POE power supply

Abstract

The utility model discloses a POE power supply, and relates to a power supply. The POE power supply comprises a first circuit board which is provided with a first side surface and a second side surface which are arranged oppositely, the first side surface is provided with a first heating element, a second heating element and a third heating element, and the second side surface is provided with a first power element; wherein the first heating element and the third heating element are positioned on two sides of the second heating element and are arranged far away from the second heating element; the second circuit board is vertically arranged at the edge position of the first side face of the first circuit board, and a second power element is arranged on the side, away from the third heating element, of the second circuit board. According to the POE power supply provided by the utility model, main heating points and power elements of the POE power supply are arranged dispersedly, and the overall heat dissipation performance of the POE power supply is improved.

Description

Technical Field

[0001] This utility model relates to a power supply, and more particularly, to a PoE power supply. Background Technology

[0002] A 12V and 54V combined PoE (Power over Ethernet) power supply is used to power Ethernet devices. As PoE technology matures, the application scope and number of PoE power supplies are increasing, such as PoE switches, IP cameras, and wireless routers. However, the development, application, and innovation of this technology are mainly focused on PoE terminal device applications, with less emphasis on the upstream of PoE terminal devices, i.e., the design of PoE power supplies.

[0003] However, the most difficult aspect of existing 2-in-1 PoE power supplies is heat management due to their small size and high output power. Therefore, while improving efficiency, heat dissipation must be fully considered.

[0004] This section is intended to provide background or context for the embodiments of the present invention set forth in the claims. The description herein is not an admission that it is prior art simply because it is included in this section. Utility Model Content

[0005] The purpose of this invention is to provide a PoE power supply that can at least solve one of the aforementioned technical problems of current PoE power supplies.

[0006] This utility model embodiment provides a PoE power supply, including: a first circuit board having a first side and a second side disposed opposite to each other, wherein a first heating element, a second heating element and a third heating element are disposed on the first side, and a first power element is disposed on the second side; wherein the first heating element and the third heating element are located on both sides of the second heating element and are disposed away from the second heating element; and a second circuit board, which is vertically disposed at the edge of the first side of the first circuit board, wherein a second power element is disposed on the side of the second circuit board away from the third heating element.

[0007] In some embodiments, the first heating element includes a common-mode inductor, the second heating element includes a first transformer and a second transformer, and the third heating element includes an X capacitor.

[0008] In some embodiments, the common-mode inductor is disposed at a first end of the first side, and the X capacitor is disposed at a second end of the first side.

[0009] In some embodiments, the first power element includes a first main switch, a second main switch, a first MOSFET, and a second MOSFET.

[0010] In some embodiments, the second power element includes a rectifier bridge.

[0011] In some embodiments, the POE power supply further includes a heat sink housing, and the first circuit board, the second circuit board, the first heating element, the second heating element, the third heating element, the first power element, and the second power element are housed inside the heat sink housing; thermally conductive adhesive is provided between the first circuit board, the second circuit board, the first heating element, the second heating element, the third heating element, the first power element, and the second power element and the heat sink housing.

[0012] In some embodiments, the coil of the common mode inductor is wound with flat wire; the first main switch and the second main switch are respectively encapsulated gallium nitride semiconductors; the first MOSFET and the second MOSFET are respectively surface mount packages; the rectifier bridge includes a first bridge rectifier and a second bridge rectifier, the first bridge rectifier and the second bridge rectifier are respectively surface mount packages.

[0013] In some embodiments, the rectifier bridge is connected in series between the common-mode inductor and the X capacitor.

[0014] In some embodiments, the input terminal of the first transformer is electrically connected to the X capacitor, and the output terminal of the first transformer is electrically connected to the first MOSFET; the input terminal of the second transformer is electrically connected to the X capacitor, and the output terminal of the second transformer is electrically connected to the second MOSFET.

[0015] In some embodiments, the first main switch is electrically connected to the X capacitor and the first transformer, respectively, and the second main switch is electrically connected to the X capacitor and the second transformer, respectively.

[0016] The POE power supply provided in this embodiment uses a first circuit board on both sides where components can be placed, which increases the heat dissipation area. The main heat-generating components are dispersed on the first side of the first circuit board, and the main power components are respectively placed on the first side of the first circuit board and on the side of the second circuit board away from the third heat-generating component. This achieves the dispersed placement of the main heat-generating points and power components of the POE power supply, thereby improving the overall heat dissipation performance of the POE power supply. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a POE power supply in a first direction, provided as an embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of a POE power supply in the second direction, provided as an embodiment of the present invention.

[0020] Figure 3 An exploded view of a POE power supply provided for an embodiment of this utility model.

[0021] Figure 4 This is a schematic diagram of the circuit structure of a POE power supply provided for an embodiment of the present invention. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present invention include many changes, modifications, and equivalents.

[0024] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0025] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0026] To address at least one of the aforementioned problems in the prior art, in a first aspect, this utility model provides a PoE power supply, such as... Figure 1and Figure 2 As shown, the PoE power supply 100 includes:

[0027] The first circuit board 1 has a first side 1a and a second side 1b arranged opposite to each other. A first heating element 11, a second heating element 12 and a third heating element 13 are arranged on the first side 1a, and a first power element 14 is arranged on the second side 1b. The first heating element 11 and the third heating element 13 are located on both sides of the second heating element 12 and are arranged away from the second heating element 12.

[0028] The second circuit board 2 is vertically disposed at the edge of the first side 1a of the first circuit board 1, and a second power element 21 is disposed on the side of the second circuit board 2 away from the third heating element 13.

[0029] The POE power supply 100 provided in this embodiment of the utility model uses a first circuit board 1 on both sides where components can be set, which increases the heat dissipation area. The main heat-generating components are dispersed on the first side 1a of the first circuit board 1, and the main power components are respectively set on the first side 1a of the first circuit board 1 and the side of the second circuit board 2 away from the third heat-generating component 13. This realizes the dispersed arrangement of the main heat-generating points and power components of the POE power supply 100, and improves the overall heat dissipation performance of the POE power supply 100.

[0030] like Figure 1 As shown, in some embodiments, the first heating element 11 includes a common-mode inductor 11a, the second heating element 12 includes a first transformer 121 and a second transformer 122, and the third heating element 13 includes an X capacitor 13a. Specifically, the POE power supply 100 provided in this embodiment of the present invention uses a large capacitor (X capacitor 13a) for both sets of output voltages, which is simpler and occupies less area compared to the traditional layout of multiple capacitors.

[0031] like Figure 1 As shown, in some embodiments, the common-mode inductor 11a is disposed at the first end of the first side 1a, and the X capacitor 13a is disposed at the second end of the first side 1a.

[0032] like Figure 2As shown, in some embodiments, the first power element 14 includes a first main switch 141, a second main switch 142, a first MOSFET 143, and a second MOSFET 144. Specifically, the first main switch 141 and the second main switch 142 are power elements, and in terms of layout, they are placed as far away as possible from the first transformer 121 and the second transformer 122. Therefore, in the layout, the first main switch 141 and the second main switch 142 are located on the back side of the first transformer 121 and the second transformer 122. The first MOSFET 143 and the second MOSFET 144 are placed on the second side 1b of the first circuit board 1, away from the heat-generating transformer.

[0033] like Figure 1 As shown, in some embodiments, the second power element 21 includes a rectifier bridge 21a. Specifically, the rectifier bridge 21a is a major heat source, so it should be kept as far away as possible from major heat-generating components such as transformers and inductors.

[0034] like Figure 3 As shown, in some embodiments, the POE power supply 100 further includes a heat sink 3. Figure 1 and Figure 2 The first circuit board 1, the second circuit board 2, the first heating element 11, the second heating element 12, the third heating element 13, the first power element 14, and the second power element 21 shown are housed inside the heat dissipation housing 3; thermally conductive adhesive is provided between the first circuit board 1, the second circuit board 2, the first heating element 11, the second heating element 12, the third heating element 13, the first power element 14, and the second power element 21 and the heat dissipation housing 3.

[0035] Specifically, the heat dissipation housing 3 may include an aluminum shield 31. The entire structure only requires applying thermally conductive adhesive to the aluminum shield 31 for heat dissipation; alternatively, potting adhesive can be used. This reduces costs compared to traditional copper heat sinks. A power supply housing 32 may also be installed on the outside of the aluminum shield 31. The bottom of the housing 32 may be raised by adding ribs, which can effectively reduce the temperature of the housing 32.

[0036] like Figure 1 and Figure 2 As shown, in some embodiments, the coil of the common-mode inductor 11a is wound with flat wire; the first main switch 141 and the second main switch 142 are respectively encapsulated gallium nitride semiconductors; the first MOSFET 143 and the second MOSFET 144 are respectively surface-mount packaged; the rectifier bridge 21a includes a first bridge rectifier 211 and a second bridge rectifier 212, the first bridge rectifier 211 and the second bridge rectifier 212 are respectively surface-mount packaged.

[0037] For example, the first transformer 121 and the second transformer 122 can be ATQ21 transformers, which are small in size, do not interfere with each other's output voltages, have better heat dissipation for the two output power outputs, and have a better effect on EMI adjustment. The common mode inductor 11a is used to suppress EMI (Electromagnetic Interference). The common mode inductor 11a is a flat wire inductor, which is relatively small in size. In addition, the wire diameter is flat copper wire, which has a large heat dissipation area, which is more conducive to heat dissipation and has better performance in suppressing EMI.

[0038] Traditional main switching transistors (MOS) use the TO-252 package. This package requires a large heat dissipation area, which takes up a lot of space and is not conducive to miniaturization design. In this embodiment, the first main switching transistor 141 and the second main switching transistor 142 are encapsulated GaN (gallium nitride) semiconductors, which can achieve multi-point heat dissipation and effectively increase the heat dissipation area. In addition, the on-resistance of encapsulated GaN semiconductors is as low as 270mΩ, which can better reduce conduction losses.

[0039] The first MOSFET 143 can be used for 12V output rectification and adopts a SOP-8 surface mount package. This makes the first MOSFET 143 small in size, large in heat dissipation area, and low in on-resistance as low as 12mΩ. Therefore, the first MOSFET 143 also has low loss under high current output.

[0040] The second MOSFET 144 can be used for output rectification of a 54V output voltage and is packaged in a TO-252 surface mount package. This results in a small size for the second MOSFET 144 and a large internal chip area, which increases the heat dissipation area.

[0041] The rectifier bridge 21a can be made of two 4A / 1000V surface mount packages; this allows for better and more uniform heat dissipation compared to a single surface mount bridge rectifier, effectively increasing the heat dissipation area. The rectifier bridge 21a is a major heat source in the PoE power supply 100 and should be kept as far away as possible from other major heat-generating components, such as the first transformer 121, the second transformer 122, and the common mode inductor 11a.

[0042] To better understand the PoE power supply provided in this embodiment, the electrical connection relationships of each component in this utility model embodiment will be described in detail below.

[0043] like Figure 4 As shown, in some embodiments, the rectifier bridge 21a is connected in series between the common-mode inductor 11a and the X capacitor 13a.

[0044] like Figure 4As shown, in some embodiments, the input terminal of the first transformer 121 is electrically connected to the X capacitor 13a, and the output terminal of the first transformer 121 is electrically connected to the first MOSFET 143; the input terminal of the second transformer 122 is electrically connected to the X capacitor 13a, and the output terminal of the second transformer 122 is electrically connected to the second MOSFET 144.

[0045] like Figure 4 As shown, in some embodiments, the first main switch 141 is electrically connected to the X capacitor 13a and the first transformer 121, respectively, and the second main switch 142 is electrically connected to the X capacitor 13a and the second transformer 122, respectively.

[0046] like Figure 4 As shown, the PoE power supply 100 may further include a first output filter capacitor 41, a first output filter inductor 42, and a first output port 43 connected in series. The input terminal of the common-mode inductor 11a is configured to receive AC input, and the first output port 43 is configured to output a first voltage. Specifically, the first output port 43 may be a DC (direct current) socket. The first voltage may be 12V, and the current output by the first output port 43 may be 2.9A. The PoE power supply 100 may further include a first sampling feedback circuit 44, a first optocoupler 45, and a first pulse width modulation integrated circuit 46 connected in series. The input terminal of the first sampling feedback circuit 44 is connected to the output terminal of the first output filter inductor 42, and the first pulse width modulation integrated circuit 46 is also connected to the first main switch 141.

[0047] like Figure 4 As shown, the PoE power supply 100 may further include a second output filter capacitor 51, a second output filter inductor 52, a network transformer 53, and a second output port 54 connected in series. The second output port 54 may be an RJ45 network port or a local area network (LAN) interface. The output terminal of the second output filter inductor 52 is configured to output a second voltage, which may be 54V. The current output by the second output port 54 may be 0.56A. The PoE power supply 100 may further include a second sampling feedback circuit 55, a second optocoupler 56, and a second pulse width modulation integrated circuit 57 connected in series. The input terminal of the second sampling feedback circuit 55 is connected to the output terminal of the second output filter inductor 52, and the second pulse width modulation integrated circuit 57 is also connected to the second main switch 142.

[0048] It should be understood that since the above-mentioned components and circuits of the POE power supply 100 provided in this embodiment of the present invention can be existing products, after the above-mentioned circuit connection relationship is given in this embodiment, those skilled in the art are able to electrically connect the above-mentioned components and circuits to obtain the POE power supply 100 proposed in this embodiment of the present invention.

[0049] The PoE power supply 100 provided in this embodiment is a two-in-one PoE power supply product. Both output voltages share a large capacitor (X capacitor 13a). The area occupied from the AC input to the X capacitor 13a is small, resulting in a simpler layout and smaller footprint compared to traditional PoE power supplies with multiple X capacitors. The second output port 54 can be an RJ45 network port, providing a second voltage for powering a switch. The first output port 43 outputs the first voltage, which can power a router. This design is smaller than a solution with two RJ45 network ports. Furthermore, the PoE power supply 100 has a wide input voltage range of 100-240Vac, suitable for most regions globally, and a maximum output power of 65W. It also has a wide range of applications, compatible with traditional PoE power supply devices.

[0050] In some embodiments, the encapsulated GaN semiconductor, which serves as the first main switch 141, and the first pulse width modulation integrated circuit 46 may be encapsulated and integrated together; similarly, the encapsulated GaN semiconductor, which serves as the second switching device 22, and the second pulse width modulation integrated circuit 57 may be encapsulated and integrated together.

[0051] like Figures 1 to 3 As shown, the PoE power supply 100 provided in this embodiment of the present invention can power a switch using only one RJ45 network port as a PoE port, and can also power a router via a DC output. Compared to solutions with two RJ45 network ports, this design is significantly smaller. Furthermore, employing encapsulated gallium nitride technology, it can condense the power of a traditional 65W PoE power supply into a compact, palm-sized form factor of only 110*55*35mm. Compared to commonly available 65W adapters, the PoE power supply product provided in this embodiment is one-third the size of its predecessor, and boasts a power density of up to 1W / cm³. 3 Weighing approximately 200g, it is more convenient to carry. Furthermore, the PoE power supply 100 provided in this embodiment has a wide input voltage range of 100-240Vac, suitable for input voltages in most parts of the world, and an output power of up to 65W. Therefore, the PoE power supply 100 provided in this embodiment has a wide range of applications and can be used with traditional PoE power supply devices.

[0052] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terms "upper," "lower," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0053] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In the description of this specification, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments in this specification. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0054] This utility model uses specific embodiments to illustrate the principle and implementation of the utility model. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the utility model. Therefore, the content of this specification should not be construed as a limitation of the utility model.

Claims

1. A PoE power supply, characterized in that, include: A first circuit board has a first side and a second side arranged opposite to each other. A first heating element, a second heating element and a third heating element are arranged on the first side, and a first power element is arranged on the second side. The first heating element and the third heating element are located on both sides of the second heating element and are arranged away from the second heating element. The second circuit board is vertically disposed at the edge of the first side of the first circuit board, and a second power element is disposed on the side of the second circuit board away from the third heating element.

2. The PoE power supply according to claim 1, characterized in that, The first heating element includes a common-mode inductor, the second heating element includes a first transformer and a second transformer, and the third heating element includes an X capacitor.

3. The PoE power supply according to claim 2, characterized in that, The common-mode inductor is disposed at the first end of the first side, and the X capacitor is disposed at the second end of the first side.

4. The PoE power supply according to claim 2 or 3, characterized in that, The first power element includes a first main switch transistor, a second main switch transistor, a first MOSFET, and a second MOSFET.

5. The PoE power supply according to claim 4, characterized in that, The second power element includes a rectifier bridge.

6. The PoE power supply according to claim 5, characterized in that, The POE power supply also includes a heat sink housing, and the first circuit board, the second circuit board, the first heating element, the second heating element, the third heating element, the first power element, and the second power element are housed inside the heat sink housing; thermally conductive adhesive is provided between the first circuit board, the second circuit board, the first heating element, the second heating element, the third heating element, the first power element, and the second power element and the heat sink housing.

7. The PoE power supply according to claim 6, characterized in that, The coil of the common mode inductor is made of flat wire. The first main switch and the second main switch are both made of encapsulated gallium nitride semiconductors. The first MOSFET and the second MOSFET are respectively surface-mount packages; The rectifier bridge rectifier includes a first bridge rectifier and a second bridge rectifier, and the first bridge rectifier and the second bridge rectifier are respectively surface-mount packaged.

8. The PoE power supply according to claim 6, characterized in that, The rectifier bridge is connected in series between the common-mode inductor and the X capacitor.

9. The PoE power supply according to claim 8, characterized in that, The input terminal of the first transformer is electrically connected to the X capacitor, and the output terminal of the first transformer is electrically connected to the first MOSFET. The input terminal of the second transformer is electrically connected to the X capacitor, and the output terminal of the second transformer is electrically connected to the second MOSFET.

10. The PoE power supply according to claim 9, characterized in that, The first main switch is electrically connected to the X capacitor and the first transformer, respectively, and the second main switch is electrically connected to the X capacitor and the second transformer, respectively.

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