Ultrasonic cleaning device for quartz polishing wafer

Abstract

The utility model discloses a quartz polishing wafer ultrasonic cleaning device which comprises an ultrasonic cleaning machine, a feeding bottom frame is hinged to the top end of the ultrasonic cleaning machine, a spring telescopic rod is fixedly connected to one end of the top face of the feeding bottom frame, a feeding top frame is fixedly connected to the top end of the spring telescopic rod, and a material guiding rectangular frame is fixedly connected to the inner side of the feeding top frame. A first feeding guide plate is fixedly connected to one side of the interior of the rectangular material guide frame, a second feeding guide plate is fixedly connected to the other side of the interior of the rectangular material guide frame, and a vibration motor is installed on one side of the exterior of the rectangular material guide frame. The material leakage distance between the first feeding guide plate and the second feeding guide plate which are arranged in a staggered mode is matched with the thickness specification of a single wafer, scattered feeding of the wafers is facilitated, the situation of firm adhesion is reduced, the cleaning efficiency after the wafers are immersed in cleaning liquid is improved, and the service life of the wafers is prolonged. A vibration motor installed on the outer side of the rectangular material guiding frame is matched with the first feeding guide plate, the second feeding guide plate and the elastic connecting structure to scatter and feed the wafers through high-frequency vibration.

Description

TECHNICAL FIELD

[0001] The utility model relates to cleaning equipment technical field, concretely is a quartz polishing wafer ultrasonic cleaning device. BACKGROUND

[0002] The quartz polishing wafer is made of high-purity quartz material, and after a series of process steps such as cutting, grinding and polishing, its surface reaches extremely high smoothness and flatness. This wafer is usually used to make various electronic devices, optical elements and sensors, etc. The wafers are generally bonded together during the cutting process step, and need to be ultrasonically cleaned after completing the process operation to remove the bonding agent on the wafer surface.

[0003] The existing Chinese patent document CN216818287U discloses an ultrasonic cleaning machine for quartz wafers, which comprises a cleaning machine body, a partition plate fixedly connected inside the cleaning machine body, and a mesh cage performing circular motion inside the cleaning machine body through a central shaft. This alternating cleaning arrangement can make the quartz wafers in the mesh cage shake and vibrate to some extent during the circular motion, thereby improving the cleaning effect when they come into contact with the cleaning liquid. On the other hand, the mesh cage can be rotated to the upper side to separate from the cleaning liquid, and the remaining cleaning liquid in the mesh cage can be used to remove the dirt on the surface of the quartz wafers by flowing under gravity, thereby avoiding residue on the surface. The mesh cage is driven to perform circular motion by rotating the central shaft, and most of the remaining cleaning liquid in the mesh cage is thrown out in this way, thereby accelerating the drying efficiency of the quartz wafers. The blades rotating with the central shaft can disturb the airflow blowing on the mesh cage, further accelerating the drying of the quartz wafers. However, this ultrasonic cleaning device still has the following problems: the wafers are directly placed in the mesh cage, and the wafers are immersed in the cleaning liquid by the reciprocating rotational motion of the two groups of mesh cages for ultrasonic cleaning. However, this feeding and placement method causes the wafers to not fully spread in the mesh cage, which may result in more stacking, thereby affecting the ultrasonic cleaning effect of the wafers. SUMMARY

[0004] The utility model aims at: in order to solve the above-mentioned ultrasonic cleaning device its wafer is directly placed in the mesh cage, and the wafer is immersed in the cleaning liquid by the reciprocating rotational motion of the two groups of mesh cages for ultrasonic cleaning. However, this feeding and placement method causes the wafers to not fully spread in the mesh cage, which may result in more stacking, thereby affecting the ultrasonic cleaning effect of the wafers. The utility model provides a quartz polishing wafer ultrasonic cleaning device.

[0005] To achieve the above object, the utility model provides the following technical scheme: a quartz polishing wafer ultrasonic cleaning device, include: ultrasonic cleaning machine, the top hinged of ultrasonic cleaning machine has the feed bottom frame, the top surface one end of feed bottom frame is firmly connected with spring telescopic link, the top end of spring telescopic link is firmly connected with feed top frame, the inboard of feed top frame is firmly connected with guide rectangular frame, the inside one side of guide rectangular frame is firmly connected with feed guide plate no.

[0006] As the further scheme of the utility model: four groups of spring telescopic links are fixedly connected, are symmetrically arranged at four ends of the top surface of the feed bottom frame, the top end of the four groups of spring telescopic links is fixedly connected with the same group of feed top frame, the feed bottom frame, four groups of spring telescopic links and feed top frame form an integral whole and are hinged to the top end of the ultrasonic cleaning machine.

[0007] As the further scheme of the utility model: the guide rectangular frame is fixedly connected to the inboard of the feed top frame, the feed guide plate no. 1 and the feed guide plate no. 2 are oppositely and staggeredly arranged in the inside of the guide rectangular frame, that is, the extension surfaces of the two cross each other.

[0008] As the further scheme of the utility model: the vibration motor is installed outside the guide rectangular frame to realize the purpose of vibrating and dispersing the wafer material entering in cooperation with the internal dispersion feed structure.

[0009] As the further scheme of the utility model: the top of the material receiving net basket is fixedly connected with the net basket handle structure, the net basket handle is matched with the number specification of the basket groove, and the material receiving net basket is suspended and arranged in the ultrasonic cleaning machine through the net basket handle and the basket groove structure.

[0010] As the further scheme of the utility model: the material receiving net basket is arranged in a rectangular structure, and a plurality of groups of material uniformizing net plates are fixedly connected in parallel inside, and the top of the plurality of groups of material uniformizing net plates is provided with a buffer rubber strip structure.

[0011] Compared with the prior art, the utility model has the beneficial effects that:

[0012] 1. The utility model discloses a feeding bottom frame and feeding top frame are through four groups of spring telescopic frame and constitute elastic support structure, whole hinged in ultrasonic cleaning machine top, it is convenient when taking material can open the structure of hinged and take internal article, after cutting complete, the stacking wafer is put into the feeding top frame, and the four -sided closed rectangle structure of guide rectangular frame prevents wafer material from spilling over and falling, and the material leakage spacing between the misplacement setting feeding guide plate no. 1 and feeding guide plate no. 2 is adapted to the thickness specification of single wafer, and it is convenient for wafer dispersed feeding, reduces the situation of firm adhesion, improves the cleaning efficiency after immersing cleaning fluid, and the vibration motor of installing in the outside of guide rectangular frame cooperates feeding guide plate no. 1, feeding guide plate no. 2 and elastic connecting structure and carries out the scattered feeding of wafer through high frequency vibration.

[0013] 2. The utility model discloses a plurality of groups of parallel insertion uniform material net board fixed in the inside of the material bearing basket is located below feeding guide plate no. 2, and it is convenient for the wafer falling down by vibration dispersion to fall in the material bearing basket evenly, avoids the transition stacking and leads to the overlapping surface cleaning effect of wafer not ideal. ACCURACY OF DRAWINGS

[0014] Figure 1 It is the overall structure schematic diagram of the quartz polishing wafer ultrasonic cleaning device of the utility model;

[0015] Figure 2 It is the structure schematic diagram of the feeding bottom frame in the quartz polishing wafer ultrasonic cleaning device of the utility model;

[0016] Figure 3 It is the structure schematic diagram of feeding guide plate no. 1 in the quartz polishing wafer ultrasonic cleaning device of the utility model;

[0017] Figure 4 It is the structure schematic diagram of the material bearing basket in the quartz polishing wafer ultrasonic cleaning device of the utility model;

[0018] Figure 5 It is the structure schematic diagram of the uniform material net board in the quartz polishing wafer ultrasonic cleaning device of the utility model.

[0019] In the drawing: 1, ultrasonic cleaning machine; 2, feeding bottom frame; 3, spring telescopic rod; 4, feeding top frame; 5, guide rectangular frame; 6, feeding guide plate no. 1; 7, feeding guide plate no. 2; 8, vibration motor; 9, material bearing basket; 10, basket groove; 11, basket handle; 12, uniform material net board; 13, buffer rubber strip. DETAILED DESCRIPTION

[0020] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0021] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "setting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. The embodiments of the present application will be described below according to the overall structure of the present application.

[0022] With reference to Figures 1 to 5 In the embodiments of the present application, a quartz polishing wafer ultrasonic cleaning device comprises: an ultrasonic cleaning machine 1, a feeding bottom frame 2 is hingedly connected to the top end of the ultrasonic cleaning machine 1, a spring telescopic rod 3 is fixedly connected to one end of the top surface of the feeding bottom frame 2, a feeding top frame 4 is fixedly connected to the top end of the spring telescopic rod 3, a guide rectangular frame 5 is fixedly connected to the inner side of the feeding top frame 4, a feeding guide plate one 6 is fixedly connected to one side of the inside of the guide rectangular frame 5, a feeding guide plate two 7 is fixedly connected to the other side of the inside of the guide rectangular frame 5, a vibration motor 8 is installed on one side of the outside of the guide rectangular frame 5, a material receiving basket 9 is arranged inside the ultrasonic cleaning machine 1, a basket groove 10 is formed at one end of the top of the material receiving basket 9, a basket handle 11 is fixedly connected to one end of the material receiving basket 9, a material uniformizing net plate 12 is fixedly connected vertically inside the material receiving basket 9, and a buffer rubber strip 13 is fixedly connected to the top end of the material uniformizing net plate 12.

[0023] With reference to Figure 1 and Figure 2The four groups of spring telescopic rods 3 are symmetrically arranged at the four ends of the top surface of the feeding bottom frame 2, and the top ends of the four groups of spring telescopic rods 3 are fixedly connected with the same group of feeding top frames 4. The feeding bottom frame 2, the four groups of spring telescopic rods 3 and the feeding top frame 4 form an integral hinge at the top end of the ultrasonic cleaning machine 1.

[0024] By adopting the above scheme, the feeding bottom frame 2 and the feeding top frame 4 form an elastic support structure through the four groups of spring telescopic rods 3, and are integrally hinged at the top end of the ultrasonic cleaning machine 1, so that the hinged structure can be easily opened when taking out the materials.

[0025] Referring to Figures 1 to 3 , the feeding rectangular frame 5 is fixedly connected inside the feeding top frame 4, and the feeding guide plate one 6 and the feeding guide plate two 7 are oppositely and staggeringly arranged inside the feeding rectangular frame 5, that is, the extension surfaces of the two are intersected.

[0026] By adopting the above scheme, the four-sided closed rectangular structure of the feeding rectangular frame 5 can prevent the wafer material from spilling and falling, the staggered arrangement of the feeding guide plate one 6 and the feeding guide plate two 7 can adapt the material leakage gap between the two to the thickness specification of the single wafer, so as to facilitate the dispersion of the wafer material and reduce the adhesion and firmness, thereby improving the cleaning efficiency after immersion in the cleaning liquid.

[0027] Referring to Figure 3 , the vibration motor 8 is installed outside the feeding rectangular frame 5 to cooperate with the internal dispersion feeding structure to achieve the purpose of vibrating and dispersing the entering wafer material.

[0028] By adopting the above scheme, the vibration motor 8 installed outside the feeding rectangular frame 5 cooperates with the feeding guide plate one 6, the feeding guide plate two 7 and the elastic connection structure to disperse the wafer through high-frequency vibration.

[0029] Referring to Figure 4 and Figure 5 , the top ends of the two ends of the material receiving basket 9 are fixedly connected with the basket handle 11 structure, the basket handle 11 is matched with the basket groove 10 in specification, and the material receiving basket 9 is suspended and arranged inside the ultrasonic cleaning machine 1 through the basket handle 11 and the basket groove 10 structure.

[0030] By adopting the above scheme, the material receiving basket 9 is suspended and arranged inside the ultrasonic cleaning machine 1 through the basket handle 11 and the basket groove 10 structure, so that the wafer to be cleaned can be received while the wafer with adhesive can be cleaned by ultrasonic vibration, and the wafer can be uniformly lifted after cleaning for subsequent processing procedures.

[0031] Referring to Figure 4 and Figure 5 , the material receiving basket 9 is arranged in a rectangular structure, and a plurality of groups of material uniformizing net plates 12 are fixedly connected inside the material receiving basket 9 in parallel, and the top ends of the plurality of groups of material uniformizing net plates 12 are provided with a buffer rubber strip 13 structure.

[0032] The above scheme is adopted: a plurality of parallelly inserted and fixed uniform material net plates 12 are arranged below the second feeding guide plate 7, so that the falling wafers can be evenly distributed in the material receiving basket 9, and the overlapping surface cleaning effect of the wafers caused by the transition stacking is avoided.

[0033] The working principle of the utility model is as follows: in use, the material receiving basket 9 is suspended and arranged in the ultrasonic cleaning machine 1 through the basket holding handle 11 and the basket holding groove 10 structure, so that the wafers to be cleaned can be received and the wafers with adhesive can be cleaned by ultrasonic vibration at the same time, and the wafers can be uniformly lifted after cleaning to be put into the subsequent processing process; the feeding bottom frame 2 and the feeding top frame 4 are connected through four spring telescopic frames 3 to form an elastic support structure, and are integrally connected to the top end of the ultrasonic cleaning machine 1, so that the connected structure can be opened to take the internal articles when taking the material, the stacked wafers after cutting are put into the feeding top frame 4, the four closed rectangular structures of the material guide rectangular frame 5 prevent the wafer material from spilling and falling, the leakage spacing between the first feeding guide plate 6 and the second feeding guide plate 7 is matched with the thickness specification of the single wafer, so that the wafers can be dispersed and fed, the adhesion is reduced, the cleaning efficiency after immersion in the cleaning liquid is improved, the vibration motor 8 installed outside the material guide rectangular frame 5 cooperates with the first feeding guide plate 6, the second feeding guide plate 7 and the elastic connection structure to disperse and feed the wafers by high-frequency vibration, and the plurality of parallelly inserted and fixed uniform material net plates 12 in the material receiving basket 9 are arranged below the second feeding guide plate 7, so that the falling wafers can be evenly distributed in the material receiving basket 9, and the overlapping surface cleaning effect of the wafers caused by the transition stacking is avoided.

[0034] The above is only a preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.

Claims

1. A quartz-polished wafer ultrasonic cleaning apparatus, characterized by comprising: Include: Ultrasonic cleaner (1), the ultrasonic cleaner (1) top end hinged with the feed bottom frame (2), the feed bottom frame (2) top surface one end is fixedly connected with spring telescopic rod (3), the spring telescopic rod (3) top end is fixedly connected with feed top frame (4), the feed top frame (4) inner side is fixedly connected with guide rectangular frame (5), the guide rectangular frame (5) inside one side is fixedly connected with feed guide plate one (6), the guide rectangular frame (5) inside the other side is fixedly connected with feed guide plate two (7), the guide rectangular frame (5) outside one side is installed with vibration motor (8), the ultrasonic cleaner (1) inside is erected with the material receiving basket (9), the material receiving basket (9) top one end is provided with basket groove (10), the material receiving basket (9) one end is fixedly connected with the basket handle (11), the material receiving basket (9) inside is vertically fixedly connected with the material uniformizing net plate (12), the material uniformizing net plate (12) top end is fixedly connected with the buffer rubber strip (13).

2. The apparatus according to claim 1, wherein The spring telescopic rod (3) is fixedly connected with four groups, which are symmetrically arranged at the top surface of the feed bottom frame (2), and the top end of the four groups of spring telescopic rod (3) is fixedly connected with the same group of feed top frame (4), the feed bottom frame (2), four groups of spring telescopic rod (3) and feed top frame (4) form an integral hinge at the top end of the ultrasonic cleaner (1).

3. The apparatus according to claim 1, wherein The guide rectangular frame (5) is fixedly connected inside the feed top frame (4), the feed guide plate one (6) and the feed guide plate two (7) are oppositely arranged inside the guide rectangular frame (5), that is, the extension surfaces of the two cross each other.

4. The apparatus according to claim 1, wherein The vibration motor (8) is installed outside the guide rectangular frame (5) to cooperate with the internal dispersion feed structure to realize the purpose of vibrating and dispersing the entering wafer material.

5. The apparatus according to claim 1, wherein The material receiving basket (9) is fixedly connected with the basket handle (11) structure at both ends of the top, the basket handle (11) is matched with the number specification of the basket groove (10), and the material receiving basket (9) is suspended and erected inside the ultrasonic cleaner (1) through the basket handle (11) and the basket groove (10) structure.

6. The apparatus according to claim 1, wherein The material receiving basket (9) is arranged in a rectangular structure, and a plurality of groups of material uniformizing net plates (12) are fixedly connected inside in parallel, and the top end of the plurality of groups of material uniformizing net plates (12) is provided with the buffer rubber strip (13) structure.

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