Internal glue sealing device for electronic component

Abstract

The utility model relates to the technical field of glue sealing of electronic components, and discloses an internal glue sealing device for electronic components, which comprises an operation box, a U-shaped frame fixedly connected to the top of the operation box, a hydraulic oil cylinder fixedly connected to the top of the U-shaped frame, a fixing frame fixedly connected to the output end of the hydraulic oil cylinder, and a lifting table fixedly connected to the bottom of the fixing frame. The bottom of the lifting table is fixedly connected with a glue spraying head, the bottoms of the two ends of the lifting table are fixedly connected with air nozzles, the two sides of the lifting table are fixedly connected with L-shaped plates, the bottoms of the two L-shaped plates are fixedly connected with first racks, the first racks are in meshed connection with gears, and the two ends of the gears are in meshed connection with second racks. According to the utility model, electronic components can be conveniently positioned, the electronic components can be cleaned, dust is prevented from influencing the adhesion performance of a sealing material and the surfaces of the components, the sealing quality is ensured, the operation is simple, and the overall efficiency of the sealing work can be effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic components glue technology field especially relates to an internal encapsulation device of electronic components. BACKGROUND

[0002] Electronic components are the basic components in electronic circuits, used to realize the functions such as processing, storage, transmission and control of electric signals. They are the basic units of more complex electronic systems (such as circuit boards, electronic equipment, etc.), and are widely used in various fields such as consumer electronics, communication, industrial control, automotive electronics, medical equipment, etc. Their types and characteristics determine the functions and performance of electronic circuits, and are the basis of modern electronic technology. Electronic components need to be encapsulated by encapsulation devices after production to protect the internal components, but the existing technology still has problems that need to be solved in the process of using the internal encapsulation device of most electronic components.

[0003] Most of the internal encapsulation devices of electronic components in the prior art lack a mechanism for cleaning electronic components, and are not convenient for positioning electronic components. Before encapsulation, the staff usually first cleans the electronic components with a brush to remove dust on the electronic components, then places the electronic components under the glue spraying head, manually positions them and then encapsulates them. The operation steps are complicated, which consumes a lot of time and effort, affects the overall efficiency of encapsulation, and needs to be solved urgently. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcomings in the prior art and provides an internal encapsulation device of electronic components.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] The utility model provides an internal encapsulation device of electronic components, including operation box, the top of operation box is fixedly connected with U -shaped frame, the top of U -shaped frame is fixedly connected with hydraulic oil cylinder, the output of hydraulic oil cylinder is fixedly connected with fixed frame, the bottom of fixed frame is fixedly connected with lifting platform, the bottom of lifting platform is fixedly connected with glue head, the bottom of both ends of lifting platform is fixedly connected with air jet mouth, the both sides of lifting platform are fixedly connected with L shaped board, the bottom of two L shaped boards is fixedly connected with first rack, first rack is engaged with gear, the both ends of gear are engaged with second rack, two second rack in the same side are fixedly connected with same slider, the top of slider is fixedly connected with side plate, is equipped with the first limiting rod in the side plate, two first limiting rods in the same side are fixedly connected with same positioning plate, is equipped with spring on the first limiting rod, is equipped with rubber pad on the positioning plate, because the technical means that the glue head and air jet mouth of descending are used simultaneously can make the positioning plate move close to electronic component, so the glue head and air jet mouth of descending keep moderate distance with electronic component, and the positioning plate moves and positions electronic component in the middle, effectively solve the problem that the internal encapsulation device of most electronic components in prior art lacks the mechanism for cleaning electronic component in the background art, and it is inconvenient to position electronic component, generally manual cleaning electronic component is carried out to the staff, and then manual positioning is carried out, and the operation steps are tedious, can consume more time and energy, affect the overall efficiency of encapsulation work, and further realize the technical effect that it is convenient to position electronic component, can clean electronic component, avoid dust to influence the adhesion of encapsulation material and element surface, ensure the quality of encapsulation, simple operation can effectively improve the overall efficiency of encapsulation work.

[0007] As a further scheme of the utility model, the both ends of the gear are sleeved with bearing seats, the inner ring inner wall of the bearing on the bearing seat is fixedly connected with the gear, and the bearing seat is fixedly connected with the U-shaped frame.

[0008] As a further scheme of the utility model, the top of the operation box is fixedly connected with two supporting plates, and the top of the two supporting plates is fixedly connected with the same placing table.

[0009] As a further scheme of the utility model, the both sides inner walls of the U-shaped frame are fixedly connected with fixed plates, the bottom of the fixed plate is fixedly connected with two third limiting rods, the third limiting rod passes through the lifting platform, and the lifting platform is slidingly connected with the third limiting rod.

[0010] As a further scheme of the utility model, two second limiting rods are arranged between the two supporting plates, the second limiting rod is fixedly connected with the supporting plate, the second limiting rod passes through the slider, and the slider is slidingly connected with the second limiting rod.

[0011] As a further scheme of the utility model, the lifting platform is provided with a hose, the output end of the hose is connected with a glue spraying head, a suction pump is arranged at the end of the hose far from the glue spraying head, the suction pump is arranged in the operation box, the hose is connected with the output end of the suction pump, a glue storage tank is fixedly connected to the bottom of the suction pump, air pipes are arranged at both ends of the lifting platform, air nozzles are fixedly connected to the output ends of the air pipes, air pumps are arranged at the input ends of the air pipes, and the air pumps are installed at the top of the U-shaped frame and connected with the air pipes.

[0012] As a further scheme of the utility model, the U-shaped frame is fixedly connected with an outer shell at both sides, and the outer shell is provided with a PLC controller.

[0013] The utility model discloses the beneficial effect is:

[0014] The utility model discloses: because adopt the technical means that the glue spraying head and air nozzle of descending can make positioning board move close to electronic component, so the glue spraying head and air nozzle keep moderate distance with electronic component, and positioning board moves and carries out center positioning to electronic component, effectively solve the problem that the internal glue sealing device of most electronic components in prior art in background art lacks the mechanism of cleaning electronic component, and it is inconvenient to position electronic component, generally, the staff manually cleans electronic component, and then manually positions, and the operation step is complicated, can consume more time and energy, influence the overall efficiency of glue sealing work, and further realize the technical effect that it is convenient to position electronic component, can clean electronic component, avoid dust to influence the adhesion of glue sealing material and element surface, guarantee the quality of glue sealing, simple operation can effectively improve the overall efficiency of glue sealing work. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 The utility model discloses a kind of internal glue sealing devices of electronic component, as shown in the figure;

[0016] Figure 2 The utility model discloses a kind of internal glue sealing devices of electronic component, as shown in the figure;

[0017] Figure 3 The utility model discloses a kind of internal glue sealing devices of electronic component, as shown in the figure;

[0018] Figure 4 The utility model discloses a kind of internal glue sealing devices of electronic component, as shown in the figure;

[0019] Figure 5The utility model provides an internal glue sealing device's sliding block of electronic component spreads out structure schematic diagram.

[0020] In the drawing: 1, operation box; 2, U-shaped frame; 3, hydraulic oil cylinder; 4, fixed frame; 5, lifting platform; 6, L-shaped plate; 7, first rack; 8, gear; 9, second rack; 10, sliding block; 11, bearing seat; 12, side plate; 13, first limit rod; 14, spring; 15, positioning plate; 16, support plate; 17, second limit rod; 18, placing table; 19, fixed plate; 20, third limit rod; 21, glue spraying head; 22, hose; 23, suction pump; 24, glue storage tank; 25, air jet nozzle; 26, air pipe; 27, air pump; 28, shell; 29, PLC controller. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0022] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0023] Reference Figure 1 - Figure 5The utility model provides an internal encapsulation device of electronic components, including operation box 1, the top of operation box 1 is fixedly connected with U-shaped frame 2, the top of U-shaped frame 2 is fixedly connected with hydraulic oil cylinder 3, the output of hydraulic oil cylinder 3 is fixedly connected with fixed frame 4, the bottom of fixed frame 4 is fixedly connected with lifting platform 5, the bottom of lifting platform 5 is fixedly connected with glue head 21, the bottom of both ends of lifting platform 5 is fixedly connected with air jet nozzle 25, and glue head 21 drops simultaneously air jet nozzle 25 also drops close electronic component, before carrying out encapsulation, two air jet nozzles 25 emit airflow and clean electronic component, and blow away dust and impurity on electronic component, the both sides of lifting platform 5 are fixedly connected with L-shaped plate 6, the bottom of two L-shaped plates 6 is fixedly connected with first rack 7, first rack 7 is connected with gear 8, and the both ends of gear 8 are engagedly connected with second rack 9, and the both sides of two second racks 9 are fixedly connected with the same sliding block 10, the top of sliding block 10 is fixedly connected with side plate 12, first limiting rod 13 is arranged on side plate 12, the both sides of two first limiting rods 13 are fixedly connected with the same positioning plate 15, spring 14 is sleeved on first limiting rod 13, and rubber pad is arranged on positioning plate 15, because the technical means that glue head and air jet nozzle drop simultaneously can make positioning plate move close electronic component, so glue head and air jet nozzle keep moderate distance from electronic component, and positioning plate moves and positions electronic component, effectively solve the problem that most internal encapsulation devices of electronic components in prior art lack cleaning mechanism for electronic component, and electronic component is not positioned, generally manually clean electronic component, and then manually position, and the operation steps are complicated, consume more time and energy, affect the overall efficiency of encapsulation work, and further realize the technical effect that electronic component is positioned, electronic component is cleaned, dust does not affect the adhesion of encapsulation material and element surface, encapsulation quality is guaranteed, operation is simple, and the overall efficiency of encapsulation work is improved.

[0024] In the embodiment, the both ends of the gear 8 are sleeved with the bearing seat 11, the inner wall of the inner ring of the bearing on the bearing seat 11 is fixedly connected with the gear 8, and the bearing seat 11 is fixedly connected with the U-shaped frame 2.

[0025] In the embodiment, the top of the operation box 1 is fixedly connected with two support plates 16, and the top of the two support plates 16 is fixedly connected with the same placement table 18.

[0026] In the embodiment, the both sides of the U-shaped frame 2 are fixedly connected with the fixed plate 19, the bottom of the fixed plate 19 is fixedly connected with two third limiting rods 20, the third limiting rod 20 passes through the lifting platform 5, and the lifting of the lifting platform 5 is moved along the third limiting rod 20, so that the stability of the lifting platform 5 during movement is guaranteed, and the lifting platform 5 is slidingly connected with the third limiting rod 20.

[0027] In the embodiment, two second limiting rods 17 are arranged between the two support plates 16, the second limiting rods 17 are fixedly connected with the support plates 16, the second limiting rods 17 pass through the sliding blocks 10, the sliding blocks 10 will move along the second limiting rods 17, so as to ensure the stability of the positioning plate 15 during movement, and the sliding blocks 10 are slidingly connected with the second limiting rods 17.

[0028] In the embodiment, the lifting platform 5 is provided with a hose 22 penetratingly arranged thereon, an output end of the hose 22 is connected with the glue spraying head 21, a suction pump 23 is arranged at an end of the hose 22 away from the glue spraying head 21, the suction pump 23 is arranged in the interior of the operation box 1, the hose 22 is connected with an output end of the suction pump 23, a glue storage tank 24 is fixedly connected to a bottom of the suction pump 23, air pipes 26 are penetratingly arranged at two ends of the lifting platform 5, output ends of the air pipes 26 are fixedly connected with air nozzles 25, air pumps 27 are arranged at input ends of the air pipes 26, the air pumps 27 are installed at the top of the U-shaped frame 2, and output ends of the air pumps 27 are connected with the air pipes 26.

[0029] In the embodiment, outer walls of the U-shaped frame 2 are fixedly connected with outer shells 28, and the outer shells 28 are provided with PLC controllers 29.

[0030] Working principle: when using the device, electronic components are placed on the placement table 18, the hydraulic system is controlled by the PLC controller 29 to make the output end of the hydraulic oil cylinder 3 extend, the output end of the hydraulic oil cylinder 3 will drive the fixed frame 4 to descend, the fixed frame 4 will drive the lifting table 5 to descend along the third limiting rod 20, the lifting table 5 will descend to drive the L-shaped plate 6 to descend, the L-shaped plate 6 will drive the first rack 7 to descend, the first rack 7 will drive the gear 8 to rotate, the gear 8 will drive the second rack 9 to move, the second rack 9 will move to drive the sliding block 10 to move along the second limiting rod 17, the sliding block 10 will move to drive the side plate 12 to move, the side plate 12 will drive the spring 14 and the first limiting rod 13 to move, the spring 14 and the positioning plate 15 will make the positioning plate 15 move, the two positioning plates 15 will move close to each other until they contact the electronic components, the two positioning plates 15 continue to move to be able to position the electronic components, by setting the spring 14 and the rubber pad, relative to the rigid clamping, it can reduce the damage to the electronic components, after completing the positioning of the electronic components, start the air pump 27 through the PLC controller 29, the two air pumps 27 work in turn, the airflow is delivered to the air nozzle 25 through the air pipe 26, and the airflow is sprayed out through the air nozzle 25, the two air nozzles 25 spray the airflow in turn to clean the electronic components, and the dust on the electronic components is blown away, then start the suction pump 23 through the PLC controller 29, the suction pump 23 sucks out the glue in the glue storage tank 24, and delivers the glue to the glue spraying head 21 through the hose 22, and sprays the glue in the electronic components through the glue spraying head 21 to perform the glue sealing work, after completing the glue sealing work, the output end of the hydraulic oil cylinder 3 is retracted, the lifting table 5 is raised, the gear 8 is reversed, the two positioning plates 15 are away from each other and no longer contact the electronic components, and the electronic components sealed with glue can be taken out.

[0031] For the purposes of this description, spatially relative terms, such as "above", "below", "up", "down", "between", "within", "left", "right", "front", "back", "upper", "lower", "horizontal", "vertical", "above", "below", "up", "down", "top", "bottom", "side", "end", etc., can be used herein for ease of description to describe one element's or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is inverted, elements described as "above" or "up" other elements or features would then be oriented "below" or "down" the other elements or features. Thus, the exemplary term "above" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will also be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation, and that the device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0032] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, devices, components and / or combinations thereof.

[0033] The preferred embodiments of the present application have been described above with the aid of drawing only for purposes of example and variation, and it should be understood that the present application can be practiced otherwise without departing from the spirit and principles of the present application. The present application is thus not limited to the embodiments described above, but encompasses any and all modifications within the spirit and scope of the present application.

Claims

1. An apparatus for encapsulating electronic components, comprising an operating box (1), characterized in that, The top of the operation box (1) is fixedly connected with a U-shaped frame (2), the top of the U-shaped frame (2) is fixedly connected with a hydraulic oil cylinder (3), the output end of the hydraulic oil cylinder (3) is fixedly connected with a fixed frame (4), the bottom of the fixed frame (4) is fixedly connected with a lifting platform (5), the bottom of the lifting platform (5) is fixedly connected with a glue spraying head (21), the bottom of the two ends of the lifting platform (5) is fixedly connected with a gas nozzle (25), the two sides of the lifting platform (5) are fixedly connected with an L-shaped plate (6), the bottom of the two L-shaped plates (6) is fixedly connected with a first rack (7), the first rack (7) is meshingly connected with a gear (8), the two ends of the gear (8) are meshingly connected with a second rack (9), the two second racks (9) on the same side are fixedly connected with the same sliding block (10), the top of the sliding block (10) is fixedly connected with a side plate (12), the first limiting rod (13) is arranged on the side plate (12), the two first limiting rods (13) on the same side are fixedly connected with the same positioning plate (15), the spring (14) is sleeved on the first limiting rod (13), and the positioning plate (15) is provided with a rubber pad.

2. The encapsulant apparatus of claim 1, wherein, The two ends of the gear (8) are sleeved with a bearing seat (11), the inner ring inner wall of the bearing on the bearing seat (11) is fixedly connected with the gear (8), and the bearing seat (11) is fixedly connected with the U-shaped frame (2).

3. The encapsulant apparatus of claim 1, wherein the encapsulant apparatus is configured to encapsulate an electronic device. The top of the operation box (1) is fixedly connected with two support plates (16), and the top of the two support plates (16) is fixedly connected with the same placing table (18).

4. The encapsulant apparatus of claim 2, wherein the encapsulant apparatus is configured to be placed on a substrate having a plurality of electronic components mounted thereon. The two side inner walls of the U-shaped frame (2) are fixedly connected with a fixed plate (19), the bottom of the fixed plate (19) is fixedly connected with two third limiting rods (20), the third limiting rods (20) pass through the lifting platform (5), and the lifting platform (5) is slidably connected with the third limiting rods (20).

5. The encapsulant apparatus of claim 3, wherein the encapsulant apparatus is configured to be used in a flip chip package. Two second limiting rods (17) are arranged between the two support plates (16), the second limiting rods (17) are fixedly connected with the support plates (16), the second limiting rods (17) pass through the sliding blocks (10), and the sliding blocks (10) are slidably connected with the second limiting rods (17).

6. The encapsulating apparatus for electronic components according to claim 4, wherein A hose (22) is arranged on the lifting platform (5), the output end of the hose (22) is connected with the glue spraying head (21), one end of the hose (22) away from the glue spraying head (21) is provided with a suction pump (23), the suction pump (23) is arranged in the operation box (1), the hose (22) is connected with the output end of the suction pump (23), the bottom of the suction pump (23) is fixedly connected with a glue storage tank (24), the two ends of the lifting platform (5) are provided with air pipes (26), the output end of the air pipe (26) is fixedly connected with the gas nozzle (25), the input end of the air pipe (26) is provided with an air pump (27), the air pump (27) is installed on the top of the U-shaped frame (2), and the output end of the air pump (27) is connected with the air pipe (26).

7. The encapsulant apparatus of claim 6, wherein the encapsulant apparatus is configured to be placed on a substrate having an electronic device mounted thereon. Both sides of the U-shaped frame (2) are fixedly connected with an outer shell (28), and the outer wall of the outer shell (28) is provided with a PLC controller (29).

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