Cooling device and tin bath

Abstract

The utility model provides a cooling device and a tin bath, and the cooling device comprises a partition wall assembly which is provided with an opening; the air cooling assembly comprises a fan structure and a first pipeline structure, the fan structure is located in the partition wall assembly and communicates with the first pipeline structure, and the first pipeline structure penetrates through the opening to be connected with the tin bath; and the water cooling assembly is connected with the inner wall of the partition wall assembly. According to the technical scheme, the problem of energy waste in the tin bath bottom cooling process in the prior art is effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of glass processing, and in particular to a cooling device and a tin bath. BACKGROUND

[0002] In a float glass manufacturing process, after the raw materials are melted into glass liquid in a kiln process, the glass liquid reaches a tin bath process, floats on the surface of molten tin liquid in the tin bath, and completes processes such as spreading, thinning, polishing, cooling, and solidification by using its own gravity and surface tension, to become high-quality flat glass.

[0003] The tin bath is a key process in glass production, and equipment problems need to be paid attention to. The bottom cooling fan is a key device for protecting production and the tin bath.

[0004] In the prior art, the air around the cooling fan is drawn into the air pipe by the fan to cool the bottom of the tank. Since the fan has high power, the air temperature around the fan is high, and the cooling effect is poor. Therefore, it is necessary to further increase the power to suck more air for tank bottom cooling, causing a vicious cycle and wasting energy, such as CN207596709U. CONTENT OF THE UTILITY MODEL

[0005] One of the technical problems to be solved by the present application is the problem of energy waste in the tin bath bottom cooling process.

[0006] To solve the above technical problems, the present application provides a cooling device and a tin bath.

[0007] The cooling device provided by the present application comprises: a partition wall assembly having an opening; a fan cooling assembly comprising a fan structure and a first pipeline structure, the fan structure being located in the partition wall assembly, and the fan structure being in communication with the first pipeline structure, and the first pipeline structure being connected to the tin bath through the opening; and a water cooling assembly connected to the inner wall of the partition wall assembly.

[0008] In some embodiments, the partition wall assembly comprises a plurality of partition walls connected in sequence, and the water cooling assembly comprises a plurality of drainage pipelines corresponding to the partition walls one by one, the drainage pipelines being connected to the partition walls and located on the side of the partition walls close to the fan cooling assembly, and the height of the drainage pipelines in the vertical direction being higher than that of the fan cooling assembly.

[0009] In some embodiments, the drainage pipeline has a plurality of drainage openings arranged on the drainage pipeline in a linear direction and spaced apart, and the axes of the plurality of drainage openings are arranged in a vertical direction.

[0010] In some embodiments, the height difference between the drainage pipeline and the fan cooling assembly in the vertical direction is 0.03 to 0.05 times the length of the tin bath.

[0011] In some embodiments, the water cooling assembly further comprises a containing groove, the containing groove is arranged corresponding to the water drainage pipeline, and a projection of the water drainage pipeline in the vertical direction is located in the containing groove.

[0012] In some embodiments, the water cooling assembly further comprises a water pump structure, the water pump structure comprises a water inlet pipeline, a water outlet pipeline and a water pump, a first end of the water inlet pipeline is in communication with the containing groove, a second end of the water inlet pipeline is in communication with the water pump, a first end of the water outlet pipeline is in communication with the water pump, and a second end of the water outlet pipeline is in communication with the water drainage pipeline.

[0013] In some embodiments, along the direction of the shortest line between the fan structure and the partition wall, the diameter of the water drainage port decreases continuously.

[0014] In some embodiments, along the direction of the shortest line between the fan structure and the partition wall, the distance between adjacent water drainage ports increases continuously.

[0015] In some embodiments, the cooling device further comprises a control assembly, the control assembly comprises a temperature monitoring module and a control module, the temperature monitoring module is connected with the tin bath, the temperature monitoring module is connected with the control module, the control module is connected with the air cooling assembly, and the control module is connected with the water cooling assembly.

[0016] According to another aspect of the present application, a tin bath is also provided, the tin bath adopts the above-mentioned cooling device, and the first pipeline structure is connected with the bottom of the tin bath.

[0017] Through the above technical solution, the cooling device provided by the present application can flow out cooling water when the fan structure radiates heat to cause the temperature in the partition wall assembly to be relatively high, the cooling water evaporates in the high-temperature environment to absorb a large amount of heat and cool the air, thereby reducing the temperature of the gas sucked into the first pipeline structure by the fan structure, ensuring the cooling effect of the tin bath, reducing the increase of the power of the fan structure, and reducing the use of energy. The technical solution of the present application effectively solves the problem of energy waste in the cooling process of the bottom of the tin bath in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 A top view structural schematic diagram of the cooling device disclosed in Embodiment One of the present application is shown;

[0020] Figure 2 A top view structural schematic diagram of the cooling device disclosed in Embodiment Two of the present application is shown;Figure 1 A schematic diagram of the internal structure of the cooling device;

[0021] Figure 3 It shows Figure 1 A partial cross-sectional view of the cooling device.

[0022] Explanation of reference numerals in the attached figures:

[0023] 10. Partition wall assembly; 11. Opening; 12. Partition wall; 20. Air-cooled assembly; 21. Fan structure; 30. Water-cooled assembly; 31. Drainage pipe; 32. Receiving tank; 33. Water pump structure; 331. Inlet pipe; 332. Outlet pipe; 333. Water pump; 34. Water supply structure; 341. Water supply pipe; 342. Valve structure. Detailed Implementation

[0024] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application. This application can be implemented in many different forms and is not limited to the specific embodiments of the application herein, but includes all technical solutions falling within the scope of the claims.

[0025] These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​illustrated in these embodiments should be interpreted as merely exemplary and not as limiting.

[0026] It should be noted that, in the description of this application, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0027] Furthermore, the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.

[0028] It should also be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0029] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0030] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0031] like Figure 1 and Figure 2 As shown, the cooling device disclosed in Embodiment 1 of this application includes a partition wall assembly 10, an air-cooled assembly 20, and a water-cooled assembly 30. The partition wall assembly 10 has an opening 11. The air-cooled assembly 20 includes a fan structure 21 and a first pipeline structure. The fan structure 21 is located inside the partition wall assembly 10 and is connected to the first pipeline structure. The first pipeline structure passes through the opening 11 and is connected to the tin bath. The water-cooled assembly 30 is connected to the inner wall of the partition wall assembly 10.

[0032] Applying the technical solution of Embodiment 1, when the heat dissipation of the fan structure 21 causes the temperature inside the partition wall assembly 10 to be high, cooling water flows out of the water-cooling assembly 30. The cooling water evaporates in the high-temperature environment, absorbing a large amount of heat and cooling the air, thereby reducing the temperature of the gas drawn into the first pipeline structure by the fan structure 21, ensuring the cooling effect of the solder bath, reducing the increase in the power of the fan structure 21, and reducing energy consumption. The technical solution of Embodiment 1 effectively solves the problem of energy waste in the cooling process at the bottom of the solder bath in the prior art.

[0033] like Figure 1 and Figure 2As shown, in the technical solution of Embodiment 1, the partition wall assembly 10 includes multiple partition walls 12 connected in sequence. The water-cooling assembly 30 includes multiple drainage pipes 31, which are arranged one-to-one with the partition walls 12. The drainage pipes 31 are connected to the partition walls 12 and located on the side of the partition walls 12 closer to the air-cooling assembly 20. The vertical height of the drainage pipes 31 is higher than that of the air-cooling assembly 20. The multiple partition walls 12 are arranged around the fan structure 21. The air around the fan structure 21, affected by the heat dissipation of the fan structure 21, is not easily moved horizontally under the action of the partition walls 12. Since the temperature of this part of the gas is high, an upward airflow is formed. The drainage pipes 31 discharge cooling water, which moves downward under the action of gravity and comes into contact with the upward-moving high-temperature air, evaporating and thus cooling the air. This structure arrangement makes the upward-moving high-temperature air and the downward-moving cooling water move towards each other, increasing their relative movement rate, accelerating liquid evaporation, and improving heat dissipation efficiency. To prevent the heat dissipation of the fan structure 21 from affecting the temperature of the bottom of the solder bath, the partition wall is made of thermal insulation material; to prevent the high-temperature water vapor after evaporation from affecting the temperature of the bottom of the solder bath, the upper edge of the partition wall is higher than the bottom of the solder bath in the vertical direction, so as to prevent the hot air from cutting off the bottom of the solder bath during the rising process and affecting the temperature of the bottom of the solder bath.

[0034] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the drainage pipe 31 has multiple drainage outlets, which are arranged alternately along a straight line on the drainage pipe 31, and the axes of the multiple drainage outlets are arranged vertically. The arrangement of multiple drainage outlets will divert the cooling water, so that the cooling water is distributed throughout the space surrounded by the partition wall assembly 10, which increases the contact area between the cooling water and the high-temperature gas, further improving the cooling efficiency. The vertical arrangement of the drainage outlets makes the drainage direction vertically downward and parallel to the partition wall 12, avoiding the problem of water flow contacting the partition wall during movement, which would slow down the flow rate.

[0035] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the vertical height difference between the drain pipe 31 and the air-cooling component 20 is 0.03 to 0.05 times the length of the solder bath. When the length of the solder bath is 100m, the vertical height difference between the drain pipe 31 and the air-cooling component 20 is 3m to 5m. When the vertical height difference between the drain pipe 31 and the air-cooling component 20 is less than 3m, the cooling water movement path is short, resulting in poor cooling effect; when the vertical height difference between the drain pipe 31 and the air-cooling component 20 is greater than 5m, the partition wall component 10 needs to be set at a higher height, resulting in higher cost and inconvenience for maintenance and repair.

[0036] like Figure 1 and Figure 2As shown, in the technical solution of Embodiment 1, the water-cooling component 30 further includes a receiving tank 32, which is arranged in a one-to-one correspondence with the drain pipe 31. The vertical projection of the drain pipe 31 is located within the receiving tank 32. The unevaporated cooling water falls into the receiving tank 32 under the action of gravity for recycling, thus avoiding the waste of water resources.

[0037] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the water-cooling component 30 further includes a water pump structure 33. The water pump structure 33 includes an inlet pipe 331, an outlet pipe 332, and a water pump 333. The first end of the inlet pipe 331 is connected to the receiving tank 32, and the second end of the inlet pipe 331 is connected to the water pump 333. The first end of the outlet pipe 332 is connected to the water pump 333, and the second end of the outlet pipe 332 is connected to the drain pipe 31. Under the action of the water pump 333, the water in the receiving tank 32 enters the water pump 333 from the inlet pipe 331, and then enters the drain pipe 31 through the outlet pipe 332, realizing the circulation of cooling water and avoiding waste of water resources. After some of the cooling water evaporates into water vapor, the water vapor moves upward and leaves the space surrounded by the partition wall component 10. Therefore, the pressure surface height in the receiving tank 32 will decrease over time. To ensure a sufficient supply of cooling water, new cooling water needs to be introduced into the receiving tank 32.

[0038] like Figure 3 As shown, in the technical solution of Embodiment 1, the water-cooled assembly 30 further includes a water supply structure 34. The water supply structure 34 includes a water supply pipe 341 and a valve structure 342. The water supply pipe 341 is connected to the receiving tank 32 and is disposed on the side wall of the receiving tank 32. The valve structure 342 is connected to the water supply pipe 341 and includes a valve body, a valve core, a lever, and a float. The float is disposed inside the receiving tank 32 and floats on the surface of the cooling water. The first end of the lever is connected to the float, and the second end of the lever is connected to the valve core. When the liquid level in the receiving tank 32 changes, the height of the float in the vertical direction changes, the valve core rotates, and the opening and closing state of the valve structure 342 changes. By reasonably setting the installation position of the valve structure 342, when the liquid level in the receiving tank 32 is high, the valve structure 342 is in the open state; when the liquid level in the receiving tank 32 decreases, the height of the float decreases, the lever rotates, the valve structure opens, and cooling water enters the receiving tank 32 to replenish the cooling water. The valve structure 342 enables automatic water replenishment of the receiving tank 32, reducing labor costs and avoiding the impact of high-temperature environments on the health of staff.

[0039] like Figure 1 and Figure 2As shown, in the technical solution of Embodiment 1, the diameter of the drain outlet continuously decreases along the shortest line connecting the fan structure 21 and the partition wall 12 from near to far. The fan structure 21 dissipates heat, resulting in a higher air temperature near the fan structure 21 than at locations far from it. Therefore, the diameter of the drain outlet near the fan structure 21 is larger than that at locations far from it, leading to a larger cooling water discharge near the fan structure 21 and a reduced discharge volume at locations far from it, thus reducing the total cooling water discharge, lowering pump energy consumption, and saving energy.

[0040] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the cooling device further includes a control component, which includes a temperature monitoring module and a control module. The temperature monitoring module is connected to the solder bath, the control module is connected to the air-cooled component 20, and the water-cooled component 30. The temperature monitoring module detects the temperature at the bottom of the solder bath and sends the temperature signal to the control module. When the temperature is high, the power of the fan structure 21 and the water pump 333 needs to be increased. Since the water pump 333 consumes less energy, its power is increased first. When the temperature is low, the power of the fan structure 21 and the water pump 333 needs to be reduced. Since the fan structure 21 consumes more energy, its power is reduced first. The connection between the control module and the air-cooled component 20 includes electrical connection and signal connection. The connection between the control module and the water-cooled component 30 includes electrical connection and signal connection. The control module receives the temperature signal from the temperature monitoring module, determines the relationship between the real-time temperature and the design temperature, and sends the signal of temperature being too low or too high to the water pump 333 and the fan structure 21 to adjust the temperature in time and ensure the stability of the environment inside the tin bath.

[0041] The difference between the technical solution of Embodiment 2 and that of Embodiment 1 lies in the increasing spacing between adjacent drain outlets along the shortest line connecting the fan structure 21 and the partition wall 12 from near to far. The fan structure 21 dissipates heat, resulting in a higher air temperature near the fan structure 21 than far from it. Therefore, the spacing between adjacent drain outlets near the fan structure 21 is smaller, while the spacing between adjacent drain outlets far from the fan structure 21 is larger. This causes the cooling water discharge near the fan structure 21 to be greater than that far from it, reducing the total cooling water discharge, lowering pump energy consumption, and saving energy.

[0042] According to another aspect of this application, a tin bath is also provided, which employs the aforementioned cooling device. The tin bath has a bottom, and a first pipeline structure is connected to the bottom. The first pipeline structure is disposed at the bottom of the bath to cool the bottom, ensuring that the temperature of the bottom meets the preset value and preventing the bottom temperature from being too high or too low, thus avoiding affecting the stability of the internal process of the glass furnace.

[0043] In summary, the structure of this application includes a cooling fan (air-cooled component 20), a water pump 333, a circulating water tank (accommodation tank 32), a water curtain, a spray pipe (drainage pipe 31), a water supply float switch (valve structure 342), an insulated wall (partition wall 12), a temperature instrument (temperature monitoring module), a DCS, and a PLC. The wall is a tin bath partition wall. The temperature of the tin bath bottom is monitored by the temperature instrument and fed back to the DCS. The DCS controls the number and frequency of the water pump 333 and the number and frequency of the air-cooled fan through temperature-level control and priority control. The cooling fan is equipped with a three-sided circulating water tank. A perforated water curtain is installed on the water tank, and a spray pipe is installed at the top of the water curtain. A water pump is used to draw water from the circulating water tank to the spray pipe at the top of the water curtain, so that the water overflows from the top of the water curtain into the circulating water tank. When the water level in the tank is too low, the water replenishment float switch opens to replenish water. After the water level is reached, the float switch (valve structure) floats upward and closes the water pipe.

[0044] The embodiments of this application have now been described in detail. To avoid obscuring the concept of this application, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions of this application based on the above description.

[0045] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any manner.

Claims

1. A cooling device, characterized in that, include: A partition wall assembly (10) having an opening (11); Air-cooled assembly (20), the air-cooled assembly (20) includes a fan structure (21) and a first pipeline structure, the fan structure (21) is located inside the partition wall assembly (10), the fan structure (21) is connected to the first pipeline structure, and the first pipeline structure passes through the opening (11) and is connected to the solder bath; A water-cooled assembly (30) is connected to the inner wall of the partition wall assembly (10).

2. The cooling device according to claim 1, characterized in that, The partition wall assembly (10) includes multiple partition walls (12) connected in sequence. The water cooling assembly (30) includes multiple drainage pipes (31). The multiple drainage pipes (31) are arranged one-to-one with the partition walls (12). The drainage pipes (31) are connected to the partition walls (12) and located on the side of the partition walls (12) close to the air cooling assembly (20). The vertical height of the drainage pipes (31) is higher than that of the air cooling assembly (20).

3. The cooling device according to claim 2, characterized in that, The drainage pipe (31) has multiple drainage outlets, which are arranged in a straight line and spaced apart on the drainage pipe (31), and the axes of the multiple drainage outlets are arranged in a vertical direction.

4. The cooling device according to claim 2, characterized in that, The vertical height difference between the drainage pipe (31) and the air-cooling component (20) is 0.03 to 0.05 times the length of the tin bath.

5. The cooling device according to claim 2, characterized in that, The water-cooling assembly (30) also includes a receiving groove (32), which is provided in a one-to-one correspondence with the drainage pipe (31), and the vertical projection of the drainage pipe (31) is located in the receiving groove (32).

6. The cooling device according to claim 5, characterized in that, The water-cooling assembly (30) also includes a water pump structure (33), which includes an inlet pipe (331), an outlet pipe (332), and a water pump (333). The first end of the inlet pipe (331) is connected to the receiving tank (32), the second end of the inlet pipe (331) is connected to the water pump (333), the first end of the outlet pipe (332) is connected to the water pump (333), and the second end of the outlet pipe (332) is connected to the drain pipe (31).

7. The cooling device according to claim 3, characterized in that, The diameter of the drain outlet decreases continuously along the shortest line connecting the fan structure (21) and the partition wall (12) from near to far.

8. The cooling device according to claim 3, characterized in that, Along the direction of the shortest line connecting the fan structure (21) and the partition wall (12) from near to far, the spacing between adjacent drain outlets continuously increases.

9. The cooling device according to claim 1, characterized in that, The cooling device further includes a control component, which includes a temperature monitoring module and a control module. The temperature monitoring module is connected to the solder bath, the temperature monitoring module is connected to the control module, the control module is connected to the air-cooled component (20), and the control module is connected to the water-cooled component (30).

10. A tin bath, characterized in that, The tin bath employs the cooling device described in any one of claims 1 to 9, the tin bath having a bottom, and the first pipeline structure being connected to the bottom of the bath.

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