Novel gold-plated wire structure

Abstract

The utility model discloses a novel gold-plated lead structure, which comprises a printed board substrate, four first gold-plated leads, two second gold-plated leads and a bonding pad, the two second gold-plated leads are crosswise fixed in the center of the printed board substrate, the width of the first gold-plated leads is larger than that of the second gold-plated leads, and the bonding pad is arranged between the first gold-plated leads and the second gold-plated leads. The four first gold-plated wires are respectively fixed at one ends of the second gold-plated wires, and the bonding pads are fixed at the other ends of the first gold-plated wires. When the pattern transfer film exposure negative film is manufactured, the width of the wire at the intersection of the two gold-plated wires is reduced, so that the etching area at the intersection of the wires can be effectively reduced in the subsequent etching process, incomplete etching caused by overlarge etching area is avoided, the etching at the intersection of the wires is ensured to be clean, and the etching quality of the wires is improved. The printed circuit board improves the aesthetic property of the printed circuit board and the stability of signal transmission, and through the design of reducing the width of the gold-plated lead, the etching speed at the crossing part of the lead is relatively consistent with that at other parts, so that the etching speed is accelerated.

Description

Technical Field

[0001] This utility model belongs to the field of printed circuit board (PCB) manufacturing technology, and specifically relates to a novel gold-plated conductor structure. Background Technology

[0002] With the development of electronic information technology, the requirements for signal transmission in high-frequency microwave printed circuit boards (PCBs) are increasingly stringent. Minimizing signal loss during transmission through conductors is crucial, as signal transmission efficiency directly impacts the overall performance of electronic devices. However, during PCB manufacturing, a certain degree of roughness is unavoidable on the surface of signal lines. Greater roughness leads to increased signal loss due to the skin effect. To reduce signal loss, gold plating is a common surface treatment method. Gold plating results in a smooth surface, effectively reducing the risk of copper oxidation and thus minimizing signal loss. Especially in PCB gold plating, conductor plating achieves a three-sided gold-plated effect and is therefore widely used. When the gold plating thickness of the pads reaches a certain standard, they can also be used as bonding pads for gold wire bonding. However, in practice, after gold plating, excess gold-plated conductors need to be removed by chemical etching. The conventional approach is to etch the conductors to their original width, but during etching, especially at conductor intersections, the large etching area can lead to incomplete etching, resulting in copper residue at the center of the conductor intersection. This problem not only affects the aesthetics of the printed circuit board, but more importantly, it causes instability and increased loss during signal transmission, reducing the overall performance and reliability of the product.

[0003] In the printed circuit board manufacturing process, pattern transfer is a key step used to define the conductive paths and pad locations on the circuit board. This process typically involves using a transparent thin film called a "film" or photomask, on which a black-and-white image of the circuit pattern is printed. Specifically, "making a pattern transfer film exposure film" refers to preparing a precise template for a specific circuit design. This template will be used to transfer the circuit pattern onto the printed circuit board using a photosensitive material (such as a dry film or wet film). Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a new type of gold-plated wire structure, which reduces the etching area at the wire intersection by adopting a narrowing design. This reduces the copper residue problem at the wire intersection.

[0005] To solve the above problems, the technical solution adopted by this utility model is as follows: a novel gold-plated conductor structure, comprising: a printed circuit board substrate, four first gold-plated conductors, two second gold-plated conductors, and a solder pad, wherein the two second gold-plated conductors are cross-fixed at the center of the printed circuit board substrate, the width of the first gold-plated conductors is greater than the width of the second gold-plated conductors, the four first gold-plated conductors are respectively fixed to one end of the second gold-plated conductors, and the solder pad is fixed to the other end of the first gold-plated conductors.

[0006] Compared with existing technologies, the beneficial effects of this invention are as follows: By reducing the width of the wires at the intersection of two gold-plated wires during the fabrication of the pattern transfer film exposure film, the etching area at the wire intersection can be effectively reduced during subsequent etching processes. This avoids the problem of incomplete etching due to an excessively large etching area, ensuring clean etching at the wire intersection, improving the aesthetics of the printed circuit board and the stability of signal transmission. Furthermore, by reducing the width of the gold-plated wires, the etching speed at the wire intersection is made relatively consistent with other parts, which not only solves the problem of copper wire residue but also greatly accelerates the etching speed. Moreover, the smoother and cleaner wire surface helps reduce the negative impact of the skin effect, thereby improving the overall performance and reliability of electronic devices.

[0007] In the above-mentioned gold-plated wire structure, the width of the second gold-plated wire is less than or equal to 1 / 4 of the width of the first gold-plated wire.

[0008] In the above-mentioned gold-plated wire structure, the length of the second gold-plated wire is less than or equal to 0.3 mm.

[0009] In the above-mentioned gold-plated wire structure, the two second gold-plated wires intersect perpendicularly.

[0010] In the above-mentioned gold-plated conductor structure, after the printed circuit board substrate is exposed, etching technology is used to etch the pads, the first gold-plated conductor, and the second gold-plated conductor.

[0011] In the above-mentioned gold-plated wire structure, the first gold-plated wire and the second gold-plated wire are integrally formed.

[0012] In the above-described gold-plated wire structure, the first gold-plated wire and the second gold-plated wire can be movably connected.

[0013] In the above-mentioned gold-plated wire structure, during the gold plating process, the surfaces of the first gold-plated wire and the second gold-plated wire are coated with a dry film or a wet film layer.

[0014] In the above-mentioned gold-plated wire structure, the dry or wet film layer is removed using a stripping solution.

[0015] In the above-mentioned gold-plated wire structure, the solder pads are fixed in the gold plating solution during the gold plating process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the gold-plated wire structure according to an embodiment of the present invention. Figure 1 ;

[0017] Figure 2 This is a schematic diagram of the gold-plated wire structure according to an embodiment of the present invention. Figure 2 ;

[0018] The reference numerals are as follows: 100 pad, 200 first gold-plated conductor, 300 second gold-plated conductor, 400 printed circuit board substrate. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below, with reference to Figures 1 to 2 The present invention provides a novel gold-plated conductor structure, comprising: a printed circuit board substrate 400, four first gold-plated conductors 200, two second gold-plated conductors 300, and a pad 100. The two second gold-plated conductors 300 are cross-fixed at the center of the printed circuit board substrate 400. The width of the first gold-plated conductors 200 is greater than the width of the second gold-plated conductors 300. The four first gold-plated conductors 200 are respectively fixed to one end of the second gold-plated conductors 300, and the pad 100 is fixed to the other end of the first gold-plated conductors 200. By reducing the width of the conductors at the intersection of two gold-plated conductors during the fabrication of the pattern transfer film exposure film, the etching area at the conductor intersection can be effectively reduced during subsequent etching. This avoids incomplete etching due to an excessively large etching area, ensuring clean etching at the conductor intersection, improving the aesthetics of the printed circuit board and the stability of signal transmission. Furthermore, by reducing the width of the gold-plated conductors, the etching speed at the conductor intersection is made relatively consistent with other parts, which not only solves the problem of copper wire residue but also greatly accelerates the etching speed. In addition, the smoother and cleaner conductor surface helps reduce the negative impact of the skin effect, thereby improving the overall performance and reliability of electronic devices.

[0020] Furthermore, the printed circuit board substrate 400 provides support, the first gold-plated conductor 200 and the second gold-plated conductor 300 are used for signal transmission, and the pad 100 serves as a connection point. This gold-plated conductor structure design achieves effective management and optimization of the signal transmission path by setting four wider first gold-plated conductors 200 and two narrower, intersecting and fixed second gold-plated conductors 300 on the printed circuit board substrate 400, along with the pad 100. This design is particularly suitable for applications requiring high-density wiring and precise control of the signal transmission path. The larger first gold-plated conductors 200 provide stronger current carrying capacity, while the narrower second gold-plated conductors 300 reduce the etching area, thereby reducing the risk of incomplete etching, especially at intersection points. In addition, fixing the pad 100 to the other end of the first gold-plated conductor 200 ensures the stability and reliability of signal transmission. Furthermore, this invention does not limit the specific width of the first gold-plated conductor 200 and the second gold-plated conductor 300. Preferably, the width of the second gold-plated conductor 300 is less than or equal to 1 / 4 of the width of the first gold-plated conductor 200. By limiting the width of the second gold-plated conductor 300 to no more than 1 / 4 of the width of the first gold-plated conductor 200, the etching efficiency during the etching process is further optimized. A narrower second gold-plated conductor 300 means a smaller etching area at the intersection, which helps improve the consistency of contact between the etching solution and the copper layer, reducing residue problems caused by uneven etching. Simultaneously, this design also makes the circuit layout more compact, improving space utilization and facilitating higher-density circuit designs. Furthermore, this invention does not limit the lengths of the second gold-plated conductor 300 and the first gold-plated conductor 200; preferably, the length of the second gold-plated conductor 300 is less than or equal to 0.3 mm. Moreover, the two second gold-plated conductors 300 intersect perpendicularly, so the length of a single side of the second gold-plated conductor 300 is less than or equal to 0.15 mm. This design not only helps to reduce the etching area but also effectively reduces potential errors during the etching process. Shorter conductor lengths mean less material needs to be etched away, thereby accelerating the etching speed and reducing the probability of minor defects that may affect circuit performance. Of course, this utility model does not limit the connection method of the first gold-plated wire 200 and the second gold-plated wire 300. Preferably, the first gold-plated wire 200 and the second gold-plated wire 300 are integrally formed. The integrated design eliminates the potential failure risks of connection points, such as breakage or corrosion, and also reduces assembly time and cost. Of course, the first gold-plated wire 200 and the second gold-plated wire 300 can be movably connected in some situations, allowing for greater flexibility. For example, this design can simplify operation when specific parts need to be repaired or replaced. However, in order to maintain good electrical performance and mechanical strength, any movable connection must be carefully designed to ensure long-term reliable operation.

[0021] Furthermore, after exposure, the printed circuit board substrate 400 is etched using etching technology to etch the pads 100, the first gold-plated conductor 200, and the second gold-plated conductor 300. Using post-exposure etching to process the pads 100, the first gold-plated conductor 200, and the second gold-plated conductor 300 ensures that each component is precisely manufactured according to the predetermined design. This method not only improves the product's precision but also enhances its durability and reliability. In this way, all details are perfectly replicated on the printed circuit board, including subtle dimensional variations and shape differences, thus meeting the requirements of high-quality electronic products. Further still, during the gold plating process, a dry film or wet film layer is coated onto the surfaces of the first gold-plated conductor 200 and the second gold-plated conductor 300. The dry film or wet film layer is removed using a stripping solution. Coating the surfaces of the first gold-plated conductor 200 and the second gold-plated conductor 300 with a dry film or wet film layer during the gold plating process protects these areas from unnecessary gold plating treatment, leaving only the pads 100 exposed to receive the gold plating. This method ensures that only the necessary parts are gold-plated, saving precious metal resources and improving process efficiency. Furthermore, selecting an appropriate film layer can prevent chemicals generated during the gold plating process from damaging other circuit components. Removing the dry or wet film layer using a stripping solution is a crucial step that determines the quality and appearance of the final product. An effective stripping process thoroughly removes excess film without damaging the underlying metal surface. This is essential for ensuring the high precision and performance of the circuit board. In addition, selecting a suitable stripping solution can reduce environmental pollution and promote green manufacturing. Further, during the gold plating process, the pads 100 are fixed in the gold plating solution. Fixing the pads 100 in the gold plating solution during the gold plating process ensures that they receive the gold plating treatment evenly, forming a smooth and continuous gold layer. This not only enhances the corrosion resistance and conductivity of the pads 100 but also lays a solid foundation for subsequent soldering or other connection operations. In this way, the reliability and lifespan of the product can be significantly improved.

[0022] It should be noted that in the description of this utility model, any descriptions of orientation, such as up, down, front, back, left, right, etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation of this utility model.

[0023] In the description of this utility model, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is mentioned, it is only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0024] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0025] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A novel gold-plated wire structure, characterized in that, include: The circuit board substrate (400), four first gold-plated conductors (200), two second gold-plated conductors (300), and a pad (100) are provided. The two second gold-plated conductors (300) are cross-fixed at the center of the circuit board substrate (400). The width of the first gold-plated conductors (200) is greater than the width of the second gold-plated conductors (300). The four first gold-plated conductors (200) are respectively fixed to one end of the second gold-plated conductors (300), and the pad (100) is fixed to the other end of the first gold-plated conductors (200).

2. The gold-plated wire structure according to claim 1, characterized in that, The width of the second gold-plated wire (300) is less than or equal to 1 / 4 of the width of the first gold-plated wire (200).

3. The gold-plated wire structure according to claim 1, characterized in that, The length of the second gold-plated conductor (300) is less than or equal to 0.3 mm.

4. The gold-plated wire structure according to claim 1, characterized in that, The two second gold-plated wires (300) intersect perpendicularly.

5. The gold-plated wire structure according to claim 1, characterized in that, After the printed circuit board substrate (400) is exposed, etching technology is used to etch the pads (100), the first gold-plated conductor (200) and the second gold-plated conductor (300).

6. The gold-plated wire structure according to claim 1, characterized in that, The first gold-plated wire (200) and the second gold-plated wire (300) are integrally formed.

7. The gold-plated wire structure according to claim 1, characterized in that, The first gold-plated wire (200) and the second gold-plated wire (300) are movably connected.

8. The gold-plated wire structure according to claim 1, characterized in that, During the gold plating process, the surfaces of the first gold-plated wire (200) and the second gold-plated wire (300) are coated with a dry film or a wet film layer.

9. The gold-plated wire structure according to claim 1, characterized in that, The dry or wet film layer is removed using a stripping solution.

10. The gold-plated wire structure according to claim 1, characterized in that, During the gold plating process, the solder pads (100) are fixed in the gold plating solution.

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