Packaging equipment
By processing the encapsulation layer using a combination of molding, humidification, and drying equipment, the warpage problem of semiconductor packages was solved, achieving stability and integrity of the packages and avoiding additional costs and structural changes.
Patent Information
- Application Number
- CN202423080601.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-12-06
- Filing Date
- 2024-12-13
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-13
AI Technical Summary
Existing semiconductor packages are prone to warping after the molding process, leading to difficulties in subsequent processing or chip breakage.
A combined process of molding, humidification and drying is adopted. By humidifying and drying the encapsulation layer after molding, the moisture content of the encapsulation layer is controlled to shape warping and avoid cracking caused by warping.
It effectively reduces warpage, prevents package breakage, and maintains package integrity without increasing additional costs or altering the existing product structure.
Smart Images
Figure CN223665419U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a semiconductor device, in particular, a packaging device for a semiconductor device. BACKGROUND
[0002] In response to the application of high-performance computing (HPC) technology in today's world life is more important and more widely used, such as medical technology development, such as the development of cancer drugs, or automatic sensing detection operation of automatic driving car, etc. The semiconductor package used in the equipment used in these fields is mostly fan-out package (FOPKG) structure. For example, fan-out multi-chip module (FOMCM) and fan-out embedded bridge die (FOEB) structure has the demand of multi-chip / high line number / large fan-out size / high heat dissipation design.
[0003] Figures 1A-1C A cross-sectional view of the manufacturing process of the existing semiconductor package 1.
[0004] As shown in Figure 1A , a circuit structure 10 is provided on a carrier 9, and at least one semiconductor chip 11 is provided on the circuit structure 10 with its non-active surface 11b through a die attach layer 18, and the active surface 11a of the semiconductor chip 11 has a plurality of conductive bumps 12.
[0005] As shown in Figure 1B , a molding process is performed to form a package gel 15 on the circuit structure 10, and the package gel 15 covers the semiconductor chip 11.
[0006] As shown in Figure 1C , a wiring structure 16 is formed on the package gel 15 to electrically connect the plurality of conductive bumps 12, and a plurality of conductive elements 17 such as C4 bump specifications are formed on the wiring structure 16 for subsequent processes.
[0007] However, in the manufacturing process of the existing semiconductor package 1, after the molding process, the overall structure may have a large amount of warping phenomenon (such as a smiling face or a crying face), resulting in the problem of difficulty or inability to work when the overall structure is placed in the machine in the subsequent stations, and more likely to cause the semiconductor package 1 (especially the semiconductor chip 11) to crack.
[0008] Therefore, how to overcome the above problems of the prior art has become a urgent problem to be solved. The utility model discloses
[0009] In view of the above deficiencies of the prior art, the present application provides a packaging apparatus, comprising: a molding device for forming a packaging layer on an electronic module; and a humidifying device configured to be connected to the molding device for humidifying the packaging layer.
[0010] The present application also provides a packaging method, comprising: placing an electronic module in a molding device to form a packaging layer on the electronic module; and placing the electronic module with the packaging layer in a humidifying device to humidify the packaging layer.
[0011] In the aforementioned packaging apparatus and packaging method, after the packaging layer absorbs moisture, the electronic module with the packaging layer is placed in a drying device to remove moisture in the packaging layer, and the electronic module with the packaging layer is shaped at the same time.
[0012] In the aforementioned packaging apparatus and packaging method, the electronic module includes a carrier structure and electronic components disposed on the carrier structure.
[0013] In the aforementioned packaging apparatus and packaging method, the electronic module is in a circular or rectangular shape.
[0014] In the aforementioned packaging apparatus and packaging method, the humidifying device is used to place the electronic module with the packaging layer in a high-humidity environment to allow the packaging layer to absorb moisture.
[0015] In the aforementioned packaging apparatus and packaging method, the drying device uses a pressure oven or uses a clamp to fix and press to remove moisture from the packaging layer.
[0016] In the aforementioned packaging apparatus and packaging method, the molding device is a molding die including an upper die and a lower die.
[0017] In the aforementioned packaging apparatus and packaging method, the humidifying device is a humidifying chamber.
[0018] In the aforementioned packaging apparatus and packaging method, the drying device is an oven.
[0019] As can be seen from the above, the packaging apparatus of the present application mainly places the electronic module in the molding device for molding operation, and then moves to the humidifying device for humidifying operation after the packaging layer is formed, and then moves to the drying device for drying operation to remove moisture in the packaging layer, so that the packaging layer is fully solidified, and the warping of the electronic module caused by the deformation of the packaging layer can be shaped within a certain range, avoiding the problem of cracking of the electronic package. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figures 1A-1C is a sectional view of a conventional semiconductor packaging method.
[0021] Figure 2 Flow chart of the packaging method of the present application.
[0022] Figures 3A-3C Schematic diagram of the packaging apparatus of the present application.
[0023] Legend of reference numerals
[0024] 1 semiconductor package
[0025] 10 wiring structure
[0026] 11 semiconductor chip
[0027] 11a active surface
[0028] 11b inactive surface
[0029] 12 conductive bump
[0030] 15 encapsulation adhesive
[0031] 16 wiring structure
[0032] 17 conductive element
[0033] 18 crystal mounting adhesive layer
[0034] 2 electronic module
[0035] 20 carrier structure
[0036] 200 carrier unit
[0037] 21 electronic element
[0038] 22 encapsulation layer
[0039] 31 molding device
[0040] 32 humidifying device
[0041] 320 chamber
[0042] 321 frame
[0043] 322 humidifying liquid
[0044] 33 drying device
[0045] 9 carrier
[0046] S21, S22, S23 steps DETAILED DESCRIPTION
[0047] The present application is herein described, by way of example only, with reference to certain embodiments thereof. It is construed that persons skilled in the art might readily devise other embodiments of the present application that are within its scope and spirit, based on the disclosure herein.
[0048] It is to be understood that the structures, proportions, sizes, etc. shown in the drawings accompanying the present specification are merely intended to assist understanding of the content disclosed in the present specification, for the understanding and reading of those skilled in the art, and are not intended to limit the conditions that can be implemented by the present application, and therefore do not have technical significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that can be produced by the present application and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present application.
[0049] Figure 2 is a flowchart of the packaging method of the present application, Figures 3A-3C is a schematic diagram of the packaging apparatus of the present application.
[0050] Please also refer to Figure 2 and Figure 3A Firstly, the packaging method comprises a step S21 of performing a molding operation. An electronic module 2 is disposed in a molding device 31 to perform the molding operation.
[0051] In the present embodiment, the molding device 31 is, for example, a molding die (but not limited thereto) comprising an upper die and a lower die. The electronic module 2 can be in a wafer form of 8-18 inches in diameter or a panel form of 300-700 mm in length of a rectangular side, comprising a support structure 20 (having a plurality of support units 200) and a plurality of electronic elements 21 disposed on the support structure 20 (each support unit 200 is provided with at least one electronic element 21). The electronic module 2 is disposed in the molding device 31 to perform the molding operation to form a packaging layer 22 on the electronic module 2, wherein the molding operation can cause the electronic module 2 to warp.
[0052] In the present embodiment, the electronic element 21 is, for example, a semiconductor chip, which can be electrically connected to the support structure 20 by flip-chip or wire bonding. The packaging layer 22 is an insulating material, such as a polyimide (PI) or an epoxy packaging adhesive material. The type of the electronic module 2, the electrical connection method of the electronic element 21 and the support structure 20, and the material and formation method of the packaging layer 22 are not limited to the foregoing.
[0053] Please also refer to Figure 2 and Figure 3BAfter the molding operation, the encapsulation method includes step S22: performing a humidification operation. After the molding operation, the electronic module 2 with the encapsulation layer 22 is placed in a humidification device 32, i.e., the electronic module 2 with the encapsulation layer 22 is left in a high humidity environment so that the encapsulation layer 22 (encapsulation material) absorbs moisture.
[0054] In this embodiment, the humidification device 32 is, for example, a humidification chamber (but not limited thereto), which mainly has multiple shelves 321 in a chamber 320 for placing multiple electronic modules 2, and sprays a humidification liquid 322 such as water in the chamber 320 to form a high humidity environment in the chamber 320.
[0055] Please refer to Figure 2 and Figure 3C After the encapsulation layer 22 (encapsulation material) absorbs moisture, the electronic module 2 is taken out of the humidification device 32 and placed in a drying device 33.
[0056] In this embodiment, the drying device 33 is, for example, an oven (but not limited thereto), which uses a pressure oven or uses a clamp to fix and press to remove the moisture absorbed in the high humidity environment, so that the encapsulation layer 22 (encapsulation material) is completely cured, and the warping of the encapsulation layer 22 (encapsulation material) caused by shrinkage or expansion deformation in the molding operation can be shaped within a certain range to return to its original state.
[0057] As shown in Figures 3A-3C , the present application also discloses an encapsulation device, which includes a molding device 31, a humidification device 32, and a drying device 33.
[0058] The molding device 31 forms an encapsulation layer 22 on the electronic module 2 to cover and protect the electronic elements 21 of the electronic module 2, wherein the electronic module 2 may be warped, such as smiling face warping or crying face warping, during the formation of the encapsulation layer 22.
[0059] The humidification device 32 is configured to be connected to the molding device 31 to humidify the encapsulation layer 22.
[0060] The drying device 33 is configured to be connected to the humidification device 32 to remove moisture in the encapsulation layer 22, so that the encapsulation layer 22 is fully cured, and the electronic module 2 with the encapsulation layer 22 is shaped to reduce the degree of warping.
[0061] In summary, the packaging device of the present application mainly places the electronic module in the molding device to perform the molding operation, and then moves to the humidifying device to perform the humidifying operation on the packaging layer, and then moves to the drying device to perform the drying operation to remove the moisture in the packaging layer, so that the packaging layer is fully solidified, and the warping of the electronic module caused by the deformation of the packaging layer can be shaped within a certain range, avoiding the problem of cracking of the electronic packaging. At the same time, the aforementioned packaging device does not need to increase the newly developed process and material to solve the existing technical problems in the industry, so there will be no additional cost, and the existing product structure will not be changed, and the existing specifications of the terminal product can be met.
[0062] The above embodiments are used to illustrate the principles and effects of the present application, but not for limiting the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be as listed in the claims.
Claims
1. A packaging apparatus, characterized by, The application relates to a packaging device for electronic modules. The packaging device comprises: a molding device for forming a packaging layer on an electronic module; and 2. The packaging apparatus of claim 1, wherein, a humidifying device configured to be connected to the molding device for humidifying the packaging layer.
3. The packaging apparatus of claim 1, wherein, The packaging device further comprises a drying device configured to be connected to the humidifying device for removing moisture from the packaging layer while shaping the electronic module provided with the packaging layer.
4. The packaging apparatus of claim 1, wherein, The electronic module comprises a carrier structure and electronic components provided on the carrier structure.
5. The packaging apparatus of claim 4, wherein, The electronic module is in a circular or rectangular shape.
6. The packaging apparatus of claim 4, wherein, The electronic module is in a circular shape with a diameter of 8-18 inches.
7. The packaging apparatus of claim 1, wherein, The electronic module is in a rectangular shape with a side length of 300-700 mm.
8. The packaging apparatus of claim 1, wherein, The humidifying device is used to place the electronic module provided with the packaging layer in a high-humidity environment to allow the packaging layer to absorb moisture.
9. The packaging apparatus of claim 1, wherein, The molding device is a molding die comprising an upper die and a lower die.
10. The packaging apparatus of claim 2, wherein, The humidifying device is a humidifying chamber.
11. The packaging apparatus of claim 2, wherein, The drying device uses a pressure oven or a clamp to remove moisture from the packaging layer. The drying device is an oven.