Resistor electroplating equipment for thick film chip resistor
By designing a rolling and conductive mechanism, and using a motor to drive an eccentric fixture to rotate and conduct current in the electroplating solution, the problem of poor electroplating effect is solved, and full electroplating of the two poles of the resistor is achieved, thus improving the quality of the resistor.
Patent Information
- Application Number
- CN202423050540.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-11
AI Technical Summary
Existing electroplating equipment has difficulty forming electrode layers with good conductivity on the two poles of thick film wafer resistors, which affects the quality of the resistors.
The system employs a rolling mechanism and a conductive mechanism. The eccentric fixture is driven by a motor to roll and rotate eccentrically around the second rotating shaft, so that the resistive substrate continuously contacts the electroplating solution. The current is conducted through the conductive ball and the limiting rod to ensure a sufficient electroplating effect.
This improves the electroplating effect, ensures sufficient electroplating on both sides of the resistor substrate, and enhances the quality and practicality of the resistor.
Smart Images
Figure CN223674794U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of electroplating equipment, especially relates to a resistance electroplating equipment for thick film chip resistor. BACKGROUND
[0002] Thick film chip resistor is a kind of common electronic component, is widely used in various electronic equipment, especially in the application requiring miniaturization, high reliability and stability, its structure usually includes a ceramic substrate (usually alumina substrate), its surface is coated with thick film resistance material, and the working principle of thick film resistor is to control current flow through resistance layer on substrate, to realize the proportional relationship between voltage and current.
[0003] But when manufacturing thick film chip resistor, the two ends of its resistance substrate need to be electroplated to form a deposited electrode layer for providing electrical contact and ensuring that the resistor can be effectively connected with circuit, and part of electroplating device structure is relatively simple, when resistance substrate is driven for electroplating by jig, the electroplating effect is low, and it is difficult to form electrode layer with good conductive effect on the two poles of resistor, which will affect the quality of thick film chip resistor to some extent. UTILITY MODEL CONTENTS
[0004] The utility model discloses a resistance electroplating equipment for thick film chip resistor, be provided with rolling mechanism by setting, utilize motor drive, drive eccentric jig and make it be eccentric rolling rotation around second pivot, make its resistance substrate contact electroplating solution constantly, vibrate on electroplating solution level liquid surface, and the two poles of resistance substrate are fully electroplated, solve the problem that part of electroplating device structure is relatively simple, and it is difficult to form electrode layer with good conductive effect on the two poles of resistor.
[0005] To solve the above technical problems, the utility model is realized by the following technical schemes:
[0006] The utility model discloses a resistance electroplating equipment for thick film chip resistor, including electroplating pool, be provided with rolling mechanism and conductive mechanism on the electroplating pool;
[0007] The rolling mechanism includes drive assembly, meshing assembly and electroplating assembly, the drive assembly includes the butt joint plate being set on the electroplating pool, the bottom surface of the butt joint plate is opened and is equipped with the recess, the inner wall of the recess is fixedly connected with motor, the output of motor is fixedly connected with first pivot, the right -hand member of first pivot is rotatably connected with the inner wall of recess, the outer wall of first pivot is fixedly connected with two first gear, the bottom surface of butt joint plate is fixedly connected with a plurality of fixed plates.
[0008] Further, the engaging assembly comprises connecting shafts rotationally connected to inner walls of the middle two fixing plates, and the two connecting shafts are fixedly connected with second gears at their ends away from each other, and the two second gears are in mesh with the first gear.
[0009] Further, the fixing plates are rotationally connected with two second rotating shafts at their sides close to each other, outer walls of the two second rotating shafts are fixedly connected with third gears, and the two third gears are in mesh with the second gears.
[0010] Further, the electroplating assembly comprises eccentric jigs fixedly connected to outer walls of the two second rotating shafts, outer walls of the two eccentric jigs are provided with a plurality of fixing grooves, outer walls of the two eccentric jigs are fixedly connected with a plurality of conductive balls, and inner walls of the a plurality of fixing plates are fixedly connected with a plurality of limiting rods.
[0011] Further, the conductive mechanism comprises an insulating assembly and a conductive assembly, the insulating assembly comprises a plurality of limiting blocks fixedly connected to a top surface of the electroplating tank, and inner walls of the electroplating tank are fixedly connected with two horizontal plates.
[0012] Further, inner walls of the a plurality of limiting blocks are slidingly connected with support columns, and outer walls of the a plurality of support columns are fixedly connected with two connecting strips.
[0013] Further, the conductive assembly comprises two support plates fixedly connected to left and right sides of the receiving plate, the two support plates are fixedly connected with the two support columns at their sides away from each other, and the two support plates are fixedly connected with a plurality of conductive rods at their sides close to each other.
[0014] The utility model has the advantages of the following beneficial effects:
[0015] 1. The rolling mechanism is provided, the motor is driven, a plurality of gears are matched, the eccentric jig is driven to roll and rotate around the second rotating shaft in an eccentric manner, the resistance substrate continuously contacts the electroplating solution, the two poles of the resistance substrate are fully electroplated, the electroplating effect of the device is improved to a certain extent, and the practicability is improved.
[0016] 2. The conductive mechanism is provided, the support plate is supported by the limiting block, the external current is conducted into the eccentric jig through the conductive rod and the limiting rod, the current is introduced into the resistance substrate in the fixing groove through a plurality of conductive balls, the rolling mechanism drives the resistance substrate to continuously contact the electroplating solution, the electroplating effect is fully completed, the current introduction path is reasonable, the current dispersion is avoided, the electroplating effect is affected, and the practicability of the device is further improved.
[0017] Of course, any product implementing the utility model does not necessarily need to achieve all the advantages described above at the same time. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0020] Figure 2 This is a top view of the structure of this utility model;
[0021] Figure 3 This is a front cross-sectional view of the present invention.
[0022] Figure 4 for Figure 3 Enlarged structural diagram at point A;
[0023] Figure 5 for Figure 2 A magnified structural diagram at point B in the middle.
[0024] The attached diagram lists the components represented by each number as follows:
[0025] 1. Electroplating tank; 2. Rolling mechanism; 3. Conductive mechanism; 21. Receiving plate; 22. Groove; 23. Motor; 24. First rotating shaft; 25. First gear; 26. Fixing plate; 27. Connecting shaft; 28. Second gear; 29. Second rotating shaft; 210. Third gear; 211. Eccentric fixture; 212. Fixing groove; 213. Conductive ball; 214. Limiting rod; 31. Limiting block; 32. Horizontal plate; 33. Support column; 34. Connecting strip; 35. Support plate; 36. Conductive rod. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0027] Please see Figures 1-5 As shown, this utility model is a resistor electroplating equipment for thick film wafer resistors, including an electroplating tank 1, on which a rolling mechanism 2 and a conductive mechanism 3 are provided.
[0028] The rolling mechanism 2 comprises a driving assembly, an engaging assembly and an electroplating assembly. The driving assembly comprises a receiving plate 21 arranged on the electroplating tank 1. The bottom surface of the receiving plate 21 is provided with a groove 22. The inner wall of the groove 22 is fixedly connected with a motor 23. The output end of the motor 23 is fixedly connected with a first rotating shaft 24. The right end of the first rotating shaft 24 is rotatably connected with the inner wall of the groove 22. The outer wall of the first rotating shaft 24 is fixedly connected with two first gears 25. The bottom surface of the receiving plate 21 is fixedly connected with a plurality of fixed plates 26.
[0029] As shown in Figure 2 , Figure 3 and Figure 4 , the engaging assembly comprises a connecting shaft 27 rotatably connected to the inner wall of the middle two fixed plates 26. The distal ends of the two connecting shafts 27 are fixedly connected with second gears 28. The two second gears 28 are engaged with the first gears 25. The side of the plurality of fixed plates 26 close to each other is rotatably connected with two second rotating shafts 29. The outer walls of the two second rotating shafts 29 are fixedly connected with third gears 210. The two third gears 210 are engaged with the second gears 28. The electroplating assembly comprises eccentric jigs 211 fixedly connected to the outer walls of the two second rotating shafts 29. The outer walls of the two eccentric jigs 211 are provided with a plurality of fixed grooves 212. The outer walls of the two eccentric jigs 211 are fixedly connected with a plurality of conductive balls 213. The inner walls of the plurality of fixed plates 26 are fixedly connected with a plurality of limiting rods 214.
[0030] By arranging the rolling mechanism 2, the motor 23 is driven. Through the cooperation of a plurality of gears, the eccentric jigs 211 are driven to roll and rotate eccentrically around the second rotating shaft 29. The resistance substrates on the eccentric jigs 211 continuously contact the electroplating solution and vibrate on the horizontal surface of the electroplating solution. The two poles of the resistance substrates are fully electroplated. The electroplating effect of the device is improved to a certain extent, and the practicability is improved.
[0031] As shown in Figure 2 , Figure 3 and Figure 5 , the conductive mechanism 3 comprises an insulating assembly and a conductive assembly. The insulating assembly comprises a plurality of limiting blocks 31 fixedly connected to the top surface of the electroplating tank 1. The inner wall of the electroplating tank 1 is fixedly connected with two horizontal plates 32. The inner wall of the plurality of limiting blocks 31 is slidably connected with a support column 33. The outer wall of the plurality of support columns 33 is fixedly connected with two connecting strips 34. The conductive assembly comprises two support plates 35 fixedly connected to the left and right sides of the receiving plate 21. The side of the two support plates 35 away from each other is fixedly connected with the two support columns 33. The side of the two support plates 35 close to each other is fixedly connected with a plurality of conductive rods 36.
[0032] By setting the conductive mechanism 3, the current is conducted into the eccentric jig 211 through the conductive rod 36 and the limiting rod 214 after the support plate 35 is insulated supported by the limiting block 31, and the current is conducted into the resistance substrate in the fixed groove 212 through the conductive ball 213, and the rolling mechanism 2 is driven to make the resistance substrate continuously contact the electroplating solution, so that the electroplating effect is fully achieved, the reasonable current conduction path avoids the current dispersion affecting the electroplating effect, and the practicability of the device is further improved.
[0033] One specific application of the embodiment is that: after the support column 33 is clamped in the limiting block 31 to fix the receiving plate 21, the first shaft 24 is driven by the driving motor 23 to rotate in the groove 22, the first shaft 24 drives the two first gears 25 to rotate, and the first gear 25 drives the second gear 28 to rotate due to the meshing of the two first gears 25 and the two second gears 28, wherein the connecting shaft 27 is arranged in the second gear 28 to limit the rotation of the second gear 28 on the fixed plate 26, the two second gears 28 drive the two third gears 210 to rotate, and the two third gears 210 drive the second shaft 29 to rotate in the fixed plate 26, and the two second shafts 29 synchronously drive the eccentric jig 211 to rotate around the second shaft 29, wherein the eccentric jig 211 is designed to be eccentric rolling structure, so that when the second shaft 29 drives the eccentric jig 211 to rotate, the resistance in the fixed groove 212 is continuously contacted with the electroplating solution in the electroplating tank 1, and the resistance is formed on the two poles of the resistance, and the electrode layer is deposited on the two poles of the resistance, and the resistance electroplating is completed, wherein the conductive ball 213 is arranged on the eccentric jig 211 to play a conductive role, and the limiting rod 214 is arranged on the fixed plate 26 to support and limit the fixed plate 26, and the current is conducted into the second shaft 29, so that the eccentric jig 211 is driven by the motor 23 to rotate around the second shaft 29 in an eccentric manner, so that the resistance substrate on the eccentric jig 211 continuously contacts the electroplating solution, and the two poles of the resistance substrate are fully electroplated, which improves the electroplating effect of the device to a certain extent and improves the practicability.
[0034] Through setting the conductive mechanism 3, the staff drives the several support columns 33 on the two side support plates 35 of the receiving plate 21 to be clamped in the limiting blocks 31 by using the mobile device, and the several limiting blocks 31 are made of insulating material, so that the current on the conductive rod 36 is prevented from flowing out through the support columns 33 to cause the current loss and reduce the electroplating efficiency, the connecting strips 34 are arranged to connect and fix the two support columns 33, the staff connects the current to the conductive rod 36, the current is conducted into the limiting rod 214 through the conductive rod 36 and the support plate 35, the current is conducted into the second rotating shaft 29 through the limiting rod 214, the current is conducted into the resistor in the fixed groove 212 through the several conductive balls 213, the electroplating treatment of the two poles of the resistor is completed, the external current is conducted into the eccentric jig 211 through the conductive rod 36 and the limiting rod 214 after the support plate 35 is supported by the limiting blocks 31, the current is conducted into the resistor substrate in the fixed groove 212 through the several conductive balls 213, the resistor substrate is driven by the rolling mechanism 2 to continuously contact the electroplating solution, the electroplating effect is fully completed, the reasonable current conduction path avoids the current escape to affect the electroplating effect, and the practicability of the device is further improved.
[0035] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0036] The preferred embodiments of the application disclosed above are only used to help explain the application. The preferred embodiments do not describe all the details, nor limit the application to the specific embodiments described. Obviously, according to the content of the specification, many modifications and changes can be made. The embodiments are selected and described in the specification in order to better explain the principles and practical applications of the application, so that the persons skilled in the art can well understand and utilize the application. The application is limited by the claims and the entire scope and equivalents thereof.
Claims
1. A resistive electroplating apparatus for thick-film wafer resistors, comprising an electroplating tank (1), wherein a rolling mechanism (2) and a conductive mechanism (3) are provided on the electroplating tank (1), characterized in that: The rolling mechanism (2) includes a driving component, a meshing component, and an electroplating component. The driving component includes a receiving plate (21) disposed on the electroplating tank (1). The bottom surface of the receiving plate (21) is provided with a groove (22). A motor (23) is fixedly connected to the inner wall of the groove (22). The output end of the motor (23) is fixedly connected to a first rotating shaft (24). The right end of the first rotating shaft (24) is rotatably connected to the inner wall of the groove (22). Two first gears (25) are fixedly connected to the outer wall of the first rotating shaft (24). Several fixed plates (26) are fixedly connected to the bottom surface of the receiving plate (21).
2. The resistive plating equipment for thick-film wafer resistors according to claim 1, characterized in that, The meshing assembly includes connecting shafts (27) that are rotatably connected to the inner walls of the two middle fixed plates (26). The ends of the two connecting shafts (27) that are far apart from each other are fixedly connected to a second gear (28). The two second gears (28) mesh with the first gear (25).
3. The resistive plating equipment for thick-film wafer resistors according to claim 2, characterized in that, Two second rotating shafts (29) are rotatably connected to the sides of several fixed plates (26) that are close to each other. The outer walls of the two second rotating shafts (29) are fixedly connected to third gears (210), and the two third gears (210) mesh with the second gears (28).
4. The resistive plating equipment for thick-film wafer resistors according to claim 3, characterized in that, The electroplating assembly includes eccentric fixtures (211) that are fixedly connected to the outer walls of two second rotating shafts (29). The outer walls of the two eccentric fixtures (211) are provided with a number of fixing grooves (212). The outer walls of the two eccentric fixtures (211) are fixedly connected with a number of conductive balls (213). The inner walls of the several fixing plates (26) are fixedly connected with a number of limiting rods (214).
5. The resistive plating equipment for thick-film wafer resistors according to claim 1, characterized in that, The conductive mechanism (3) includes an insulating component and a conductive component. The insulating component includes several limiting blocks (31) that are fixedly connected to the top surface of the electroplating tank (1). The inner wall of the electroplating tank (1) is fixedly connected to two horizontal plates (32).
6. The resistive plating equipment for thick-film wafer resistors according to claim 5, characterized in that, The inner walls of several of the limiting blocks (31) are slidably connected with support columns (33), and the outer walls of several of the support columns (33) are fixedly connected with two connecting strips (34).
7. The resistive plating equipment for thick-film wafer resistors according to claim 6, characterized in that, The conductive component includes two support plates (35) fixedly connected to the left and right sides of the receiving plate (21). The two support plates (35) are fixedly connected to two support columns (33) on the side away from each other, and a number of conductive rods (36) are fixedly connected to the side of the two support plates (35) close to each other.