Evaporation device and vapor deposition furnace

Abstract

The embodiment of the utility model provides an evaporation device and a vapor deposition furnace, and the evaporation device comprises an evaporator which is provided with an accommodating cavity for accommodating a solid material to be converted; the heating assembly is arranged outside the evaporator and is configured to heat the evaporator so as to convert the solid material into a gaseous material; the input pipeline is communicated with the accommodating cavity and is configured to convey carrier gas to the accommodating cavity; the weighing sensor is configured to detect the weight of the solid material converted into the gaseous material in the accommodating cavity; and the output pipeline is communicated with the accommodating cavity and is configured to enable the carrier gas carrying the gaseous material to be discharged out of the accommodating cavity.

Description

Technical Field

[0001] This specification relates to the field of semiconductor manufacturing technology, and in particular to an evaporation apparatus and a vapor deposition furnace. Background Technology

[0002] Chemical Vapor Deposition (CVD) is a widely used technique in materials science and semiconductor manufacturing. The basic principle of CVD is to introduce a gaseous reactive precursor into a reaction chamber. Under specific temperature and pressure conditions, the gaseous precursor undergoes a chemical reaction on the substrate surface, ultimately depositing to form a solid thin film or coating. However, when the reactive precursor is solid at room temperature and pressure, it needs to be converted into a gaseous state before it can be transported into the reaction chamber. Furthermore, it is difficult to stably and accurately transport the converted gaseous precursor into the reaction chamber under high-temperature conditions.

[0003] Therefore, it is desirable to provide an evaporation apparatus that can convert solid materials into gaseous materials and accurately deliver the gaseous materials to a designated environment while maintaining the stability of the gaseous material's morphology. For example, when the evaporation apparatus is applied to a vapor deposition furnace, the converted gaseous material (i.e., the reaction precursor) can be stably and accurately delivered to the reaction chamber of the vapor deposition furnace. Utility Model Content

[0004] Some embodiments of this specification provide an evaporation apparatus, including: an evaporator having a receiving cavity for containing a solid material to be converted; a heating assembly disposed outside the evaporator and configured to heat the evaporator to convert the solid material into a gaseous material; an input pipe communicating with the receiving cavity and configured to deliver a carrier gas into the receiving cavity; a weighing sensor configured to detect the weight of the solid material converted into the gaseous material in the receiving cavity; and an output pipe communicating with the receiving cavity and configured to allow the carrier gas to carry the gaseous material out of the receiving cavity.

[0005] In some embodiments, the heating assembly includes a first heating element and a first insulation layer; the first heating element is disposed outside the evaporator and configured to heat the evaporator, and the first insulation layer is wrapped around the evaporator and configured to insulate the evaporator.

[0006] In some embodiments, the heating assembly further includes a temperature sensor disposed within the first insulation layer and configured to detect the temperature of the evaporator.

[0007] In some embodiments, the evaporator includes a placement port and a cover, the placement port communicating with the receiving cavity, the cover being detachably and sealingly installed on the placement port, and the cover having a second insulation layer; the input pipe passes through the second insulation layer and the cover and communicates with the receiving cavity.

[0008] In some embodiments, the output conduit includes a rigid output conduit and a flexible output conduit, one end of the rigid output conduit being connected to the receiving cavity, and the other end of the rigid output conduit being connected to the flexible output conduit.

[0009] In some embodiments, a third heating element and a third insulation layer are provided outside the output pipe. The third heating element is disposed outside the output pipe and is configured to heat the output pipe. The third insulation layer is wrapped around the output pipe and is configured to insulate the output pipe.

[0010] In some embodiments, the evaporation apparatus further includes a material receiving component that is movably inserted into or removed from the receiving cavity via the placement port to deliver the solid material into the receiving cavity. The material receiving component is made of metal, graphite, or ceramic.

[0011] In some embodiments, the material receiving component is provided with heat-conducting fins.

[0012] In some embodiments, a controller is also included, configured to adjust the heating temperature of the heating assembly based on the detection results of the weighing sensor.

[0013] Some embodiments of this specification also provide a vapor deposition furnace, including a reaction chamber and the evaporation device described in the foregoing embodiments, wherein the reaction chamber is connected to the output pipe, and the reaction chamber is used for the gaseous material to undergo a vapor deposition reaction. Attached Figure Description

[0014] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0015] Figure 1 This is a schematic diagram of a module of an evaporation apparatus according to some embodiments of this specification;

[0016] Figure 2 This is a schematic diagram of the evaporation apparatus shown in some embodiments of this specification;

[0017] Figure 3 This is a schematic diagram of the evaporation apparatus according to other embodiments shown in this specification;

[0018] Figure 4 This is a structural schematic diagram of the cover according to some embodiments of this specification;

[0019] Figure 5 This is a schematic diagram of the structure of a vapor deposition furnace according to some embodiments of this specification.

[0020] Reference numerals: Evaporation device 100; Evaporator 10; Receiving cavity 11; Cylinder 12; Placement port 13; Cover 14; Heating assembly 20; First heating element 21; First insulation layer 22; Temperature sensor 23; Second insulation layer 24; Second heating element 25; Input pipe 30; First sealing flange 31; Weighing sensor 40; Output pipe 50; Flexible output pipe 51; Rigid output pipe 52; Second sealing flange 53; Third sealing flange 54; T-joint 55; Sealing plate 56; Third heating element 61; Third insulation layer 62; Material receiving component 70; Material receiving bottom plate 71; Material receiving side plate 72; Support component 73; Vapor deposition furnace 300; Reaction chamber 310; Vacuum pump 320; Process gas conveying pipe 330. Detailed Implementation

[0021] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0022] As indicated in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. The term "based on" means "at least partially based on." The term "some embodiments" means "at least one embodiment"; the term "other embodiments" means "at least one additional embodiment," and the relevant definitions of other terms will be given in the description below.

[0023] The basic principle of chemical vapor deposition (CVD) is to introduce a gaseous reactive precursor into a reaction chamber. Under specific temperature and pressure conditions, the gaseous precursor undergoes a chemical reaction on the substrate surface, ultimately depositing to form a solid thin film or coating. In some approaches, when the reactive precursor (e.g., argon, hydrogen, and ethylene) is in a gaseous state at room temperature (e.g., 25 degrees Celsius) and atmospheric pressure (e.g., one standard atmosphere), it can be delivered into the reaction chamber more stably and precisely. In other approaches, when the reactive precursor is solid at room temperature and pressure, it needs to be converted into a gaseous state before it can be delivered into the reaction chamber. However, it is difficult to stably and precisely deliver the converted reactive precursor into the reaction chamber under high-temperature conditions.

[0024] It should be noted that the vapor deposition methods mentioned in this specification may include physical vapor deposition and chemical vapor deposition. In some embodiments, chemical vapor deposition may be metal-organic chemical vapor deposition (MOCVD), plasma chemical vapor deposition (PCVD), laser chemical vapor deposition (LCVD), low-pressure chemical vapor deposition (LPCVD), ultra-high vacuum chemical vapor deposition (UHVCVD), ultrasonic chemical vapor deposition (UWCVD), etc.

[0025] Figure 1 This is a schematic diagram of a module of an evaporation apparatus according to some embodiments of this specification; Figure 2 This is a schematic diagram of the evaporation apparatus shown in some embodiments of this specification.

[0026] In some embodiments, combined with Figures 1-2 As shown, the evaporation device 100 may include an evaporator 10, a heating assembly 20, an input pipe 30, a weighing sensor 40, and an output pipe 50.

[0027] Evaporator 10 is configured to contain solid material 200 to be converted. In some embodiments, the inner wall of evaporator 10 encloses a receiving cavity 11 for containing the solid material 200 to be converted. In some embodiments, evaporator 10 may be made of conductors such as iridium (Ir), molybdenum (Mo), tungsten (W), rhenium (Re), graphite (C), tungsten-molybdenum alloy, or ceramic to facilitate heat transfer. In some embodiments, evaporator 10 may be cylindrical, cubic, prismatic, or other feasible shapes and structures.

[0028] The heating assembly 20 is configured to heat the evaporator 10 to convert the solid material 200 within the containment cavity 11 into a gaseous material. In some embodiments, the gaseous material may be a reaction precursor for a vapor deposition reaction, solid at room temperature (e.g., 25°C) and atmospheric pressure (e.g., standard atmospheric pressure), and converted into a gaseous material within the containment cavity 11 by heating with the heating assembly 20. In some embodiments, the solid material 200 may include powdered material or bulk material. In some embodiments, the process of converting the solid material 200 into a gaseous material may include: melting the solid material 200 by heating to convert it into a liquid material, and converting the liquid material into a gaseous material by evaporating and / or vaporizing it.

[0029] An inlet pipe 30 communicates with a receiving cavity 11 and is configured to deliver a carrier gas to the receiving cavity 11. In some embodiments, the carrier gas can be used to carry gaseous material out of the receiving cavity 11. For example, when the evaporation apparatus 100 is applied to a vapor deposition furnace (e.g., Figure 5 In the vapor deposition furnace 300, the carrier gas can carry the gaseous material (i.e., the reaction precursor) into the reaction chamber (e.g., through the output pipe 50) via the output pipe 50. Figure 5 In the reaction chamber 310, since the carrier gas does not participate in the vapor-phase deposition reaction and only serves to carry the gaseous material, an inert gas or a gas with high chemical stability can be selected. In some embodiments, the carrier gas can be hydrogen, nitrogen, argon, or helium. In some specific embodiments, considering both price and chemical stability, the carrier gas can be hydrogen or nitrogen.

[0030] The weighing sensor 40 is configured to detect the weight of the solid material 200 in the receiving cavity 11 after it has been converted into a gaseous material. As described above, the process of converting the solid material 200 into a gaseous material includes melting the solid material 200 into a liquid material, and evaporating and / or vaporizing the liquid material into a gaseous material. Therefore, during the conversion process, a portion of the solid material 200 may not be melted and / or the liquid material may not be evaporated or vaporized. This portion of the solid material 200 and / or liquid material accumulates in the receiving cavity 11 under its own gravity, and its weight can be detected by the weighing sensor 40. By comparing this weight with the initial weight of the solid material 200, the weight of the solid material 200 that has been converted into a gaseous material can be determined. In some embodiments, such as... Figure 3As shown, the evaporator 10 can be supported on the weighing sensor 40. The carrier gas and the converted gaseous material have little or no impact on the detection results of the weighing sensor 40, while the unconverted solid material 200 and liquid material accumulate at the bottom of the receiving cavity 11 under their own gravity, and their weight can be detected by the weighing sensor 40. In some embodiments, the weighing sensor 40 can determine the weight of the solid material 200 converted into gaseous material between two time points (i.e., the conversion amount of solid material 200) by the detection results at two time points, and can determine the conversion rate of solid material 200 into gaseous material between the two time points by combining the time difference between the two time points. In some embodiments, the weighing sensor 40 can collect the weight of the unconverted solid material 200 and liquid material at a preset frequency (e.g., the preset frequency can be 0.1 seconds, 0.5 seconds, 1 second, etc.), thereby determining the conversion amount and conversion rate of solid material 200 in each collection process.

[0031] The output conduit 50 is connected to the receiving cavity 11 and is configured to allow a carrier gas to carry gaseous material out of the receiving cavity 11. In some embodiments, the output conduit 50 may be connected to other designated chambers to deliver gaseous material to the respective chambers. For example, when the evaporation apparatus 100 is used in a vapor deposition furnace, the output conduit 50 may connect the receiving cavity 11 and the reaction chamber of the vapor deposition furnace to deliver gaseous material, which serves as a reaction precursor, to the reaction chamber.

[0032] By collecting the conversion amount and rate of solid material 200 to gaseous material using the weighing sensor 40, and combining this with the heating power of the heating component 20, a relationship between the conversion rate and the heating power of the heating component 20 can be established. This allows for maintaining a stable and controllable conversion rate by adjusting the heating power. Furthermore, since no additional flow metering or control device (such as a flow sensor) is installed for the measurement and control of high-temperature (e.g., in some embodiments of this specification, temperatures above 1000°C can be referred to as high-temperature) gaseous materials, drift and deviation of the flow sensor at high temperatures are avoided. This also prevents sensor damage and blockage of the output pipe 50 due to the condensation point of the output pipe 50, ensuring a stable and controllable supply of gaseous materials.

[0033] In some embodiments, the heating assembly 20 may include a first heating element 21, which may be disposed outside the evaporator 10 and configured to heat the evaporator 10. As an example only, the first heating element 21 may be a mineral-insulated heating cable, which can directly contact the evaporator 10 for heating without the need for insulation material to isolate it from the evaporation chamber. This reduces the overall weight of the evaporation device 100, thereby avoiding the need for a large-range weighing sensor 40 and reducing overall weighing accuracy.

[0034] In some embodiments, the heating assembly 20 may further include a first insulation layer 22, which may wrap around the evaporator 10 and is configured to insulate the evaporator 10, thereby stabilizing the temperature within the containment cavity 11. In some embodiments, the first insulation layer 22 may be made of a material with good heat resistance to maintain a stable temperature within the containment cavity 11 during operation of the evaporator 100. For example, the evaporator 10 may be made of quartz (silicon oxide), corundum (alumina), zirconium oxide, graphite, carbon fiber, ceramics, or other high-temperature resistant materials (e.g., rare earth metal borides, carbides, nitrides, silicides, phosphides, sulfides, etc.).

[0035] In some embodiments, the heating assembly 20 may include a temperature sensor 23 disposed within the first insulation layer 22. The temperature sensor 23 is configured to detect the temperature of the evaporator 10. By providing the temperature sensor 23, the temperature of the evaporator 10 can be monitored in real time, ensuring that the evaporation device 100 operates within a safe range, preventing overheating or underheating, and improving the safety and stability of the evaporation device 100. Furthermore, since the temperature sensor 23 is disposed within the first insulation layer 22 rather than directly within the receiving cavity 11, the probe of the temperature sensor 23 can be prevented from contacting the high-temperature gas in the receiving cavity 11 and being damaged.

[0036] In some embodiments, the evaporator 10 can be a modular design, meaning it is assembled from multiple components. Before adding solid material, the evaporator 10 can be disassembled, filled with the solid material, and then reassembled and sealed. As an example only, the evaporator 10 is provided with a placement port 13 and a cover 14. For instance, the evaporator 10 includes a cylinder 12 and a cover 14. The cylinder 12 has a receiving cavity 11 for accommodating solid material 200, and one end of the cylinder 12 has an opening communicating with the receiving cavity 11, which is the placement port 13 of the evaporator 10. The cover 14 is detachably installed on the placement port 13, and when installed on the placement port 13, the cover 14 can seal the placement port 13, thereby forming a sealed receiving cavity 11. Before the evaporator 100 is operated, the cover 14 can be removed from the placement port 13, and then the solid material can be transported into the receiving cavity 11 through the placement port 13. Finally, the cover 14 can be installed on the placement port 13 to seal the receiving cavity 11.

[0037] In some embodiments, the type of sealing connection may include mechanical seals, packing seals, flange seals, dry gas seals, labyrinth seals, oil seals, and spiral seals. In some specific embodiments, the cover 14 and the placement port 13 may employ flange seals. Exemplary flange seals may include CF (Conflat Flang) flange seals, KF flange seals, ISO flange seals, etc. For example, both the cover 14 and the placement port 13 may be made of metal and employ KF flange seals to prevent condensation of gaseous materials at the cover 14.

[0038] In some embodiments, the radial dimension of the cover 14 is larger than the radial dimension of the placement opening 13, so that the cover 14 can completely cover the placement opening 13, improving the installation seal. In this specification, dimension refers to any parameter that can be used to characterize the size or shape of an object. For example, for a cuboid, dimensions may include length, width, height, whether a chamfer is included, chamfer parameters, etc. For a cylinder, dimensions may include height, diameter, whether a chamfer is included, chamfer parameters, etc. By way of example only, the placement opening 13 is circular, and its radial dimension is the diameter of the circle; the cover 14 is a circular plate, and its radial dimension is the diameter of the circular plate. In another example, the placement opening 13 is rectangular, and its radial dimension is the length of the diagonal of the rectangle; the cover 14 is a rectangular plate, and its radial dimension is the length of the diagonal of the rectangular plate.

[0039] In some embodiments, a second insulation layer 24 may be provided on the surface of the cover 14. The second insulation layer 24 can insulate the cover 14 and further prevent condensation of gaseous materials at the cover 14. In some embodiments, similar to the first insulation layer 22, the second insulation layer 24 may be made of a material with good heat resistance to keep the temperature inside the containment cavity 11 of the evaporator 100 stable during operation. For example, the material of the second insulation layer 24 may be quartz (silicon oxide), corundum (alumina), zirconium oxide, graphite, carbon fiber, ceramics, or other high-temperature resistant materials (e.g., rare earth metal borides, carbides, nitrides, silicides, phosphides, sulfides, etc.). In some embodiments, the material of the second insulation layer 24 may be the same as or similar to the material of the first insulation layer 22. For example, both the first insulation layer 22 and the second insulation layer 24 may be made of zirconium oxide. In other embodiments, the material of the second insulation layer 24 may be different from that of the first insulation layer 22. For example, the material of the first insulation layer 22 is zirconium oxide, and the material of the second insulation layer 24 is corundum.

[0040] In some embodiments, the second insulation layer 24 and the first insulation layer 22 may be two parts of the same insulation layer used to wrap different components. For example, the first insulation layer 22 and the second insulation layer 24 are two parts of the same insulation layer that wrap the cylinder 12 and the cover 14, respectively.

[0041] In some embodiments, a second heating element 25 may be provided on the cover 14. The second heating element 25 can heat the cover 12, making the temperature distribution in the receiving cavity 11 more uniform and preventing the condensation of gaseous materials at the cover 14. In some embodiments, the second heating element 25 may be the same as or similar to the first heating element 21. In some embodiments, the second heating element 25 and the first heating element 21 may be two parts of the same heating element used for heating different components. For example, the first heating element 21 and the second heating element 25 are two parts of the same heating element provided on the cylinder 12 and the cover 14, respectively.

[0042] In some embodiments, when the cover 14 is provided with a second insulation layer 24, a first through hole can be opened on the second insulation layer 24 at the position corresponding to the carrier gas inlet hole, and the delivery pipe can pass through the first through hole and connect with the carrier gas inlet hole, thereby connecting the receiving cavity 11.

[0043] In other embodiments, the evaporator 10 can be a single, integral design, meaning the evaporator 10 is an inseparable unit. Solid materials can be transported into the receiving cavity 11 through holes provided on the evaporator 10 or through pipes communicating with the receiving cavity 11. As an example only, the evaporator 10 may be provided with a material inlet hole (not shown in the figure), which communicates with a material inlet pipe 30. Before the evaporation apparatus 100 operates, solid materials are transported into the receiving cavity 11 through the material inlet pipe 30 and the material inlet hole.

[0044] In some embodiments, the input pipe 30 is detachably connected to the cover 14. In some embodiments, the cover 14 may be provided with a carrier gas input hole (not shown in the figure), which is adapted to the input pipe 30. Before evaporation, the carrier gas input hole can be connected to the input pipe 30. When the carrier gas input hole is connected to the input pipe 30, the carrier gas can be input into the receiving cavity 11 via the input pipe 30 and the carrier gas input hole. The adaptation of the carrier gas input hole to the input pipe 30 can be that the shape of the carrier gas input hole is the same as or substantially the same as the shape of the input pipe 30, and the size of the carrier gas input hole is larger than the size of the input pipe 30, and the difference between the size of the carrier gas input hole and the size of the input pipe 30 is less than a preset size threshold (e.g., 2 mm, where the preset size threshold can be a default value or can be adjusted according to actual conditions). In other embodiments, the input pipe 30 is fixedly connected to the cover 14.

[0045] In some embodiments, the inlet pipe 30 is connected to an external carrier gas pumping device (not shown) via a first sealing flange 31, for example, the first sealing flange 31 can be a CF flange seal.

[0046] In some embodiments, the input pipe 30 may include a flexible input pipe that can be bent according to the relative position of the external carrier gas pumping device and the evaporator 10 to ensure stable delivery of the carrier gas.

[0047] In some embodiments, such as Figure 2 As shown, the output pipe 50 may include a flexible output pipe 51, one end of which is connected to the receiving cavity 11. The carrier gas can carry gaseous material out of the evaporator 10 through the flexible output pipe 51. In some embodiments, the flexible output pipe 51 may include a stainless steel corrugated hose. In this embodiment, the flexible output pipe 51 serves as the evaporator 10 (e.g., the receiving cavity 11 of the evaporator 10) and other chambers (e.g., Figure 5 The transition between the reaction chamber 310 and the intermediate vapor deposition furnace 300 is facilitated by the deformation of the flexible output pipe 51 as gaseous material and carrier gas enter. With a constant carrier gas flow rate, the weight of the gaseous material converted from the evaporator 100 can be directly measured based on the deformation of the flexible output pipe 51. This weight measurement, obtained from the deformation of the flexible output pipe 51, can be combined with the detection results of the weighing sensor 40 in the aforementioned embodiment to improve the accuracy of detecting the weight of the gaseous material converted by the evaporator 100, thereby enabling more precise control of the heating power of the heating component 20. Furthermore, the flexible output pipe 51 serves both a connecting function and avoids excessively increasing the weight of the evaporator 100, thus avoiding the use of a large-range weighing sensor 23 and improving the measurement accuracy of the weighing sensor 23.

[0048] In some embodiments, the evaporator 10 (e.g., the receiving cavity 11 of the evaporator 10) can be sealed to the inlet of the flexible output pipe 51, the outlet of the flexible output pipe 51, and other chambers to improve the airtightness during the gaseous material transport process and reduce the number of condensation points in the output pipe 50. In some embodiments, the evaporator 10 can be sealed to the inlet of the flexible output pipe 51, the outlet of the flexible output pipe 51, and other chambers using flanges. For example, when the evaporation device 100 is applied to a vapor deposition furnace, the outlet of the flexible output pipe 51 can be connected to the reaction chamber of the vapor deposition furnace via a second sealing flange 53, which can be a KF flange.

[0049] In some embodiments, such as Figure 4As shown, the output pipe 50 may further include a rigid output pipe 52, one end of which is connected to the receiving cavity 11, and the other end of which is connected to one end of a flexible output pipe 51, the other end of which is connected to the external environment. In some embodiments, the rigid output pipe 52 may include a stainless steel rigid pipe. In this embodiment, connecting the rigid output pipe 52 to the receiving cavity 11 can improve the connection strength between the output pipe 50 and the evaporator 10, and also facilitate the disassembly and maintenance of the output pipe 50.

[0050] In some embodiments, the inlet of the rigid output pipe 52 and the receiving cavity 11, and the outlet of the rigid output pipe 52 and the inlet of the flexible output pipe 51 can be sealed connections. In some embodiments, the rigid output pipe 52 and the evaporator 10, and the rigid output pipe 52 and the flexible output pipe 51 can be flange-sealed. For example, the inlet of the rigid output pipe 52 and the evaporator 10 (e.g., the receiving cavity 11 of the evaporator 10), and the outlet of the rigid output pipe 52 and the inlet of the flexible output pipe 51 can be connected by a third sealing flange 54, which can be a KF flange.

[0051] In some embodiments, the output pipe 50 may further include a tee connector 55, through which the output pipe 50 can communicate with other chambers. The inlet of the tee connector 55 is connected to the other end of the flexible output pipe 51, the first outlet of the tee connector 55 is connected to the reaction chamber 310, and a sealing plate 56 is detachably and sealingly installed at the second outlet of the tee connector 55. The first and second outlets of the tee connector 55 are respectively located on opposite sides of the inlet. In this embodiment, since the first and second outlets are respectively located on opposite sides of the inlet, when solids and / or liquids are discharged from the output pipe 50, they can accumulate on the sealing plate 56 at the second outlet under their own gravity, preventing solids and / or liquids from directly accumulating at the outlet of the output pipe 50 and causing blockage. Furthermore, by providing a removable sealing plate 56 at the second outlet of the tee joint 55, maintenance of the bend in the tee joint 55 can be facilitated. For example, when solid and liquid accumulate at the bend of the tee joint 55, the sealing plate 56 can be removed to clear the blockage and extend the service life of the tee joint 55. In some embodiments, the sealing plate 56 and the second outlet of the tee joint 55 can be sealed by a KF flange.

[0052] In some embodiments, the evaporation device 100 may further include a second heating component configured to control the output pipe 50 and the temperature within the output pipe 50. In some embodiments, the second heating component may include a third heating element 61 disposed outside the output pipe 50 and configured to heat the output pipe 50. In some embodiments, the third heating element 61 may be the same as or similar to the first heating element 21. For example, the third heating element 61 may be a mineral-insulated heating cable, which can directly contact the output pipe 50 for heating without the need for insulation material to isolate the contact with the output pipe 50, thereby reducing the overall weight of the evaporation device 100. In some embodiments, the second heating component may further include a third insulation layer 62, which wraps around the output pipe 50. By insulating the output pipe 50, the evaporated gaseous substance can be kept within a specific temperature range during transmission, effectively preventing condensation of the gaseous substance. Furthermore, since the second heating component is located outside the output pipe 50 and no flow meter or control device is required, the airtightness of the output pipe 50 can be improved, reducing the condensation point during the transport of gaseous materials. In some embodiments, the third insulation layer 62 may be the same as or similar to the first insulation layer 22, which will not be described in detail here.

[0053] In some embodiments, a temperature sensor may also be provided in the third insulation layer 62. By providing a temperature sensor, the temperature of the output pipe 50 can be monitored in real time to ensure that the output pipe 50 delivers gaseous materials within the ideal temperature range, prevent the temperature of the output pipe 50 from being too high or too low, and improve the stability of the gaseous material supply.

[0054] In some embodiments, the evaporation apparatus 100 may further include a material receiving component 70, which is movably inserted into or removed from the receiving cavity 11 via a placement port 13 to deliver solid material 200 into the receiving cavity 11.

[0055] In some embodiments, the material receiving component 70 may include a material receiving base plate 71 and a material receiving side plate 72 disposed around the edge of the material receiving base plate 71. The material receiving side plate 72 and the material receiving base plate 71 together form a box-shaped (or boat-shaped) structure capable of containing solid material 200. In some embodiments, the material receiving side plate 72 may be an integral structure; for example, the material receiving side plate 72 may be an annular plate surrounding the side of the material receiving base plate 71. In other embodiments, the material receiving side plate 72 may be composed of multiple plates stacked along the side of the material receiving base plate 71. For example, the material receiving base plate 71 may be a circular plate, and the material receiving side plate 72 may be composed of multiple arc-shaped plates stacked along the side of the material receiving base plate 71.

[0056] In some embodiments, a support member is provided on the material receiving base plate 71. The support member is configured to support the material receiving component 70 on the inner wall of the evaporator 10 (i.e., the cavity wall of the receiving cavity 11), so that the material receiving base plate 71 is spaced a certain distance from the inner wall of the evaporator 10, which facilitates the placement and removal of the material receiving component 70.

[0057] In some embodiments, the material of the material receiving component 70 may be a metallic material (e.g., iridium (Ir), molybdenum (Mo), tungsten (W), rhenium (Re), etc.), an alloy material (e.g., tungsten-molybdenum alloy), graphite (C), or ceramic, etc., to improve the thermal shock resistance and thermal conductivity of the material receiving component 70.

[0058] In some embodiments, the material receiving component 70 may be provided with heat-conducting fins (not shown in the figure). The heat-conducting fins can increase the contact area between the material receiving component 70 and the solid material 200 to be converted, thereby improving the heat transfer efficiency between the material receiving component 70 and the solid material 200 and improving the efficiency of converting the solid material 200 into a gaseous material.

[0059] In some embodiments, one or more components of the evaporator 100 can perform their respective functions manually. For example, an operator can manually control the heating power of the heating assembly 20 to heat the evaporator 10.

[0060] In some embodiments, one or more components of the evaporation apparatus 100 may be controlled by other components to perform corresponding functions. In some embodiments, the evaporation apparatus 100 may also include a controller that can adjust the heating temperature of the heating element 20 (e.g., the first heating element 21) based on the detection results of the weighing sensor 40. By way of example only, according to the description of other embodiments in this specification, the weighing sensor 40 can detect the weight of the solid material 200 in the receiving cavity 11 converted into a gaseous material, and determine the conversion rate based on the weight of the solid material 200 converted into a gaseous material in the receiving cavity 11 and the time taken for the conversion. Based on this, the controller can adjust the heating power according to the detection results of the weighing sensor 40 based on the relationship between the heating power of the heating element 20 and the conversion rate to maintain a stable and controllable conversion rate. For example, when the conversion rate of the solid material 200 is detected to be too fast, the controller can reduce the heating power of the heating element 20, thereby reducing the conversion rate of the solid material 200. As another example, when the conversion rate of the solid material 200 is detected to be too slow, the controller can increase the heating power of the heating element 20, thereby reducing the conversion rate of the solid material 200.

[0061] In some embodiments, the evaporation apparatus may further include a pressure sensor (not shown) and a humidity sensor (not shown), which may be disposed in the containment cavity 11 and configured to detect the pressure and humidity in the containment cavity 11, respectively. The pressure sensor and humidity sensor may be communicatively connected to the controller to transmit the detection results to the controller. The controller may adjust the heating power of the heating component 20 (e.g., the first heating element 21) based on the detection results of the pressure sensor, humidity sensor, and weighing sensor 23. For example, when the pressure or humidity in the containment cavity 11 is too high, it may indicate that the gaseous material in the containment cavity 11 has not been discharged in time. The controller may reduce the heating power of the heating component 20 to prevent the pressure or humidity in the containment cavity 11 from increasing further, thereby improving the safety and stability of the evaporation apparatus 100. As another example, when the pressure or humidity in the containment cavity 11 is too low, it may indicate that the conversion efficiency of the solid material is low. The controller may increase the heating power of the heating component 20 to maintain a stable conversion rate.

[0062] This specification also provides a method for operating an evaporator 100, which includes, but is not limited to, the following steps: before operation, preparing the evaporator (e.g., ...) Figure 2 The cover of the evaporator 10 in the middle (e.g., Figure 2 The cover 14) is removed, and the material receiving component containing the solid material 200 (e.g., Figure 2 The material receiving component 70 in the middle) is placed through the placement port (e.g., Figure 2 The placement port 13 is placed into the receiving cavity 11, and then the cover 14 is sealed to the placement port 13, and the second insulation layer (e.g., Figure 2 The second insulation layer 24 is installed on the cover 14; the input pipe 30 is sealed to the external carrier gas pumping device (through the first sealing flange 31); the evaporator 10 and the output pipe 50 are heated and the conversion rate is set; the carrier gas is introduced and the conversion of the solid material 200 begins.

[0063] To more clearly illustrate the operation of the evaporator 100, this manual will use ZrCl4 (zirconium chloride) as a solid material 200 as an example to describe the process of converting ZrCl4 powder in the evaporator 100. The process of converting ZrCl4 powder in the evaporator 100 includes the following steps:

[0064] Step a: Remove the cover 14 with the second insulation layer 24 from the placement port 13 and take out the material receiving component 70;

[0065] Step b: Place 1000g of ZrCl4 powder into the material receiving component 70 and level the surface of the ZrCl4 powder inside the material receiving component 70.

[0066] Step c: Insert the material receiving component 70 into the receiving cavity 11 through the placement port 13, and seal the cover 14 with the second insulation layer 24 onto the placement port 13.

[0067] Step d: Connect the inlet of input pipeline 30 to the carrier gas pumping device for transporting argon.

[0068] Step e: Control the first heating element 21 and the second heating element 25 to heat the evaporator 10 at a temperature of 250℃~300℃, control the third heating element 61 to heat the output pipe 50 at a temperature of 330℃~350℃, and set the conversion rate to 2g / min.

[0069] Step f: When the temperature inside the evaporator 10 (e.g., the accommodating cavity 11 of the evaporator 10) rises to 330°C, argon gas is supplied to the accommodating cavity 11, and the heating power of the first heating element 21 and the second heating element 25 is controlled so that the temperature inside the accommodating cavity 11 is in the range of 290°C to 340°C, so as to stabilize the conversion rate in the range of 1.9 g / min to 2.1 g / min.

[0070] This specification also provides a vapor deposition furnace for performing vapor deposition reactions in some embodiments. In some embodiments, such as Figure 5 As shown, the vapor deposition furnace 300 may include a reaction chamber 310 and an evaporation device 100 as described in other embodiments of this specification. The reaction chamber 310 is connected to an output pipe 50. When the reaction precursor used for the vapor deposition reaction is solid at room temperature (e.g., 25 degrees Celsius) and atmospheric pressure (e.g., standard atmospheric pressure), the solid material 200 can be converted into a gaseous material by the evaporation device 100 and transported to the reaction chamber 310 of the vapor deposition furnace 300 through the output pipe 50.

[0071] In some embodiments, the reaction chamber 310 may include a batch reactor, a tubular reactor, a tower reactor, a fluidized bed, or a fixed bed.

[0072] In some embodiments, the vapor deposition furnace 300 may further include a vacuum pump 320 connected to the reaction chamber 310, the vacuum pump 320 being configured to extract air from the reaction chamber 310 to create a vacuum environment in the reaction chamber 310, so as to facilitate the vapor deposition reaction in the reaction chamber 310.

[0073] In some embodiments, the vapor deposition furnace 300 may further include a process gas delivery pipe 330 communicating with the reaction chamber 310, the process gas delivery pipe 330 being configured to deliver process gases for the vapor deposition reaction, such as carbonization gases (e.g., methane, propane, butane, etc.), to the reaction chamber 310.

[0074] The beneficial effects of the evaporation apparatus and vapor deposition furnace provided in this manual include, but are not limited to: (1) By collecting the conversion amount and conversion rate of solid material to gaseous material through a weighing sensor, and combining it with the heating power of the heating component, the relationship between the conversion rate and the heating power of the heating component can be established, thereby enabling the maintenance of a stable and controllable conversion rate by adjusting the heating power; (2) Since no additional flow metering or control device (such as a flow sensor) is installed for the measurement and control of high-temperature gaseous material, the drift and deviation of the flow sensor at high temperature are avoided, and the sensor damage and blockage of the output pipe caused by the condensation point of the output pipe can also be avoided, ensuring a stable and controllable supply of gaseous material; (3) By setting a temperature sensor, the temperature of the containment cavity can be monitored in real time to ensure evaporation. The device operates within a safe range to prevent overheating or insufficient temperature, thereby improving the safety and stability of the evaporation device; (4) Since the output pipe is connected to the reaction chamber of the vapor deposition furnace through a three-way connector, and since the first outlet and the second outlet are respectively located on both sides of the inlet, when solids and / or liquids are discharged from the output pipe, they can accumulate on the sealing plate of the second outlet under their own gravity, thus avoiding the direct accumulation of solids and / or liquids at the outlet of the output pipe and causing blockage of the output pipe. In addition, by setting a removable sealing plate at the second outlet of the three-way connector, it is convenient to inspect the bend of the three-way connector. For example, when solids and liquids accumulate at the bend of the three-way connector, the sealing plate can be removed to unclog the three-way connector and improve the service life of the three-way connector.

[0075] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0076] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0077] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although some embodiments that are currently considered useful have been discussed through various examples in the foregoing disclosure, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. Rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing servers or mobile devices.

[0078] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0079] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0080] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that material are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this application, as well as documents that limit the broadest scope of the claims in this application (currently or subsequently appended to this application). It should be noted that if there is any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0081] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. An evaporation apparatus, characterized in that, include: An evaporator having a receiving cavity for containing solid material to be converted; A heating component, disposed outside the evaporator, is configured to heat the evaporator to convert the solid material into a gaseous material; An input pipe, connected to the receiving cavity, is configured to deliver carrier gas into the receiving cavity; A weighing sensor is configured to detect the weight of the solid material in the containment cavity after it has been converted into the gaseous material. An output pipe, connected to the receiving cavity, is configured to allow the carrier gas to carry the gaseous material out of the receiving cavity.

2. The evaporation apparatus according to claim 1, characterized in that, The heating assembly includes a first heating element and a first insulation layer; the first heating element is disposed outside the evaporator and configured to heat the evaporator, and the first insulation layer is wrapped around the evaporator and configured to insulate the evaporator.

3. The evaporation apparatus according to claim 2, characterized in that, The heating assembly also includes a temperature sensor disposed within the first insulation layer and configured to detect the temperature of the evaporator.

4. The evaporation apparatus according to claim 1, characterized in that, The evaporator includes a placement port and a cover. The placement port communicates with the receiving cavity. The cover is detachably and sealed to the placement port. A second insulation layer is provided on the cover. The input pipe passes through the second insulation layer and the cover and communicates with the receiving cavity.

5. The evaporation apparatus according to claim 1, characterized in that, The output pipe includes a rigid output pipe and a flexible output pipe. One end of the rigid output pipe is connected to the receiving cavity, and the other end of the rigid output pipe is connected to the flexible output pipe.

6. The evaporation apparatus according to claim 1, characterized in that, A third heating element and a third insulation layer are provided outside the output pipe. The third heating element is disposed outside the output pipe and is configured to heat the output pipe. The third insulation layer is wrapped around the output pipe and is configured to insulate the output pipe.

7. The evaporation apparatus according to claim 4, characterized in that, The evaporation device further includes a material receiving component, which can be movably inserted into or removed from the receiving cavity through the placement port to deliver the solid material into the receiving cavity. The material receiving component is made of metal, graphite, or ceramic.

8. The evaporation apparatus according to claim 7, characterized in that, The material receiving component is provided with heat-conducting fins.

9. The evaporation apparatus according to claim 1, characterized in that, It also includes a controller configured to adjust the heating temperature of the heating assembly based on the detection results of the weighing sensor.

10. A vapor deposition furnace, characterized in that, The device includes a reaction chamber and an evaporation apparatus according to any one of claims 1-9, wherein the reaction chamber is connected to the output pipe and the reaction chamber is used for the gaseous material to undergo a vapor-phase deposition reaction.

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