Ceramic substrate pre-plated with gold and tin

Abstract

The utility model discloses a pre-gold-tin-plated ceramic substrate, and relates to the field of ceramic substrates, the pre-gold-tin-plated ceramic substrate comprises a fixed plate and a ceramic substrate, four corners of the fixed plate are provided with positioning grooves, four corners of the ceramic substrate are provided with positioning plug-ins, the middle position of the inner wall of the fixed plate is provided with a lower supporting plate, and the upper part of the lower supporting plate is provided with a first inclined surface; an upper supporting plate is installed on the lower portion of the ceramic substrate, a second inclined face is arranged on the lower portion of the upper supporting plate, connecting parts are further installed at the four corners of the ceramic substrate, connecting blocks are installed at the four corners of the inner side of the fixing plate, screw holes are formed in the connecting blocks, screws are installed on the connecting parts, and the lower portions of the screws are connected with the inner sides of the screw holes. According to the invention, the second inclined surface on the upper supporting plate and the first inclined surface on the lower supporting plate are in contact with each other, so that the central position of the ceramic substrate corresponds to the central position of the fixing plate, and the four corners of the ceramic substrate are fixed through screws and screw holes, thereby achieving the purpose of convenient installation.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of ceramic substrates, in particular to a pre-plated gold-tin ceramic substrate. BACKGROUND

[0002] The ceramic substrate refers to a special process board in which a copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperature. The prepared ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can be etched into various patterns like a PCB board, has great current-carrying capacity, and thus has become a basic material for power electronic circuit structure technology and interconnection technology.

[0003] At present, when the ceramic substrate is installed, it is fixed by small screws, but in the actual installation process, because the installation hole on the ceramic substrate and the screw hole on the fixed plate are small, it is not easy to make the installation hole and the screw hole correspond to each other, and it is inconvenient to install, and the ceramic substrate may be damaged during installation, which is not conducive to improving the overall installation efficiency. CONTENT OF THE UTILITY MODEL

[0004] In order to solve the problem that the installation hole on the ceramic substrate and the screw hole on the fixed plate are small, it is not easy to make the installation hole and the screw hole correspond to each other, and it is inconvenient to install, the present application provides a pre-plated gold-tin ceramic substrate.

[0005] The pre-plated gold-tin ceramic substrate provided by the present application adopts the following technical scheme:

[0006] The pre-plated gold-tin ceramic substrate provided by the present application adopts the following technical scheme:

[0007] By adopting the above technical scheme, the center position of the ceramic substrate and the center position of the fixed plate can be corresponded by the second inclined surface on the upper support plate and the first inclined surface on the lower support plate contacting each other, and then the center position of the ceramic substrate is fixed by the center screw and the center fixing cylinder.

[0008] Preferably, the positions of the positioning slot and the positioning insert are arranged in an upper-lower corresponding manner, the sizes of the positioning slot and the positioning insert are adapted to each other, and the positioning insert is located inside the positioning slot.

[0009] By adopting the above technical solution, the positions of the positioning plug and the positioning groove on the ceramic substrate are aligned vertically, and the ceramic substrate is moved vertically downwards so that the positioning plug gradually enters the interior of the positioning groove, thereby positioning the ceramic substrate for installation.

[0010] Preferably, the lower support plate and the upper support plate are positioned vertically correspondingly, the first inclined surface and the second inclined surface have the same inclination angle, and the first inclined surface and the second inclined surface are in contact with each other.

[0011] By adopting the above technical solution, the center position of the ceramic substrate can be made to correspond with the center position of the fixing plate by the contact between the second inclined surface on the upper support plate and the first inclined surface on the lower support plate.

[0012] Preferably, a central fixing cylinder is installed in the middle of the inner side of the fixing plate, a central screw is installed in the middle of the ceramic substrate, and the lower part of the central screw is connected to the central fixing cylinder.

[0013] By adopting the above technical solution, the positions of the positioning plug and the positioning groove on the ceramic substrate are aligned vertically. The ceramic substrate is moved vertically downward, so that the positioning plug gradually enters the interior of the positioning groove. The center position of the ceramic substrate is fixed by the center screw and the center fixing cylinder.

[0014] Preferably, the lower part of the lower support plate is equipped with heat sinks, there are four groups of heat sinks, and there are gaps between the heat sinks for air circulation.

[0015] By adopting the above technical solution, heat is dispersed to multiple heat sinks and into the air, which can improve the service life of the ceramic substrate.

[0016] Preferably, flow grooves are formed at opposite ends on the ceramic substrate, and the flow grooves are located at two sets of heat sinks.

[0017] By adopting the above technical solution, air can be quickly circulated between the ceramic substrate and the fixing plate through the oppositely arranged flow channels, carrying away the heat dispersed by the heat sink.

[0018] Preferably, the lower support plate and the upper support plate are made of aluminum alloy.

[0019] By adopting the above technical solution, the generated heat is conducted through the lower and upper support plates made of aluminum alloy, and the heat is dispersed to multiple heat sinks and then into the air.

[0020] In summary, this application includes at least one of the following beneficial technical effects:

[0021] 1. This application moves the ceramic substrate vertically downward, allowing the positioning plug to gradually enter the positioning groove. At this time, the upper support plate at the bottom of the ceramic substrate gradually approaches the lower support plate. The second inclined surface on the upper support plate and the first inclined surface on the lower support plate come into contact with each other, so that the center position of the ceramic substrate corresponds to the center position of the fixing plate. The center position of the ceramic substrate is fixed by the center screw and the center fixing cylinder, and the four corner positions of the ceramic substrate are fixed by the screws and screw holes, thereby achieving the purpose of convenient installation.

[0022] 2. This application uses an aluminum alloy lower support plate and an upper support plate to conduct the generated heat, dispersing the heat to multiple heat sinks and into the air. Then, through the oppositely arranged flow channels, the air can quickly flow between the ceramic substrate and the fixed plate, carrying away the heat dispersed by the heat sinks and improving the overall heat dissipation effect. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of a pre-plated gold-tin ceramic substrate according to an embodiment of this application;

[0024] Figure 2 This is a schematic diagram illustrating the inner structure of the fixing plate, which is the main feature of this application embodiment;

[0025] Figure 3 This is a schematic diagram illustrating the lower structure of the ceramic substrate, as shown in the embodiments of this application.

[0026] Figure 4 This is a schematic diagram illustrating the disassembled structure of the fixing plate and the ceramic substrate, which is the main embodiment of this application.

[0027] Reference numerals: 1. Fixing plate; 2. Ceramic substrate; 3. Positioning groove; 4. Positioning plug; 5. Lower support plate; 6. First inclined surface; 7. Upper support plate; 8. Second inclined surface; 9. Connecting part; 10. Connecting block; 11. Screw hole; 12. Screw; 13. Central fixing cylinder; 14. Central screw; 15. Heat sink; 16. Flow groove. Detailed Implementation

[0028] The following is in conjunction with the appendix Figures 1-4 This application will be described in further detail.

[0029] This application discloses a pre-plated gold-tin ceramic substrate, including a fixing plate 1 and a ceramic substrate 2. Positioning grooves 3 are formed at the four corners of the fixing plate 1, and positioning inserts 4 are installed at the four corners of the ceramic substrate 2. The positioning inserts 4 on the ceramic substrate 2 are aligned vertically with the positioning grooves 3. The ceramic substrate 2 is then moved vertically downwards, causing the positioning inserts 4 to gradually enter the positioning grooves 3, thus positioning the ceramic substrate. A lower support plate 5 is installed in the middle of the inner wall of the fixing plate 1, and a first inclined surface 6 is formed on the upper part of the lower support plate 5. An upper support plate 7 is installed on the lower part of the ceramic substrate 2. The lower part of the upper support plate 7 is provided with a second inclined surface 8. The second inclined surface 8 on the upper support plate 7 and the first inclined surface 6 on the lower support plate 5 are in contact with each other, so that the center position of the ceramic substrate 2 corresponds to the center position of the fixing plate 1. Connecting parts 9 are also installed at the four corners of the ceramic substrate 2. Connecting blocks 10 are installed at the four corners of the inner side of the fixing plate 1. Screw holes 11 are provided on the connecting blocks 10. Screws 12 are installed on the connecting parts 9. The lower part of the screws 12 is connected to the inner side of the screw holes 11. The four corners of the ceramic substrate 2 can be fixed by the screws 12 and the screw holes 11.

[0030] Please refer to Figure 2 and Figure 3 The positioning groove 3 and the positioning plug 4 are positioned vertically correspondingly, and their sizes are compatible. The positioning plug 4 is located inside the positioning groove 3. The lower support plate 5 and the upper support plate 7 are positioned vertically correspondingly. The first inclined surface 6 and the second inclined surface 8 have the same inclination angle and are in close contact with each other. A central fixing cylinder 13 is installed in the middle of the inner side of the fixing plate 1. A central screw 14 is installed in the middle of the ceramic substrate 2. The lower part of the central screw 14 is connected to the central fixing cylinder 13. The positioning plug 4 on the ceramic substrate 2 is positioned vertically corresponding to the positioning groove 3. The ceramic substrate 2 is moved vertically downward so that the positioning plug 4 gradually enters the interior of the positioning groove 3. The center position of the ceramic substrate 2 is fixed by the central screw 14 and the central fixing cylinder 13. The four corner positions of the ceramic substrate 2 are fixed by the screw 12 and the screw hole 11.

[0031] Please refer to Figure 1 , Figure 2 and Figure 4 The lower support plate 5 is equipped with four sets of heat sinks 15, and there are gaps between the heat sinks 15 for air circulation. The ceramic substrate 2 has flow grooves 16 at opposite ends, and the flow grooves 16 are located at two of the sets of heat sinks 15. The lower support plate 5 and the upper support plate 7 are made of aluminum alloy. The heat generated is conducted through the lower support plate 5 and the upper support plate 7 made of aluminum alloy, and the heat is dispersed to the multiple sets of heat sinks 15 and dispersed into the air. Then, through the opposite flow grooves 16, the air can quickly flow between the ceramic substrate 2 and the fixed plate 1, and take away the heat dispersed by the heat sinks 15.

[0032] The implementation principle of a pre-plated gold-tin ceramic substrate according to an embodiment of this application is as follows: When installing the ceramic substrate 2, first align the positions of the positioning plug 4 and the positioning groove 3 on the ceramic substrate 2 vertically downwards, so that the positioning plug 4 gradually enters the interior of the positioning groove 3. At this time, the upper support plate 7 at the bottom of the ceramic substrate 2 gradually approaches the lower support plate 5. Through the contact between the second inclined surface 8 on the upper support plate 7 and the first inclined surface 6 on the lower support plate 5, the center position of the ceramic substrate 2 can be aligned with the center position of the fixing plate 1. Then, the center position of the ceramic substrate 2 is fixed by the center screw 14 and the center fixing cylinder 13, and the four corner positions of the ceramic substrate 2 are fixed by the screw 12 and the screw hole 11. During the use of the ceramic substrate 2, the heat generated is conducted through the lower support plate 5 and the upper support plate 7 made of aluminum alloy, and the heat is dispersed to multiple sets of heat sinks 15 and dispersed into the air. Then, through the oppositely arranged flow grooves 16, the air can quickly flow between the ceramic substrate 2 and the fixing plate 1, carrying away the heat dispersed by the heat sinks 15 and improving the overall heat dissipation effect.

[0033] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A pre-plated gold-tin ceramic substrate, characterized in that: The system includes a fixing plate (1) and a ceramic substrate (2). The fixing plate (1) has positioning grooves (3) at its four corners. The ceramic substrate (2) has positioning plugs (4) at its four corners. The fixing plate (1) has a lower support plate (5) at the middle of its inner wall. The lower support plate (5) has a first inclined surface (6) at its upper part. The ceramic substrate (2) has an upper support plate (7) at its lower part. The upper support plate (7) has a second inclined surface (8) at its lower part. The ceramic substrate (2) also has connecting parts (9) at its four corners. The fixing plate (1) has connecting blocks (10) at its inner four corners. The connecting blocks (10) have screw holes (11) at their respective corners. The connecting parts (9) have screws (12) installed on their respective corners. The lower part of the screws (12) is connected to the inner side of the screw holes (11).

2. The pre-plated gold-tin ceramic substrate according to claim 1, characterized in that: The positioning slot (3) and the positioning plug (4) are positioned vertically and correspondingly, and the sizes of the positioning slot (3) and the positioning plug (4) are compatible. The positioning plug (4) is located inside the positioning slot (3).

3. The pre-plated gold-tin ceramic substrate according to claim 2, characterized in that: The lower support plate (5) and the upper support plate (7) are positioned vertically corresponding to each other. The first inclined surface (6) and the second inclined surface (8) have the same inclination angle and are in close contact with each other.

4. A pre-plated gold-tin ceramic substrate according to claim 3, characterized in that: A central fixing cylinder (13) is installed in the middle of the inner side of the fixing plate (1), and a central screw (14) is installed in the middle of the ceramic substrate (2). The lower part of the central screw (14) is connected to the central fixing cylinder (13).

5. A pre-plated gold-tin ceramic substrate according to claim 1, characterized in that: The lower support plate (5) is equipped with heat sinks (15) at its lower part. There are four sets of heat sinks (15), and there are gaps for air circulation between the heat sinks (15).

6. A pre-plated gold-tin ceramic substrate according to claim 5, characterized in that: The ceramic substrate (2) has flow grooves (16) at opposite ends, and the flow grooves (16) are located at two sets of heat sinks (15).

7. A pre-plated gold-tin ceramic substrate according to claim 6, characterized in that: The lower support plate (5) and the upper support plate (7) are made of aluminum alloy.

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