Turnover feeding device for chip processing

Abstract

The utility model relates to a turnover feeding device for chip processing, which comprises a machine table, a feeding assembly for conveying chips is mounted on the top surface of the machine table, and the feeding assembly consists of a first conveying component, a second conveying component and a third conveying component. The top surfaces of the first material conveying component, the second material conveying component and the third material conveying component are provided with material conveying channels for moving chips; the chip overturning device further comprises an overturning mechanism, the overturning mechanism is installed on the top face of the machine table and located on one side of the third material conveying component, and the overturning mechanism is used for overturning the chips conveyed to the third material conveying component. According to the technical scheme, chips are sequentially placed in the material conveying channel on the top face of the first material conveying component, the chips flow through the second material conveying component and finally stop between the material conveying channel on the third material conveying component and the turnover mechanism, and then the chips in the material conveying channel on the third material conveying component can enter the turnover mechanism through the turnover mechanism; and when the clamping mechanism clamps the chip, the pins can be soldered outside, so that the purpose of improving the working efficiency is achieved.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and specifically to a flipping and feeding device for chip processing. Background Technology

[0002] In the assembly and production of electronic products, electronic components (chips) are typically mounted on a PCB (Printed Circuit Board) and then soldered to secure them. Common soldering methods include dip soldering, wave soldering, and reflow soldering. For PCBs with through-hole mounting, dip soldering is the primary method. Dip soldering involves immersing the PCB with the inserted electronic components in a molten solder bath, completing the soldering of numerous joints in one pass.

[0003] The dip soldering process is as follows: 1. Place the solder into a solder bath and heat the bath to melt the solder; 2. Apply flux to the printed circuit board (PCB) and component leads, usually by immersing the soldering surfaces of the PCB and component leads in flux solution or foam, or by spraying the flux solution onto the soldering surfaces of the PCB and component leads using a spray device; 3. Preheat the PCB and component leads to a certain temperature and allow the applied flux to dry; 4. Immerse the soldering surfaces of the PCB and component leads in the molten solder bath, allowing them to contact the molten solder for a period of time before removing them. The solder will then be bonded to the soldering surfaces of the PCB and component leads, completing the soldering process; 5. Trim the soldered PCB leads (remove excess leads from electronic components).

[0004] In the existing technology, because the chip has pins, the pins of the chip need to be soldered during the processing of the chip. However, the existing conveying device cannot align the pins of the chip in one direction, so the staff needs to adjust it manually, which affects the work efficiency. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a flipping and feeding device for chip processing, so as to solve the technical problems mentioned in the background art.

[0006] This utility model is achieved through the following technical solution:

[0007] A flip-feeding device for chip processing includes a machine base. A feeding assembly for chip conveying is installed on the top surface of the machine base. The feeding assembly consists of a first feeding component, a second feeding component, and a third feeding component. The two ends of the second feeding component are respectively connected to one end of the first feeding component and the third feeding component. The top surfaces of the first feeding component, the second feeding component, and the third feeding component are all provided with feeding channels for chip movement.

[0008] It further includes a flipping mechanism which is installed on the top surface of the machine table and is located on one side of the third material conveying member. The flipping mechanism is used to flip the chips conveyed to the third material conveying member.

[0009] Furthermore, the first material conveying member includes a first connecting plate, two clamping plates distributed oppositely, a cleaning component and a collecting plate. The two clamping plates distributed oppositely are both installed on the top surface of the first connecting plate and are respectively installed at both ends of the first connecting plate. Sliding grooves for the chip box to slide are formed on the opposite surfaces of the two clamping plates. The cleaning component is installed on one side of the first connecting plate, and the collecting plate is installed on the other side away from the cleaning component.

[0010] Furthermore, the cleaning component includes a first reciprocating pushing mechanism and a pushing plate. The first reciprocating pushing mechanism is installed on the bottom surface of the first connecting plate. An L-shaped plate is connected to one side of the first reciprocating pushing mechanism. The top surface of the horizontal plate of the L-shaped plate is higher than the first connecting plate. The L-shaped plate is connected to the pushing plate. The end of the pushing plate away from the L-shaped plate is slidably fitted on the top surface of the first connecting plate and is located between the two clamping plates. [[ID=​​​​​​​​​​​​​​​​​

[0017] This flipping and feeding device for chip processing sequentially places the chips to be processed into the feeding channel on the top surface of the first feeding component. The chips flow through the second feeding component and finally stop between the feeding channel on the third feeding component and the flipping mechanism. Then, through the flipping mechanism, the chips located in the feeding channel on the third feeding component can be moved into the flipping mechanism, so that the side of the chip with the pins is facing down and the side away from the pins is facing up. This makes it easier for the clamping mechanism to hold the chip with the pins on the outside for soldering. Compared with the manual adjustment of the pin direction by the operator, it is more convenient and achieves the purpose of improving work efficiency.

[0018] Other advantages, objectives, and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination and study, or may be learned from practice of this invention. The objectives and other advantages of this invention can be realized and obtained through the following description. Attached Figure Description

[0019] Figure 1 This is a perspective view of the present utility model;

[0020] Figure 2 This is a schematic diagram of the feeding component structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the first material conveying component of the present invention (first perspective).

[0022] Figure 4 For the present utility model Figure 3 A magnified view of part A in the image;

[0023] Figure 5 This is a schematic diagram of the first material conveying component of this utility model (second perspective).

[0024] Figure 6 This is a schematic diagram of the second material conveying component of the present invention (first perspective).

[0025] Figure 7 For the present utility model Figure 6 A magnified view of part B in the image;

[0026] Figure 8 This is a schematic diagram of the second material conveying component of the present invention (second perspective).

[0027] Figure 9 This is a schematic diagram of the third material conveying component of this utility model (first perspective).

[0028] Figure 10This is a schematic diagram of the third material conveying component of this utility model (second perspective).

[0029] Figure 11 Top view of the third material conveying component of this utility model;

[0030] In the diagram: 1. Machine base; 2. Feeding assembly; 201. First conveying component; 202. Second conveying component; 203. Third conveying component;

[0031] 2011, First connecting plate; 2012, Clamping plate; 2013, Cleaning assembly; 2014, Collecting plate; 2015, Slide chute; 2016, First reciprocating pushing mechanism; 2017, Push plate; 2018, L-plate; 2019, Movable groove; 20110, Second reciprocating pushing mechanism; 20111, Movable block; 20112, Discharge port;

[0032] 2021, Second connecting plate; 2022, Connecting hole; 2023, Third reciprocating drive mechanism;

[0033] 2031. Fixing base; 2032. Third connecting plate;

[0034] 3. Tilting mechanism; 301. Support plate; 302. Motor; 303. Movable plate; 304. Ear plate; 305. Fixing rod;

[0035] 4. Slide rail; 5. Slider; 6. Limiting plate; 7. Material conveying channel. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0038] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0039] In the above description of this utility model, it should be noted that the terms "one side," "the other side," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0040] Furthermore, terms such as "identical" do not imply that components must be absolutely identical; minor differences are permissible. The term "perpendicular" simply means that the positional relationship between components is more perpendicular than "parallel," not that the structure must be perfectly perpendicular; a slight tilt is acceptable.

[0041] Please see Figure 1-11 This utility model provides a technical solution: a flip-feeding device for chip processing, including a machine base 1, with a feeding assembly 2 for chip conveying installed on the top surface of the machine base 1. The feeding assembly 2 is composed of a first feeding component 201, a second feeding component 202 and a third feeding component 203. The two ends of the second feeding component 202 are respectively connected to one end of the first feeding component 201 and the third feeding component 203. The top surfaces of the first feeding component 201, the second feeding component 202 and the third feeding component 203 are all provided with feeding channels 7 for chip movement.

[0042] It also includes a flipping mechanism 3, which is installed on the top surface of the machine and located on one side of the third feeding component 203. The flipping mechanism 3 is used to flip the chips conveyed to the third feeding component 203.

[0043] In this technical solution, the two ends of the second feeding component 202 are respectively connected to one end of the first feeding component 201 and the third feeding component 203, and the feeding channels 7 are all in a connected state; the flipping mechanism 3 is located on the top surface of the feeding channel 7 on the third feeding component 203 during the chip feeding process, and the bottom surface of the flipping mechanism 3 abuts against the top surface of the third feeding mechanism.

[0044] In use, the chips to be processed are first placed into the feeding channel 7 on the top surface of the first feeding component 201, with the chip having the pins facing up and the side away from the pins facing down during the feeding process. As the chips flow through the feeding channel 7 through the second feeding component 202 and finally stop between the feeding channel 7 and the flipping mechanism 3 on the third feeding component 203, the flipping mechanism 3 is then controlled to flip the chips, so that the chips in the feeding channel 7 on the third feeding component 203 enter the flipping mechanism 3, with the chip having the pins facing down and the side away from the pins facing up. Finally, the chips in the flipping mechanism 3 are clamped by the clamping mechanism and immersed in solder.

[0045] In this process, the chips to be processed are sequentially placed into the feeding channel 7 on the top surface of the first feeding component 201. The chips flow through the second feeding component 202 and finally stop between the feeding channel 7 on the third feeding component 203 and the flipping mechanism 3. Then, through the flipping mechanism 3, the chips located in the feeding channel 7 on the third feeding component 203 can be put into the flipping mechanism 3, so that the side of the chip with the pins is facing down and the side away from the pins is facing up. This makes it easier for the clamping mechanism to hold the chip with the pins on the outside for soldering. Compared with the manual adjustment of the pin direction by the operator, it is more convenient and achieves the purpose of improving work efficiency.

[0046] In this embodiment: the first conveying component 201 includes a first connecting plate 2011, two opposing clamping plates 2012, a cleaning component 2013, and a collecting plate 2014. The two opposing clamping plates 2012 are both installed on the top surface of the first connecting plate 2011 and are respectively installed at both ends of the first connecting plate 2011. The opposite surfaces of the two clamping plates 2012 are provided with sliding grooves 2015 for the chip box to slide. The cleaning component 2013 is installed on one side of the first connecting plate 2011, and the collecting plate 2014 is installed on the other side away from the cleaning component 2013.

[0047] In this technical solution, the clamping plate 2012 is installed on the top surface of the first connecting plate 2011, and a discharge port 20112 is opened at the bottom of the clamping plate 2012 near the second feeding component 202. The discharge port 20112 is used to allow the chip to slide smoothly from it into the feeding channel 7.

[0048] In use, multiple chip boxes are placed one by one between a pair of clamping plates 2012. The two ends of these chip boxes slide into grooves 2015 on the inner side of the clamping plates 2012, allowing the chip boxes to move smoothly along the grooves 2015. As chip boxes are added one by one, they are arranged along the grooves 2015 until the grooves 2015 are completely filled. When all the chips in the chip box at the bottom of the groove 2015 have entered the conveying channel 7, the cleaning component 2013 will start working, pushing the bottom chip box out so that it falls onto the collecting plate 2014. Subsequently, the remaining chip boxes will slide down one by one due to gravity. In this way, new chips can continue to be conveyed through the conveying channel 7, thereby improving the efficiency of the feeding process.

[0049] In this embodiment: the cleaning component 2013 includes a first reciprocating pushing mechanism 2016 and a push plate 2017. The first reciprocating pushing mechanism 2016 is installed on the bottom surface of the first connecting plate 2011. An L plate 2018 is connected to one side of the first reciprocating pushing mechanism 2016. The top surface of the horizontal plate of the L plate 2018 is higher than the first connecting plate 2011. The L plate 2018 is connected to the push plate 2017. The end of the push plate 2017 away from the L plate 2018 is slidably engaged with the top surface of the first connecting plate 2011 and is located between two clamping plates 2012.

[0050] In use, after all the chips in the chip box at the bottom of the chute 2015 have entered the feeding channel 7, the first reciprocating push mechanism 2016 is activated and changes from an extended state to a retracted state. During the retraction of the first reciprocating push mechanism 2016, it will drive the L plate 2018 and the push plate 2017 to retract synchronously along the direction of the first connecting plate 2011. During the retraction of the push plate 2017 along the direction of the first connecting plate 2011, the chip box at the bottom of the chute 2015 will be pushed out and collected.

[0051] In this embodiment: a movable groove 2019 is provided at the bottom end of the side of the chute 2015 near the collecting plate 2014. The movable groove 2019 extends horizontally through the side wall of the chute 2015, and a second reciprocating pushing mechanism 20110 is provided on the outside of the chute 2015 above the movable groove 2019. The bottom end of the second reciprocating pushing mechanism 20110 is connected to a movable block 20111 that slides within the movable groove 2019.

[0052] In this technical solution, an opening is constructed between the bottom of the slide 2015 next to the collection plate 2014 and the first connecting plate 2011, and the vertical dimension of the opening matches the chip box; the second reciprocating push mechanism 20110 is extended in its initial configuration, at which time the lower middle end of the moving block 20111 is exactly within the range of this opening.

[0053] When in use, when it is necessary to clean an empty chip box, first start the second reciprocating pushing mechanism 20110. The second reciprocating pushing mechanism 20110 changes from the extended state to the contracted state. When the second reciprocating pushing mechanism 20110 contracts, it can drive the movable block 20111 to rise along the movable groove 2019, so that the movable block 20111 is completely retracted into the movable groove 2019 from the opening, facilitating the cleaning component 2013 to push out the empty chip box.

[0054] In this embodiment: The second feeding member 202 includes a second connecting plate 2021, a connecting hole 2022 and a third reciprocating pushing mechanism 2023. The second connecting plate 2021 is in an inverted "L" shape. The connecting hole 2022 is opened at the bending part of the second connecting plate 2021 and transversely penetrates through the second connecting plate 2021 and is located in the feeding channel 7. The third reciprocating pushing mechanism 2023 is installed on the bottom surface of the second connecting plate 2021, and the output direction of the third reciprocating pushing mechanism 2023 is the direction of the connecting hole 2022.

[0055] When the chip slides from the feeding channel 7 on the first connecting plate 2011 to the feeding channel 7 on the second connecting plate 2021, it will stop sliding at the bending part of the second connecting plate 2021. Subsequently, the third reciprocating pushing mechanism 2023 is started, and the inner rod of the third reciprocating pushing mechanism 2023 will pass through the connecting hole 2022 and extend until the chip located at the bending part of the second connecting plate 2021 is pushed into the third feeding member 203. This process is repeated until the feeding channel 7 on the third feeding member 203 is filled with chips.

[0056] In this embodiment: The third feeding member 203 includes a fixed seat 2031 and a third connecting plate 2032. The third connecting plate 2032 is installed on the top surface of the fixed seat 2031, and the feeding channel 7 is opened on the top surface of the third connecting plate 2032.

[0057] After the third reciprocating pushing mechanism 2023 pushes the chip into the feeding channel 7 on the third connecting plate 2032, the chip is then flipped by the flipping mechanism 3, so that the chip enters the flipping mechanism 3 from the third connecting plate 2032, with the pins of the chip facing downward uniformly and the side away from the pins facing upward.

[0058] In this embodiment, the flipping mechanism 3 includes a support plate 301, a motor 302, a movable plate 303, and two fixed rods 305 installed on the same side of the fixed base 2031. The lower end of the fixed rod 305 is connected to one side of the support plate 301, and the upper end extends upward above the third connecting plate 2032. The motor 302 is installed on the top surface of one side of the support plate 301. The output shaft of the motor 302 is connected to a rotating rod. Both ends of the movable plate 303 are connected to ear plates 304. The two ear plates 304 respectively abut against the upper ends of the two fixed rods 305. The end of the rotating rod away from the motor 302 is fixedly connected to one of the ear plates 304 and rotatably fitted onto one of the fixed rods 305. The other ear plate 304 is connected to the other fixed rod 305 by a pin.

[0059] When the third reciprocating push mechanism 2023 pushes the chip into the feeding channel 7 on the third connecting plate 2032, the motor 302 is started. The motor 302 drives the rotating rod connected to the output shaft to rotate. The rotating rod drives an ear plate 304 fixedly connected to it and the entire movable plate 303 to move together. At the same time, the ear plate 304 connected to the other end of the movable plate 303 will also rotate on the pin due to the action of the movable plate 303 connected to the rotating rod. This series of actions enables the movable plate 303 to push the chip from the top of the third connecting plate 2032, thereby realizing the flipping of the chip.

[0060] Among them, the first reciprocating drive mechanism 2016, the second reciprocating drive mechanism 20110 and the third reciprocating drive mechanism 2023 can all be hydraulic cylinders or pneumatic cylinders.

[0061] In this embodiment: a slide rail 4 is provided on one side of the support plate 301. The slide rail 4 is distributed along the vertical direction of the support plate 301. A slider 5 is slidably fitted on the slide rail 4. A limit plate 6 is connected to the top surface of the slider 5.

[0062] When the movable plate 303 is flipped, the bottom surface of the flipped movable plate 303 abuts against the top surface of the limiting plate 6, limiting the flipping angle of the movable plate 303 and preventing the movable plate 303 from deviating from its angle after flipping.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A turnover feeding device for chip processing, comprising a machine table (1), characterized in that: The machine table (1) top surface is provided with a feeding assembly (2) for chip conveying, the feeding assembly (2) is composed of a first feeding member (201), a second feeding member (202) and a third feeding member (203), the second feeding member (202) is connected with one end of the first feeding member (201) and the third feeding member (203) respectively, the top surface of the first feeding member (201), the second feeding member (202) and the third feeding member (203) is provided with a feeding channel (7) for chip movement. It also includes a turnover mechanism (3), which is installed on the top surface of the machine table (1) and located on one side of the third feeding member (203), and the turnover mechanism (3) is used for turning over the chip conveyed to the third feeding member (203).

2. The flip loading device for chip processing according to claim 1, wherein: The first feeding member (201) includes a first connecting plate (2011), two opposite clamping plates (2012), a cleaning assembly (2013) and a collecting plate (2014), the two opposite clamping plates (2012) are installed on the top surface of the first connecting plate (2011) and are installed on both ends of the first connecting plate (2011) respectively, the opposite surfaces of the two clamping plates (2012) are provided with a sliding groove (2015) for the sliding of the chip box, the cleaning assembly (2013) is installed on one side of the first connecting plate (2011), and the collecting plate (2014) is installed on the other side away from the cleaning assembly (2013).

3. The flip loading device for chip processing according to claim 2, wherein: The cleaning assembly (2013) includes a first reciprocating pushing mechanism (2016) and a push plate (2017), the first reciprocating pushing mechanism (2016) is installed on the bottom surface of the first connecting plate (2011), one side of the first reciprocating pushing mechanism (2016) is connected with an L plate (2018), the top surface of the horizontal plate of the L plate (2018) is higher than the first connecting plate (2011), the L plate (2018) is connected with the push plate (2017), one end of the push plate (2017) away from the L plate (2018) is slidingly fitted on the top surface of the first connecting plate (2011) and located between the two clamping plates (2012).

4. The flip loading device for chip processing according to claim 2, wherein: The sliding groove (2015) is provided with a movable slot (2019) at the bottom end of one side close to the collecting plate (2014), the movable slot (2019) transversely penetrates the side wall of the sliding groove (2015), and a second reciprocating pushing mechanism (20110) is arranged outside the sliding groove (2015) above the movable slot (2019), the bottom end of the second reciprocating pushing mechanism (20110) is connected with a movable block (20111) slidingly fitted in the movable slot (2019).

5. The flip loading device for chip processing according to claim 1, wherein: The second feeding member (202) includes a second connecting plate (2021), a connecting hole (2022) and a third reciprocating pushing mechanism (2023). The second connecting plate (2021) is in an "L" shape. The connecting hole (2022) is opened at the bending part of the second connecting plate (2021), horizontally penetrates the second connecting plate (2021), and is located in the feeding channel (7). The third reciprocating pushing mechanism (2023) is installed on the bottom surface of the second connecting plate (2021), and the output direction of the third reciprocating pushing mechanism (2023) is the direction of the connecting hole (2022).

6. The flip loading device for chip processing according to claim 1, wherein: The third feeding member (203) includes a fixed seat (2031) and a third connecting plate (2032). The third connecting plate (2032) is installed on the top surface of the fixed seat (2031). The feeding channel (7) is opened on the top surface of the third connecting plate (2032).

7. The flip loading device for chip processing according to claim 6, wherein: The flipping mechanism (3) includes a support plate (301), a motor (302), a movable plate (303) and two fixed rods (305) installed on the same side of the fixed seat (2031). The middle and lower ends of the fixed rods (305) are connected to one side of the support plate (301), and the upper ends extend upward higher than the third connecting plate (2032). The motor (302) is installed on the top surface of one side of the support plate (301). A rotating rod is connected to the output shaft of the motor (302). Both ends of the movable plate (303) are connected with ear plates (304). The two ear plates (304) are respectively in contact with the upper ends of the two fixed rods (305). The end of the rotating rod away from the motor (302) is fixedly connected to one of the ear plates (304) and is rotationally fitted on one of the fixed rods (305). The other ear plate (304) is connected to the other fixed rod (305) through a pin shaft.

8. The flip loading device for chip processing according to claim 7, wherein: A slide rail (4) is arranged on one side of the support plate (301). The slide rail (4) is distributed along the up and down direction of the support plate (301). A slider (5) is slidably fitted on the slide rail (4). A limiting plate (6) is connected to the top surface of the slider (5).

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