Lead frame

Abstract

The utility model discloses a lead frame. The lead frame comprises a frame body; the at least one frame unit is arranged in the frame body, the frame unit comprises a base island and a pin, the base island is arranged in the middle of the frame unit and used for supporting a chip, the pin is arranged on the outer side of the base island and comprises a first pin section, a second pin section and a third pin section, and the first pin section, the second pin section and the third pin section are arranged in parallel. The first foot section is connected with the frame body, the second foot section is connected with the first foot section, the side, facing the first foot section, of the second foot section is obliquely arranged, the third foot section is connected with the second foot section, and a bent part is arranged at the end, away from the second foot section, of the third foot section. According to the lead frame provided by the embodiment of the invention, the glue grabbing area of the glue and the lead frame can be increased, the influence of the punching force of an external punching die on the interior of a plastic package body is reduced, the reliability of a product is improved, and the quality of the product is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a lead frame. BACKGROUND

[0002] The lead frame is a chip carrier of an integrated circuit and a chip lead frame, which is a key structural part for realizing electrical connection between an internal circuit lead-out end of a chip and an external lead wire by means of a bonding wire to form an electrical circuit. The lead frame plays a role of a bridge for connecting the external lead wire, and is used in most semiconductor integrated blocks and is an important basic material in the electronic information industry. However, the existing lead frame is cracked due to pulling by a punching force in a cutting rib forming process after packaging. CONTENT OF THE UTILITY MODEL

[0003] The present application aims to at least solve one of the technical problems in the prior art. To this end, the present application provides a lead frame which can increase the glue holding area of the glue and the lead frame, reduce the influence of the punching force of the external punching die on the inside of the plastic package, improve the reliability of the product, and ensure the product quality.

[0004] The lead frame according to the embodiment of the present application comprises: a frame body; at least one frame unit arranged in the frame body, the frame unit comprising a base island and a lead pin, the base island being arranged at the middle part of the frame unit and being used for supporting a chip, the lead pin being arranged at the outer side of the base island, the lead pin comprising a first pin segment, a second pin segment and a third pin segment, the first pin segment being connected with the frame body, the second pin segment being connected with the first pin segment, the second pin segment being arranged obliquely towards one side of the first pin segment, and the third pin segment being connected with the second pin segment, and a bending part being arranged at one end of the third pin segment away from the second pin segment.

[0005] The lead frame according to the embodiment of the present application has at least the following beneficial effects: the lead frame according to the embodiment of the present application can increase the glue holding area of the glue and the lead frame, reduce the influence of the punching force of the external punching die on the inside of the plastic package, improve the reliability of the product, and ensure the product quality by dividing the lead pin into the first pin segment, the second pin segment and the third pin segment, and arranging the second pin segment obliquely towards one side of the first pin segment and arranging the bending part at one end of the third pin segment away from the second pin segment.

[0006] The first pin segment is connected perpendicularly with the frame body according to the embodiment of the lead frame of the present application.

[0007] The second pin segment is provided with a protruding part on one side away from the base island according to the embodiment of the lead frame of the present application.

[0008] According to the lead frame described in the embodiment of this application, the third leg segment is arranged parallel to the first leg segment, and a recess is provided on the side of the third leg segment away from the base island, so that the recess and the end face of the third leg segment form the bending portion.

[0009] According to the lead frame described in the embodiments of this application, the second leg segment and the first leg segment are connected by a riser, the riser being located on the side of the second leg segment and the first leg segment near the base island.

[0010] According to the lead frame described in the embodiments of this application, the base island has a rectangular structure, and the pins are arranged on the left and right sides of the base island and corresponding to the four corners of the base island, with the pins on the same side arranged opposite to each other.

[0011] According to the lead frame described in the embodiments of this application, the four corners of the base island are provided with inclined surfaces, and the inclined surfaces are arranged parallel to the second foot segment.

[0012] According to the lead frame described in the embodiments of this application, the base island is provided with lugs, and the lugs are located between the pins on the same side.

[0013] According to the lead frame described in the embodiments of this application, the frame body is provided with a connecting rib, the connecting rib is located below the base island, and the connecting rib is connected to the base island.

[0014] According to the lead frame described in the embodiments of this application, the surfaces of the pins and the base island are both provided with a metal plating layer.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0017] Figure 1 This is a schematic diagram of the lead frame structure according to an embodiment of this application;

[0018] Figure 2 This is a schematic diagram of the structure of the frame unit in the lead frame according to an embodiment of this application;

[0019] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0020] Figure label:

[0021] Frame body 100; connecting rib 110; frame unit 200; base island 210; inclined surface 211; support lug 212; pin 220; first leg segment 221; second leg segment 222; third leg segment 223; bent part 224; protrusion 225; recessed part 226; rising part 227. Detailed Implementation

[0022] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0023] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] In the description of this application, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" and "second" are mentioned, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation, connection, and linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] Reference Figures 1 to 3This application provides a lead frame, including: a frame body 100; at least one frame unit 200 disposed within the frame body 100, the frame unit 200 including a base island 210 and pins 220, the base island 210 being disposed in the middle of the frame unit 200 and used to support a chip, the pins 220 being disposed on the outer side of the base island 210, the pins 220 including a first pin segment 221, a second pin segment 222 and a third pin segment 223, the first pin segment 221 being connected to the frame body 100, the second pin segment 222 being connected to the first pin segment 221, the second pin segment 222 being inclined toward one side of the first pin segment 221, the third pin segment 223 being connected to the second pin segment 222, and a bent portion 224 being provided at the end of the third pin segment 223 away from the second pin segment 222.

[0027] The lead frame described in this application divides the pin 220 into a first pin segment 221, a second pin segment 222, and a third pin segment 223. The second pin segment 222 is inclined toward the side of the first pin segment 221, and the third pin segment 223 has a bent portion 224 at the end away from the second pin segment 222. This increases the adhesive gripping area between the adhesive and the lead frame, reduces the impact of the external die-cutting force on the interior of the encapsulation, improves product reliability, and ensures product quality.

[0028] Reference Figure 1 In this embodiment, four frame units 200 are provided, and the four frame units 200 are arranged in an array on the frame body 100. Of course, three, five, or other frame units 200 may also be provided. This application does not limit the number of frame units 200.

[0029] Reference Figures 1 to 3 Furthermore, the first foot segment 221 is vertically connected to the frame body 100 to facilitate manufacturing and processing, and to simplify operation. Of course, the first foot segment 221 can also be inclined to the frame body 100, and this application does not limit this.

[0030] A protrusion 225 is provided on the side of the second lead segment 222 away from the base island 210. By providing the protrusion 225 on the side of the second lead segment 222 away from the base island 210, the molding strength between the lead 220 and the outer wall of the molding compound can be improved, ensuring product quality. The protrusion 225 is designed with an arc shape, which enhances the overall aesthetics. It should be noted that the protrusion 225 can also be designed with rectangular, triangular, or other shapes; this application does not impose any limitations on this.

[0031] The third leg segment 223 is arranged parallel to the first leg segment 221. A recess 226 is provided on the side of the third leg segment 223 away from the base island 210, forming a bend 224 between the recess 226 and the end face of the third leg segment 223. By placing the recess 226 on the side of the third leg segment 223 away from the base island 210, the bonding strength with the molding compound can be further enhanced, improving product quality. The bend 224 formed by the recess 226 and the end face of the third leg segment 223, located on the side of the third leg segment away from the base island 210, increases the adhesive gripping area between the colloid and the lead frame, reduces the impact of the external die-cutting force on the interior of the molding compound, improves product reliability, and ensures product quality. The recess 226 can be an arc structure or a rectangular structure, etc., and those skilled in the art can make a reasonable choice according to the actual situation; this application does not impose any restrictions on this.

[0032] Furthermore, the second lead segment 222 is connected to the first lead segment 221 via a riser 227, which is located on the side of the second lead segment 222 and the first lead segment 221 closest to the base island 210. The bending portion 224 cooperates with the riser 227 to form a double-locking mechanism to prevent stretching. After molding, this mechanism can form a reverse locking action with the molding body. Under the physical locking and interlocking action of the action and reaction forces, a reverse force is provided during the molding and punching process to counteract the external force, protecting the product's leads 220 from being loosened or misaligned by external forces. This effectively solves problems such as delamination between the leads 220 and the molding body, and lead wire breakage, thus improving product quality.

[0033] Reference Figures 1 to 3 In this embodiment, the base island 210 has a rectangular structure, and four pins 220 are arranged on the left and right sides of the base island 210, corresponding to the four corners of the base island 210. The pins 220 on the same side are arranged opposite each other. Further, the four corners of the base island 210 are provided with bevels 211, which are parallel to the second lead segment 222. This structure improves the overall aesthetics. Furthermore, the base island 210 is provided with lugs 212, located between the pins 220 on the same side, which helps improve the bonding with the molding compound and enhances product quality. Both the pins 220 and the base island 210 have a metal plating layer. This metal plating layer provides protection, facilitates the internal lead layout of the product, and avoids the risk of delamination between the molding compound and the base island 210 by preventing the entire base island 210 from being silver-plated.

[0034] It is conceivable that the frame body 100 is provided with connecting ribs 110, which are located below the base island 210 and connected to the base island 210, thereby ensuring the stability and reliability of the structure.

[0035] In the description of this application, the references to terms such as "an embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The terms "first," "second," "third," "fourth," etc. (if applicable) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein.

[0037] It should also be noted that, in the description of this application, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0038] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may also include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or apparatus.

[0039] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0040] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A lead frame, characterized in that, include: Framework body; At least one frame unit is disposed within the frame body. The frame unit includes a base island and pins. The base island is disposed in the middle of the frame unit and is used to support a chip. The pins are disposed on the outer side of the base island and include a first pin segment, a second pin segment, and a third pin segment. The first pin segment is connected to the frame body, the second pin segment is connected to the first pin segment, the second pin segment is inclined toward one side of the first pin segment, the third pin segment is connected to the second pin segment, and a bent portion is provided at the end of the third pin segment away from the second pin segment.

2. The lead frame according to claim 1, characterized in that, The first foot segment is perpendicularly connected to the frame body.

3. The lead frame according to claim 2, characterized in that, The second foot segment has a protrusion on the side away from the base island.

4. The lead frame according to claim 3, characterized in that, The third leg segment is arranged parallel to the first leg segment, and a recess is provided on the side of the third leg segment away from the base island, so that the recess and the end face of the third leg segment form the bent portion.

5. The lead frame according to claim 4, characterized in that, The second foot segment is connected to the first foot segment by a rising part, which is located on the side of the second foot segment and the first foot segment closer to the base island.

6. The lead frame according to claim 1, characterized in that, The base island has a rectangular structure, and the pins are located on the left and right sides of the base island and corresponding to the four corners of the base island. The pins on the same side are arranged opposite each other.

7. The lead frame according to claim 6, characterized in that, The four corners of the base island are provided with inclined surfaces, which are arranged parallel to the second foot segment.

8. The lead frame according to claim 7, characterized in that, The base island is provided with lugs, which are located between the pins on the same side.

9. The lead frame according to claim 6, characterized in that, The frame body is provided with connecting ribs, which are located below the base island and connected to the base island.

10. The lead frame according to claim 6, characterized in that, Both the pins and the base island have a metal plating layer on their surfaces.

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