Composite surge suppressor with planar packaging structure
By connecting TVS and TSS transistors in parallel in a planar package structure, the problems of complex packaging processes and insufficient heat dissipation in traditional packaging are solved, achieving effective protection and surge suppression of semiconductor devices, and improving product reliability and heat dissipation performance.
Patent Information
- Application Number
- CN202422955522.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-02
AI Technical Summary
Existing technologies are insufficient to effectively protect semiconductor devices from electrostatic discharge, electrical fast transient pulses, and lightning surges, and traditional packaging processes are complex and have insufficient heat dissipation performance.
A planar packaging structure is adopted, in which TVS diodes and TSS diodes are connected in parallel, taking advantage of their complementary characteristics, and are jointly packaged by them through a simple planar packaging technology to form a composite surge suppressor, which simplifies the soldering process and improves reliability and heat dissipation.
It achieves effective protection for semiconductor devices, simplifies the soldering process, improves product reliability and heat dissipation performance, enhances surge suppression, and reduces circuit interference.
Smart Images
Figure CN223666038U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of suppressor, concretely relates to a composite surge suppressor of plane packaging structure. BACKGROUND
[0002] The transient interference commonly said includes static electricity discharge, electric fast transient pulse group, and the surge of thunderbolt. "Static electricity discharge" simulates the instantaneous discharge of the accumulated charge when the objects rub each other in the nature, especially the static electricity discharge of human body; "Electric fast transient pulse group" simulates a series of pulse interference produced when the mechanical switch switches the inductive load in the circuit; "Surge of thunderbolt" simulates the waveform induced by the thunderbolt on the power line or communication line. Because the application scene is different, the simulated waveform is also different, the energy of the surge of thunderbolt is the largest, and the energy of the other two is very small, but no matter which kind of electric transient can easily make the semiconductor device produce breakdown and endanger the normal work of other circuits. SUMMARY
[0003] The utility model discloses a composite surge suppressor of plane packaging structure, solves above technical problem: utilize plane group welding mode, according to the size of chip, can select on the basis of not changing the present patch rectifier bridge packaging technology, and TVS and TSS are combined and sealed, and this packaging technology is simple, and the operability is good, and the reliability and heat dissipation are all promoted.
[0004] The utility model discloses a composite surge suppressor of plane packaging structure, solves above technical problem: utilize plane group welding mode, according to the size of chip, can select on the basis of not changing the present patch rectifier bridge packaging technology, and TVS and TSS are combined and sealed, and this packaging technology is simple, and the operability is good, and the reliability and heat dissipation are all promoted.
[0005] A composite surge suppressor of plane packaging structure, including wiring terminal one, resistance, TVS pipe, TSS pipe, wiring terminal two, diode, protected device, the output of wiring terminal one is connected with the input of resistance, the output of resistance is connected with TVS pipe, TSS pipe in parallel, TVS pipe, TSS pipe are connected with protected device after parallel connection;
[0006] The output of TVS pipe, TSS pipe is connected with wiring terminal two, diode after parallel connection, and the diode is also connected with the protected device.
[0007] As a further scheme of the utility model: the TVS pipe and TSS pipe structure are same, and all include shell and the inside setting upper frame, chip, jump piece and lower frame, the lower frame is connected with chip on point gum, and the lower frame is connected with the upper frame through the jump piece, and four pin structures are formed to the shell outside.
[0008] As a further scheme of the utility model: the upper frame and lower frame are Z type structure.
[0009] As a further scheme of the utility model: the shell is formed by epoxy resin glue through mold injection.
[0010] The utility model discloses the beneficial effect:
[0011] The utility model discloses utilize the characteristic complementation of semiconductor device TVS and TSS, and use simple plane package structure to complete composite package, improve product reliability and heat dissipation capacity. Be favorable to solve the combination use on the surge suppression circuit, reduce the welding frequency, improve the layout of PCB layout. The composite tube formed after combination forms the combination type energy absorption to the absorption of surge and the protection of rear circuit, better protects the rear circuit.
[0012] The utility model discloses mature packaging technology, high yield. Reduce the welding frequency of client application;Make the protection circuit more simple, and the inhibition effect of surge is better, and the interference is smaller. DRAWINGS
[0013] The utility model will be further described below in combination with the drawings.
[0014] Figure 1 It is the circuit schematic diagram of the utility model;
[0015] Figure 2 It is the overall structure schematic diagram of diode of the utility model;
[0016] Figure 3 It is the internal structure schematic diagram of diode of the utility model;
[0017] Figure 4 It is the TVS pipe absorption effect schematic diagram of the utility model;
[0018] Figure 5 It is the TSS pipe absorption effect schematic diagram of the utility model.
[0019] In the drawing: 1, terminal one;2, resistance;3, TVS pipe;4, TSS pipe;5, terminal two;6, diode;7, protected device;31, shell;32, upper frame;33, chip;34, jump sheet;35, lower frame. SPECIFIC IMPLEMENTATION
[0020] The technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment, and obviously, the described embodiment only is a part of the embodiment of the utility model, not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making the creative labor belong to the range of the utility model protection.
[0021] Please refer to Figures 1-5As shown, the utility model is a kind of composite surge suppressor of plane packaging structure, including terminal one 1, resistance 2, TVS tube 3, TSS tube 4, terminal two 5, diode 6, protected device 7, the output of terminal one 1 is connected with the input of resistance 2, the output of resistance 2 is connected with TVS tube 3, TSS tube 4 in parallel, TVS tube 3, TSS tube 4 are connected with protected device 7 after being connected in parallel;
[0022] The packaging type of TVS tube and TSS tube is similar. But the absorption effect of both has certain difference. TVS tube, full name silicon transient voltage absorption diode; TSS is voltage switch type transient suppression diode, or called conductor discharge tube, solid discharge tube. The difference of anti-interference ability of both can be directly seen from the name, and similarly, the absorption effect can be simply understood as Figure 4 And Figure 5 Compared with varistor and gas discharge tube, silicon transient voltage absorption diode has better clamping effect on surge voltage, and the corresponding speed is the fastest, which can reach ps level. TVS tube is used for protecting circuit, so that the circuit composed of integrated circuit, MOS tube, hybrid circuit and other semiconductor devices is protected from the harm of transient interference such as electrostatic, inductive load switching, lightning induced voltage. Its nonlinear characteristic is better than that of varistor, and the voltage rises more slowly for the increased current; but its through-flow is small. The working principle of solid discharge tube is similar to that of gas discharge tube, and is different from that of clamping type absorption device.
[0023] The characteristics of semiconductor devices TVS and TSS are complementary, and the composite packaging is completed by using simple plane packaging structure, so as to improve product reliability and heat dissipation capacity. It is beneficial to solve the combination use in surge suppression circuit, reduce the welding times, and improve the layout of PCB layout. The composite tube formed after combination can form combined energy absorption for surge absorption and protection of the subsequent circuit, and better protect the subsequent circuit.
[0024] The output of TVS tube 3 and TSS tube 4 is connected with terminal two 5 and diode 6 in parallel, and the diode 6 is also connected with protected device 7.
[0025] The TVS tube 3 and TSS tube 4 are the same structure, which includes shell 31, upper frame 32, chip 33, jumpers 34 and lower frame 35 arranged in the shell 31, the chip 33 is connected to the lower frame 35 by glue, the lower frame 35 is connected with the upper frame 32 through the jumpers 34, and four pin structures are formed outside the shell 31. The upper frame 32 and the lower frame 35 are Z-shaped structures. The shell 31 is formed by epoxy resin glue through mold injection.
[0026] The processing steps of TVS tube 3 and TSS tube 4 are as follows:
[0027] First, first in the frame on the glue after die bonding (solid TSS or TVS chip), and then the chip on the top of the glue, put the jumpers 34 into the soldering furnace welding integration;
[0028] Second, using epoxy resin glue by mold injection forming black protection;
[0029] Third, the external pin plating particle;
[0030] Fourth, after testing, the appearance inspection package.
[0031] The above embodiment of the present application is described in detail, but the content is only the preferred embodiment of the present application, and cannot be considered to limit the scope of the present application. Any equivalent changes and improvements made within the scope of the present application should still belong to the patent coverage of the present application.
Claims
1. A composite surge suppressor with a planar encapsulation structure, characterized in that, The application relates to a protection circuit, which comprises a first connecting terminal (1), a resistor (2), a TVS tube (3), a TSS tube (4), a second connecting terminal (5), a diode (6) and a protected device (7), the output end of the first connecting terminal (1) is connected with the input end of the resistor (2), the output end of the resistor (2) is connected in parallel with the TVS tube (3) and the TSS tube (4), the TVS tube (3) and the TSS tube (4) are further connected with the protected device (7) after being connected in parallel; the output ends of the TVS tube (3) and the TSS tube (4) are respectively connected with the second connecting terminal (5) and the diode (6) after being connected in parallel, and the diode (6) is further connected with the protected device (7).
2. A composite surge suppressor for a planar package structure according to claim 1, wherein The TVS tube (3) and the TSS tube (4) are of the same structure and comprise an outer shell (31), an upper frame (32), a chip (33), a jump piece (34) and a lower frame (35) arranged in the outer shell (31), the chip (33) is connected with the lower frame (35) through glue-dropping, the lower frame (35) is connected with the upper frame (32) through the jump piece (34), and four pin structures are formed by extending outward from the outer shell (31).
3. A composite surge suppressor for a planar package structure according to claim 2, wherein The upper frame (32) and the lower frame (35) are both Z-shaped structures.
4. The composite surge suppressor of claim 2, wherein the plurality of metal-oxide varistors are arranged in a planar configuration. The outer shell (31) is formed by epoxy resin glue through mold injection.