Wafer surface blowing device of Die Attach equipment

Abstract

The utility model relates to the related technical field of Die Attach equipment, in particular to a die Attach equipment wafer surface blowing device, which comprises an equipment main body and a rotating frame arranged on the equipment main body, and further comprises a slide way arranged on the rotating frame, a sliding block is connected in the slide way in a sliding manner, an extension frame is connected with the sliding block in a sliding manner, and the extension frame is connected with the rotating frame in a sliding manner. A rotating base is arranged at the end, away from the sliding block, of the extending frame. The air pipe is connected to the rotating base through a rotating piece, a driving assembly used for driving the rotating piece to rotate on the rotating base is arranged on the rotating base, and the rotating piece which can rotate and is used for fixedly installing the air pipe and the driving assembly used for driving the rotating piece to rotate are arranged on the rotating base. The air pipe and the surface of the wafer can be adjusted in a multi-angle mode, under the action of the air pump, air output by the air pipe has impact force with proper strength and acts on the surface of the wafer, and the purpose of better removing impurities is achieved by matching with the inclination angle of the air pipe.

Description

Technical Field

[0001] This utility model relates to the technical field of Die Attach equipment, and in particular to a wafer surface blowing device for Die Attach equipment. Background Technology

[0002] Die attach equipment, also known as a die bonder or chip mounter, is one of the key pieces of equipment in semiconductor packaging processes. Its main function is to accurately place the chips cut from the wafer onto the packaging substrate and firmly bond the chips to the substrate with adhesive. Die attach equipment is usually equipped with an air blowing device to clean the wafer surface.

[0003] When in use, the air blowing device introduces air into the air tube, which then acts on the wafer surface. Impurities on the wafer surface are detached from the wafer surface by the impact of the airflow and carried away by the airflow, ultimately cleaning away the impurities attached to the wafer. However, during use, the air blowing device has some dead air angles due to the difficulty in adjusting the angle, which weakens the impact force when the airflow acts on the impurities. Moreover, it is not effective in dealing with sticky impurities, and the cleaning effect is not thorough enough, affecting the overall dust removal efficiency of the air blowing device.

[0004] Based on the above situation, it is necessary to design a die attach device for blowing air onto the wafer surface to solve the above problems. Utility Model Content

[0005] This invention provides a die attach device for blowing air onto the wafer surface, which solves the problem that the angle of the blowing device is not easy to adjust in the prior art, resulting in insufficient cleaning of impurities and affecting the overall dust removal efficiency of the blowing device.

[0006] The technical problem solved by this utility model is achieved by the following technical solution:

[0007] A die attach device wafer surface air blowing device includes a device body and a rotating frame mounted on the device body. It further includes: a slide rail on the rotating frame, with a sliding block slidably connected within the slide rail; an extension frame slidably connected to the sliding block, with a rotating base at the end of the extension frame away from the sliding block; an air pipe connected to the rotating base via a rotating component, the output end of the air pipe facing the location of the device body, and a driving assembly on the rotating base for driving the rotating component to rotate on the rotating base; and a telescopic conduit, the output end of which is connected to the input end of the air pipe, and an air pump mounted on the conduit.

[0008] Preferably, the rotating component includes a rotating shaft, a fixing block connected to the rotating shaft, and a fastening plate connected to the fixing block by bolts. When the fastening plate is connected to the fixing block, the purpose of fixing the air tube is achieved.

[0009] Preferably, the drive assembly includes a worm gear connected to one end of the rotating shaft, a worm screwed into the worm gear, and a motor mounted on a rotating base, wherein the worm screw is connected to the output end of the motor.

[0010] Preferably, the extension frame is provided with a rack, the sliding block is connected to a second motor, the output end of the second motor is connected to a rotating gear, and the rotating gear meshes with the rack.

[0011] Preferably, the rotating frame is provided with a telescopic rod, and the movable end of the telescopic rod is connected to the sliding block.

[0012] Preferably, the main body of the equipment is provided with a motor three, the output end of the motor three is connected to a driving gear, and the rotating frame is connected to a driven gear, the driving gear and the driven gear meshing.

[0013] Preferably, a limiting rod is connected to the extension frame, and the limiting rod is slidably connected to the sliding block.

[0014] The beneficial effects of this utility model are as follows: by setting a rotating component that can rotate and is used to fix the air pipe on the rotating base, and a driving component that drives the rotating component to rotate, the air pipe and the wafer surface can be adjusted at multiple angles. Under the action of the air pump, the gas output from the air pipe has an appropriate impact force and acts on the wafer surface. Combined with the tilt angle of the air pipe, the purpose of removing impurities is achieved better. When dealing with some airflow dead corners or sticky impurities, the cleaning effect is good, and the overall dust removal efficiency of the blowing device is improved. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a partial structural diagram of the present invention. Figure 1 ;

[0018] Figure 3 This is a partial structural diagram of the present invention. Figure 2 ;

[0019] Figure 4 This utility model Figure 3 Schematic diagram of local structure Figure 1 ;

[0020] Figure 5 This utility model Figure 3 Schematic diagram of local structure Figure 2 .

[0021] In the diagram, 1. Main body of the equipment; 2. Rotating frame; 3. Slide rail; 4. Sliding block; 5. Extension frame; 6. Rotating base; 7. Air pipe; 8. Conduit; 9. Air pump; 10. Rotating shaft; 11. Fixing block; 12. Fastening plate; 13. Worm gear; 14. Worm; 15. Motor 1; 16. Rack; 17. Motor 2; 18. Rotating gear; 19. Telescopic rod; 20. Motor 3; 21. Driven gear; 22. Driving gear; 23. Limiting rod; 24. Stop bar; 25. Support component. Detailed Implementation

[0022] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below with reference to specific illustrations.

[0023] Reference Figures 1-5 As shown, a die attach device wafer surface blowing device includes a device body 1 and a rotating frame 2 mounted on the device body 1. The device body 1 is a die attach device. When the die attach device is working, the wafer will be located at a specific position on it. Since this device is an existing device, it will not be described in detail. It also includes a slide rail 3 mounted on the rotating frame 2, an extension frame 5 slidably connected to the sliding block 4, an air pipe 7 connected to the rotating base 6 through a rotating component, and a conduit 8 with telescopic function.

[0024] Specifically, a sliding block 4 is slidably connected inside the slide rail 3; a rotating base 6 is provided on the end of the extension frame 5 away from the sliding block 4; the output end of the air pipe 7 faces the location of the main body 1 of the equipment, and a driving component for driving the rotating parts to rotate on the rotating base 6 is provided; the output end of the conduit 8 is connected to the input end of the air pipe 7, and the conduit 8 is telescopic, so when the air pipe 7 deflects, the conduit 8 will not affect the air pipe 7, reducing the large interaction force between the conduit 8 and the air pipe 7; an air pump 9 is provided on the conduit 8, which is used to accelerate the gas and give the gas a certain impact force; and a support member 25 for supporting the conduit 8 is provided on the rotating base 6, which prevents the conduit 8 from being clamped in the extension frame 5;

[0025] In use, when the wafer is located at a specific position on the main body 1 of the equipment, the extension frame 5 is moved so that the end connected to the rotating base 6 moves toward the position of the wafer. After the extension frame 5 moves the air tube 7 to the required position, the drive component drives the rotating part to rotate, which in turn drives the air tube 7 connected to the rotating part to rotate. The movement trajectory of the output end of the air tube 7 is a circular motion with the rotating part as the center, which can be used to adjust the deflection angle of the output end of the air tube 7. Then the air pump 9 will accelerate the gas received by the conduit 8, so that the gas has an appropriate impact force and acts on the surface of the wafer, thereby achieving the purpose of better removing impurities. In addition, the drive component can be used at any time during use to deflect the output end of the conduit 8.

[0026] The effects on impurities vary depending on the deflection angle of the conduit 8. When the conduit 8 outputs gas at an angle perpendicular to the wafer surface, the vertical airflow can directly provide a force opposite to the bonding force, which helps to separate the deposits from the wafer surface. When the conduit 8 outputs gas at an angle inclined to the wafer surface, the inclined airflow can form a shear force on the wafer surface. This shear force can destroy the bonding force between the deposits and the wafer surface. Especially for some deposits that have a certain friction or adhesion to the wafer surface, the shear force effect of the inclined airflow is more obvious. At the same time, the inclined airflow can also change the airflow environment around the deposits, making them easier to be carried away by the airflow.

[0027] When dealing with impurities in some airflow dead zones attached to the wafer, this device structure can be used in conjunction with the conduit 8 by adjusting the tilt angle of the conduit 8, and by adjusting the positional relationship of the extension frame 5, the sliding block 4 and the rotating frame 2, so as to clean the impurities in the airflow dead zones.

[0028] The rotating component includes a rotating shaft 10, one end of which passes through the rotating base 6 and extends to the outside of the rotating base 6. The rotating component also includes a fixing block 11 connected to the rotating shaft 10 and a fastening plate 12 connected to the fixing block 11 by bolts. The fixing block 11 and the fastening plate 12 are provided with corresponding slots. When in use, the air tube 7 is placed in the appropriate position of the slot, and then the fastening plate 12 is connected to the fixing block 11 to achieve the purpose of fixing the air tube 7.

[0029] Furthermore, the drive assembly includes a worm gear 13 connected to one end of the rotating shaft 10, a worm 14 screwed into the worm gear 13, and a motor 15 mounted on the rotating base 6. The worm 14 is connected to the output end of the motor 15. In use, the motor 15 drives the worm 14 to rotate, which in turn drives the worm gear 13 to rotate, which in turn drives the rotating shaft 10 to rotate.

[0030] To ensure that the vertical angle of the air tube 7 is more accurate each time it is deflected perpendicular to the wafer surface, a stop bar 24 is added to the rotating base 6. The stop bar 24 blocks the deflection of the air tube 7, ensuring that the air tube 7 remains perpendicular to the wafer surface.

[0031] In addition, to facilitate the movement of the extension frame 5, a rack 16 is provided on the extension frame 5, and a second motor 17 is connected to the sliding block 4. A rotating gear 18 is connected to the output end of the second motor 17. The rotating gear 18 meshes with the rack 16. When it is necessary to move the extension frame 5, it is only necessary to start and control the second motor 17. The output end of the second motor 17 will drive the rotating gear 18 to rotate, and then drive the extension frame 5 to move in a linear direction through the rack 16.

[0032] Next, in order to solve the problem that the air tube 7 might touch the wafer when it rotates, a telescopic rod 19 is provided on the rotating frame 2. The movable end of the telescopic rod 19 is connected to the sliding block 4. When the air tube 7 changes from being inclined to being perpendicular to the wafer surface, the vertical distance between the output end of the air tube 7 and the wafer surface will increase, which will create the risk of the air tube 7 touching the wafer. Therefore, after the telescopic rod 19 is provided, it can be activated at the same time as the air tube 7 deflects, and the sliding block 4 can be moved vertically. This will counteract the change in distance between the air tube 7 and the wafer caused by the angle deflection, so that the output end of the air tube 7 and the wafer are always at a relatively safe distance.

[0033] Furthermore, to increase the horizontal movement area of ​​the air tube 7, a motor 20 is provided on the main body 1 of the device. The output end of the motor 20 is connected to a drive gear 22, and a driven gear 21 is connected to the rotating frame 2. The drive gear 22 and the driven gear 21 mesh. When in use, the motor 20 is started and controlled, which drives the drive gear 22 to rotate, which in turn drives the driven gear 21 to rotate, which in turn drives the rotating frame 2 to rotate, and finally drives the extension frame 5 and the air tube 7 to move synchronously. With the linear movement of the extension frame 5, the air tube 7 can be positioned in a suitable position.

[0034] Finally, in order to make the extension frame 5 move more smoothly on the sliding block 4, a limiting rod 23 is connected to the extension frame 5. The limiting rod 23 is slidably connected to the sliding block 4. When the extension frame 5 moves on the sliding block 4, it will be more stable under the action of the limiting rod 23.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A die attach device for blowing air onto the wafer surface, comprising a main body (1) and a rotating frame (2) mounted on the main body (1), characterized in that, Also includes: A slide rail (3) is provided on the rotating frame (2), and a sliding block (4) is slidably connected in the slide rail (3): An extension frame (5) is slidably connected to the sliding block (4), and a rotating base (6) is provided on one end of the extension frame (5) away from the sliding block (4). The air pipe (7) is connected to the rotating base (6) via a rotating component. The output end of the air pipe (7) faces the location of the main body (1) of the device. The rotating base (6) is provided with a drive assembly for driving the rotating component to rotate on the rotating base (6). A telescopic conduit (8) is provided, the output end of which is connected to the input end of the trachea (7), and an air pump (9) is provided on the conduit (8).

2. The die attach device for wafer surface blowing according to claim 1, characterized in that, The rotating component includes a rotating shaft (10), a fixing block (11) connected to the rotating shaft (10), and a fastening plate (12) connected to the fixing block (11) by bolts. When the fastening plate (12) is connected to the fixing block (11), the purpose of fixing the air tube (7) is achieved.

3. The wafer surface blowing device for a die attach apparatus according to claim 2, characterized in that, The drive assembly includes a worm gear (13) connected to one end of a rotating shaft (10), a worm (14) screwed into the worm gear (13), and a motor (15) mounted on a rotating base (6), wherein the worm (14) is connected to the output end of the motor (15).

4. The wafer surface blowing device for a die attach apparatus according to claim 1, characterized in that, The extension frame (5) is provided with a rack (16), and a second motor (17) is connected to the sliding block (4). A rotating gear (18) is connected to the output end of the second motor (17), and the rotating gear (18) meshes with the rack (16).

5. The wafer surface blowing device for a die attach apparatus according to claim 1, characterized in that, The rotating frame (2) is provided with a telescopic rod (19), and the movable end of the telescopic rod (19) is connected to the sliding block (4).

6. The wafer surface blowing device for a die attach apparatus according to claim 1, characterized in that, The main body (1) of the equipment is provided with a motor three (20), the output end of the motor three (20) is connected to a drive gear (22), and the rotating frame (2) is connected to a driven gear (21), the drive gear (22) and the driven gear (21) mesh with each other.

7. The wafer surface blowing device for a die attach apparatus according to claim 1, characterized in that, The extension frame (5) is connected to a limiting rod (23), and the limiting rod (23) is slidably connected to the sliding block (4).

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