Portable multi-protocol power conversion module

Abstract

A portable multi-protocol power conversion module provided by the present application comprises a substrate, a voltage reduction chip, a digital display screen and an interface, the substrate is connected with the voltage reduction chip through a power line, the digital display screen is installed at the outer end part of the substrate, the voltage reduction chip is connected with the interface through a power line, a heat dissipation assembly is installed below the voltage reduction chip, and the heat dissipation assembly comprises M.2 heat conduction silica gel and a heat dissipation aluminum sheet. The multi-battery input module is novel in structural design and low in manufacturing cost, achieves the purpose of battery input of multiple battery packs, has the purposes of input overvoltage protection, input under-voltage protection, output overcurrent protection, output short-circuit protection and temperature protection, and is small in size, wide in application and suitable for popularization and application. The safety and the stability are good, and the utilization problem of a plurality of battery packs is solved.

Description

Technical Field

[0001] This application relates to the field of power conversion module technology, and in particular to a portable multi-protocol power conversion module. Background Technology

[0002] Lithium-ion batteries are batteries that contain lithium (including metallic lithium, lithium alloys, lithium ions, and lithium polymers) in their electrochemical system. They can be broadly classified into two categories: lithium metal batteries and lithium-ion batteries. Lithium metal batteries are typically non-rechargeable and contain metallic lithium. Lithium-ion batteries do not contain metallic lithium and are rechargeable.

[0003] Multi-cell battery packs are commonly used in applications such as model airplanes and models of cars that require high-capacity batteries. However, these battery packs typically use special interfaces such as XT60 or DC5521, which often renders the batteries idle and unusable for regular or emergency purposes. Furthermore, due to the low frequency of battery use, it is impossible to know the battery level in real time when needed, requiring specialized equipment for testing, resulting in low work efficiency. Therefore, it is necessary to design a portable multi-protocol power conversion module. Summary of the Invention

[0004] This application provides a portable multi-protocol power conversion module to solve the problem in the prior art where the battery is not used frequently, resulting in the inability to know the battery level when needed. It realizes the purpose of multiple battery packs for battery input, and also has the purpose of input overvoltage protection, input undervoltage protection, output overcurrent protection, output short circuit protection, and temperature protection.

[0005] This application provides a portable multi-protocol power conversion module, including a housing, a substrate, a step-down chip, a digital display screen, and an interface; the substrate and the step-down chip are both installed inside the housing, the interface is installed on one side of the housing, and the digital display screen is installed on the upper surface of the housing;

[0006] The substrate is connected to the step-down chip via a power line;

[0007] The step-down chip is connected to the interface via a power line.

[0008] Preferably, the portable multi-protocol power conversion module provided in this application uses the SW3518 substrate.

[0009] Preferably, the portable multi-protocol power conversion module provided in this application uses the MP1593DCDC step-down chip.

[0010] Preferably, the portable multi-protocol power conversion module provided in this application uses an XT60 interface.

[0011] Preferably, in the portable multi-protocol power conversion module provided in this application, the interface is externally heat-sealed using an insulating plastic encapsulation tube.

[0012] Preferably, in the portable multi-protocol power conversion module provided in this application, a heat dissipation component is installed below the step-down chip. The heat dissipation component includes M.2 thermally conductive silicone and a heat sink aluminum plate. The lower surface of the step-down chip is connected to the heat sink aluminum plate through the M.2 thermally conductive silicone.

[0013] Preferably, the portable multi-protocol power conversion module provided in this application has a plurality of heat dissipation holes evenly distributed on the surface of the heat sink aluminum sheet, and a plurality of heat-conducting fins provided on the lower surface of the heat sink aluminum sheet.

[0014] Preferably, in the portable multi-protocol power conversion module provided in this application, the heat-conducting fins adopt a U-shaped structure.

[0015] Preferably, the portable multi-protocol power conversion module provided in this application includes an HQ-LED digital display screen. Beneficial effects

[0016] (1) This utility model has a novel structural design and low manufacturing cost. It achieves the purpose of battery input for multiple battery packs. At the same time, it also has the purpose of input overvoltage protection, input undervoltage protection, output overcurrent protection, output short circuit protection, and temperature protection. It is small in size, has a wide range of uses, and has good safety and stability. It solves the problem of utilizing multiple battery packs.

[0017] (2) In this utility model, a heat dissipation component is also installed below the step-down chip. The heat dissipation component includes M.2 thermal conductive silicone and heat dissipation aluminum sheet. The lower surface of the step-down chip is connected to the heat dissipation aluminum sheet through M.2 thermal conductive silicone. With this structure, the purpose of rapid and uniform heat dissipation can be achieved, and the service life of the step-down chip can be extended.

[0018] The above description is merely an overview of the technical solutions of the embodiments of this application. In order to better understand the technical means of the embodiments of this application and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of this application more obvious and understandable, specific implementation methods of this application are described below. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the installation of the heat dissipation component of this utility model;

[0022] Figure 3 This is a schematic diagram of the heat sink aluminum fin structure of this utility model;

[0023] Explanation of reference numerals in the attached diagram: 1. Substrate; 2. Step-down chip; 3. Digital display screen; 4. Interface; 5. Heat dissipation component; 6. M.2 thermal conductive silicone; 7. Heat dissipation fin; 8. Heat dissipation hole; 9. Heat dissipation fin; 10. Housing. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims and drawings of this application are intended to cover non-exclusive inclusion.

[0026] The term "embodiment" as used herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of the phrase "embodiment" in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of this application. For example, in the description of this application, terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] Furthermore, the descriptions of directions such as the X direction, Y direction, and Z direction used to explain the operation and construction of the components in this embodiment are not absolute but relative. Although these directions are appropriate when the components are in the positions shown in the figure, they should be interpreted differently when these positions change.

[0029] Furthermore, the terms "first," "second," etc., in the specification and claims of this application or in the aforementioned drawings are used to distinguish different objects rather than to describe a specific order, and may explicitly or implicitly include one or more of the features.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, "connection" or "joining" in mechanical structures can refer to a physical connection, such as a fixed connection, for example, a connection fixed by fasteners, such as a connection fixed by screws, bolts, or other fasteners; a physical connection can also be a detachable connection, such as a snap-fit ​​or interlocking connection; a physical connection can also be an integral connection, such as a connection formed by welding, bonding, or integral molding. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0032] Please see Figures 1-2 This application discloses a portable multi-protocol power conversion module, including a housing 10, a substrate 1, a step-down chip 2, a digital display screen 3, and an interface 4; the substrate 1 and the step-down chip 2 are both installed inside the housing 10, the interface 4 is installed on one side of the housing 10, and the digital display screen 3 is installed on the upper surface of the housing 10.

[0033] The substrate 1 is connected to the step-down chip 2 via a power line, and the digital display screen 3 adopts an HQ--LED digital screen;

[0034] The step-down chip 2 is connected to interface 4 via a power line.

[0035] Among them, substrate 1 uses the SW3518, which has multiple protection mechanisms, including input overvoltage protection, input undervoltage protection, output overcurrent protection, and output short circuit protection. It also integrates a thermistor for temperature protection and is equipped with a fuse to ensure safe operation.

[0036] Among them, step-down chip 2 uses the MP1593DCDC step-down chip. This step-down chip has the characteristics of high integration, low power consumption, wide input voltage range and precise voltage regulation capability.

[0037] Interface 4 uses an XT60 interface, and its exterior is heat-sealed with an insulating plastic encapsulation tube. This interface has high temperature resistance and a long service life.

[0038] Furthermore, in this invention, a heat dissipation assembly 5 is installed below the step-down chip 2. The heat dissipation assembly 5 includes M.2 thermally conductive silicone 6 and a heat sink aluminum fin 7. The lower surface of the step-down chip 2 is connected to the heat sink aluminum fin 7 via the M.2 thermally conductive silicone 6. A plurality of heat dissipation holes 8 are evenly distributed on the surface of the heat sink aluminum fin 7, and multiple thermally conductive fins 9 are provided on the lower surface of the heat sink aluminum fin 7. The thermally conductive fins 9 adopt a U-shaped structure, which can improve the uniformity of heat dissipation. In this invention, a heat dissipation assembly is also installed below the step-down chip. The heat dissipation assembly includes M.2 thermally conductive silicone and a heat sink aluminum fin. The lower surface of the step-down chip is connected to the heat sink aluminum fin via M.2 thermally conductive silicone. This structure can achieve rapid and uniform heat dissipation, extending the service life of the step-down chip.

[0039] In summary, this utility model features a novel structural design, low manufacturing cost, and achieves the purpose of battery input for multiple battery packs. It also provides input overvoltage protection, input undervoltage protection, output overcurrent protection, output short circuit protection, and temperature protection. It is small in size, versatile in application, and offers good safety and stability, thus solving the problem of utilizing multiple battery packs.

[0040] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A portable multi-protocol power conversion module, characterized in that, It includes a housing (10), a substrate (1), a step-down chip (2), a digital display screen (3), and an interface (4); the substrate (1) and the step-down chip (2) are both installed inside the housing (10), the interface (4) is installed on one side of the housing (10), and the digital display screen (3) is installed on the upper surface of the housing (10); The substrate (1) is connected to the step-down chip (2) via a power line; The step-down chip (2) is connected to the interface (4) via a power line. A heat dissipation component (5) is also installed below the step-down chip (2). The heat dissipation component (5) includes M.2 thermally conductive silicone (6) and a heat dissipation aluminum sheet (7). The lower surface of the step-down chip (2) is connected to the heat dissipation aluminum sheet (7) through M.2 thermally conductive silicone (6). The surface of the heat dissipation aluminum sheet (7) is evenly distributed with several heat dissipation holes (8), and the lower surface of the heat dissipation aluminum sheet (7) is provided with multiple heat-conducting fins (9).

2. The portable multi-protocol power conversion module according to claim 1, characterized in that, The substrate (1) is of model SW3518.

3. A portable multi-protocol power conversion module according to claim 1, characterized in that, The step-down chip (2) is an MP1593DCDC step-down chip.

4. A portable multi-protocol power conversion module according to claim 1, characterized in that, The interface (4) adopts the XT60 interface.

5. A portable multi-protocol power conversion module according to claim 4, characterized in that, The interface (4) is heat-sealed with an insulating plastic tube.

6. A portable multi-protocol power conversion module according to claim 1, characterized in that, The heat-conducting fins (9) adopt a U-shaped structure.

7. A portable multi-protocol power conversion module according to claim 1, characterized in that, The digital display screen (3) adopts an HQ--LED digital screen.

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