Packaging type integrated circuit

Abstract

The utility model discloses a packaged integrated circuit which comprises a ceramic shell, an integrated circuit board body is arranged in a groove in the upper side of the ceramic shell through a base plate, a first positioning groove is formed in the upper side of the ceramic shell, a sealing cover is clamped in the first positioning groove, and second positioning grooves are formed in the two sides of the sealing cover. A second positioning groove is formed in the upper side of the ceramic shell, a limiting protrusion is elastically arranged in the upper side of the ceramic shell in a sliding mode and clamped in the second positioning groove, a heat dissipation heat conduction plate transversely penetrates through the bottom in the ceramic shell, and an upper heat dissipation plate and a lower heat dissipation plate are arranged on the two sides of the heat dissipation heat conduction plate respectively. Meanwhile, the upper heat dissipation plate and the lower heat dissipation plate are arranged on the two sides of the heat dissipation and heat conduction plate respectively, and the ventilation and heat dissipation channels are formed in the heat dissipation and heat conduction plate, so that the heat conduction and heat dissipation effects of the lower portion in the ceramic shell are good, and the purpose of rapidly dissipating heat of the packaged integrated circuit chip is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit technical field, concretely is a kind of encapsulated integrated circuit. BACKGROUND

[0002] The integrated circuit module is composed of the way that all devices and interconnect lines are disposed on a semiconductor substrate material, these components are disposed on a single silicon substrate by semiconductor device manufacturing process (such as photolithography etc.), to form circuit, the integrated circuit module is required to have good airtightness when applied in aerospace field, therefore the integrated circuit module often adopts the way of metal ceramic shell packaging to guarantee airtightness. The highly integrated integrated circuit chip is packaged in ceramic shell, due to the limited space in cavity, the requirement for heat dissipation is higher, especially for continuous operation condition, the requirement for heat dissipation is more stringent.

[0003] In the prior art, the application number CN201922339656.7 of a kind of metal ceramic encapsulated integrated circuit module of high pressure resistance, by further installing upper cover and lower cover on the outside of metal ceramic encapsulated integrated circuit module body, it is closed and protected, prevent the problem that high pressure directly passes through air and damages the metal ceramic shell of integrated circuit module body, guarantee the long-term reliability of integrated circuit module body. However, the clamping positioning stability of sealing cover is general, and the disassembly and assembly operation is not convenient, and the heat dissipation effect of the lower part in the ceramic shell is poor, which is difficult to meet the needs of integrated circuit packaging use. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of encapsulated integrated circuit, to solve the problem that the clamping positioning stability of sealing cover in prior art is general, and the disassembly and assembly operation is not convenient, and the heat dissipation effect of the lower part in the ceramic shell is poor, which is difficult to meet the needs of integrated circuit packaging use.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of encapsulated integrated circuit, including ceramic shell, the recess in the upper side of the ceramic shell is provided with integrated circuit board body by gusset plate, the first positioning groove is set up in the upper side of the ceramic shell, and the sealing cover is clamped and set in the first positioning groove, the second positioning groove is set up in the both sides of the sealing cover, the limit protrusion is elastically slid and set in the inside of the upper side of the ceramic shell, and the limit protrusion is clamped and set in the second positioning groove, the heat dissipation and heat conduction plate is horizontally through and set in the bottom of the ceramic shell, the upper heat dissipation plate and the lower heat dissipation plate are respectively set in the both sides of the heat dissipation and heat conduction plate, and the ventilation and heat dissipation channel is set up in the inside of the heat dissipation and heat conduction plate.

[0006] Further, the sealing protruding strip is installed in the lower side of the sealing cover, and the sealing protruding strip is set into rectangular frame shape.

[0007] Further, the ceramic shell upper side is internally provided with a limiting sliding groove, the limiting convex is slidably arranged in the limiting sliding groove through a limiting plate, and a spring is arranged between the limiting sliding groove and the limiting plate.

[0008] Further, the limiting sliding groove inner wall is further provided with a guide rod, and the limiting plate two sides are slidably arranged with the guide rod, and the limiting plate one side is provided with a pull rod.

[0009] Further, the ceramic shell upper side of the heat dissipation heat conduction plate two ends is provided with a sealing clamping groove, and the sealing clamping groove is hingedly provided with a sealing plate.

[0010] Further, the upper heat dissipation plate is internally provided with a heat dissipation groove, and the lower heat dissipation plate is internally provided with a heat dissipation hole, and the heat dissipation hole and the heat dissipation groove are communicated with the ventilation heat dissipation channel.

[0011] Compared with the prior art, the beneficial effects of the present application are:

[0012] The first positioning groove of the ceramic shell upper side is provided with a sealing cover, the sealing cover two sides are provided with a second positioning groove, the ceramic shell upper side is internally provided with a limiting convex which is elastically slidably arranged, and the limiting convex is clamped in the second positioning groove, so that the sealing cover clamped on the ceramic shell upper side has high stability, and is convenient and fast to disassemble and assemble.

[0013] The ceramic shell inner bottom is transversely provided with a heat dissipation heat conduction plate, the heat dissipation heat conduction plate two sides are respectively provided with an upper heat dissipation plate and a lower heat dissipation plate, the heat dissipation heat conduction plate is internally provided with a ventilation heat dissipation channel, the area of heat conduction and heat dissipation is increased, and the air cooling is carried out by cooperating with the air blower, so that the heat conduction and heat dissipation effect of the ceramic shell inner lower part is good, thereby realizing the purpose of quickly dissipating heat of the packaged integrated circuit chip.

[0014] The ceramic shell inner bottom is transversely provided with a heat dissipation heat conduction plate, the heat dissipation heat conduction plate two sides are respectively provided with an upper heat dissipation plate and a lower heat dissipation plate, the heat dissipation heat conduction plate is internally provided with a ventilation heat dissipation channel, the area of heat conduction and heat dissipation is increased, and the air cooling is carried out by cooperating with the air blower, so that the heat conduction and heat dissipation effect of the ceramic shell inner lower part is good, thereby realizing the purpose of quickly dissipating heat of the packaged integrated circuit chip. BRIEF DESCRIPTION OF DRAWINGS

[0015] The drawings are used to provide further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with the embodiments of the present application, and do not constitute a limitation on the present application.

[0016] Figure 1 is the ceramic shell internal structure front view of the present application;

[0017] Figure 2 is the overall structure schematic view of the present application;

[0018] Figure 3It is the heat dissipation and heat conduction plate structure schematic diagram of the utility model;

[0019] Figure 4 It is the A place structure amplification schematic diagram of the utility model;

[0020] Figure 5 It is the limiting protruding structure schematic diagram of the utility model.

[0021] In the drawing: 1, ceramic shell;2, sealing cover;3, integrated circuit board body;4, pad;5, heat dissipation and heat conduction plate;6, lower heat dissipation plate;7, upper heat dissipation plate;8, ventilation and heat dissipation channel;9, heat dissipation hole;10, heat dissipation groove;11, sealing clamping groove;12, sealing plate;13, first positioning groove;14, sealing protruding strip;15, second positioning groove;16, limiting protrusion;17, limiting plate;18, limiting sliding slot;19, guide rod;20, spring;21, pull rod;22, air blower. Specific implementation

[0022] The technical scheme in the embodiments of the utility model will be apparently and completely described in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the range of protection of the utility model.

[0023] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 In the embodiments of the utility model, a packaged integrated circuit includes a ceramic shell 1, an integrated circuit board body 3 is arranged in the recess on the upper side of the ceramic shell 1 through a pad 4, a first positioning groove 13 is formed on the upper side of the ceramic shell 1, and a sealing cover 2 is clamped in the first positioning groove 13, so as to seal the upper part of the ceramic shell 1, second positioning grooves 15 are formed on the two sides of the sealing cover 2, a limiting protrusion 16 is elastically and slidably arranged in the ceramic shell 1, and the limiting protrusion 16 is clamped in the second positioning grooves 15, so as to improve the stability of the sealing cover 2 clamped in the first positioning groove 13, and the sealing cover 2 is convenient to disassemble and assemble, a heat dissipation and heat conduction plate 5 is transversely arranged in the bottom of the ceramic shell 1, upper and lower heat dissipation plates 7 and 6 are arranged on the two sides of the heat dissipation and heat conduction plate 5, a ventilation and heat dissipation channel 8 is formed in the heat dissipation and heat conduction plate 5, and an air blower 22 is connected to one end of the ventilation and heat dissipation channel 8 through a wind conveying pipe, the air blower 22 is a micro air blower, so as to convey cool air to the ventilation and heat dissipation channel 8 for air cooling treatment, increase the area of heat conduction and heat dissipation, and cooperate with air cooling, so that the heat conduction and heat dissipation effect of the lower part of the ceramic shell 1 is good, and the purpose of rapidly dissipating heat of the packaged integrated circuit chip is achieved.

[0024] Preferably, the sealing cover 2 is provided with a sealing protrusion 14 on the lower side, and the sealing protrusion 14 is arranged in a rectangular frame shape, so as to improve the sealing performance of the sealing cover 2 clamped in the first positioning groove 13.

[0025] Preferably, a limiting sliding groove 18 is arranged in the upper side of the ceramic shell 1, and one end of the limiting protrusion 16 is slidably arranged in the limiting sliding groove 18 through a limiting plate 17, and a spring 20 is arranged between the limiting sliding groove 18 and the limiting plate 17, so as to elastically slide the one end of the limiting protrusion 16 in the upper side of the ceramic shell 1, thereby facilitating the elastic clamping and positioning of the two sides of the sealing cover 2.

[0026] Preferably, the limiting sliding groove 18 is further provided with a guide rod 19, and the limiting plate 17 is slidably arranged on both sides of the guide rod 19, so as to guide the sliding of the limiting protrusion 16 during movement adjustment, thereby improving the stability of the limiting protrusion 16 clamped in the second positioning groove 15, and the limiting plate 17 is provided with a pull rod 21 on one side, so as to pull the limiting protrusion 16 to make it separate from the second positioning groove 15, thereby facilitating the disassembly of the sealing cover 2.

[0027] Preferably, the ceramic shell 1 is provided with a sealing clamping groove 11 on both ends of the heat dissipation and conduction plate 5, and a sealing plate 12 is hingedly arranged in the sealing clamping groove 11, so that the heat dissipation and conduction plate 5 can be sealed by the two ends when not in use, thereby improving the flexibility of use.

[0028] Preferably, the upper heat dissipation plate 7 is provided with a heat dissipation groove 10, and the lower heat dissipation plate 6 is provided with a heat dissipation hole 9, and the heat dissipation hole 9 and the heat dissipation groove 10 are in communication with the ventilation and heat dissipation channel 8, thereby increasing the air flow between the upper heat dissipation plate 7, the lower heat dissipation plate 6 and the heat dissipation and conduction plate 5, and further improving the efficiency of heat conduction and dissipation.

[0029] The working principle and use process of the utility model are as follows: the sealing cover 2 is clamped in the first positioning groove 13 on the upper side of the ceramic shell 1, which is used for sealing the upper part of the ceramic shell 1, the second positioning groove 15 is arranged on both sides of the sealing cover 2, the limiting protrusion 16 is elastically slidably arranged in the upper side of the ceramic shell 1, and the limiting protrusion 16 is clamped in the second positioning groove 15, so that the stability of the sealing cover 2 clamped on the upper side of the ceramic shell 1 is high, the sealing performance is good, and the disassembly and assembly are convenient and fast; the heat dissipation and conduction plate 5 is transversely arranged in the bottom of the ceramic shell 1, the upper heat dissipation plate 7 and the lower heat dissipation plate 6 are arranged on both sides of the heat dissipation and conduction plate 5, the ventilation and heat dissipation channel 8 is arranged in the heat dissipation and conduction plate 5, thereby increasing the area of heat conduction and dissipation, and cooperating with air cooling, so that the heat conduction and dissipation effect of the lower part of the ceramic shell 1 is good, thereby realizing the purpose of quickly dissipating heat of the packaged integrated circuit chip.

[0030] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application have been described in detail, for the skilled in the art, it still can be modified, or for the equivalent replacement of part of the technical features of the technical solutions recorded in the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included within the scope of the present application.

Claims

1. A packaged integrated circuit comprising a ceramic housing (1), characterized in that: The ceramic shell (1) upper side inside the recess is provided with integrated circuit board body (3) through the backing plate (4), the ceramic shell (1) upper side is provided with first positioning groove (13), and the first positioning groove (13) is provided with sealing cover (2), the sealing cover (2) both sides are provided with second positioning groove (15), the ceramic shell (1) upper side inside is elastically slidably provided with limiting protrusion (16), and the limiting protrusion (16) is clamped in the second positioning groove (15), the ceramic shell (1) inner bottom is provided with heat dissipation heat conduction plate (5) through the horizontal, the heat dissipation heat conduction plate (5) both sides are respectively provided with upper heat dissipation plate (7) and lower heat dissipation plate (6), the heat dissipation heat conduction plate (5) inside is provided with ventilation heat dissipation channel (8), the ventilation heat dissipation channel (8) one end inside is connected with the air blower (22) through the air conveying pipeline.

2. The packaged integrated circuit of claim 1, wherein: The sealing cover (2) lower side is provided with sealing convex strip (14), and the sealing convex strip (14) is provided with rectangular frame shape.

3. The packaged integrated circuit of claim 1, wherein: The ceramic shell (1) upper side inside is provided with limiting sliding groove (18), and the limiting protrusion (16) one end is slidably provided in the limiting sliding groove (18) through the limiting plate (17), and the limiting sliding groove (18) and the limiting plate (17) are provided with spring (20) between.

4. The packaged integrated circuit of claim 3, wherein: The limiting sliding groove (18) inner wall is also provided with guide rod (19), and the limiting plate (17) both sides are slidably provided with guide rod (19), the limiting plate (17) one side is provided with pull rod (21).

5. The packaged integrated circuit of claim 1, wherein: The ceramic shell (1) on both ends of the heat dissipation heat conduction plate (5) is provided with sealing clamping groove (11), and the sealing clamping groove (11) is hingedly provided with sealing plate (12).

6. The packaged integrated circuit of claim 1, wherein: The upper heat dissipation plate (7) inside is provided with heat dissipation groove (10), the lower heat dissipation plate (6) is provided with heat dissipation hole (9) inside, and the heat dissipation hole (9) and the heat dissipation groove (10) are all communicated with the ventilation heat dissipation channel (8).

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