Temperature control cooling clamp used after sintering of ceramic green body

Abstract

The utility model relates to the technical field of ceramic green body sintering, in particular to a temperature control cooling clamp used after ceramic green body sintering, which comprises a placing plate, and the top end of the placing plate is connected with a plurality of evenly distributed clamping plates in a sliding mode. The cooling mechanism capable of quickly cooling and controlling the temperature of the sintered ceramic body is arranged on the inner wall of the placing plate; by arranging the cooling mechanism, the top of a semiconductor chilling plate can produce cold air after the semiconductor chilling plate is electrified, the cold end of the semiconductor chilling plate is matched with a conduction rod to convey the cold air, the cold air is gathered through a refrigeration plate, and air flow blown out by a first fan passes through the refrigeration plate to become cold air to refrigerate and cool a ceramic body; cold air is guided through the ventilation grooves, so that the ceramic green body on the placing plate can be cooled, heat dissipation can be conducted on the hot end of the semiconductor chilling plate through cooperation of the cooling fins and the second fan, refrigeration and heat dissipation can be conducted on the sintered ceramic green body, and the machining quality of the ceramic green body is improved.

Description

Technical Field

[0001] This utility model relates to the field of ceramic green body sintering technology, and in particular to a temperature-controlled cooling fixture for ceramic green bodies after sintering. Background Technology

[0002] Ceramics is a general term for pottery and porcelain, and it is also a kind of arts and crafts in my country. As early as the Neolithic Age, my country already had painted pottery and black pottery with a rough and simple style. Pottery and porcelain have different textures and properties. When producing ceramics, the ceramic body needs to be sintered and then cooled using temperature-controlled cooling fixtures.

[0003] A search of the Chinese patent "A Quick Self-Aligning Clamp for Ceramic Green Body" (publication number CN217047035U) reveals that this patent uses a first screw that slides within a moving hole. The first screw pulls one end of a connecting piece, and the other end of the connecting piece rotates around a second screw, causing the end of a lever away from the second screw to move towards the center of a fixed plate. This self-aligning motion is achieved through several levers moving towards the center of the fixed plate, providing clamping force. This invention utilizes the tension of a rubber band to move a rotating plate around the outer periphery of the fixed plate. The rubber band has low tension, is less likely to damage the ceramic green body, and is inexpensive, saving production costs. The device uses the first screw sliding within the moving hole to rotate the connecting plate and the second screw. One side of the lever moves towards the center of the fixed plate, pushing the outer circle of the ceramic green body to clamp and fix it. However, at high sintering temperatures, the contact area between the lever end and the ceramic green body is small, making it prone to damaging the high-temperature surface of the ceramic green body during clamping. Furthermore, it is inconvenient to quickly cool the ceramic green body during clamping, reducing its usability.

[0004] Therefore, a temperature-controlled cooling fixture is proposed to solve the above problems after the ceramic blank is sintered. Utility Model Content

[0005] The purpose of this invention is to provide a temperature-controlled cooling fixture for ceramic blanks after sintering in order to solve the above-mentioned problems, thereby improving the problem of inconvenience in rapidly cooling ceramic blanks.

[0006] This utility model achieves the above-mentioned objectives through the following technical solution: a temperature-controlled cooling fixture for sintering ceramic blanks, including a placement plate with several evenly distributed clamping plates slidably connected to the top of the placement plate; a cooling mechanism, which allows for rapid cooling and temperature control of the sintered ceramic blank, is disposed on the inner wall of the placement plate; wherein, the cooling mechanism includes a semiconductor refrigeration chip fixedly installed on the inner wall of the placement plate, a first fan rotatably connected to the top of the semiconductor refrigeration chip, two conduction rods fixedly connected to both sides of the semiconductor refrigeration chip, a cooling plate disposed at the top of the first fan, conduction rods connecting both sides of the cooling plate, and a cooling component disposed at the top of the placement plate; when the semiconductor refrigeration chip is energized, one end emits cold air which is transported to the cooling plate via the conduction rods, and the airflow blown out by the first fan is converted into cold air through the cooling plate to cool the sintered ceramic blank.

[0007] Preferably, the cooling mechanism further includes a heat sink fixedly installed at the bottom of the semiconductor cooling chip. A second fan is fixedly installed at the bottom of the heat sink. The heat sink contacts the hot end of the semiconductor cooling chip to dissipate heat, and then cooperates with the second fan to dissipate heat and cool down the chip.

[0008] Preferably, the top of the inner wall of the placement plate is provided with a plurality of ventilation slots arranged in sequence. The ventilation slots are located at the top of the first fan and are arc-shaped. They are located at the four corners of the top of the placement plate and can guide the airflow blown out by the first fan to cool and dissipate heat from the ceramic blank.

[0009] Preferably, a filter screen is fixedly connected to the bottom end of the placement plate, and the filter screen at the bottom end of the placement plate can prevent dust from entering the interior of the placement plate.

[0010] Preferably, the cooling component includes a protective plate fixedly connected to the inner wall of the clamping plate, a slider fixedly connected to the bottom end of the clamping plate, the slider slidably connected to the top end of the placement plate, and temperature sensors fixedly installed on both the protective plate and the inner wall of the clamping plate. The clamping plate can clamp and fix the ceramic blank through the protective plate, the protective plate can provide a certain degree of protection for the ceramic blank, and the temperature sensors can detect the temperature of the ceramic blank in real time, thereby improving the temperature control effect of the device.

[0011] Preferably, the top of the inner wall of the placement plate is rotatably connected to several evenly distributed lead screws, the lead screws are threadedly connected to the slider, and a second bevel gear is fixedly connected to one end of the lead screw. The lead screw can drive the clamping plate to move to one side through the slider to clamp the ceramic blank.

[0012] Preferably, a motor is fixedly installed on the inner wall of the placement plate, and a first bevel gear is fixedly connected to the output shaft of one end of the motor. The first bevel gear and the second bevel gear mesh with each other. The first bevel gear and the second bevel gear cooperate to simultaneously drive several clamping plates to move to one side to clamp and fix the ceramic blank.

[0013] The beneficial effects of this utility model are:

[0014] 1. By setting up a cooling mechanism, the top of the semiconductor refrigeration chip can generate cold air and the bottom can generate hot air after being energized. The cold end of the semiconductor refrigeration chip can be used to transport the cold air in conjunction with the conduction rod. The cold air is collected by the cooling plate. The airflow blown out by the first fan passes through the cooling plate and becomes cold air, which can cool down the ceramic blank. The cold air is guided by the ventilation slot so that it can cool down the ceramic blank on the placement plate. The heat sink works with the second fan to dissipate heat from the hot end of the semiconductor refrigeration chip. This can cool down the sintered ceramic blank and improve the processing quality of the ceramic blank.

[0015] 2. By setting up a cooling component, the screw and slider work together to move the clamping plate to one side to clamp and fix the ceramic blank. The protective plate can prevent the clamping plate from damaging the surface of the ceramic blank. The temperature sensor is set on the inner wall of the protective plate and the clamping plate to detect the temperature of the ceramic blank in real time and control the processing temperature of the ceramic blank. The first bevel gear meshes with several second bevel gears to drive several screws to rotate at the same time, driving several clamping plates to move simultaneously and fix the ceramic blank in the center of the placement plate. This allows for rapid clamping of the ceramic blank and improves the cooling effect of the device on the ceramic blank. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the external structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the cooling mechanism structure of this utility model;

[0018] Figure 3 for Figure 2 Enlarged view of A in the middle;

[0019] Figure 4 This is a schematic diagram of the cooling component structure of this utility model.

[0020] In the diagram: 1. Placement plate; 2. Clamping plate; 3. Cooling mechanism; 301. Semiconductor cooling chip; 302. First fan; 303. Conducting rod; 304. Cooling plate; 305. Heat sink; 306. Second fan; 307. Ventilation slot; 308. Filter screen; 309. Cooling component; 3091. Protective plate; 3092. Slider; 3093. Temperature sensor; 3094. Lead screw; 3095. First bevel gear; 3096. Second bevel gear; 3097. Motor. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In practical implementation: such as Figure 1-4 As shown, after sintering, the ceramic blank is cooled using a temperature-controlled cooling fixture. A placement plate 1 is used, and several evenly distributed clamping plates 2 are slidably connected to the top of the placement plate 1. A cooling mechanism 3, capable of rapidly cooling and controlling the temperature of the sintered ceramic blank, is located on the inner wall of the placement plate 1. The cooling mechanism 3 includes a semiconductor cooling chip 301 fixedly installed on the inner wall of the placement plate 1. A first fan 302 is rotatably connected to the top of the semiconductor cooling chip 301. Two conductive rods 303 are fixedly connected to both sides of the semiconductor cooling chip 301. The top of the first fan 302... A cooling plate 304 is provided, with conduction rods 303 connecting both sides of the cooling plate 304. A cooling component 309 is provided at the top of the placement plate 1. When the semiconductor cooling chip 301 is energized, its cold end emits cold air, which contacts the conduction rods 303 and conducts the cold air to the cooling plate 304. The airflow blown out by the first fan 302 passes through the grooves on the cooling plate 304 and becomes cold air. The grooves on the cooling plate 304 can increase the contact area between the airflow and the plate. The cold air is blown towards the ceramic blank through the ventilation slots 307, which can cool the sintered ceramic blank.

[0023] like Figure 2 and Figure 3As shown, the cooling mechanism 3 also includes a heat sink 305 fixedly installed at the bottom of the semiconductor cooling chip 301. A second fan 306 is fixedly installed at the bottom of the heat sink 305. Several ventilation slots 307 arranged in sequence are opened at the top of the inner wall of the placement plate 1. The ventilation slots 307 are located at the top of the first fan 302. A filter screen 308 is fixedly connected to the bottom of the placement plate 1. When the airflow blown out by the first fan 302 passes through the cooling plate 304 and becomes cold air, the cold air is guided and transported through several ventilation slots 307 on the inner top wall of the placement plate 1, which can uniformly cool the ceramic blank. The heat sink 305 and the second fan 306 work together to dissipate heat from the hot end of the semiconductor cooling chip 301, which can uniformly dissipate heat from the ceramic blank and improve the performance of the device.

[0024] like Figure 4 As shown, the cooling assembly 309 includes a protective plate 3091 fixedly connected to the inner wall of the clamping plate 2, a slider 3092 fixedly connected to the bottom end of the clamping plate 2, the slider 3092 slidably connected to the top end of the placement plate 1, temperature sensors 3093 fixedly installed on both the protective plate 3091 and the inner wall of the clamping plate 2, several evenly distributed lead screws 3094 rotatably connected to the top end of the inner wall of the placement plate 1, the lead screws 3094 being threadedly connected to the slider 3092, a second bevel gear 3096 fixedly connected to one end of the lead screw 3094, a motor 3097 fixedly installed on the inner wall of the placement plate 1, and a first bevel gear 3096 fixedly connected to the output shaft of one end of the motor 3097. 095, the first bevel gear 3095 and the second bevel gear 3096 mesh with each other, the motor 3097 meshes with several second bevel gears 3096 through the first bevel gear 3095, and at the same time drives several lead screws 3094 to be threadedly connected to the slider 3092. The slider 3092 drives the clamping plate 2 to move from one side to the middle to clamp the ceramic blank. The protective plate 3091 protects the ceramic blank when the clamping plate 2 clamps it. The temperature sensor 3093 can detect the temperature of the ceramic blank in real time, so as to facilitate processing according to the temperature of the ceramic blank. Fixing it in the center of the placement plate 1 can provide uniform cooling and heat dissipation.

[0025] In use, this invention uses a drive motor 3097 to drive a first bevel gear 3095 to mesh with several second bevel gears 3096, which in turn drives a lead screw 3094 to connect with a slider 3092. This drives the clamping plate 2 to move from one side to the middle to clamp the ceramic blank. A temperature sensor 3093 monitors the temperature of the ceramic blank in real time. A controller powers on the semiconductor cooling chip 301, cooling the top of the chip. The cold air is then conducted to the cooling plate 304 via a transmission rod 303. The controller then drives a first fan 302 to rotate and blow out airflow that passes through the cooling plate 304 and becomes cold air. This cold air passes through a ventilation slot 307 to cool the ceramic blank. The heat sink 305 and the hot end of the semiconductor cooling chip 301 come into contact to dissipate heat. The controller also drives a second fan 306 to blow out airflow that works in conjunction with the heat sink 305 to cool the semiconductor cooling chip 301.

[0026] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A temperature-controlled cooling fixture for sintering ceramic blanks, characterized in that, include: Placement plate (1), the top of which is slidably connected to several evenly distributed clamping plates (2); Cooling mechanism (3), which can rapidly cool and control the temperature of the ceramic blank after sintering, is provided on the inner wall of the placement plate (1); The cooling mechanism (3) includes a semiconductor cooling chip (301) fixedly installed on the inner wall of the placement plate (1). A first fan (302) is rotatably connected to the top of the semiconductor cooling chip (301). Two conductive rods (303) are fixedly connected to both sides of the semiconductor cooling chip (301). A cooling plate (304) is provided at the top of the first fan (302). The conductive rods (303) are connected to both sides of the cooling plate (304). A cooling component (309) is provided at the top of the placement plate (1).

2. The temperature-controlled cooling fixture for ceramic green bodies after sintering according to claim 1, characterized in that: The cooling mechanism (3) further includes a heat sink (305) fixedly installed at the bottom of the semiconductor cooling chip (301), and a second fan (306) is fixedly installed at the bottom of the heat sink (305).

3. The temperature-controlled cooling fixture for ceramic green bodies after sintering according to claim 1, characterized in that: The top of the inner wall of the placement plate (1) is provided with a number of ventilation slots (307) arranged in sequence, and the ventilation slots (307) are located at the top of the first fan (302).

4. The temperature-controlled cooling fixture for ceramic green bodies after sintering according to claim 1, characterized in that: A filter screen (308) is fixedly connected to the bottom end of the placement plate (1).

5. The temperature-controlled cooling fixture for ceramic green bodies after sintering according to claim 1, characterized in that: The cooling component (309) includes a protective plate (3091) fixedly connected to the inner wall of the clamping plate (2), a slider (3092) fixedly connected to the bottom end of the clamping plate (2), the slider (3092) being slidably connected to the top end of the placement plate (1), and temperature sensors (3093) being fixedly installed on both the protective plate (3091) and the inner wall of the clamping plate (2).

6. The temperature-controlled cooling fixture for ceramic green bodies after sintering according to claim 5, characterized in that: The top of the inner wall of the placement plate (1) is rotatably connected to several evenly distributed lead screws (3094), the lead screws (3094) are threadedly connected to the slider (3092), and one end of the lead screws (3094) is fixedly connected to a second bevel gear (3096).

7. The temperature-controlled cooling fixture for ceramic green bodies after sintering according to claim 6, characterized in that: A motor (3097) is fixedly installed on the inner wall of the placement plate (1). The output shaft of one end of the motor (3097) is fixedly connected to a first bevel gear (3095). The first bevel gear (3095) meshes with a second bevel gear (3096).

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