A soldering machine capable of preventing soldering offset

Abstract

This invention discloses a soldering machine for preventing dip soldering misalignment, relating to the field of integrated circuit manufacturing technology. It includes a frame, on which a placement rack, flux nozzle, and solder bath are fixedly connected; a moving mechanism; a hook mechanism including a top frame, hook housing, side slide plate, and pressure mold; and a slag removal mechanism. Through the hook and slag removal mechanisms, as the hook mechanism lifts the PCB to be dip soldered from the placement rack and transports it directly above the solder bath, it moves downwards driven by the moving mechanism. When the bottom surface of the side slide plate abuts against the top surface of the lowering frame, the side slide plate continues to move downwards, causing the lowering frame and slag removal plate to move downwards as well. At this time, the slag removal plate opens to both sides, pushing the oxides on the surface of the solder bath to the sides, thus overflowing the solder bath. This ensures that oxides do not adhere to the pins during dip soldering, guaranteeing the dip soldering effect.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, specifically to a soldering machine that prevents soldering deviation. Background Technology

[0002] When manufacturing integrated circuits inside circuit breakers (such as electronic circuit breakers), the components are first inserted into their corresponding positions on the PCB board. Then, a dip soldering machine is used to dip solder the entire PCB, thereby soldering the components onto the PCB to complete the circuit connection.

[0003] Dip soldering is a manufacturing process in which a PCB with components already inserted is transported to a solder bath using lifting devices or clamps. The bottom surface of the PCB is then immersed in molten solder (avoiding the solder from overflowing the top surface). The solder fills and coats the vias and component leads, thus connecting the components to the PCB. During this process, the solder is continuously heated and circulated, keeping it in a constant flow. When component leads are pre-cut, some lighter components may be lifted by the flowing solder when the PCB is immersed. When inserting non-standard, thick-leaded components such as coils, the vias often need to be designed to be slightly larger to facilitate this process. In both cases mentioned above, through-hole components and their pins are prone to misalignment, leading to defects such as uneven solder filling, cold solder joints, voids, and bubbles, which affect the soldering yield. When the number of through-hole components is greater than the number of surface-mount components, dip soldering is performed first to complete the through-hole component soldering, followed by reflow soldering to solder the surface-mount components onto the PCB. However, if the through-hole component moves during dip soldering and covers part of the surface-mount pads, then soldering the surface-mount component at this time requires pushing the through-hole component to the side, which not only increases the processing time but also easily causes hidden cracks in the pins of the through-hole component, leading to faster damage during subsequent use. Summary of the Invention

[0004] The purpose of this invention is to provide a soldering machine that prevents dip soldering misalignment, thereby overcoming the shortcomings of the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a soldering machine for preventing dip soldering misalignment, comprising a frame, wherein a placement rack, a flux nozzle, and a solder pool are fixedly connected to the table surface of the frame, and further comprising:

[0006] The moving mechanism includes a slide rail fixed to the frame table surface;

[0007] The hook mechanism includes a top frame, a hook housing, a side slide plate, and a pressure mold. The side slide plate is slidably connected to both sides of the hook housing. The hook mechanism is driven to move by a moving mechanism.

[0008] The slag removal mechanism includes a fixed frame, a lowering frame, and a slag removal plate, wherein the slag removal plate is positioned above the liquid surface of the tin bath in the default state.

[0009] When the lowering frame is pressed down by the side slide plate, the slag removal plate opens to both sides to push the oxides on the surface of the molten solder pool to both sides. After the lowering frame abuts against the fixed frame, the side slide plate slides upward and moves the mold downward to abut against the top surface of the PCB.

[0010] Preferably, the moving mechanism further includes a lead screw carriage fixedly connected to the slide rail slider, the sliders of the two symmetrical lead screw carriages are fixedly connected to the top frame, and a dual-output motor is fixedly connected to the top of the two lead screw carriages. The two output shafts of the dual-output motor are respectively connected to the lead screws of the lead screw carriages on both sides.

[0011] Preferably, the fixed frame is fixedly connected to the solder bath, the lower moving frame is slidably connected to the fixed frame, and an elastic element is provided between the side slide plate and the top frame. The elastic element is compressed only after the side slide plate pushes the lower moving frame to abut against the top surface of the fixed frame.

[0012] Preferably, the hook claw shell is fixedly connected to the bottom surface of the top frame, and the pressure mold is slidably connected inside the hook claw shell.

[0013] Preferably, the top frame is fixedly connected to a slide rail, and a horizontal slider is slidably connected within the slide rail. The horizontal slider has an inclined surface on one side facing the side slide plate. After the side slide plate moves upward, the horizontal slider is pushed towards the centerline of the fixed frame.

[0014] Preferably, a cable is fixedly connected between the symmetrical horizontal sliders, and the cable suspends the mold at the center of the claw shell. After the symmetrical horizontal sliders move towards each other, the mold moves downward.

[0015] Preferably, the bottom surface of the hook shell is slidably connected to multiple sets of symmetrical picking hooks, and the symmetrical picking hooks open and close synchronously to pick up and place the PCB located on the placement rack.

[0016] Preferably, the two ends of the slag-removing plate are rotatably installed in adjacent fixed frames, and both ends of the slag-removing plate are fixedly connected to connecting rods. The other end of the connecting rod is rotatably installed with a roller, and the roller abuts against the top surface of the fixed frame.

[0017] Preferably, the top surface of the fixed frame is slidably connected to a symmetrical pusher frame, one end of which abuts against a roller. After the downward frame is no longer pressed down, the pusher frame pushes the roller to return.

[0018] Preferably, the tin pool is divided into inner and outer layers, the inner layer of the tin pool is lower than the outer layer, there is a gap between the inner and outer layers for overflow recovery, and the tin pool is connected to the tin liquid filtration and circulation system in the frame.

[0019] The beneficial effects of this invention are as follows:

[0020] 1. In this invention, through the hook mechanism and the slag removal mechanism, as the hook mechanism lifts the PCB to be dipped and transports it to the top of the solder bath from the placement frame, the hook mechanism is driven to move downward by the moving mechanism. When the bottom surface of the side slide plate abuts against the top surface of the lowering frame, as the hook mechanism continues to move downward, the side slide plate drives the lowering frame and the slag removal plate to move downward. At this time, under the guidance of the connecting rod, the slag removal plate opens to both sides. As the slag removal plate moves downward, the oxides on the surface of the solder bath are pushed to both sides by the opened slag removal plate, thereby overflowing the solder bath. This ensures that oxides do not adhere to the pins during the dip soldering process, thus ensuring the dip soldering effect.

[0021] 2. As the lower frame abuts against the fixed frame, the side slide can no longer follow the hook housing downwards, causing the elastic element on the hook housing to compress. At this time, the side slide will move upwards relative to the hook housing, thus pushing the horizontal slider to move. As the distance between the relative horizontal sliders decreases, the middle section of the cable is pulled by the pressure mold. At this time, the pressure mold moves downwards and presses on the PCB board and the components above it, thus preventing the components from moving and causing problems with the soldering of the pins during the subsequent dip soldering process. Attached Figure Description

[0022] Figure 1 This is a side view of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the internal structure of the frame of the present invention;

[0024] Figure 3 This is a schematic cross-sectional view of the tin pool structure of the present invention;

[0025] Figure 4 This is a top view of the hook mechanism of the present invention;

[0026] Figure 5 This is a bottom view of the hook mechanism of the present invention;

[0027] Figure 6 This is a partial cross-sectional view of the hook mechanism of the present invention;

[0028] Figure 7 This is a schematic diagram of the slag removal mechanism of the present invention;

[0029] Figure 8 This is a schematic diagram of the hook mechanism of the present invention positioned directly above the tin bath.

[0030] In the diagram: 1. Frame; 11. Placement rack; 12. Flux nozzle; 13. Solder pool; 2. Moving mechanism; 21. Slide rail; 22. Screw slide; 23. Dual output motor; 3. Hook mechanism; 31. Top frame; 311. Slide rail; 32. Hook housing; 321. Picking hook; 33. Side slide; 34. Horizontal slider; 35. Cable; 36. Press mold; 4. Slag removal mechanism; 41. Fixed frame; 42. Lowering frame; 43. Slag removal plate; 44. Connecting rod; 441. Roller; 45. Pushback frame. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0032] like Figures 1 to 8 As shown, an embodiment of the present invention provides a soldering machine for preventing dip soldering misalignment, including a frame 1, on which a placement rack 11, a flux nozzle 12, and a solder pool 13 are fixedly connected, and further includes:

[0033] The moving mechanism 2 includes a slide rail 21 fixed to the table surface of the frame 1;

[0034] The hook mechanism 3 includes a top frame 31, a hook housing 32, a side slide plate 33, and a pressure mold 36. The side slide plate 33 is slidably connected to both sides of the hook housing 32. The hook mechanism 3 is driven to move by the moving mechanism 2.

[0035] The slag removal mechanism 4 includes a fixed frame 41, a lowering frame 42 and a slag removal plate 43. The slag removal plate 43 is positioned above the liquid surface of the tin bath 13 in the default state.

[0036] When the lowering frame 42 is pressed down by the side slide plate 33, the slag removal plate 43 opens to both sides to push the oxides on the surface of the molten tin pool 13 to both sides. After the lowering frame 42 abuts against the fixed frame 41, the side slide plate 33 slides upward and causes the pressing mold 36 to move downward to abut against the top surface of the PCB.

[0037] In this invention, through the hook mechanism 3 and the slag-removing mechanism 4, as the hook mechanism 3 lifts the PCB to be immersed in solder from the placement frame 11 and transports it directly above the solder pool 13, the hook mechanism 3 is driven downward by the moving mechanism 2. When the bottom surface of the side slide plate 33 abuts against the top surface of the lowering frame 42, as the hook mechanism 3 continues to move downward, the side slide plate 33 drives the lowering frame 42 and the slag-removing plate 43 to move downward. At this time, under the guidance of the connecting rod 44, the slag-removing plate 43 opens to both sides. As the slag-removing plate 43 moves downward, the oxides on the surface of the solder pool 13 are pushed to both sides by the opened slag-removing plate 43, thereby overflowing the solder pool 13, ensuring that oxides do not adhere to the pins during the immersion soldering process, thus ensuring... Dip soldering effect: As the lowering frame 42 abuts against the fixed frame 41, the side slide plate 33 can no longer follow the hook claw shell 32 to continue moving downward, thus compressing the elastic element (spring in the figure) on the hook claw shell 32. At this time, the side slide plate 33 will move upward relative to the hook claw shell 32, thus pushing the horizontal slider 34 to move. As the distance between the relative horizontal sliders 34 decreases, the middle section of the pull cable 35 is pulled by the pressure mold 36. At this time, the pressure mold 36 moves downward and presses on the PCB board and the components above it (the corresponding pressure mold 36 can be produced according to the position of the components in the production process). In the subsequent dip soldering process, the components are prevented from moving, which would cause problems with the soldering of the pins.

[0038] In this embodiment, the moving mechanism 2 also includes a lead screw slide 22 fixedly connected to the slider of the slide rail 21. The sliders of the two symmetrical lead screw slides 22 are fixedly connected to the top frame 31. The top ends of the two lead screw slides 22 are fixedly connected to a dual-output motor 23. The two output shafts of the dual-output motor 23 are respectively connected to the lead screws of the lead screw slides 22 on both sides.

[0039] like Figure 1 and Figure 2 As shown, the claw mechanism 3 is fixed between the two lead screw slides 22 of the moving mechanism 2. As the lead screw in the lead screw slide 22 rotates, the slider in the lead screw slide 22 moves up and down, thereby driving the claw mechanism 3 to move up and down. Using a dual-output motor 23 to drive the lead screw in the lead screw slides 22 on both sides to rotate can ensure that the claw mechanism 3 always remains in a horizontal state, ensuring that the component slots opened on the die 36 can correspond to the components below, and ensuring the accuracy of pressing down on the components.

[0040] In this embodiment, the fixed frame 41 is fixedly connected to the solder bath 13, the lower moving frame 42 is slidably connected to the fixed frame 41, and an elastic element is provided between the side slide plate 33 and the top frame 31. The elastic element is compressed only after the side slide plate 33 pushes the lower moving frame 42 to abut against the top surface of the fixed frame 41.

[0041] like Figures 4 to 6As shown, a sliding post is provided on the side slide plate 33, and a spring is fitted on the sliding post. The sliding post ensures the stability of the side slide plate 33 sliding up and down, while the spring ensures that the side slide plate 33 will only move relative to the hook claw shell 32 when the lower moving frame 42 is pushed and pressed against the fixed frame 41.

[0042] In this embodiment, the hook claw shell 32 is fixedly connected to the bottom surface of the top frame 31, and the pressure mold 36 is slidably connected to the inside of the hook claw shell 32.

[0043] like Figures 4 to 5 As shown, when taking the PCB board from the placement rack 11, it is only necessary to clamp the PCB with the pick-up hooks 321 on both sides to ensure that the PCB will not shake during the movement, thereby ensuring that the pressure mold 36 can accurately press on the component, ensuring that the component position will not shift after dip soldering. At the same time, due to the limiting of the pressure mold 36, the appearance of the soldered integrated circuits is the same, improving the product appearance.

[0044] In this embodiment, a slide rail 311 is fixedly connected inside the top frame 31, and a horizontal slider 34 is slidably connected inside the slide rail 311. The horizontal slider 34 has an inclined surface on the side facing the side slide plate 33. After the side slide plate 33 moves upward, the horizontal slider 34 is pushed towards the center line of the fixed frame 41. A pull cable 35 is fixedly connected between the symmetrical horizontal sliders 34. The pull cable 35 suspends the pressing mold 36 at the center of the hook claw shell 32. After the symmetrical horizontal sliders 34 move towards each other, the pressing mold 36 moves downward.

[0045] like Figures 4 to 6 As shown, since most components on the PCB are relatively lightweight, only a small downward pressure is needed to prevent them from being affected by the flowing solder. Relatively heavier components require even less downward pressure to fix them. Therefore, the mold 36 does not need to be designed to be too heavy. The slide 311 is equipped with a spring that abuts against the horizontal slider 34. Under the push of the springs on both sides, the horizontal sliders 34 on the same side move away from each other, thereby lifting the mold 36 upward. This allows the claw mechanism 3 to have sufficient space to pick up the PCB during the material handling stage, preventing the mold 36 from colliding with the components on the PCB and causing component misalignment. The specific displacement of the mold 36 as it moves downward by the horizontal sliders 34 on both sides can be adjusted according to the actual product requirements.

[0046] In this embodiment, the bottom surface of the hook shell 32 is slidably connected to multiple sets of symmetrical picking hooks 321. The symmetrical picking hooks 321 open and close synchronously to pick up and place the PCB located on the placement rack 11.

[0047] like Figure 5As shown, the bottom of the hook housing 32 has multiple hook slots, and the picking hook 321 is slidably connected in the hook slots (the picking hook 321 picking up the PCB from the placement rack 11 is a common design in the field, and will not be described in detail here). As the PCB is picked up by the picking hook 321, the pressure mold 36 is located directly above the PCB. When the pressure mold 36 moves down, it can press down the components on the PCB to avoid problems such as component movement during dip soldering.

[0048] In this embodiment, the two ends of the slag-removing plate 43 are respectively rotatably installed in adjacent fixed frames 41. Both ends of the slag-removing plate 43 are fixedly connected to connecting rods 44, and the other end of the connecting rods 44 is rotatably installed with rollers 441, which abut against the top surface of the fixed frame 41.

[0049] like Figure 2 and Figure 7 As shown, the slag removal plate 43 is in the default state at this time, that is, the hook mechanism 3 has not yet been driven by the moving mechanism 2 for dip soldering. At this time, the two slag removal plates 43 are in a closed state and are above the liquid surface of the solder pool 13. As the lower moving frame 42 is pushed downward by the side slide plate 33 in the hook mechanism 3, the lower end of the slag removal plate 43 is submerged in the solder pool 13 and gradually opens to both sides. As the slag removal plate 43 enters the solder pool 13 and opens, the molten solder in the solder pool 13 will overflow the solder pool 13 and flow to both sides. At this time, the oxide on the surface of the molten solder will flow to both sides with the movement of the slag removal plate 43 and overflow into the interior, thereby ensuring that no oxide adheres to the pins of the components during the subsequent dip soldering, ensuring the quality of the component and PCB solder joint.

[0050] In this embodiment, a symmetrical pusher frame 45 is slidably connected to the top surface of the fixed frame 41. One end of the pusher frame 45 abuts against the roller 441. After the lowering frame 42 is no longer pressed down, the pusher frame 45 pushes the roller 441 to return.

[0051] like Figure 7 As shown, after the dip soldering is completed, the moving mechanism 2 will first drive the hook mechanism 3 to move upward. As the hook mechanism 3 moves upward, the lower moving frame 42 will no longer be pressed down. The lower moving frame 42 will move upward again under the action of the spring set on its bottom surface. As the lower moving frame 42 moves upward, the push back frame 45 will also return under the drive of the spring it is fitted with. At this time, the push back frame 45 will push the roller 441 to roll along the top surface of the fixed frame 41 to ensure that the two slag removal plates 43 can rotate back to the initial retracted state, ensuring that the oxides on the surface of the molten solder are accurately removed in the next operation.

[0052] In this embodiment, the tin pool 13 is divided into inner and outer layers. The height of the inner layer of the tin pool 13 is lower than that of the outer layer. There is a gap between the inner and outer layers for recovering overflow. The tin pool 13 is connected to the tin liquid filtration and circulation system in the frame 1.

[0053] like Figure 3 As shown, in the actual immersion soldering process, it is necessary to ensure that the molten solder in the solder pool 13 is in a flowing state. On the one hand, this is to make the temperature of the bottom and top layers of the molten solder uniform (the heating components of the molten solder are usually set at the bottom of the solder pool 13). On the other hand, it is to ensure the homogenization of the composition of the molten solder and avoid the dispersion of solder joint performance. After the newly added solder bar melts, it needs time for the alloying elements in it to diffuse evenly. Finally, the flowing molten solder can reduce oxidation and the generation of solder dross (but cannot guarantee that it will not oxidize at all), thereby reducing cost losses.

[0054] Working principle:

[0055] When using this equipment for dip soldering, first place the PCB with the components already inserted on the placement rack 11. Then, the lead screw slide 22 of the moving mechanism 2 drives the hook mechanism 3 to move downward, so that the hook mechanism 3 grabs the PCB on the placement rack 11 (there are many solutions for PCB feeding in existing automated equipment). Then, the lead screw slide 22 drives the hook mechanism 3 to move upward to lift the PCB. Then, the moving mechanism 2 moves to the flux nozzle 12 behind and stops. After the flux is sprayed on the bottom of the PCB, the moving mechanism 2 drives the hook mechanism 3 to continue moving, so that the hook mechanism 3 moves directly above the slag removal mechanism 4.

[0056] After the hook mechanism 3 moves directly above the slag removal mechanism 4, as the hook mechanism 3 moves downward, when the side slide plate 33 contacts the lowering frame 42 and continues to move downward, the lowering frame 42 drives the slag removal plate 43 to move downward. At this time, the slag removal plate 43 will open to both sides while moving downward and inserting into the molten tin, thereby causing the molten tin at the top of the molten tin pool 13 to flow to both sides. At this time, the oxides floating on the molten tin will flow into the gap between the inner and outer layers of the molten tin pool 13 with the flowing molten tin, and be sent back to the molten tin pool 13 through the molten tin filtration and circulation system in the frame 1.

[0057] As the hook mechanism 3 continues to move downward, the side slide plate 33 cannot continue to move downward because the lowering frame 42 abuts against the top surface of the fixed frame 41. Instead, the inclined surface at the top of the side slide plate 33 contacts the inclined surface of the horizontal slider 34 and pushes the horizontal slider 34 to slide, thereby causing the two horizontal sliders 34 connected by the cable 35 to move towards each other. At this time, the pressure mold 36 moves towards each other under its own weight and presses on the components on the PCB, thereby applying downward pressure to the components and PCB to ensure that the PCB and components will not shake or shift due to the flowing solder during the dip soldering process, which would affect the soldering quality.

[0058] Once welding is complete, simply move the moving mechanism 2 to move the hook mechanism 3 upwards and back, and the various mechanisms will be reset under the action of the springs.

[0059] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A soldering machine for preventing dip soldering misalignment, comprising a frame (1), wherein a placement rack (11), a flux nozzle (12), and a solder pool (13) are fixedly connected to the table surface of the frame (1), characterized in that, Also includes: The moving mechanism (2) includes a slide rail (21) fixed on the table surface of the frame (1). The hook mechanism (3) includes a top frame (31), a hook shell (32), a side slide plate (33) and a pressure mold (36). The side slide plate (33) is slidably connected to both sides of the hook shell (32). The hook mechanism (3) is driven to move by the moving mechanism (2). The slag removal mechanism (4) includes a fixed frame (41), a lowering frame (42) and a slag removal plate (43), which is positioned above the liquid surface of the tin bath (13) in the default state. When the lowering frame (42) is pressed down by the side slide plate (33), the slag removal plate (43) opens to both sides to push the oxides on the surface of the tin pool (13) to both sides. After the lowering frame (42) abuts against the fixed frame (41), the side slide plate (33) slides upward and causes the mold (36) to move downward to abut against the top surface of the PCB. The fixed frame (41) is fixedly connected to the tin bath (13), the lower moving frame (42) is slidably connected to the fixed frame (41), and an elastic element is provided between the side slide plate (33) and the top frame (31). The elastic element is compressed after the side slide plate (33) pushes the lower moving frame (42) to abut against the top surface of the fixed frame (41). The top frame (31) is fixedly connected to a slide rail (311), and a horizontal slider (34) is slidably connected inside the slide rail (311). The horizontal slider (34) has an inclined surface on the side facing the side slide plate (33). After the side slide plate (33) moves upward, the horizontal slider (34) is pushed towards the center line of the fixed frame (41). A cable (35) is fixedly connected between the symmetrical horizontal sliders (34). The cable (35) suspends the mold (36) at the center of the claw shell (32). After the symmetrical horizontal sliders (34) move towards each other, the mold (36) moves downward.

2. The soldering machine of claim 1, wherein: The moving mechanism (2) also includes a screw slide (22) fixedly connected to the slider of the slide rail (21). The sliders of the two symmetrical screw slides (22) are fixedly connected to the top frame (31). The top ends of the two screw slides (22) are fixedly connected to a dual-output motor (23). The two output shafts of the dual-output motor (23) are respectively connected to the screw drive of the two screw slides (22) on both sides.

3. The soldering machine of claim 1, wherein: The hook shell (32) is fixedly connected to the bottom surface of the top frame (31), and the mold (36) is slidably connected inside the hook shell (32).

4. The soldering machine of claim 1, wherein: The bottom surface of the hook shell (32) is slidably connected to multiple sets of symmetrical picking hooks (321), and the symmetrical picking hooks (321) open and close synchronously to pick up and place the PCB located on the placement rack (11).

5. The soldering machine of claim 1, wherein: The two ends of the slag-removing plate (43) are respectively rotatably installed in adjacent fixed frames (41). Both ends of the slag-removing plate (43) are fixedly connected to connecting rods (44). The other end of the connecting rods (44) is rotatably installed with rollers (441), and the rollers (441) abut against the top surface of the fixed frames (41).

6. The soldering machine of claim 5, wherein: The top surface of the fixed frame (41) is slidably connected to a symmetrical pusher frame (45). One end of the pusher frame (45) abuts against the roller (441). After the lowering frame (42) is no longer pressed down, the pusher frame (45) pushes the roller (441) back.

7. The soldering machine of claim 1, wherein: The tin pool (13) is divided into inner and outer layers. The height of the inner layer of the tin pool (13) is lower than that of the outer layer. There is a gap for overflow recovery between the inner and outer layers. The tin pool (13) is connected to the tin liquid filtration and circulation system in the frame (1).

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