COB (Chip On Board) packaged LED (Light Emitting Diode) structure

Abstract

The utility model belongs to the technical field of LEDs, and provides a COB packaged LED structure and an integrated packaging device. Comprising a substrate, an LED chip, a conductive connecting part, a box dam and a conductive connecting wire, the box dam is arranged on the substrate and forms a die bonding area with the substrate, and the LED chip and the conductive connecting part are arranged in the die bonding area; the number of the conductive connecting parts is more than two, groove parts used for placing the LED chips are formed between the adjacent conductive connecting parts, and the LED chips in the same groove part are connected through conductive connecting wires and are distributed in the same direction; and the conductive connecting wire is also used for connecting the LED chip with the conductive connecting part and the box dam. By electrically connecting the conductive connecting wire with the conductive connecting part and the substrate, due to the arrangement of the conductive connecting part, the LED chips can be ensured to face the same direction, the process of reversing the LED chips is reduced, and the die bonding production efficiency of COB products can be effectively improved; and meanwhile, the groove part formed by the conductive connecting part is arranged on the substrate, so that convenience can be provided for dispensing of double-color-temperature products.

Description

TECHNICAL FIELD

[0001] The utility model belongs to LED technical field, specifically related to a COB package's LED structure. BACKGROUND

[0002] COB is a kind of packaging technology, it will be multiple LED chip directly mounted on substrate, form a kind of integrated light source.This technology is widely used in lighting, display and other need high efficiency output application, with high integration, strong reliability and other characteristics.But COB product generally contains multiple LED chip, when first line homochiral chip reaches certain quantity, in order to the reliability of subsequent wire bonding process, the LED chip of secondary line needs to be reversed and then reflow soldering operation is carried out, but this method can greatly reduce the reflow soldering efficiency.Otherwise, wire bonding needs to use relatively long conductive connecting wire, so process and reliability quality are difficult to guarantee.For example, see Figure 1 , currently, the reflow soldering production operation method of COB product is that when first line chip reaches certain quantity, secondary line chip needs to be reversed and then reflow soldering operation is carried out, for reflow soldering equipment, need to increase the action of reversing LED chip, so as to cause the problem of greatly reducing reflow soldering efficiency described above.Or adopt bridge chip as the support point of secondary wire bonding to avoid using too long conductive connecting wire, but this method will increase the adhesion step of bridge chip and substrate, and cannot effectively improve the reflow soldering efficiency.

[0003] Therefore, it is particularly important to design an effective COB package LED structure. CONTENT OF THE UTILITY MODEL

[0004] In order to overcome the above-mentioned shortcomings of prior art, the purpose of the utility model is to provide a COB package LED structure, to solve the problems existing in prior art.

[0005] The technical scheme adopted by the utility model to solve its technical problems is:

[0006] A COB package LED structure, comprising:

[0007] Substrate, LED chip, conductive connecting part, dam and conductive connecting wire;

[0008] The dam is arranged on the substrate and forms a reflow soldering area with the substrate, and the LED chip and the conductive connecting part are arranged in the reflow soldering area;

[0009] The number of conductive connecting parts is two or more, and a groove part for placing the LED chip is formed between adjacent conductive connecting parts, and the LED chips in the same groove part are connected by the conductive connecting wire and are distributed in the same direction;

[0010] The conductive connecting wire is also used to connect the LED chip with the conductive connecting part and the dam.

[0011] Preferably, the shape of the die bonding area is circular.

[0012] Preferably, the plurality of conductive connecting parts are symmetrically arranged along the center line of the radial end of the die bonding area.

[0013] Preferably, the LED chips in the same groove part are uniformly arranged, and the orientations of the LED chips in the adjacent groove parts are consistent.

[0014] Preferably, the conductive connecting part comprises a plating layer, an ink layer, a copper foil layer, a BT layer and a glue layer arranged from top to bottom, and the glue layer is arranged on the substrate, and the plating layer is used to connect the conductive connecting wire.

[0015] Preferably, the conductive connecting part comprises a long strip stop edge, and the two ends of the long strip stop edge are provided with connecting ends for connecting the conductive connecting wire.

[0016] Preferably, it further comprises a first layer of encapsulating glue, and the first layer of encapsulating glue is arranged on the groove part and covers the LED chip.

[0017] Preferably, it further comprises a second layer of encapsulating glue, and the second layer of encapsulating glue is arranged on the die bonding area and covers the first layer of encapsulating glue and the LED chip.

[0018] Preferably, the first layer of encapsulating glue and the second layer of encapsulating glue comprise fluorescent powder and silica gel.

[0019] Compared with the prior art, the beneficial effects of the present application include:

[0020] The applied LED structure is provided with a plurality of conductive connecting parts on the substrate, and the groove part for placing the LED chip is formed between the adjacent conductive connecting parts. Because the LED chips in the same groove part are distributed in the same direction, and the orientations of the LED chips in the adjacent groove parts can be kept consistent, the above structure is electrically connected with the conductive connecting part and the substrate through the conductive connecting wire. Thanks to the arrangement of the conductive connecting part, the orientations of the LED chips can be guaranteed to be in the same direction, the process of reversing the LED chip is reduced, and the die bonding production efficiency of the COB product can be effectively improved. At the same time, the groove part formed by the conductive connecting part on the substrate can also provide convenience for the dispensing of the double-color temperature product. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0022] Figure 1 It is the LED structure of the prior art.

[0023] Figure 2 The first structure schematic view of embodiment 1 of the utility model.

[0024] Figure 3 The second structure schematic view of embodiment 1 of the utility model.

[0025] Figure 4 The structure schematic view of embodiment 2 of the utility model.

[0026] Figure 5 The structure schematic view of embodiment 3 of the utility model.

[0027] Wherein:

[0028] 1-base plate, 2-LED chip, 3-conductive connection part, 301-long strip blocking edge, 302-connection end, 4-dam, 5-conductive connection line, 6-first layer encapsulation glue, 7-second layer encapsulation glue. DETAILED DESCRIPTION

[0029] In order to more clearly understand the above purpose, features and advantages of the utility model, the utility model is described in detail below in combination with the drawings and specific embodiments. It should be explained that the embodiments and the features in the embodiments of the present application can be combined with each other without conflict. In the following description, a lot of specific details are described so as to fully understand the utility model, and the described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor are within the protection scope of the utility model.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terms used in the specification of the utility model herein are only for the purpose of describing the specific embodiments and are not intended to limit the utility model.

[0031] Embodiment:

[0032] With reference to Figures 2 to 5 A COB packaged LED structure, comprising:

[0033] The base plate 1, the LED chip 2, the conductive connection part 3, the dam 4 and the conductive connection line 5;

[0034] The dam 4 is arranged on the base plate 1 and forms a die bonding area with the base plate 1, and the LED chip 2 and the conductive connection part 3 are arranged in the die bonding area;

[0035] There are two or more conductive connection parts 3, and a groove for placing LED chip 2 is formed between adjacent conductive connection parts 3. The LED chips 2 in the same groove are connected by conductive connection lines 5 and are distributed in the same direction.

[0036] The conductive connecting wire 5 is also used to connect the LED chip 2 to the conductive connecting part 3 and the dam 4.

[0037] In this embodiment, the LED structure has a plurality of conductive connection portions 3 on the substrate 1. A groove for placing the LED chip 2 is formed between adjacent conductive connection portions 3. Since the LED chips 2 in the same groove are distributed in the same direction, the orientation of the LED chips 2 in adjacent grooves can be kept consistent. The above structure is electrically connected to the conductive connection portions 3 and the substrate 1 through conductive connection lines 5. Thanks to the setting of conductive connection portions 3, the LED chips 2 can be ensured to face the same direction, reducing the process of reversing the LED chips 2 and effectively improving the die bonding production efficiency of COB products. At the same time, the groove formed by the conductive connection portions 3 on the substrate 1 can also facilitate the dispensing of dual-color temperature products.

[0038] The specific application examples of the structure in this embodiment are as follows:

[0039] Example 1:

[0040] like Figure 2 and Figure 3 As shown, the device includes a substrate 11, a plurality of conductive connection portions 3 and a plurality of LED chips 2 disposed on the substrate 11. A circular die-bonding region is provided on the substrate 11, and a dam 4 is provided around the die-bonding region to enclose it. The conductive connection portions 3 are disposed within the die-bonding region, as shown in the figure. Figure 2 The die-bonding region is divided into an upper half and a lower half along the center line of its radial end. The conductive connection portion 3 in the upper half of the die-bonding region is symmetrically arranged with the conductive connection portion 3 in the lower half of the die-bonding region. The LED chip 2 is disposed in the die-bonding region and is evenly distributed in the groove portion formed by the adjacent conductive connection portion 3. They are distributed in the same direction. Multiple conductive connection lines 5 are used to electrically connect the LED chip 2 to the dam 4 on the substrate 1 and the conductive connection portion 3.

[0041] Figure 2 and Figure 3 The difference is that, Figure 3 A conductive connection portion 3 is provided at the centerline of the radial end of the die-bonding region.

[0042] Example 2:

[0043] The structure can be seen in Figure 4 The structure, in the embodiment Figure 3 Based on the structure, see Figure 4Further comprising a first layer of encapsulation glue 6, the first layer of encapsulation glue 6 is arranged in the groove part and covers the LED chip 2. The structure of the groove part can avoid the problem of overflow of encapsulation glue due to lack of blocking, improve the consistency of dispensing, and improve the light color uniformity.

[0044] Embodiment 3:

[0045] On the basis of the structure of the embodiment Figure 4 , referring to Figure 5 , further comprising a second layer of encapsulation glue 7, the second layer of encapsulation glue 7 is arranged in the die bonding area and covers the first layer of encapsulation glue 6 and the LED chip 2. The above structure can achieve the effect of double color temperature dispensing.

[0046] For the conductive connection part 3 in each of the above embodiments, it comprises a plating layer, an ink layer, a copper foil layer, a BT layer and a glue layer arranged from top to bottom, the glue layer is arranged on the substrate 1, and the plating layer is used to connect the conductive connection wire 5.

[0047] Meanwhile, the conductive connection part 3 comprises a long strip stop edge 301, both ends of the long strip stop edge 301 are provided with a connecting end 302, the connecting end 302 is used to connect the conductive connection wire 5, and the above structure facilitates the connection with the conductive connection wire 5 at the LED chip 2, and ensures the consistency of the orientation.

[0048] Meanwhile, the first layer of encapsulation glue 6 and the second layer of encapsulation glue 7 comprise fluorescent powder and silica gel.

[0049] In summary, the present application can ensure that the LED chip 2 is oriented in the same direction, reduces the process of reversing the LED chip 2, and can effectively improve the die bonding production efficiency of the COB product. Meanwhile, the groove part formed by the conductive connection part 3 arranged on the substrate 1 can also facilitate the dispensing of double color temperature products.

[0050] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Therefore, any modification, equivalent change and modification of the above embodiment according to the technical essence of the present application, which does not deviate from the technical solution content of the present application, still belongs to the scope of the technical solution of the present application.

Claims

1. A COB packaged LED structure, characterized in that, The application relates to a substrate, LED chip, conductive connecting part, dam and conductive connecting line. The dam is arranged on the substrate and forms a die bonding area with the substrate, the LED chip and the conductive connecting part are arranged in the die bonding area; The number of the conductive connecting parts is two or more, the adjacent conductive connecting parts form a groove part for placing the LED chip, the LED chips in the same groove part are connected by the conductive connecting line and are distributed in the same direction; The conductive connecting line is also used for connecting the LED chip with the conductive connecting part and the dam. The shape of the die bonding area is circular.

2. The COB packaged LED structure according to claim 1, characterized in that, The conductive connecting parts are symmetrically arranged along the middle line of the radial end of the die bonding area.

3. The COB packaged LED structure according to claim 2, characterized in that, The LED chips in the same groove part are evenly arranged, and the directions of the LED chips in the adjacent groove parts are consistent.

4. The COB packaged LED structure according to claim 1, characterized in that, The conductive connecting part comprises a plating layer, an ink layer, a copper foil layer, a BT layer and a glue layer arranged from top to bottom, the glue layer is arranged on the substrate, and the plating layer is used for connecting the conductive connecting line.

5. The COB packaged LED structure according to claim 1, characterized in that, The conductive connecting part comprises a long strip stop edge, two ends of the long strip stop edge are provided with connecting ends, and the connecting ends are used for connecting the conductive connecting line.

6. The COB packaged LED structure according to claim 1, characterized in that, The application further comprises a first layer of encapsulating glue, and the first layer of encapsulating glue is arranged on the groove part and covers the LED chip.

7. The COB packaged LED structure according to claim 1, characterized in that, The application further comprises a second layer of encapsulating glue, and the second layer of encapsulating glue is arranged on the die bonding area and covers the first layer of encapsulating glue and the LED chip.

8. The COB packaged LED structure according to claim 7, characterized in that, The first layer of encapsulating glue and the second layer of encapsulating glue comprise fluorescent powder and silica gel.

9. The COB packaged LED structure according to claim 8, characterized in that, ​

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