Flexible photovoltaic packaging conductive film and flexible perovskite photovoltaic module

Abstract

The utility model relates to the technical field of photovoltaic packaging, and specifically discloses a flexible photovoltaic packaging conductive film and a flexible perovskite photovoltaic assembly. The flexible photovoltaic packaging conductive film comprises a weather-proof layer, a base material layer, a barrier layer and a transparent conductive layer which are sequentially laminated, wherein the transparent conductive layer is used for being in contact with a photovoltaic cell; the transparent conducting layer comprises a flexible conducting metal layer and a ZnO conducting layer, the ZnO conducting layer is arranged on the side, close to the photovoltaic cell, of the flexible photovoltaic packaging conducting film, and the flexible conducting metal layer is arranged between the blocking layer and the ZnO conducting layer; the ZnO conductive layer is a doped conductive ZnO film, a non-doped conductive ZnO film or a composite film material formed by stacking the doped conductive ZnO film and the non-doped conductive ZnO film. The flexible photovoltaic packaging conductive film has the comprehensive properties of weather resistance, high water and oxygen barrier property, low cost, good flexibility, high transmittance, high conductivity, good stability in long-term outdoor use and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to photovoltaic packaging technical field, concretely relates to a kind of flexible photovoltaic packaging conductive film and flexible perovskite photovoltaic module. BACKGROUND

[0002] Among many renewable energy sources, solar energy, as a widely available and easily accessible renewable energy source, is considered one of the most valuable clean energy sources. There are many ways to use solar energy to generate electricity, among which the most widely used method is to directly convert light energy into electricity through photovoltaic effect. Currently, rigid solar cells represented by crystalline silicon cells have achieved good practical results. However, crystalline silicon solar cells require a relatively thick active layer (typically about 180 microns for commercial crystalline silicon cells) to achieve saturated absorption of light due to their indirect bandgap semiconductors, and their active layer itself has strong rigidity, making it difficult to withstand small radius bending and other forms of deformation. The third generation of solar cells represented by perovskite photovoltaic cells (PSCs) has shown a rapid upward trend in energy conversion efficiency under the efforts of researchers. Researchers have only used ten years to increase the cell energy conversion efficiency (PCE) of PSCs from the initial 3.8% to more than 25%.

[0003] With the continuous deepening of the research on perovskite photovoltaic cells, researchers have found that for the actual use of photovoltaic modules, efficient packaging technology is also one of the important links to ensure the service life of the photovoltaic modules. Since the perovskite active layer contains lead elements harmful to the environment, effective packaging is not only important for prolonging the service life of PSCs photovoltaic modules, but also plays an irreplaceable role in preventing lead leakage from damaging the environment.

[0004] The prior art, such as the patent publication CN107225827A, discloses a substrate material which can be used to realize the packaging of photoelectric devices such as liquid crystal displays, thin-film solar cells, OLED display panels and touch screens, and which comprises a base material, a barrier layer, a transparent conductive layer and a weather-resistant layer. The barrier layer can effectively block the erosion of external environment such as water and oxygen to the device, and meanwhile, the weather-resistant layer can effectively ensure the aging resistance of the substrate material by being attached or coated. The transparent conductive layer realizes good conductive performance of the substrate material. However, the transparent conductive layer of the existing substrate material is an ITO conductive film or a graphene conductive film or a nano-silver wire conductive film. The ITO conductive film has low transmittance in the visible light band, high cost and great brittleness, and is not suitable for use in flexible perovskite photovoltaic modules. The preparation process of the graphene conductive film is complex and the production cost is high. Although the nano-silver wire conductive film has excellent conductive performance and flexibility, the cost of the nano-silver wire conductive film is high and silver migration is prone to occur, resulting in poor long-term use stability of the nano-silver wire conductive film. Therefore, the existing substrate material is difficult to balance the comprehensive performance of low cost, good flexibility, high transmittance, high conductive performance and good long-term use stability. Utility model content

[0005] The utility model discloses a flexible photovoltaic packaging conductive film and flexible perovskite photovoltaic module which overcome the defects of the prior art.

[0006] Based on this, the utility model discloses a kind of flexible photovoltaic packaging conductive film, including weather-resistant layer, substrate layer, barrier layer and transparent conductive layer for contacting photovoltaic cell which are sequentially laminated;

[0007] The transparent conductive layer includes a flexible conductive metal layer and a ZnO conductive layer. The ZnO conductive layer is disposed on the side of the flexible photovoltaic packaging conductive film close to the photovoltaic cell, and the flexible conductive metal layer is disposed between the barrier layer and the ZnO conductive layer. The ZnO conductive layer is a doped conductive ZnO film, an undoped conductive ZnO film, or a composite film formed by stacking a doped conductive ZnO film and an undoped conductive ZnO film.

[0008] Preferably, the doped conductive ZnO film is a single film material formed by one of a fluorine-doped conductive ZnO film, a gallium-doped conductive ZnO film, and an aluminum-doped conductive ZnO film, or a composite film material formed by stacking multiple films. The thickness of the single-layer conductive ZnO film is 10-300 nm.

[0009] Further preferably, the ZnO conductive layer is a fluorine-doped conductive ZnO film with a thickness of 75-150 nm.

[0010] Further preferably, the flexible conductive metal layer is a metal film, nanowire, or metal mesh with a material of copper, silver, or aluminum.

[0011] More preferably, the flexible conductive metal layer is nanosilver wire, and the length of the nanosilver wire is 40-100 μm.

[0012] Preferably, the barrier layer comprises a top protective coating, a plating layer and a bottom protective coating which are sequentially stacked; the bottom protective coating is arranged between the plating layer and the substrate layer, and the top protective coating is arranged between the plating layer and the flexible conductive metal layer.

[0013] The plating layer is a single film material formed by one of silicon nitride plating, aluminum oxide plating, zinc oxide plating, silicon oxide plating, titanium oxide plating and yttrium fluoride plating, or a composite film material formed by stacking multiple plating films; the thickness of the single plating film is 10-300 nm.

[0014] More preferably, the top protective coating and the bottom protective coating are both polyurethane coatings with a thickness of 2-10 μm; and the plating layer is a silicon oxide plating film with a thickness of 20-200 nm.

[0015] Preferably, the weather-resistant layer is a polyester weather-resistant coating, an acrylic resin weather-resistant coating or a fluorine-containing polyurethane cured coating; the thickness of the weather-resistant layer is 1-30 μm.

[0016] Preferably, the substrate layer is a single film material formed by one of polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, polyethylene film, polypropylene film and polyamide film, or a composite film material formed by stacking multiple films; the thickness of the substrate layer is 25-350 μm.

[0017] The utility model discloses a kind of flexible perovskite photovoltaic modules, it includes perovskite photovoltaic cell and encapsulation conductive film;The encapsulation conductive film is a kind of flexible photovoltaic encapsulation conductive film described in the utility model content above.

[0018] Compared with the prior art, the utility model at least includes following beneficial effects:

[0019] The flexible photovoltaic packaging conductive film has weather resistance, high water-oxygen barrier property and conductive performance by laminating the weather resistance layer on one surface of the substrate layer and laminating the barrier layer and the transparent conductive layer on the other surface of the substrate layer in sequence.

[0020] The flexible photovoltaic packaging conductive film is especially suitable for being applied to the flexible perovskite photovoltaic module, can solve the water vapor sensitive characteristics of the perovskite itself, can effectively improve the stability and reliability of the flexible perovskite photovoltaic module for long-term outdoor use, is helpful to improve the power generation efficiency of the flexible perovskite photovoltaic module, and can reduce the cost. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a cross-sectional structure schematic view of a flexible photovoltaic packaging conductive film of the embodiment.

[0022] Figure 2 It is a cross-sectional structure schematic view of a barrier layer in a flexible photovoltaic packaging conductive film of the embodiment.

[0023] Corresponding parts are indicated by the same reference numerals in the drawings. DETAILED DESCRIPTION

[0024] In order to make the above objectives, characteristics and advantages of the utility model more apparent and easily understood, the utility model will be further explained in detail below with the drawings and specific implementation manners.

[0025] EMBODIMENT

[0026] The flexible photovoltaic packaging conductive film of the embodiment, referring to Figure 1, including weather-resistant layer 1, substrate layer 2, barrier layer 3 and transparent conductive layer 4 arranged in sequence. Among them, the weather-resistant layer 1 is arranged on the side away from the photovoltaic cell, and the transparent conductive layer 4 is arranged on the side close to the photovoltaic cell. Moreover, the transparent conductive layer 4 includes a flexible conductive metal layer 41 and a ZnO conductive layer 42, the ZnO conductive layer 42 is arranged on the side close to the photovoltaic cell of the flexible photovoltaic packaging conductive film, and the flexible conductive metal layer 41 is arranged between the barrier layer 3 and the ZnO conductive layer 42, and the ZnO conductive layer 42 is electrically connected to the photovoltaic cell, and the flexible conductive metal layer 41 and the ZnO conductive layer 42 are also electrically connected, to ensure better current transmission.

[0027] In practice, the flexible photovoltaic packaging conductive film is a transparent flexible photovoltaic packaging conductive film, to ensure that external sunlight can pass through the flexible photovoltaic packaging conductive film to reach the photovoltaic cell, so as to be absorbed and utilized by the photovoltaic cell, and then the photovoltaic cell converts light energy into electrical energy for external power equipment.

[0028] Among them, the weather-resistant layer 1 is a polyester weather-resistant coating, an acrylic resin weather-resistant coating or a fluorine-containing polyurethane curing coating; the thickness of the weather-resistant layer 1 is 1-30μm. The weather-resistant layer 1 is mainly used to improve the weather resistance, ultraviolet resistance and aging resistance of the flexible photovoltaic packaging conductive film, to ensure that the flexible photovoltaic packaging conductive film can be used in complex outdoor environment for a long time.

[0029] Specifically, the weather-resistant layer 1 is preferably a fluorine-containing polyurethane curing coating, and the thickness of the weather-resistant layer 1 is preferably 10-20μm (such as 10μm, 12μm, 15μm, 18μm or 20μm).

[0030] Among them, the substrate layer 2 is a transparent flexible film material with supporting effect; the thickness of the substrate layer 2 is 25-350μm.

[0031] In practice, the substrate layer 2 can be a single film material or a composite film material. When the substrate layer 2 is a single film material, the single film material is a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polyethylene film, a polypropylene film or a polyamide film. For example, the substrate layer 2 is a polyethylene terephthalate film.

[0032] When the substrate layer 2 is a composite film material, the composite film material is at least two of the polyethylene terephthalate film, the polybutylene terephthalate film, the polyethylene naphthalate film, the polyethylene film, the polypropylene film and the polyamide film stacked to form. For example, the substrate layer 2 is a composite film material formed by stacking a polyethylene film, a polyethylene terephthalate film and a polyethylene film in sequence.

[0033] In one example of this embodiment, the substrate layer 2 is preferably a transparent polyethylene terephthalate film, and the thickness of the substrate layer 2 is preferably 150-300μm (such as 150μm, 200μm, 250μm or 300μm) to ensure that it has good flexibility, light transmittance and support function.

[0034] Among them, see Figures 1-2 The barrier layer 3 includes a base protective layer 31, a coating layer 32, and a top protective layer 33 stacked sequentially (e.g., ...). Figure 2 (As shown). The base coat protective layer 31 is disposed between the substrate layer 2 and the coating layer 32, while the top coat protective layer 33 is disposed between the coating layer 32 and the flexible conductive metal layer 41. The coating layer 32 is mainly used to improve the water vapor barrier performance of the flexible photovoltaic encapsulation conductive film; while the addition of the top coat protective layer 33 and the base coat protective layer 31 can further improve the overall barrier performance of the barrier layer 3, and also improve the adhesion between the layers to prevent delamination during long-term use, thereby improving the overall barrier durability of the barrier layer 3, and thus improving the stability and reliability of the flexible photovoltaic encapsulation conductive film for long-term outdoor use.

[0035] In practice, the coating layer 32 can be prepared using deposition methods such as magnetron sputtering, plasma-enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), and atomic layer deposition (ALD). The coating layer 32 can be a single film material or a composite film material. When the coating layer 32 is a single film material, the single film material can be a silicon nitride coating, an aluminum oxide coating, a zinc oxide coating, a silicon oxide coating, a titanium oxide coating, or a yttrium fluoride coating. For example, the coating layer 32 is a silicon nitride coating. In this case, the thickness of the coating layer 32 is 10-300 nm, preferably 20-200 nm (e.g., 20 nm, 50 nm, 100 nm, 150 nm, or 200 nm).

[0036] When the coating layer 32 is a composite film material, the composite film material is formed by stacking at least two of the following coatings: silicon nitride coating, aluminum oxide coating, zinc oxide coating, silicon oxide coating, titanium oxide coating, and yttrium fluoride coating. For example, the coating layer 32 is a composite film material formed by sequentially stacking silicon nitride coating and silicon oxide coating. In this case, the thickness of a single coating layer is 10-300 nm (preferably 20-200 nm); that is, in this composite film material, the thickness of the silicon nitride coating is preferably 20-200 nm, and the thickness of the silicon oxide coating is also preferably 20-200 nm; therefore, the thickness of the coating layer 32 is the sum of the thickness of the silicon nitride coating and the thickness of the silicon oxide coating.

[0037] In one example of the embodiment, the coating layer 32 is preferably a 20-200 nm thick silicon oxide coating layer prepared by PECVD method; and the surface protective layer 33 and the bottom protective layer 31 are both preferably polyurethane coating layers, and the thickness of the surface protective layer 33 and the bottom protective layer 31 is preferably 2-10 μm (e.g., 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm).

[0038] The ZnO conductive layer 42 is a doped conductive ZnO film, a non-doped conductive ZnO film, or a composite film formed by stacking a doped conductive ZnO film and a non-doped conductive ZnO film. The perovskite photovoltaic cell has a requirement for the work function of the conductive layer, and the work function can be adjusted by element doping to suppress the loss of photoelectric conversion energy at the upper and lower interfaces of the perovskite photovoltaic device (e.g., a perovskite photovoltaic module), and better meet the requirements of the conductive layer and packaging of the perovskite photovoltaic device.

[0039] Specifically, the doped conductive ZnO film can be a single film or a composite film. When the doped conductive ZnO film is a single film, the single film is a fluorine-doped conductive ZnO film, a gallium-doped conductive ZnO film, or an aluminum-doped conductive ZnO film. For example, the doped conductive ZnO film is a fluorine-doped conductive ZnO film. In this case, the thickness of the doped conductive ZnO film is 10-300 nm.

[0040] When the doped conductive ZnO film is a composite film, the composite film is formed by stacking at least two of a fluorine-doped conductive ZnO film, a gallium-doped conductive ZnO film, and an aluminum-doped conductive ZnO film. For example, the doped conductive ZnO film is a composite film formed by stacking a fluorine-doped conductive ZnO film and a gallium-doped conductive ZnO film in sequence. In this case, the thickness of a single conductive ZnO film is 10-300 nm; that is, in the composite film, the thickness of the fluorine-doped conductive ZnO film is 10-300 nm, and the thickness of the gallium-doped conductive ZnO film is also 10-300 nm; therefore, the thickness of the doped conductive ZnO film is the sum of the thickness of the fluorine-doped conductive ZnO film and the thickness of the gallium-doped conductive ZnO film.

[0041] Further, the flexible conductive metal layer 41 is a metal film, nanowire, or metal mesh; and the material of the flexible conductive metal layer 41 is copper, silver, or aluminum.

[0042] In one example of the embodiment, the ZnO conductive layer 42 is preferably a fluorine-doped conductive ZnO film formed by pulsed laser deposition, and the thickness of the ZnO conductive layer 42 is preferably 75-150 nm (e.g., 75 nm, 85 nm, 95 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, or 150 nm); and the flexible conductive metal layer 41 is preferably nano-silver wire, and the length of the nano-silver wire is preferably 40-100 μm (e.g., 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm).

[0043] The flexible conductive metal layer 41 can provide the transparent conductive layer 4 with better flexibility, transmittance, and conductivity, and the flexible conductive metal layer 41 can also use low-cost metal materials (e.g., copper, aluminum) to reduce costs; and the use amount of the flexible conductive metal layer 41 can be further reduced by the use of the ZnO conductive layer 42, thereby further reducing costs. The ZnO conductive layer 42 can provide the transparent conductive layer 4 with excellent light transmittance and electrical properties, and the ZnO conductive layer 42 has high chemical stability and good heat resistance, and is particularly suitable for use in harsh environments, thereby improving the stability and reliability of the transparent conductive layer 4 for long-term outdoor use.

[0044] In summary, the flexible photovoltaic packaging conductive film of the embodiment has the weather-resistant layer 1 stacked on one surface of the substrate layer 2, and has the barrier layer 3 and the transparent conductive layer 4 stacked in sequence on the other surface of the substrate layer 2, and the transparent conductive layer 4 is combined with the flexible conductive metal layer 41 and the ZnO conductive layer 42, so that the flexible photovoltaic packaging conductive film has the comprehensive properties of weather resistance, high water vapor barrier property, low cost, good flexibility, high transmittance, high conductivity, and good stability for long-term use; the flexible photovoltaic packaging conductive film is particularly suitable for use in flexible perovskite photovoltaic modules, can solve the water vapor sensitivity of perovskite itself, can effectively improve the stability and reliability of the flexible perovskite photovoltaic module for long-term outdoor use, can help to improve the power generation efficiency of the flexible perovskite photovoltaic module, and can reduce costs.

[0045] The flexible photovoltaic packaging conductive film of the embodiment meets the requirements of FPSCs for water and oxygen barrier, and meets the requirements of FPSCs for the work function of the conductive layer, the water vapor transmittance of the flexible photovoltaic packaging conductive film is <0.01 g / (m 2 *d) (infrared method), the light transmittance is ≥90% (400-1100 waveband), and the resistivity is at least 6.6×10-5Ω·cm. Compared with conventional ITO / FTO type conductive materials, the flexible photovoltaic packaging conductive film of the embodiment has small resistivity, improved barrier property, better stability for long-term use, and lower cost, and is more suitable for use as a flexible packaging of a perovskite photovoltaic cell.

[0046] The embodiment also discloses a flexible perovskite photovoltaic module, which comprises a perovskite photovoltaic cell and a packaging conductive film; the packaging conductive film is the flexible photovoltaic packaging conductive film described in the embodiment.

[0047] Although the preferred embodiments of the present application have been described, those skilled in the art can make further changes and modifications to the embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to cover all changes and modifications falling within the scope of the present application.

[0048] The above describes the technical solutions provided by the present application in detail, and the principles and implementation manners of the present application are described by applying specific examples; the above embodiment descriptions are only used to help understand the method and core idea of the present application; meanwhile, for those skilled in the art, the specific implementation manners and application ranges can be changed according to the idea of the present application; in conclusion, the content of the present application should not be understood as a limitation.

Claims

1. A flexible photovoltaic encapsulant conductive film, characterized by, The transparent conductive layer comprises a flexible conductive metal layer and a ZnO conductive layer, the ZnO conductive layer is arranged on the side of the flexible photovoltaic encapsulation conductive film close to the photovoltaic cell, and the flexible conductive metal layer is arranged between the barrier layer and the ZnO conductive layer; the ZnO conductive layer is a doped conductive ZnO film, an undoped conductive ZnO film, or a composite film formed by stacking the doped conductive ZnO film and the undoped conductive ZnO film. The doped conductive ZnO film is a single film material formed by one of fluorine-doped conductive ZnO film, gallium-doped conductive ZnO film, and aluminum-doped conductive ZnO film, or a composite film material formed by stacking multiple films.

2. The flexible photovoltaic encapsulant conductive film of claim 1, wherein, The thickness of the single-layer conductive ZnO film is 10-300 nm. The ZnO conductive layer is a fluorine-doped conductive ZnO film, and the thickness is 75-150 nm.

3. The flexible photovoltaic encapsulant conductive film of claim 2, wherein, The flexible conductive metal layer is a metal film, nanowire, or metal mesh, and the material is copper, silver, or aluminum.

4. The flexible photovoltaic encapsulated conductive film according to any one of claims 1-3, wherein, The flexible conductive metal layer is nanosilver wire, and the length of the nanosilver wire is 40-100 μm.

5. The flexible photovoltaic encapsulated conductive film of claim 4, wherein, The barrier layer comprises a top protective coating, a plating film, and a bottom protective coating arranged in sequence; the bottom protective coating is arranged between the plating film and the substrate layer, and the top protective coating is arranged between the plating film and the flexible conductive metal layer.

6. The flexible photovoltaic encapsulant conductive film of claim 1, wherein, The plating film is a single film material formed by one of silicon nitride plating film, aluminum oxide plating film, zinc oxide plating film, silicon oxide plating film, titanium oxide plating film, and yttrium fluoride plating film, or a composite film material formed by stacking multiple plating films, and the thickness of the single-layer plating film is 10-300 nm. The top protective coating and the bottom protective coating are both polyurethane coatings with a thickness of 2-10 μm, and the plating film is a silicon oxide plating film with a thickness of 20-200 nm.

7. The flexible photovoltaic encapsulated conductive film of claim 6, wherein, The weather-resistant layer is a polyester weather-resistant coating, an acrylic resin weather-resistant coating, or a fluorine-containing polyurethane cured coating, and the thickness of the weather-resistant layer is 1-30 μm.

8. The flexible photovoltaic encapsulant conductive film of claim 1, wherein, The substrate layer is a single film material formed by one of polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, polyethylene film, polypropylene film, and polyamide film, or a composite film material formed by stacking multiple films, and the thickness of the substrate layer is 25-350 μm.

9. The flexible photovoltaic encapsulated conductive film of claim 1, wherein, The flexible photovoltaic encapsulation conductive film is any one of the flexible photovoltaic encapsulation conductive films described in claims 1-9.

10. A flexible perovskite photovoltaic module characterized in that, ​

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