Carrier tape for packaging semiconductor elements

Abstract

The utility model discloses a carrier tape for packaging semiconductor elements, which comprises a carrier tape body, a plurality of holes arranged at the top of the carrier tape body, grooves arranged on two side walls of the carrier tape body, fixing shafts arranged on the side walls of the grooves, connecting rods rotatably connected to the outer walls of the circumferences of the fixing shafts, limiting plates arranged at one ends of the connecting rods, and shifting plates arranged at the other ends of the connecting rods. The bottom of the connecting rod is provided with an elastic block located on the side wall of the carrier tape body, the side wall of an inner cavity of each hole is provided with a dismounting assembly, and the side walls of the two sides of the carrier tape body are each provided with a plurality of pushing holes. The semiconductor element is installed in the hole, the shifting plate is loosened, and the connecting rod is driven to rotate through resilience force of the elastic block, so that the limiting plate is reset to limit the semiconductor element, the stability of the semiconductor element is improved, and the semiconductor element is taken out more conveniently through the dismounting assembly.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of packaging carrier tape, specifically to a carrier tape for semiconductor element packaging. BACKGROUND

[0002] Carrier tape refers to a strip-shaped product applied to the field of electronic packaging, and is mainly applied to the industry of electronic component mounting, which is used in combination with cover tape to load and store resistors, capacitors, transistors, diodes and other electronic components in the pockets of the carrier tape, and forms a closed package by sealing the cover tape above the carrier tape to protect the electronic components from being contaminated and damaged during transportation.

[0003] The patent document with the publication number CN211845659U disclosed in the prior art provides: a carrier tape for semiconductor mounting, which comprises a side wall body, a bottom wall body and a boss fixedly connected with the carrier tape body, the boss protrudes from the bottom wall body and protrudes inwardly of the cavity, can be used for carrying electronic components, the area of the bottom except the boss is reversely protruding, when the bottom of the hole is extruded, the reversely protruding bottom wall body will be extruded first, can play a certain buffering effect, avoid the directly extruded electronic components installed inside, compared with the existing hole structure, can form protection for components.

[0004] Although the device has many beneficial effects, it still has the following problems: during the use of the device, the semiconductor element mounting stability is insufficient, and it is easy to fall off; secondly, the semiconductor element is not convenient to take down during the use of the device, and the use is not convenient enough, which needs to be improved, in view of this, we propose a carrier tape for semiconductor element packaging. SUMMARY

[0005] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part and the abstract of the specification and the utility model name to avoid obscuring the purpose of this part, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0006] 1. Technical problems to be solved:

[0007] In order to solve the problems of insufficient semiconductor element mounting stability, easy to fall off and inconvenient to take down the semiconductor element, the utility model is proposed.

[0008] Therefore, the purpose of the utility model is to provide a carrier tape for semiconductor element packaging, which can improve the mounting stability of semiconductor elements, is not easy to fall off, and is convenient for taking down the semiconductor elements.

[0009] 2. Technical scheme:

[0010] To solve the above technical problems, according to one aspect of the present application, the present application provides the following technical scheme:

[0011] A kind of semiconductor element packaging carrier tape, it includes carrier tape body, the plurality of holes are set in the top of the carrier tape body, the plurality of limiting components are arranged on the two side walls of the carrier tape body, the limiting component includes the groove set in the side wall of the carrier tape body, the fixed shaft is arranged on the side wall of the groove, the connecting rod is rotatably connected to the circumferential outer wall of the fixed shaft, the limiting plate is arranged on one end of the connecting rod, the push plate is arranged on the other end of the connecting rod, the elastic block is arranged on the bottom of the connecting rod and located in the side wall of the carrier tape body, the disassembly component is arranged on the side wall of the hole inner cavity, the plurality of advancing holes are set in the two side walls of the carrier tape body.

[0012] As a preferred scheme of the semiconductor element packaging carrier tape of the present application, wherein the disassembly component includes the push plate, the grooves are set in the two side walls of the hole inner cavity, the sliding blocks are slidably connected to the inner walls of the two grooves, the connecting blocks are arranged on the side walls of the push plate and located on the side walls of the two sliding blocks, the through hole is set in the bottom of the hole.

[0013] As a preferred scheme of the semiconductor element packaging carrier tape of the present application, wherein the material of the carrier tape body is ABS, and the material of the elastic block is nitrile rubber.

[0014] As a preferred scheme of the semiconductor element packaging carrier tape of the present application, wherein the limiting plate is arranged on one side of the top of the hole, and one end of the bottom of the connecting rod is inclined.

[0015] As a preferred scheme of the semiconductor element packaging carrier tape of the present application, wherein the size of the push plate matches the size of the bottom of the hole, and the size and position of the groove match the size and position of the sliding block.

[0016] As a preferred scheme of the semiconductor element packaging carrier tape of the present application, wherein the size of the top of the hole is larger than the size of the bottom, and the through hole penetrates the bottom of the carrier tape body.

[0017] 3. Beneficial effects:

[0018] Compared with the prior art, the present application has the beneficial effects that:

[0019] The semiconductor element packaging carrier tape, by pressing the push plate to drive the connecting rod to rotate around the fixed shaft, so that the limiting plate is separated from the top of the hole, the semiconductor element is installed into the hole, the push plate is loosened, the elastic block is driven to rotate the connecting rod by the elastic force, so that the limiting plate is reset to limit the semiconductor element, and the stability of the semiconductor element is improved.

[0020] The semiconductor element packaging carrier tape, when the semiconductor element needs to be taken out, the push plate is pushed through the through hole, the connecting block drives the sliding block to slide in the inner wall of the sliding groove, so that the semiconductor element is lifted for convenient disassembly, and the push plate falls to close the through hole, thereby avoiding impurities from entering and polluting the semiconductor element. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the present application will be described in detail below in conjunction with the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor. Among them:

[0022] Figure 1 It is a whole structure schematic diagram of the semiconductor element packaging carrier tape of the present application;

[0023] Figure 2 It is a carrier tape body structure schematic diagram of the semiconductor element packaging carrier tape of the present application;

[0024] Figure 3 It is a split schematic diagram of the limiting assembly structure of the semiconductor element packaging carrier tape of the present application;

[0025] Figure 4 It is a cross-sectional schematic diagram of the disassembly assembly structure of the semiconductor element packaging carrier tape of the present application.

[0026] Explanation of reference numerals in the drawings: 1, carrier tape body; 2, hole; 3, limiting assembly; 4, disassembly assembly; 5, push hole; 301, groove; 302, fixed shaft; 303, connecting rod; 304, limiting plate; 305, push plate; 306, elastic block; 401, push plate; 402, sliding groove; 403, sliding block; 404, connecting block; 405, through hole. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below in conjunction with the drawings.

[0028] The present application is described in detail in conjunction with the schematic diagram, and in the detailed description of the embodiments of the present application, the cross-sectional view of the device structure will be partially enlarged without general proportion for convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, three-dimensional spatial dimensions including length, width and depth should be included in actual manufacture.

[0029] The positional relationship indicated in the terms is based on the positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0030] The connection mode in the terms should be understood broadly, for example, "connection" can be fixed connection, can be detachable connection, or integral connection; can be mechanical connection, can be electrical connection; can be directly connected, can be indirectly connected through an intermediate medium, and can be internal communication of two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0031] The embodiments of the utility model will be described in further detail below with reference to the drawings.

[0032] The utility model provides a kind of whole structure schematic diagram of the embodiment of semiconductor element packaging carrier tape, including:

[0033] Please refer to Figures 1-4 , a kind of semiconductor element packaging carrier tape of the embodiment, including carrier tape body 1, multiple holes 2 are set in the top of carrier tape body 1, multiple limiting assemblies 3 are rotatably connected to the two side walls of carrier tape body 1, limiting assembly 3 includes the recess 301 being set in the side wall of carrier tape body 1, fixed shaft 302 is fixedly arranged on the side wall of recess 301, connecting rod 303 is rotatably connected to the circumferential outer wall of fixed shaft 302, limiting plate 304 is fixedly arranged on one end of connecting rod 303, and knob 305 is fixedly arranged on the other end of connecting rod 303, and elastic block 306 is fixedly arranged on the bottom of connecting rod 303 and located in the side wall of carrier tape body 1, disassembly assembly 4 is slidably connected to the inner cavity side wall of hole 2, multiple push holes 5 are set in the two side walls of carrier tape body 1, connecting rod 303 is rotated around fixed shaft 302 by pressing knob 305, so that limiting plate 304 is separated from the top of hole 2, semiconductor element is installed into the inside of hole 2, knob 305 is loosened, connecting rod 303 is rotated by the rebound force of elastic block 306, so that limiting plate 304 resets and limits semiconductor element, improve the stability of semiconductor element.

[0034] It is worth mentioning that in order to facilitate the removal of the semiconductor element, specifically, the disassembly assembly 4 includes a push plate 401, the inner cavity of the groove 301 is provided with a sliding groove 402 on both side walls, the inner wall of the two sliding grooves 402 is slidably connected with a sliding block 403, the side wall of the two sliding blocks 403 is fixedly provided with a connecting block 404 located on the side wall of the push plate 401, and the bottom of the hole 2 is provided with a through hole 405. When the semiconductor element needs to be taken out, the push plate 401 is pushed through the through hole 405, the connecting block 404 drives the sliding block 403 to slide on the inner wall of the sliding groove 402, so that the semiconductor element is lifted for easy disassembly, and the push plate 401 falls to close the through hole 405, avoiding impurities from entering and contaminating the semiconductor element.

[0035] Next, in order to improve the performance of the carrier tape body 1, specifically, the material of the carrier tape body 1 is ABS, and the material of the elastic block 306 is nitrile rubber. ABS plastic is a terpolymer of acrylonitrile (A), butadiene (B), and styrene (S). ABS plastic has the common properties of the three components, and has excellent mechanical and thermal properties. The elastic modulus is 2.2 GPa, and the performance is stable in the range of -40~100℃. A makes it resistant to chemical corrosion, heat resistant, and has a certain surface hardness. B makes it have high elasticity and toughness. S makes it have the processing and molding characteristics of thermoplastic plastic and improves the electrical properties. Through the nitrile rubber material of the elastic block 306, the resilience is improved to drive the connecting rod 303 to reset.

[0036] At the same time, in order to better limit the semiconductor element, specifically, the limiting plate 304 is arranged on one side of the top of the hole 2, and one end of the bottom of the connecting rod 303 is inclined. By arranging the limiting plate 304 on one side of the top of the hole 2, it is convenient to adapt to the position of the semiconductor element. By the inclined connecting rod 303 at one end of the bottom, the rotation of the connecting rod 303 is avoided.

[0037] Further, in order to avoid shaking, specifically, the size of the push plate 401 matches the size of the bottom of the hole 2, and the size and position of the sliding groove 402 match the size and position of the sliding block 403. By matching the size and position of the sliding groove 402 with the sliding block 403, it is convenient to make the push plate 401 move more smoothly, and prevent the semiconductor element from sliding and falling.

[0038] Finally, in order to facilitate the operation of the staff, specifically, the size of the top of the hole 2 is larger than the size of the bottom, and the through hole 405 penetrates the bottom of the carrier tape body 1. By the hole 2 with the top size larger than the bottom size, it is convenient to clamp the semiconductor element and improve the stability. By the penetrating through hole 405, it is convenient for the staff to push the push plate 401 from the bottom.

[0039] In combination Figures 1-4 , the carrier tape for packaging semiconductor elements of the embodiment is used as follows:

[0040] 1: According to actual use, the elastic block 306 is installed at the bottom of the connecting rod 303, the side wall of the elastic block 306 is installed at the side wall of the carrier tape body 1, the pressing plate 305 drives the connecting rod 303 to rotate around the fixed shaft 302, the connecting rod 303 extrudes the elastic block 306, the limiting plate 304 is rotated to be separated from the top of the hole 2, the semiconductor element is installed into the hole 2, the pressing plate 305 is loosened, the elastic block 306 drives the connecting rod 303 to rotate by the elastic force, so that the limiting plate 304 is reset to limit the semiconductor element;

[0041] 2: When the semiconductor element needs to be taken out, the push plate 401 is pushed through the through hole 405, the connecting block 404 drives the sliding block 403 to slide in the inner wall of the sliding groove 402, so that the semiconductor element is taken out, and the push plate 401 falls to close the through hole 405.

[0042] Although the utility model has been described above with reference to the embodiments, various improvements can be made to it and equivalent parts can be substituted for the parts thereof without departing from the scope of the utility model. In particular, as long as there is no structural conflict, each feature in the embodiments disclosed by the utility model can be combined with each other in any way, and the combinations are not exhaustively described in the specification only for the consideration of omitting the length and saving the resources. Therefore, the utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A carrier tape for packaging semiconductor elements, characterized by comprising: The utility model provides a kind of carrier tape body (1), it is characterized by: the plurality of holes (2) are set in the top of the carrier tape body (1), the plurality of limiting components (3) are set in the two side walls of the carrier tape body (1), the limiting component (3) includes the recess (301) set in the side wall of carrier tape body (1), the fixed shaft (302) is set in the side wall of the recess (301), the connecting rod (303) is rotatably connected on the circumferential outer wall of the fixed shaft (302), the limiting plate (304) is set in one end of the connecting rod (303), the push plate (305) is set in the other end of the connecting rod (303), the elastic block (306) is set in the bottom of the connecting rod (303) and is located in the side wall of carrier tape body (1), the disassembly component (4) is set in the hole (2) inner wall, the plurality of advancing holes (5) are set in the two side walls of the carrier tape body (1).

2. The tape according to claim 1, wherein The disassembly component (4) includes push plate (401), the recess (301) inner wall is set with the sliding slot (402) in the two side walls, the sliding block (403) is slidably connected in the inner wall of two sliding slots (402), the connecting block (404) is set in the side wall of push plate (401) in the side wall of two sliding blocks (403), the through hole (405) is set in the bottom of hole (2).

3. The tape according to claim 2, wherein The material of the carrier tape body (1) is ABS, and the material of the elastic block (306) is nitrile rubber.

4. The tape according to claim 3, wherein The limiting plate (304) is arranged on one side of the top of the hole (2), and one end of the bottom of the connecting rod (303) is inclined.

5. The tape according to claim 4, wherein The size of the push plate (401) matches the size of the bottom of the hole (2), and the size and position of the sliding slot (402) match the size and position of the sliding block (403).

6. The tape according to claim 5, wherein The size of the top of the hole (2) is larger than the size of the bottom, and the through hole (405) penetrates the bottom of the carrier tape body (1).

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