Ceramic dielectric capacitor microstrip fixing and welding device

Abstract

The utility model discloses a ceramic dielectric capacitor microstrip fixing and welding device which comprises an upper plate and a bottom plate, a product groove is formed in the middle of the upper plate, the bottom of the product groove is arranged in a penetrating mode, microstrip grooves are formed in the two ends of the upper plate, and the two microstrip grooves are communicated with the product groove. A placing table is arranged in the middle of the bottom plate, and the placing table and the product groove are oppositely arranged; and the welding efficiency is greatly improved, upper, lower, left and right symmetry is achieved after welding is completed, and the appearance quality of a welded product is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a porcelain dielectric capacitor reflow soldering process, especially a porcelain dielectric capacitor microstrip fixed welding device. BACKGROUND

[0002] The multilayer chip porcelain dielectric capacitor is formed by stacking a plurality of dielectric films with printed inner electrodes in a staggered manner, and the two ends are sealed with end electrodes to form an inorganic dielectric capacitor, which has the characteristics of non-polarity, high reliability, high precision, high integration, high frequency, intelligence, low power consumption, large capacity, miniaturization and low cost, and is widely used in various electronic fields.

[0003] In the microstrip welding process of the porcelain dielectric capacitor, solder paste needs to be applied to the two ends of the porcelain dielectric capacitor, and the two microstrips are fixed on the ends with solder paste, and then sent into the reflow soldering furnace. The solder paste is fully dissolved by high temperature in the furnace, and the lead wires on the two ends of the porcelain dielectric capacitor are welded after the temperature cools down. It is required that the microstrip does not tilt after welding, and the solder paste amount and the microstrip height of each product remain consistent.

[0004] In the welding process, a large amount of time is spent on applying solder paste and placing microstrips, and in the reflow soldering furnace, the microstrips are easily tilted by hot air, and the solder paste amount of each product is also difficult to guarantee consistency, resulting in difficulty in porcelain dielectric capacitor microstrip welding process, low welding quality and low welding efficiency. UTILITY MODEL CONTENTS

[0005] To solve the above technical problems, the utility model provides a porcelain dielectric capacitor microstrip fixed welding device.

[0006] The utility model is implemented through the following technical solutions.

[0007] The utility model provides a porcelain dielectric capacitor microstrip fixed welding device, including upper plate and bottom plate, the middle part position of upper plate is equipped with product groove, and the bottom part is through setting, the both ends of upper plate are equipped with microstrip groove, and two microstrip grooves are in communication with product groove;The middle part of bottom plate is provided with a platform, and the platform is opposite to the product groove.

[0008] Preferably, the lower end of the upper plate is provided with a positioning groove, and the upper end of the bottom plate is provided with a positioning pin, which is adapted to the positioning groove.

[0009] Preferably, the both sides of the product groove are provided with tin solder grooves, and the two tin solder grooves are in communication with the two microstrip grooves respectively, and the bottom part of the tin solder groove is through setting.

[0010] Preferably, two hot air grooves are arranged on the bottom plate, and the hot air grooves are through setting along the length direction, and the two hot air grooves are located on the both sides of the platform.

[0011] Preferably, the upper plate and the bottom plate are both made of aluminum alloy material.

[0012] Preferably, the width of the rest platform is less than the width of the product slot.

[0013] Preferably, the product slot cooperates with the product gap.

[0014] The beneficial effects of the present application are as follows:

[0015] 1. During welding operation, the product is placed on the rest platform and in the product slot, the microstrip to be welded is placed in the two microstrip slots, the product and the microstrip are positioned, the welding efficiency and quality are greatly improved, the hot air slot is provided, the welding temperature is not affected, the flux is not accumulated to pollute the appearance of the welded product, the soldering slot for accumulating solder paste is provided, the consistency of the amount of solder paste of each product is ensured, and the appearance quality of the product after welding is greatly improved.

[0016] 2. The structure is simple, is not easy to deform in a high-temperature environment in a reflow soldering furnace, can be used repeatedly for many times, the bottom plate can be replaced, and the microstrip welding of ceramic capacitor of different thicknesses and ceramic capacitor at different positions is adapted. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic diagram of the present application;

[0018] Figure 2 is an exploded view of the present application;

[0019] In the figure: 1-upper plate; 2-microstrip slot; 3-soldering slot; 4-product slot; 5-positioning slot; 6-hot air slot; 7-bottom plate; 8-positioning pin; 9-rest platform. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0021] It should be noted that all directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directionality indications also change accordingly.

[0022] In the present embodiment, reference is made toFigure 1 and Figure 2 , including the upper plate 1 and the bottom plate 7, the upper plate 1 and the bottom plate 7 are made of aluminum alloy material, so that the upper plate 1 and the bottom plate 7 have good thermal conductivity, corrosion resistance, and are not easy to deform at high temperature, and are suitable for use in high temperature environment.

[0023] Referring to Figure 1 and Figure 2 , the middle part of the upper plate 1 is provided with a product slot 4, the bottom of the product slot 4 is provided in a penetrating manner, the product slot 4 cooperates with the product gap, and the product is placed in the product slot 4 during the soldering process; both ends of the upper plate 1 are provided with a microstrip slot 2, both of the two microstrip slots 2 are in communication with the product slot 4, the microstrip slot 2 cooperates with the microstrip gap, the two microstrips to be soldered are respectively placed in the two microstrip slots 2, and the rapid positioning of the microstrip is realized; the two sides of the product slot 4 are provided with a soldering slot 3, and the two sides of the soldering slot 3 away from each other are respectively in communication with the two microstrip slots 2, so that the microstrip slot 2, the soldering slot 3 and the product slot 4 are provided in a penetrating manner, one end of the two microstrips close to each other is respectively in contact with the two sides of the product, and the welding part of the product and the microstrip is placed in the soldering slot 3, so as to facilitate the control of the amount of solder paste, ensure the consistency of the amount of solder paste of each product, and realize the symmetry of the upper and lower and left and right after welding, greatly improving the appearance quality of the product after welding; the bottom of the soldering slot 3 is penetrated to avoid the accumulation of flux.

[0024] In this embodiment, referring to Figure 1 and Figure 2 , the middle part of the bottom plate 7 is fixedly connected with a presentation platform 9, the presentation platform 9 is arranged opposite to the product slot 4, the width of the presentation platform 9 is less than the width of the product slot 4, and the length of the presentation platform 9 is greater than the length of the product slot 4, the bottom of the product is placed on the presentation platform 9, the presentation platform 9 supports the product, the upper end of the product is placed in the product slot 4, the fixation and positioning of the product are realized; two hot air slots 6 are formed in the bottom plate 7, the hot air slots 6 are provided in a penetrating manner along the length direction, the two hot air slots 6 are respectively located on the two sides of the presentation platform 9, the hot air slots 6 realize the ventilation effect, thereby avoiding the influence on the welding temperature of the product, and the hot air slots 6 are also in communication with the soldering slot 3, which also avoids the pollution of the appearance of the welded product caused by the accumulation of flux.

[0025] In this embodiment, referring to Figure 1 and Figure 2 , the lower end of the upper plate 1 is provided with a positioning slot 5, and the upper end of the bottom plate 7 is provided with a positioning pin 8, the positioning pin 8 is adapted to be clamped in the positioning slot 5, the positioning connection between the upper plate 1 and the bottom plate 7 is realized, and the product is conveniently positioned and placed later.

[0026] The working principle of the embodiment is as follows: during welding, the product is placed on the supporting table 9, so that the product is partially placed in the product groove 4, and two microstrips are placed in the two microstrip grooves 2 respectively, the ends of the two microstrips close to each other are respectively in contact with the two sides of the product to be welded, the contact parts are placed in the soldering groove 3, solder paste is coated on the end of the product, then the two microstrips are gently pushed inward so that the ends thereof contact the solder paste, and the microstrips are sent into a reflow soldering furnace; the microstrips enter a high-temperature environment, in the high-temperature environment, the solder paste is dissolved, and the flux flows downward, since the supporting table 9 supports the product, the flux will not accumulate and contaminate the product, after high-temperature welding is completed; the microstrips enter a hot air environment, in the hot air environment, since the product is fixed by the product groove 4 and the microstrips are fixed by the microstrip grooves 2, the product and the microstrips always maintain correct positions, the microstrips will not be skewed or separated, and the product groove 4 and the microstrip grooves 2 facilitate the placement of the product and the microstrips, so that the welding efficiency and the welding quality are greatly improved.

[0027] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation made according to the contents of the utility model specification and drawings, or direct / indirect application in other related technical fields under the concept of the utility model is included in the patent protection range of the utility model.

Claims

1. A microstrip fixture for ceramic dielectric capacitor soldering, characterized by: The utility model relates to a product display device, including upper plate (1) and bottom plate (7), the middle part position of upper plate (1) is set with product slot (4), and the bottom of product slot (4) is set through, and the both ends of upper plate (1) are provided with microstrip slot (2), and two microstrip slots (2) all are communicated with product slot (4), and the middle part of bottom plate (7) is provided with and presents the platform (9), and presents the platform (9) with product slot (4) is opposite and sets up.

2. A microstrip fixation soldering device for ceramic dielectric capacitors as claimed in claim 1, characterized in that: The lower end of upper plate (1) is provided with positioning slot (5), and the upper end of bottom plate (7) is provided with positioning pin (8), and positioning pin (8) is matched with positioning slot (5) and is connected.

3. A microstrip fixation soldering device for ceramic dielectric capacitors as claimed in claim 1, characterized in that: The both sides of product slot (4) are provided with tin soldering groove (3), and two tin soldering grooves (3) are communicated with two microstrip slots (2) respectively on the side away from each other, and the bottom of tin soldering groove (3) is set through.

4. A microstrip fixation soldering device for ceramic dielectric capacitors as claimed in claim 1, characterized in that: The bottom plate (7) is provided with two hot air grooves (6), and the hot air grooves (6) are set through along the length direction, and two hot air grooves (6) are located on the both sides of the platform (9) respectively.

5. A microstrip fixation soldering device for ceramic dielectric capacitors as claimed in claim 1, characterized in that: The upper plate (1) and bottom plate (7) are made of aluminum alloy material.

6. A ceramic dielectric capacitor microstrip fixation soldering device as claimed in claim 1, characterized in that: The microstrip slot (2) is matched with the microstrip gap.

7. A microstrip fixation soldering device for ceramic dielectric capacitors as claimed in claim 1, characterized in that: The width of the platform (9) is less than the width of the product slot (4).

8. A ceramic dielectric capacitor microstrip fixation soldering device as claimed in claim 1, characterized in that: The product slot (4) is matched with the product gap.

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