QSFP DD optical module golden finger protection cover
By designing a protective cover for the gold fingers of the QSFP DD optical module, the problem of easy deformation of the gold fingers and lower shell tongue on the PCB board was solved, achieving stability of protocol dimensions and protection of the chip, and improving the reliability and dustproof effect of the product.
Patent Information
- Application Number
- CN202520154109.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2035-01-22
AI Technical Summary
The gold fingers on the PCB board and the lower housing tongue of the QSFP DD optical module are prone to deformation, which affects the protocol size and insertion/removal. Furthermore, the risk of deformation increases after high-temperature testing, leading to product defects.
Design a protective cover for the gold fingers of a QSFP DD optical module, including mounting holes and limiting holes, for aligning and protecting the gold fingers and tongues, preventing deformation from affecting protocol dimensions, and protecting the chip in the event of ESD.
It effectively prevents deformation of the gold fingers and tongue, ensures that the protocol size meets the requirements, protects the chip from electrostatic damage, prevents damage during insertion and removal, and prevents dust.
Smart Images
Figure CN223664816U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical module technology, specifically to a protective cover for the gold fingers of a QSFP DD optical module. Background Technology
[0002] For QSFP DD optical modules, the gold fingers on their PCBs are relatively long. This excessive length poses a risk of deformation, potentially leading to an out-of-specification (NG) 2.25±0.1mm protocol dimension. See details... Figure 1 As shown, the thickness of the upper tongue on the lower housing is only 0.6±0.05mm, which is very thin and easily deformed, resulting in a 0.6±0.05mm protocol size NG. In addition, for QSFP DD optical modules, high temperature, low temperature and room temperature tests are required at the factory to verify product performance. In particular, after the high temperature test, the gold fingers are more prone to deformation during the circulation process, which affects delivery. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a protective cover for the gold fingers of a QSFP DD optical module, so as to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:
[0005] A protective cover for the gold fingers of a QSFP DD optical module includes: a cover body, an assembly hole for inserting the electrical port of the QSFP DD optical module is provided on one side of the cover body, and a first limiting hole is provided on the wall surface facing the hole opening at the gold finger position of the PCB board in the QSFP DD optical module for inserting the gold finger and positioning it.
[0006] The beneficial effects of this utility model are as follows: When the gold fingers of the PCB board in the QSFP DD optical module are deformed during incoming materials or testing, the electrical port of the QSFP DD optical module is inserted into the assembly hole of the protective cover, and the gold fingers are allowed to enter the first limiting hole, so that the gold fingers of the PCB board are forcibly returned to their original position, so as to prevent the deformation from affecting the protocol size and insertion / removal. When the electrical port of the QSFP DD optical module is covered with a protective cover, it can also prevent damage to the gold fingers during the production process, and at the same time, it can also achieve dust prevention.
[0007] Based on the above technical solution, the present invention can be further improved as follows.
[0008] Furthermore, the enclosure is made of anti-static material. When the gold fingers of the QSFP DD optical module are inserted into the first limiting hole through the mounting hole, the enclosure connects the high-speed pad of the gold fingers to the GND of the QSFP DD optical module.
[0009] The further beneficial effect of adopting the above is that it can protect the chips on the PCB board when ESD (electrostatic discharge) occurs, so as to prevent damage to the chips.
[0010] Furthermore, the cover is made of non-metallic material with antistatic particles or antistatic liquid added inside.
[0011] Furthermore, the non-metallic material is PE or PP.
[0012] Furthermore, the first limiting hole has a c-angle of 0.2mm to 0.5mm at the edge of its opening.
[0013] The further beneficial effects of adopting the above are as follows: the edge of the PCB board in the QSFP DD optical module usually has a c-angle of 0.35mm. Therefore, after designing a c-angle of 0.2mm to 0.5mm at the opening of the first limiting hole, the c-angle can serve as a guide surface. Even if there is a deformation of 0.15mm, it will not affect the insertion of the PCB board into the first limiting hole.
[0014] Furthermore, on the wall surface facing the mounting hole, a second limiting hole is provided at the position of the tongue on the lower housing of the QSFP DD optical module, for inserting the tongue and positioning it.
[0015] The further beneficial effect of adopting the above is that when the tongue on the lower housing of the QSFP DD optical module is deformed during the incoming material or testing process, the electrical port of the QSFP DD optical module is inserted into the assembly hole of the protective cover, and the tongue is allowed to enter the second limiting hole, so that the tongue on the lower housing is forcibly returned to its original position, so as to avoid affecting the protocol size and insertion / removal due to its deformation.
[0016] Furthermore, the second limiting hole has a c-angle of 0.2mm to 0.5mm at the edge of its opening.
[0017] The further beneficial effect of adopting the above is that after designing a c-angle of 0.2mm to 0.5mm at the opening of the second limiting hole, the c-angle can serve as a guide surface. Even if there is a deformation of 0.15mm, it will not affect the insertion of the tongue on the lower housing into the second limiting hole. Attached Figure Description
[0018] Figure 1 This is a diagram showing the protocol dimensions of a QSFP DD optical module in the prior art.
[0019] Figure 2 This is a perspective view of the gold finger protective cover for the QSFP DD optical module in this utility model;
[0020] Figure 3 This is a cross-sectional view of the gold finger protective cover of the QSFP DD optical module in this utility model;
[0021] Figure 4Assembly diagram for the protective cover being fitted onto the electrical port of the QSFP DD optical module;
[0022] Figure 5 Enlarged cross-sectional view of a protective cover fitted over the electrical port of a QSFP DD optical module.
[0023] The attached diagram lists the components represented by each number as follows:
[0024] 1. Cover body; 110. Assembly hole; 120. First limiting hole; 130. Second limiting hole; 2. QSFP DD optical module; 210. PCB board; 220. Lower housing; 221. Tongue. Detailed Implementation
[0025] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0026] Example 1
[0027] like Figures 2 to 5 As shown, a protective cover for the gold fingers of a QSFP DD optical module includes:
[0028] The housing 1 has a mounting hole 110 on one side. The mounting hole 110 is a blind hole, not a through hole, for inserting the electrical port of the QSFP DD optical module 2, allowing the housing 1 to fit over the electrical port of the QSFP DD optical module 2. The cross-sectional dimensions of the mounting hole 110 are adapted to the cross-sectional dimensions of the electrical port of the QSFP DD optical module 2, ensuring that the housing 1 does not easily fall off when fitted over the electrical port of the QSFP DD optical module 2. On the wall facing the mounting hole 110, a first limiting hole 120 is provided at the gold finger position of the PCB board 210 in the QSFP DD optical module 2. This first limiting hole 120 is designed to allow the gold finger of the PCB board 210 in the QSFP DD optical module 2 to be inserted and to reposition itself. The height of the first limiting hole 120 is relative to the QSFP DD optical module 2. The protocol dimensions of the DD optical module remain consistent, and the opening size of the first limiting hole 120 is consistent with the gold finger size. If the gold fingers of the PCB board 210 in the QSFP DD optical module 2 deform during incoming materials or testing, the electrical port of the QSFP DD optical module 2 is inserted into the mounting hole 110 of the protective cover, and the gold fingers are allowed to enter the first limiting hole 120, forcibly returning the gold fingers of the PCB board 210 to their original position to prevent the deformation from affecting the protocol dimensions and insertion / removal. Under normal circumstances, even if deformation exists, the deformation is at most within 0.15mm. For products with large deformation, they can be stuck during incoming materials and thus not assembled into finished products. However, even a deformation of only 0.15mm will affect the protocol dimensions and insertion / removal. Therefore, this protective cover is used to return it to its original position. When the electrical port of the QSFP DD optical module 2 is covered with the protective cover, it can also prevent damage to the gold fingers during production and achieve dust protection.
[0029] Example 2
[0030] like Figures 2 to 5 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:
[0031] The cover 1 is made of anti-static material. When the gold fingers of the QSFP DD optical module 2 are inserted into the first limiting hole 120 through the mounting hole 110, the cover 1 connects the high-speed pad of the gold fingers to the GND of the QSFP DD optical module 2. When ESD (electrostatic discharge) occurs, it can protect the chip on the PCB board 210 to prevent damage to the chip. The cover 1 is made of non-metallic material with anti-static particles or anti-static liquid added. The non-metallic material is preferably PE or PP, but other materials can also be used. This is just an example.
[0032] Example 3
[0033] like Figure 2 , Figure 3 ,Figure 5 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:
[0034] The first limiting hole 120 has a c-angle of 0.2mm to 0.5mm at the edge of the hole, for example, a c-angle of 0.3mm. The edge of the PCB board 210 in the QSFPDD optical module 2 usually has a c-angle of 0.35mm. Therefore, after designing a c-angle of 0.2mm to 0.5mm at the opening of the first limiting hole 120, the c-angle can serve as a guide surface. Even if there is a deformation of 0.15mm, it will not affect the insertion of the PCB board 210 into the first limiting hole 120.
[0035] Example 4
[0036] like Figure 2 , Figure 3 , Figure 5 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below:
[0037] On the wall facing the mounting hole 110, a second limiting hole 130 is provided at the position of the tongue 221 on the lower housing 220 of the QSFP DD optical module 2. This second limiting hole 130 is designed to allow the tongue 221 on the lower housing 220 of the QSFP DD optical module 2 to be inserted and positioned. The height of the second limiting hole 130 is consistent with the protocol dimensions of the QSFP DD optical module, and the opening size of the second limiting hole 130 is consistent with the size of the tongue 221. If the tongue 221 on the lower housing 220 of the QSFP DD optical module 2 deforms during incoming materials or testing, the QSFP... The electrical port of the DD optical module 2 is inserted into the mounting hole 110 of the protective cover, and the tongue 221 is inserted into the second limiting hole 130 to force the tongue 221 on the lower housing 220 to return to its original position, so as to prevent its deformation from affecting the protocol size and insertion / removal. Normally, even if there is deformation, the deformation is at most within 0.15mm. For products with large deformation, they can be stuck when they arrive, so they will not be assembled into finished products. However, even a deformation of only 0.15mm will affect the protocol size and insertion / removal, so the protective cover is used to return it to its original position.
[0038] Example 5
[0039] like Figure 2 , Figure 3 , Figure 5 As shown, this embodiment is a further improvement on embodiment 4, as detailed below:
[0040] The second limiting hole 130 has a c-angle of 0.2mm to 0.5mm at the edge of the opening, for example, a c-angle of 0.3mm. After designing a c-angle of 0.2mm to 0.5mm at the opening of the second limiting hole 130, the c-angle can serve as a guide surface. Even if there is a deformation of 0.15mm, it will not affect the insertion of the tongue 221 on the lower housing 220 into the second limiting hole 130.
[0041] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A protective cover for the gold fingers of a QSFP DD optical module, characterized in that, include: The cover (1) has an assembly hole (110) on one side for inserting the electrical port of the QSFP DD optical module (2). On the wall facing the hole, the assembly hole (110) has a first limiting hole (120) for inserting and positioning the gold fingers at the gold fingers of the PCB board (210) in the QSFP DD optical module (2).
2. The QSFP DD optical module gold finger protective cover according to claim 1, characterized in that, The cover (1) is made of anti-static material. When the gold fingers of the QSFP DD optical module (2) are inserted into the first limiting hole (120) through the mounting hole (110), the cover (1) connects the high-speed Pad of the gold fingers to the GND of the QSFP DD optical module (2).
3. A protective cover for the gold fingers of a QSFP DD optical module according to claim 2, characterized in that, The cover (1) is made of non-metallic material with antistatic particles or antistatic liquid added inside.
4. A protective cover for the gold fingers of a QSFP DD optical module according to claim 3, characterized in that, The non-metallic material is PE or PP.
5. A protective cover for the gold fingers of a QSFP DD optical module according to claim 1, characterized in that, The first limiting hole (120) has a c-angle of 0.2mm to 0.5mm at the edge of the hole opening.
6. A protective cover for the gold fingers of a QSFP DD optical module according to claim 1, characterized in that, On the wall surface of the assembly hole (110) facing the opening, there is a second limiting hole (130) at the tongue (221) on the lower housing (220) of the QSFP DD optical module (2) for inserting the tongue (221) and positioning it.
7. A protective cover for the gold fingers of a QSFP DD optical module according to claim 6, characterized in that, The second limiting hole (130) has a c-angle of 0.2mm to 0.5mm at the edge of the opening.