Pipeline for preparing semiconductor chip

Abstract

The utility model provides a pipeline for preparing a semiconductor chip, and relates to the technical field of pipelines for preparing semiconductor chips, the pipeline comprises a base, a filter cartridge and a U-shaped pipe, the left and right parts of the base are both fixedly provided with a support frame, and the upper part of the support frame is internally provided with a conveying main pipeline; a U-shaped pipe is installed between the conveying main pipeline and the adjacent conveying main pipeline, the U-shaped pipe is detachably connected with the conveying main pipeline, a filter cartridge is installed on the lower portion of the U-shaped pipe, a flow dividing pipe is installed at the lower end of the filter cartridge, a side frame plate is fixed to the lower portion of the outer side face of the supporting frame, and a middle frame plate is fixed to the lower portion of the inner side face of the supporting frame; and the shunt pipes are positioned on the upper end surfaces of the middle frame plate and the side frame plates. According to the utility model, the conveying is safer and more stable, a plurality of anti-backflow U-shaped pipes can be assembled on the conveying pipeline, the residual filtered medium is discharged and filtered, and then the filtered medium is conveyed independently, so that the conveying pipeline is more flexible and practical.

Description

Technical Field

[0001] This utility model relates to the field of pipeline technology for preparing semiconductor chips, and more specifically to a pipeline for preparing semiconductor chips. Background Technology

[0002] In today's high-tech world, semiconductor chips have become core components of electronic devices, ubiquitous from smartphones and data centers to aerospace. Behind this, thin-film deposition (TFT) technology, as a front-end process in semiconductor manufacturing, plays a crucial role. It not only determines chip performance but also directly affects its reliability and cost. Thin-film fabrication processes are mainly divided into two categories based on the film formation method: physical vapor deposition (PVD) and chemical vapor deposition (CVD). The operation and maintenance of CVD equipment face numerous challenges, the biggest being environmental contamination of the reaction chamber. During equipment operation, if backflow of gas occurs in the pipelines, it may carry contaminants into the reaction chamber, causing serious pollution.

[0003] The specification of the pipeline and equipment used for preparing semiconductor chips in the prior art (publication number CN221881158U) mentions that "the pipeline includes a reaction chamber, a filter and a first pipeline connected between the reaction chamber and the filter. A one-way valve and a pressure sensor are provided on the first pipeline. The pressure sensor is located downstream of the one-way valve and is configured to monitor the gas flowing through the one-way valve in real time." However, when there is too much local accumulation in the pipeline in the prior art, there is still a risk of backflow. Moreover, the pipeline structure is not easy to replace and is not convenient to use. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, a conduit for manufacturing semiconductor chips is provided to solve the problems of backflow risk when excessive local accumulation occurs in existing conduits, and the conduit structure is not easy to replace and is not convenient to use.

[0005] To achieve the above objectives, a conduit for fabricating semiconductor chips is provided, comprising a base, a filter cartridge, and a U-shaped tube. Support frames are fixed to both the left and right sides of the base, and a main conveying pipe is installed in an upper slot provided on the upper part of the support frame. A U-shaped tube is installed between the main conveying pipe and an adjacent set of main conveying pipes, and the U-shaped tube is detachably connected to the main conveying pipe. A filter cartridge is installed at the lower part of the U-shaped tube, and a diverter pipe is installed at the lower end of the filter cartridge.

[0006] Furthermore, a side frame plate is fixed to the lower part of the outer side of the support frame, and a middle frame plate is fixed to the lower part of the inner side of the support frame. The middle frame plate and the side frame plate are aligned left and right, and the diversion pipe is located on the upper end face of the middle frame plate and the side frame plate.

[0007] Furthermore, pipe joints are fixed on both the left and right sides of the upper part of the U-shaped tube, and the pipe joints are made of stainless steel U-shaped pipes.

[0008] Furthermore, the lower end face of the main conveying pipeline is provided with first pipe interfaces on both the left and right sides, and the upper end of the pipe joint is fitted into the first pipe interface, and the pipe joint and the first pipe interface are detachably connected.

[0009] Furthermore, the filter cylinder is fitted with an outer filter bag, and the outer filter bag is fitted with an inner filter bag, and both the inner and outer filter bags are detachably connected to the filter cylinder.

[0010] Furthermore, the upper end of the filter cylinder is provided with an upper pipe opening, a sealing sleeve is fitted inside the upper pipe opening, and an upper connecting pipe is fitted inside the sealing sleeve. The lower end of the filter cylinder is provided with a lower pipe opening, and a lower connecting pipe is fitted inside the lower pipe opening. The upper pipe opening and the lower pipe opening, as well as the upper connecting pipe and the lower connecting pipe, are symmetrical about the filter cylinder.

[0011] The beneficial effects of this utility model are as follows:

[0012] 1. The base of this utility model provides convenient and stable support for the main conveying pipe and the branch pipe, and the main conveying pipe, the branch pipe and the base are easy to assemble or disassemble, which is more convenient and saves time.

[0013] 2. The U-shaped pipe and the main conveying pipeline of this utility model are assembled together to form the main line of the transportation pipeline. The U-shaped pipe adopts a U-shaped pipe body structure to prevent the remaining medium from flowing back. Moreover, the U-shaped pipe and the main conveying pipeline can be easily and flexibly assembled or disassembled, making it more convenient and practical.

[0014] 3. The filter cylinder installed at the lower end of the U-shaped tube of this utility model facilitates the release of excess media accumulated in the lower part, and performs double filtration through the inner and outer filter bags. The filtered media is then transported to the diversion pipe and separately transported to another storage space, which is safer and more reliable. Attached Figure Description

[0015] Figure 1 This is a front view schematic diagram of an embodiment of the present utility model;

[0016] Figure 2 This is a schematic diagram of the base according to an embodiment of the present utility model;

[0017] Figure 3 This is a cross-sectional schematic diagram of the filter cylinder according to an embodiment of the present utility model;

[0018] Figure 4 This is a schematic diagram of the U-shaped tube according to an embodiment of the present utility model;

[0019] Figure 5 This is a schematic diagram of the main conveying pipeline according to an embodiment of the present utility model.

[0020] In the diagram: 1. Base; 10. Support frame; 11. Upper slot; 12. Middle frame plate; 13. Side frame plate; 2. Diverter pipe; 3. Filter cartridge; 30. Inner filter bag; 31. Outer filter bag; 32. Upper pipe opening; 33. Sealing sleeve; 34. Upper connecting pipe; 35. Lower pipe opening; 36. Lower connecting pipe; 4. U-shaped pipe; 40. Pipe joint; 5. Main conveying pipeline; 50. First pipe interface. Detailed Implementation

[0021] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. The specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. Specific details such as particular system structures and technologies are provided to facilitate a more thorough understanding of the embodiments of this utility model. The described embodiments are some, but not all, of the embodiments disclosed herein. However, those skilled in the art should understand that the present utility model can also be implemented in other embodiments without these specific details. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0022] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0023] Figure 1 This is a front view schematic diagram of an embodiment of the present utility model. Figure 2 This is a schematic diagram of the base according to an embodiment of the present utility model. Figure 3 This is a cross-sectional schematic diagram of the filter cartridge according to an embodiment of the present utility model. Figure 4 A schematic diagram of the U-shaped tube according to an embodiment of this utility model and Figure 5 This is a schematic diagram of the main conveying pipeline according to an embodiment of the present utility model.

[0024] Reference Figures 1 to 5 As shown, this utility model provides a conduit for preparing semiconductor chips, including a base 1, a filter cylinder 3, and a U-shaped tube 4. Support frames 10 are fixed on both the left and right sides of the base 1, and a main conveying pipe 5 is installed in the upper slot 11 provided on the upper part of the support frame 10. A U-shaped tube 4 is installed between the main conveying pipe 5 and an adjacent set of main conveying pipes 5, and the U-shaped tube 4 is detached from the main conveying pipe 5. A filter cylinder 3 is installed at the lower part of the U-shaped tube 4, and a diversion pipe 2 is installed at the lower end of the filter cylinder 3.

[0025] In this embodiment, a side frame plate 13 is fixed to the lower part of the outer side of the support frame 10, and a middle frame plate 12 is fixed to the lower part of the inner side of the support frame 10. The middle frame plate 12 and the side frame plate 13 are aligned left and right, and the diversion pipe 2 is located on the upper end face of the middle frame plate 12 and the side frame plate 13.

[0026] As a preferred embodiment, the base 1 of this utility model provides convenient and stable support for the main conveying pipe 5 and the branch pipe 2. Moreover, the main conveying pipe 5, the branch pipe 2 and the base 1 are easy to assemble or disassemble, which is more convenient and saves time.

[0027] In this embodiment, pipe joints 40 are fixed on both the left and right sides of the upper part of the U-shaped pipe 4, and the pipe joints 40 are made of stainless steel U-shaped pipes; the lower end face of the main conveying pipe 5 is provided with first pipe interfaces 50 on both the left and right sides, and the upper end of the pipe joint 40 is fitted into the first pipe interface 50, and the pipe joint 40 and the first pipe interface 50 are detachably connected.

[0028] As a preferred embodiment, the U-shaped pipe 4 and the main conveying pipeline 5 of this utility model are assembled together to form the main line of the transportation pipeline. The U-shaped pipe 4 adopts a U-shaped pipe body structure to prevent the remaining medium from flowing back. Moreover, the U-shaped pipe 4 and the main conveying pipeline 5 can be easily and flexibly assembled or disassembled, making it more convenient and practical.

[0029] In this embodiment, an outer filter bag 31 is fitted inside the filter cylinder 3, and an inner filter bag 30 is fitted inside the outer filter bag 31. Both the inner filter bag 30 and the outer filter bag 31 are detachably connected to the filter cylinder 3. An upper pipe opening 32 is provided at the upper end of the filter cylinder 3. A sealing sleeve 33 is fitted inside the upper pipe opening 32, and an upper connecting pipe 34 is fitted inside the sealing sleeve 33. A lower pipe opening 35 is provided at the lower end of the filter cylinder 3, and a lower connecting pipe 36 is fitted inside the lower pipe opening 35. The upper pipe opening 32 and the lower pipe opening 35, as well as the upper connecting pipe 34 and the lower connecting pipe 36, are symmetrical about the filter cylinder 3.

[0030] As a preferred embodiment, the filter cylinder 3 installed at the lower end of the U-shaped tube 4 of this utility model facilitates the release of excess media accumulated in the lower part, and performs dual filtration through the inner filter bag 30 and the outer filter bag 31. The filtered media is then transported to the diversion pipe 2, and then separately transported to another storage space through the diversion pipe 2, which is safer and more reliable.

[0031] This invention effectively solves the problems of backflow risk when there is excessive local accumulation in the pipeline in the existing technology, and the pipeline structure is not easy to replace and is not convenient to use. This invention provides safer and more stable delivery. Multiple anti-backflow U-shaped pipes can be assembled on the delivery pipeline, and the remaining filtered medium can be released, filtered, and then delivered separately, making it more flexible and practical.

[0032] The above embodiments are used to explain and illustrate the present utility model, and are not intended to limit the utility model. Any modifications and changes made to the present utility model within the spirit and scope of the claims should be included within the protection scope of the present utility model.

Claims

1. A conduit for fabricating semiconductor chips, characterized in that: Includes a base (1), a filter cylinder (3) and a U-shaped tube (4). The left and right sides of the base (1) are fixed with support frames (10), and the upper slot (11) provided on the upper part of the support frame (10) is equipped with a main conveying pipe (5). The main conveying pipe (5) is connected to an adjacent set of main conveying pipes (5) with a U-shaped tube (4), and the U-shaped tube (4) is connected to the main conveying pipe (5) separately. The filter cylinder (3) is installed at the lower part of the U-shaped tube (4), and a diversion pipe (2) is installed at the lower end of the filter cylinder (3).

2. The conduit for fabricating a semiconductor chip according to claim 1, characterized in that, The lower outer side of the support frame (10) is fixed with a side frame plate (13), and the lower inner side of the support frame (10) is fixed with a middle frame plate (12). The middle frame plate (12) and the side frame plate (13) are aligned left and right, and the diversion pipe (2) is located on the upper surface of the middle frame plate (12) and the side frame plate (13).

3. The conduit for fabricating a semiconductor chip according to claim 1, characterized in that, The upper left and right sides of the U-shaped pipe (4) are fixed with pipe joints (40), and the pipe joints (40) are made of stainless steel U-shaped pipes.

4. The conduit for fabricating a semiconductor chip according to claim 1, characterized in that, The lower end face of the main conveying pipeline (5) is provided with a first pipe interface (50) on both the left and right sides, and the upper end of the pipe joint (40) is fitted into the first pipe interface (50), and the pipe joint (40) and the first pipe interface (50) are connected separately.

5. The conduit for fabricating a semiconductor chip according to claim 1, characterized in that, The filter cylinder (3) is fitted with an outer filter bag (31), and the outer filter bag (31) is fitted with an inner filter bag (30). Both the inner filter bag (30) and the outer filter bag (31) are detachably connected to the filter cylinder (3).

6. The conduit for fabricating a semiconductor chip according to claim 5, characterized in that, The filter cylinder (3) has an upper pipe opening (32) at its upper end, a sealing sleeve (33) inside the upper pipe opening (32), and an upper connecting pipe (34) inside the sealing sleeve (33). The filter cylinder (3) has a lower pipe opening (35) at its lower end, and a lower connecting pipe (36) inside the lower pipe opening (35). The upper pipe opening (32) and the lower pipe opening (35), as well as the upper connecting pipe (34) and the lower connecting pipe (36), are symmetrical about the filter cylinder (3).

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