tank 302 and penetrates into the sponge body in the movable tank 302, the pins of the electronic component are immersed into the sponge body, and thus the soldering flux is uniformly attached to the pins, the working efficiency of applying the soldering flux is improved, and the soldering flux can be supplemented in time and in an appropriate amount by observing the immersion degree of the sponge.

[0036] In the embodiment, the top surfaces of the side walls on the opposite sides of the liquid storage tank 301 are provided with clamping grooves 303, the opposite sides of the movable tank 302 are clamped with the two clamping grooves 303, and the sponge body is matched with the internal space of the movable tank 302.

[0037] The movable tank 302 is clamped in the clamping grooves 303 on the opposite sides of the liquid storage tank 301, and when the liquid storage tank 301 needs to be cleaned, the movable tank 302 can be removed to facilitate the cleaning of the inside of the liquid storage tank 301.

[0038] In the embodiment, a plurality of through holes 304 are formed in the inner wall bottom surface of the movable tank 302, the plurality of through holes 304 longitudinally penetrate the inner wall bottom surface of the movable tank 302, a liquid injection hole 305 is further formed in the inner wall bottom surface of the movable tank 302, the liquid injection hole 305 longitudinally penetrates the inner wall bottom surface of the movable tank 302, a liquid inlet pipe 306 is connected to the bottom surface of the liquid injection hole 305, and a one-way valve 307 is arranged on the liquid inlet pipe 306.

[0039] The soldering flux is injected into the liquid storage tank 301 through the liquid injection hole 305 and the liquid inlet pipe 306. As the liquid level of the soldering flux in the liquid storage tank 301 gradually rises until the bottom of the movable tank 302 is reached, the soldering flux will flow into the movable tank 302 through the liquid injection hole 305. At this time, the injection process of the soldering flux is terminated, and the one-way valve 307 is arranged on the liquid inlet pipe 306, which ensures that the soldering flux cannot flow back after the liquid storage tank 301 is filled with the soldering flux.

[0040] In the embodiment, a tin immersion mechanism 4 is further arranged on the top surface of the rack, and the tin immersion mechanism 4 is used for clamping the electronic component to immerse the electronic component in the tin tank 2.

[0041] When the electronic component is immersed in tin, manual tin immersion is not only slow but also easy to be hurt, so the tin immersion mechanism 4 is used to immerse the electronic component in tin, thereby improving the tin immersion efficiency.

[0042] In the embodiment, the tin immersion mechanism 4 includes a movable seat 401, a mechanical arm 402, and a clamping member 403. The movable seat 401 is arranged on the top surface of the rack, one end of the mechanical arm 402 is connected with the movable seat 401, and the other end of the mechanical arm 402 is connected with the clamping member 403.

[0043] In the scheme, the mechanical arm 402 is a robot capable of simulating human arm movement, which is composed of multiple joints and actuators, and can complete various complex industrial operations through remote control of the controller, which belongs to the mature technology in the prior art, therefore, the present application does not make too much description here.

[0044] The worker controls the mechanical arm 402 to move to the position where the electronic components are placed, then controls the clamping member 403 to clamp and fix the arranged electronic components, and finally controls the mechanical arm 402 to place the clamped electronic components into the tin bath 2 for tin immersion.

[0045] In the embodiment, the clamping member 403 includes a mounting plate 4031, a mounting seat 4032 and two symmetrically distributed clamping plates 4034, the mounting plate 4031 is connected to the end of the mechanical arm 402 away from the movable seat 401, the mounting plate 4031 is provided with a mounting hole 4033, the mounting seat 4032 is installed in the mounting hole 4033, and the two clamping plates 4034 are slidingly fitted to the bottom surface of the mounting seat 4032.

[0046] When the electronic components need to be clamped, the two clamping plates 4034 can adjust the spacing on the bottom surface of the mounting seat 4032, so as to facilitate clamping and releasing the electronic components.

[0047] In the embodiment, the bottom surface of the mounting seat 4032 is provided with a sliding groove 4035 extending along the length direction of the mounting seat 4032, the outer sides of the two clamping plates 4034 are connected with fixing plates 4036, one end of each fixing plate 4036 is connected with the outer side of the clamping plate 4034, and the other end extends upward, the top surfaces of the two fixing plates 4036 are respectively provided with electric sliding blocks 4037 slidingly fitted in the sliding groove 4035, and the two electric sliding blocks 4037 drive the two clamping plates 4034 to move synchronously towards or away from each other along the sliding groove 4035.

[0048] In use, the two electric sliding blocks are controlled to move synchronously towards or away from each other along the sliding groove 4035, so as to adjust the spacing between the two clamping plates 4034.

[0049] In the embodiment, the mounting plate 4031 is provided with two first reciprocating pushing mechanisms 404, the bottom ends of the two first reciprocating pushing mechanisms 404 longitudinally penetrate the bottom end of the mounting plate 4031, and the bottom ends of the two first reciprocating pushing mechanisms 404 are connected with an adsorption plate 405 located between the two clamping plates 4034.

[0050] When the clamping mechanism moves above the electronic component, firstly, the two electric sliding blocks 4037 are controlled to move synchronously and reversely along the sliding grooves 4035, so that the distance between the two clamping plates 4034 is enlarged, then the first reciprocating pushing mechanism 404 is started, the output direction of the first reciprocating pushing mechanism 404 is downward, and the adsorption plate 405 is driven to move downward until the adsorption plate 405 adsorbs the electronic component, then the two electric sliding blocks 4037 are controlled to move synchronously and oppositely along the sliding grooves 4035, so that the distance between the two clamping plates 4034 is reduced until the opposite surfaces of the two clamping plates 4034 respectively abut against the opposite sides of the adsorption plate 405, and the pins of the electronic component are located outside the two clamping plates 4034, thereby facilitating the tin immersion on the pins of the electronic component.

[0051] The first reciprocating pushing mechanism 404 can be a hydraulic cylinder or a pneumatic cylinder.

[0052] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the present application but not limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the purpose and scope of the present application, and all of them should be covered in the scope of the claims of the present application.

Claims

1. An electronic component immersion tin production apparatus comprising a machine table (1), characterized in that: The machine table (1) top surface is provided with two groups of tin tank (2) which are oppositely distributed, two groups of tin tank (2) between the machine table (1) top surface is provided with two groups of soldering flux assembly (3) which are oppositely distributed, the soldering flux assembly (3) is used for applying soldering flux to the pin of electronic component, the soldering flux assembly (3) includes liquid storage tank (301) installed on the top surface of the machine table (1) and movable tank (302) clamped on the top surface of the liquid storage tank (301), sponge body is arranged in the movable tank (302).

2. The electronic component immersion tin production apparatus according to claim 1, wherein: The relative two sides of the liquid storage tank (301) are provided with clamping groove (303) on the top surface of the side wall, the relative two sides of the movable tank (302) are respectively clamped with two clamping grooves (303), the sponge body is matched with the internal space of the movable tank (302).

3. The electronic component immersion tin production apparatus according to claim 2, wherein: A plurality of through holes (304) are arranged on the inner wall bottom surface of the movable tank (302), a plurality of through holes (304) vertically penetrate the inner wall bottom surface of the movable tank (302), the inner wall bottom surface of the movable tank (302) is also provided with liquid injection hole (305), the liquid injection hole (305) vertically penetrates the inner wall bottom surface of the movable tank (302), the bottom surface of the liquid injection hole (305) is connected with liquid inlet pipe (306), the liquid inlet pipe (306) is provided with one-way valve (307).

4. The electronic component immersion tin production apparatus according to any one of claims 1 to 3, characterized by: It also includes tin immersion mechanism (4), the tin immersion mechanism (4) is installed on the top surface of the frame, the tin immersion mechanism (4) is used for clamping electronic components into tin tank (2) for tin immersion.

5. The electronic component immersion tin production apparatus according to claim 4, wherein: The tin immersion mechanism (4) includes movable seat (401), mechanical arm (402) and clamping member (403), the movable seat (401) is installed on the top surface of the frame, one end of the mechanical arm (402) is connected with the movable seat (401), and the other end is connected with the clamping member (403).

6. The electronic component immersion tin production apparatus according to claim 5, wherein: The clamping member (403) includes mounting plate (4031), mounting seat (4032) and two symmetrically distributed clamping plates (4034), the mounting plate (4031) is connected with the end of the mechanical arm (402) away from the movable seat (401), the mounting plate (4031) is provided with mounting hole (4033), the mounting seat (4032) is installed in the mounting hole (4033), and the two clamping plates (4034) are slidingly fitted on the bottom surface of the mounting seat (4032).

7. The electronic component immersion tin production apparatus according to claim 6, wherein: The bottom surface of the mounting seat (4032) is provided with sliding groove (4035), the sliding groove (4035) extends along the length direction of the mounting seat (4032), the outer side of the two clamping plates (4034) is connected with fixing plate (4036), one end of the fixing plate (4036) is connected with the outer side of the clamping plate (4034), and the other end extends upward, the top surface of the two fixing plates (4036) is provided with electric sliding block (4037) which is slidingly fitted in the sliding groove (4035), and the two electric sliding blocks (4037) drive the two clamping plates (4034) to move synchronously towards or away from each other along the sliding groove (4035).

8. The electronic component immersion tin production apparatus according to claim 6, wherein: Two first reciprocating push mechanisms (404) are installed on the mounting plate (4031), the bottom ends of the two first reciprocating push mechanisms (404) longitudinally penetrate the bottom end of the mounting plate (4031), and the bottom ends of the two first reciprocating push mechanisms (404) are connected with an adsorption plate (405), and the adsorption plate (405) is located between the two clamping plates (4034).

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