Buffer isolation ring and wafer box

Abstract

The utility model discloses a buffer isolation ring and a wafer box, the edge of a disc body is provided with a supporting surface, the supporting surface is used for placing a wafer, a plurality of buffer members are arranged on the disc body, and the buffer members are elastic; the number of the buffer isolation rings is multiple, when the multiple buffer isolation rings are stacked together, the multiple buffer pieces of the buffer isolation ring on the upper layer extend to the buffer isolation ring on the lower layer, the multiple buffer pieces abut against the edge of the wafer, the position of the wafer is limited and fixed, and under the buffer force provided by the elastic buffer pieces, the wafer can be prevented from falling off. The safety during carrying is effectively improved, and the risk of wafer breakage is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field especially, relates to a buffer isolation ring and wafer box. BACKGROUND

[0002] The wafer isolation ring on the market can simply isolate the wafer loaded in the wafer box, and the shaking force generated during wafer transportation makes the support of the wafer unstable, leading to the risk of wafer cracking. In addition, the ordinary wafer isolation ring has a large contact area with the wafer, which causes the wafer to generate particles, thereby affecting the quality and yield of semiconductor manufacturing. Therefore, the ordinary wafer isolation ring is slightly lacking in protection of the wafer. SUMMARY

[0003] The utility model aims at the technical problem existing in the background art and provides a buffer isolation ring.

[0004] To achieve the above technical purpose, the utility model adopts the following technical scheme in the first aspect:

[0005] A buffer isolation ring for placing a wafer, the buffer isolation ring comprising a disc body and a plurality of buffer members, the disc body having a support surface at its edge for placing the wafer, and the plurality of buffer members being arranged on the disc body and having elasticity; wherein the buffer isolation ring is provided with a plurality of buffer isolation rings, when the plurality of buffer isolation rings are stacked together, the plurality of buffer members of the upper buffer isolation ring extend to the lower buffer isolation ring, and the plurality of buffer members abut against the edge of the wafer.

[0006] Preferably, the disc body edge extends outwardly with a plurality of protrusions.

[0007] Preferably, the protrusions are provided with support lugs for supporting the upper buffer isolation ring.

[0008] Preferably, the disc body is provided with a plurality of notches, the plurality of notches correspond to the plurality of protrusions respectively, the plurality of buffer members are installed in the plurality of notches respectively, the first end of the buffer member is fixedly connected to the inner wall of the notch near the center of the disc body, and the second end of the buffer member extends out of the notch and is placed below the disc body.

[0009] Preferably, the buffer member comprises an extension and an abutting portion, one end of the extension is fixedly connected to the inner wall of the notch near the center of the disc body, and the other end of the extension is fixedly connected to the abutting portion, when the plurality of buffer isolation rings are stacked together, the end of the abutting portion extends to abut against the edge of the wafer.

[0010] Preferably, the extension and the abutting portion both have slopes, and the slope of the abutting portion is larger than that of the extension.

[0011] Preferably, the support surface comprises a first surface and a second surface, the first surface serving as the edge of the buffer isolation ring and used for placing the wafer, and the second surface being connected with the first surface and extending towards the center of the disc body.

[0012] Preferably, the second surface is designed as an inclined surface, and a plurality of grooves are arranged on the second surface.

[0013] The utility model discloses a wafer box in the second aspect adopts the technical scheme as follows:

[0014] Compared with the prior art, the utility model has the following beneficial technical effects: the support surface is arranged at the edge of the disc body and used for placing the wafer, a plurality of buffer members are arranged on the disc body, and the buffer members are elastic; wherein, the buffer isolation ring is provided with a plurality of buffer isolation rings, when the plurality of buffer isolation rings are stacked together, the plurality of buffer members of the upper buffer isolation ring extend to the lower buffer isolation ring, the plurality of buffer members abut against the edge of the wafer, the position of the wafer is limited and fixed, under the buffering force provided by the elastic buffer members, the safety during transportation is effectively improved, and the risk of wafer breakage is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is an assembly state explosion schematic view of the utility model embodiment;

[0016] Figure 2 It is a structure state schematic view of the utility model embodiment;

[0017] Figure 3 It is Figure 2 It is a partial enlarged view of A part in the middle;

[0018] Figure 4 It is a use state schematic view of the disc body stacking in the utility model embodiment;

[0019] Figure 5 It is Figure 4 It is a sectional view of B-B part in the middle;

[0020] Figure 6 It is Figure 5 It is a partial enlarged view of C part in the middle.

[0021] REFERENCE SIGNS

[0022] 100 disc body, 101 support surface, 1011 first surface, 1012 second surface, 1013 groove, 102 protrusion, 103 support block, 104 slot, 200 buffer member, 201 extension, 202 abutting portion. DETAILED DESCRIPTION

[0023] It should be noted that the embodiments in the utility model and the features in the embodiments can be combined with each other without conflict.

[0024] In the description of the utility model, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the orientation or positional relationship shown based on the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the device or group indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0025] In the description of the utility model, it needs to be understood that the terms "mounting", "connection", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be connected, or it can be specifically connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be connected between two groups. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0026] The specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0027] As Figures 1-6 shown, the utility model discloses a buffer isolation ring for placing wafer, which comprises a disc body 100 and a plurality of buffer pieces 200, the edge of the disc body 100 is provided with a supporting surface 101, the supporting surface 101 is used to place wafer, the plurality of buffer pieces 200 are arranged on the disc body 100, and the buffer piece 200 has elasticity;Wherein, the buffer isolation ring is provided with a plurality of, when the plurality of buffer isolation rings are stacked together, the plurality of buffer pieces 200 of the last buffer isolation ring extend to the next buffer isolation ring, and the plurality of buffer pieces 200 abut against the edge of wafer.

[0028] Specifically, the overall structure of the disc body 100 presents annular, the middle is hollow design, the edge of the disc body 100 is provided with a supporting surface 101, i.e. annular surface, the plurality of buffer pieces 200 extend to the next buffer isolation ring from the last buffer isolation ring when the plurality of buffer isolation rings are stacked together, and the plurality of buffer pieces 200 abut against the edge of wafer, as shown in the accompanying Figure 6 In this embodiment, the plurality of buffer pieces 200 are uniformly mounted on the disc body 100, as shown in the accompanyingFigure 2 As shown, the outer contour of the wafer on the next layer of buffer isolation ring can be contacted. While ensuring that the wafer is limited and fixed, the wafer is limited to a position closer to the center of the disk 100. Since the disk 100 is ring-shaped, the contact area between the wafer and the support surface 101 will be reduced accordingly, or the contact surface will be controlled at the edge of the wafer. This avoids the wafer from shaking and moving laterally, and also reduces the particles generated on the wafer. Furthermore, since the buffer 200 has a certain degree of elasticity, it can provide a certain buffering effect while fixing and limiting the wafer, thereby improving the safety of the wafer during transportation and avoiding the risk of wafer breakage.

[0029] Furthermore, multiple protrusions 102 extend outward from the edge of the disk body 100, and support protrusions 103 are provided on the protrusions 102. The support protrusions 103 are used to support the buffer isolation ring of the upper layer.

[0030] In this embodiment, the monkey-shaped protrusion 102 has 18 protrusions, which are evenly distributed on the outer contour of the disc body 100, as shown in the attached figure. Figure 1 As shown, when the wafer isolation ring is placed into the wafer transport box, the external limiting protrusion structure will be locked at the notch in the receiving cavity wall of the wafer transport box, ensuring that the isolation ring is fixed in the wafer transport and no longer rotates, effectively and securely installing the wafer in the wafer transport box.

[0031] Furthermore, the disk body 100 is provided with a plurality of slots 104, which correspond to a plurality of protrusions 102 respectively. A plurality of buffer members 200 are respectively installed in the plurality of slots 104. The first end of the buffer member 200 is fixedly connected to the inner wall of the slot 104 near the center of the disk body 100, and the second end of the buffer member 200 extends out of the slot 104 and is placed below the disk body 100.

[0032] Specifically, multiple protrusions 102, supporting protrusions 103, slots 104, and buffers 200 form a structural assembly. Specifically, slots 104 are provided on the protrusions 102, and supporting protrusions 103 are provided on the protrusions 102 on the side furthest from the center of the disk body 100, as shown in the attached diagram. Figure 3 As shown, a pair of support protrusions 103 are provided to better support the upper layer of buffer isolation rings. A buffer member 200 is provided on the inner wall of the slot 104 near the center of the disk body 100. The second end of the buffer member 200 extends out of the slot 104 and is positioned below the disk body 100, as shown in the attached figure. Figure 3 and appendix Figure 6 As shown, if there is a buffer isolation ring in the next layer, the first segment of the buffer 200 will rise to the slot 104 of the next layer and abut against the outer contour of the wafer in the next layer to limit the wafer to a designated position, reduce the contact area between the wafer and the support surface 101, and reduce the particles generated on the wafer.

[0033] Further, the buffer 200 comprises an extension 201 and a contact portion 202, one end of the extension 201 is fixedly connected with the inner wall close to the center of the disc body 100 in the notch 104, the other end of the extension 201 is fixedly connected with the contact portion 202, when a plurality of buffer isolation rings are stacked together, the end of the contact portion 202 extends to contact the edge of the wafer;

[0034] The extension 201 and the contact portion 202 both have slopes, and the slope of the contact portion 202 is larger than that of the extension 201.

[0035] Specifically, the entire buffer 200 actually presents a half Y-shaped spring structure, when the wafer is placed on the support surface 101 of the buffer isolation ring, the wafer is limited on the support surface 101 by the cooperation of the support protrusion 103 and the tail of the upper buffer 200, so as to avoid the wafer from shaking and moving horizontally, and at the same time, the buffer 200 can provide a buffering force to protect the loaded wafer in the wafer transportation process, and avoid the risk of wafer breakage.

[0036] Further, the support surface 101 comprises a first surface 1011 and a second surface 1012, the first surface 1011 serves as the edge of the buffer isolation ring and is used for placing the wafer, the second surface 1012 is connected with the first surface 1011 and extends towards the center of the disc body 100, the second surface 1012 is designed as an inclined surface, and a plurality of grooves 1013 are arranged on the second surface 1012.

[0037] Specifically, when the wafer is placed on the first surface 1011, the tail of the buffer 200 limits the wafer at this position, reduces the contact area of the wafer with the plane, and reduces the generation of particulate matters of the wafer, and the design of the grooves 1013 facilitates the use in the industry, so that the mechanical hand can pick up the wafer ring through the plane to the next process, and adapts to the development of industrial intelligentization.

[0038] The utility model provides a wafer box in the second aspect, including the buffer isolation ring of any one of the above scheme.

[0039] The above is one or more embodiments provided in combination with specific content, and the specific implementation of the utility model is not limited to these descriptions. Any approximation, similarity or replacement of the method and structure of the utility model, or any technical deduction or replacement under the concept of the utility model, should be regarded as the protection range of the utility model.

Claims

1. A buffer isolation ring for placing a wafer, characterized in that, The buffer isolation ring includes: A disk body (100) is provided with a support surface (101) at the edge of the disk body (100), and the support surface (101) is used to place the wafer; Multiple buffers (200) are disposed on the disk body (100), and the buffers (200) are elastic; The buffer isolation ring is provided in multiple ways. When multiple buffer isolation rings are stacked together, multiple buffer elements (200) of the upper layer buffer isolation ring extend to the lower layer buffer isolation ring, and multiple buffer elements (200) abut against the edge of the wafer.

2. The buffer isolation ring according to claim 1, characterized in that, The disc body (100) has multiple protrusions (102) extending outward from its edge.

3. A buffer isolation ring according to claim 2, characterized in that, The protrusion (102) is provided with a support protrusion (103), which is used to support the buffer isolation ring of the upper layer.

4. A buffer isolation ring according to claim 3, characterized in that, The disc body (100) is provided with a plurality of slots (104), each slot (104) corresponding to a plurality of protrusions (102). A plurality of buffer members (200) are respectively installed in the plurality of slots (104). The first end of the buffer member (200) is fixedly connected to the inner wall of the slot (104) near the center of the disc body (100). The second end of the buffer member (200) extends out of the slot (104) and is placed below the disc body (100).

5. A buffer isolation ring according to claim 4, characterized in that, The buffer (200) includes an extension (201) and an abutment (202). One end of the extension (201) is fixedly connected to the inner wall of the slot (104) near the center of the disk (100), and the other end of the extension (201) is fixedly connected to the abutment (202). When multiple buffer isolation rings are stacked together, the end of the abutment (202) extends to abut against the edge of the wafer.

6. A buffer isolation ring according to claim 5, characterized in that, Both the extension (201) and the contact portion (202) have a slope, and the slope of the contact portion (202) is greater than the slope of the extension (201).

7. A buffer isolation ring according to claim 1, characterized in that, The support surface (101) includes a first surface (1011) and a second surface (1012). The first surface (1011) serves as the edge of the buffer isolation ring and is used to place the wafer. The second surface (1012) is connected to the first surface (1011) and extends toward the center of the disk body (100).

8. A buffer isolation ring according to claim 7, characterized in that, The second surface (1012) is designed with an angle, and multiple grooves (1013) are provided on the second surface (1012).

9. A wafer cassette, characterized in that, Includes a buffer isolation ring as described in any one of claims 1-8.

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