Welding device for electronic component production

Abstract

The utility model belongs to the technical field of electronic component welding, particularly relates to a welding device for electronic component production, and aims to solve the problems that the quality is influenced by floating residues on the surface of welding flux and a circuit board is thermally deformed in the prior art. A preheating frame is welded to the outer wall of one side of the lead-tin solder pool, and heating rods distributed at equal intervals are installed on the inner wall of the preheating frame. According to the utility model, the preheating frame is arranged on one side of the lead-tin solder pool, after the template is placed on the positioning block, the heating rod in the preheating frame can heat the circuit board, and before dip soldering, pre-soldering preheating can be carried out firstly, so that bridge area deformation of the circuit board caused by heating can be avoided, and the problem of circuit board deformation can be solved; the automatic tin removing structure is arranged on the lead-tin solder pool, the lead scraping plate can be controlled to move by driving the connecting rod to move through the electric guide rail, dross on the surface of solder can be scraped, cleaning is convenient, and the quality of solder joints can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component welding technical field especially relates to a welding device for electronic component production. BACKGROUND

[0002] Electronic component welding refers to the technology that electronic components and circuit boards and other substrates are connected through welding technology. According to the different welding methods, the welding of electronic components can be divided into manual welding, wave soldering, soldering iron welding and surface mounting and other ways.

[0003] In the welding process, immersion soldering method can make all components on the whole circuit board complete welding at one time, and this welding method has simple operation, and as long as the mutual cooperation of the solderability of the circuit board design pad pin and the process parameter control and other aspects is appropriate, the welding can be realized. However, immersion soldering also has some deficiencies, and oxidation residues floating on the surface in the pool can be easily produced, which will seriously affect the quality of the welding point if not removed in time, in addition, the circuit board will also be deformed due to the large thermal shock when entering the solder. UTILITY MODEL CONTENTS

[0004] In view of the deficiencies of the prior art, the utility model provides a welding device for electronic component production, which overcomes the deficiencies of the prior art and effectively solves the problems of the influence of the floating residues on the surface of the solder on the quality and the thermal deformation of the circuit board.

[0005] In order to realize the above purpose, the utility model adopts the following technical scheme:

[0006] A welding device for electronic component production, comprising a lead-tin solder pool, a preheating frame is welded on one side of the outer wall of the lead-tin solder pool, and heating rods are installed on the inner wall of the preheating frame at equal distances, and positioning blocks are fixedly connected around the top outer wall of the preheating frame.

[0007] A lead-tin solder pool top outer wall is fixedly connected with an electric guide rail through a screw, and a connecting rod is fixedly connected on the electric guide rail sliding block, and a lead scraping plate is welded on the outer wall of one end of the connecting rod.

[0008] Preferably, a top frame is welded on the top outer wall of the lead-tin solder pool, and a gas cylinder is installed on the top outer wall of the top frame, and a rectangular frame is fixedly connected with the piston rod of the gas cylinder.

[0009] Preferably, a hook is hung on the outer wall of the rectangular frame, and a template is welded on the bottom outer wall of the hook.

[0010] Preferably, a circuit board is placed on the inner wall of the template, and a pin is arranged on the bottom outer wall of the circuit board.

[0011] Preferably, a welding port is arranged on the bottom outer wall of the template, and the pin is arranged on the inner side of the welding port.

[0012] Preferably, the template top outer wall is provided with symmetrically distributed pressing plates, and the pressing plates are tightly attached to the top outer wall of the circuit board.

[0013] Preferably, the lead-tin solder pool is provided with a PLC controller on the other side outer wall, and the PLC controller is connected with the electric guide rail and the air cylinder through signal lines.

[0014] The electronic component production welding device has the advantages that:

[0015] 1. The electronic component production welding device is provided with a preheating frame on one side of the lead-tin solder pool, so that the heating rod in the preheating frame can heat the circuit board after the template is placed on the positioning block, preheating before soldering can be performed, thereby avoiding bridge deformation of the circuit board caused by heating, and the problem of circuit board deformation can be solved.

[0016] 2. The electronic component production welding device is provided with an automatic tin removal structure on the lead-tin solder pool, so that the lead scraping plate can be moved by controlling the movement of the connecting rod driven by the electric guide rail, the dross on the surface of the solder can be scraped off, cleaning is convenient, and the quality of the welding points can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 The utility model provides a kind of electronic component production welding device's overall structure schematic Figure 1 ;

[0018] Figure 2 The utility model provides a kind of electronic component production welding device's overall structure schematic Figure 2 ;

[0019] Figure 3 A kind of electronic component production welding device's electric guide rail connection structure schematic drawing is provided for the utility model;

[0020] Figure 4 A kind of electronic component production welding device's air cylinder connection structure schematic drawing is provided for the utility model;

[0021] Figure 5 A kind of electronic component production welding device's template connection structure schematic drawing is provided for the utility model.

[0022] In the drawing: 1, lead-tin solder pool;2, preheating frame;3, heating rod;4, positioning block;5, electric guide rail;6, connecting rod;7, lead scraping plate;8, top frame;9, air cylinder;10, rectangular frame;11, hook;12, template;13, circuit board;14, pin;15, welding port;16, pressing plate;17, PLC controller. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.

[0024] Embodiment one, refer to Figure 1 A welding device for electronic component production, comprising a lead-tin solder pool 1, a preheating frame 2 is welded on one side of the outer wall of the lead-tin solder pool 1, and heating rods 3 are installed on the inner wall of the preheating frame 2 at equal distances, and positioning blocks 4 are fixedly connected around the top outer wall of the preheating frame 2.

[0025] In this embodiment, the preheating frame 2 is arranged on one side of the lead-tin solder pool 1, and the heating rods 3 inside the preheating frame 2 can heat the circuit board 13 after the template 12 is placed on the positioning blocks 4, so that preheating before welding can be performed before immersion welding, thereby avoiding deformation of the bridge area of the circuit board 13 due to heating, and the problem of deformation of the circuit board 13 can be solved.

[0026] Embodiment two, refer to Figure 3 A welding device for electronic component production, a lead-tin solder pool 1, a top outer wall of the lead-tin solder pool 1 is fixedly connected with an electric guide rail 5 through a screw, and a connecting rod 6 is fixedly connected to the sliding block of the electric guide rail 5, and a lead scraping plate 7 is welded to one end of the outer wall of the connecting rod 6.

[0027] In this embodiment, an automatic tin removal structure is arranged on the lead-tin solder pool 1, and the movement of the lead scraping plate 7 can be controlled by moving the connecting rod 6 driven by the electric guide rail 5, so that the dross on the surface of the solder can be scraped off, which is convenient to clean and helps to improve the quality of the welding points.

[0028] Refer to Figure 2 With Figure 4 A top frame 8 is welded to the top outer wall of the lead-tin solder pool 1, a gas cylinder 9 is installed on the top outer wall of the top frame 8, and a rectangular frame 10 is fixedly connected to the piston rod of the gas cylinder 9.

[0029] Refer to Figure 4 A hook 11 is hung on the outer wall of the rectangular frame 10, and a template 12 is welded to the bottom outer wall of the hook 11.

[0030] Refer to Figures 4-5 A circuit board 13 is placed in the inner wall of the template 12, and a pin 14 is arranged on the bottom outer wall of the circuit board 13.

[0031] Refer to Figure 5 A welding port 15 is formed in the bottom outer wall of the template 12, and the pin 14 is arranged on the inner side of the welding port 15.

[0032] Refer to Figure 4The outer wall of the top of the template 12 is provided with symmetrically distributed pressing plates 16, which are tightly attached to the outer wall of the top of the circuit board 13.

[0033] With reference to Figure 1 , Figure 3 With Figure 4 The outer wall of the other side of the lead-tin solder pool 1 is provided with a PLC controller 17, which is connected with the electric guide rail 5 and the air cylinder 9 through signal lines.

[0034] Working principle: the circuit board 13 is placed on the positioning block 4 before welding, the heating rod 3 in the preheating frame 2 is used to heat the circuit board 13 to complete preheating operation, at the same time, the electric guide rail 5 drives the connecting rod 6 to move to control the lead scraping plate 7 to move to scrape off the dross on the surface of the solder, then the hooks 11 on the template 12 are hung in the rectangular frame 10 and the rectangular frame 10 is pushed down by the air cylinder 9, so that the pins 14 at the bottom of the circuit board 13 are immersed in the solder to complete immersion welding operation.

[0035] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A soldering device for electronic component production, comprising a pool (1) of lead-tin solder, characterized in that, The lead-tin solder pool (1) one side outer wall is welded with preheating frame (2), and preheating frame (2) inner wall is installed with equidistance distribution heating rod (3), the preheating frame (2) top outer wall is fixedly connected with positioning block (4) around, The lead-tin solder pool (1) top outer wall is fixedly connected with electric guide rail (5) through screw, and the electric guide rail (5) slider is fixedly connected with connecting rod (6), one end outer wall of the connecting rod (6) is welded with lead scraping plate (7).

2. The soldering apparatus for electronic component production according to claim 1, wherein The lead-tin solder pool (1) top outer wall is welded with top frame (8), and the top frame (8) top outer wall is installed with air cylinder (9), and the air cylinder (9) piston rod is fixedly connected with rectangular frame (10).

3. The soldering apparatus for electronic component production according to claim 2, wherein The outer wall of the rectangular frame (10) is hung with hook (11), and the hook (11) bottom outer wall is welded with template (12).

4. The soldering apparatus for electronic component production according to claim 3, wherein The inner wall of the template (12) is placed with circuit board (13), and the circuit board (13) bottom outer wall is provided with pin (14).

5. The soldering apparatus for electronic component production according to claim 3, wherein The template (12) bottom outer wall is provided with welding port (15), and the pin (14) is arranged in the inside of the welding port (15).

6. The soldering apparatus for electronic component production according to claim 3, wherein The template (12) top outer wall is installed with symmetrically distributed pressing plate (16), and the pressing plate (16) is closely attached to the top outer wall of the circuit board (13).

7. The soldering apparatus for electronic component production according to claim 1, wherein The other side outer wall of the lead-tin solder pool (1) is installed with PLC controller (17), and the PLC controller (17) is connected with electric guide rail (5) and air cylinder (9) through signal line.

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