Temperature adjusting device applied to backpack

By integrating a semiconductor chip and a fan into the backpack, the problems of large size and short duration of ice cooling systems have been solved, achieving miniaturization and continuous temperature regulation.

CN223677993UActive Publication Date: 2025-12-16SHENZHEN YUSHANG TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202423098223.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-14
Publication Date
2025-12-16
Estimated Expiration
2034-12-14

AI Technical Summary

Technical Problem

Existing ice cooling systems require specialized water tanks and circulation pumps, increasing their size and weight. Furthermore, the duration of ice water cooling is limited, making it difficult to achieve continuous cooling and causing inconvenience to users.

Method used

Design a temperature regulation device for backpacks, which uses a combination of semiconductor chip and fan to achieve temperature regulation through the Peltier effect, and combines an exhaust channel and a heat conduction plate to provide a continuous temperature regulation effect.

Benefits of technology

It offers a miniaturized temperature control device that is easy to carry and can be attached to a backpack to achieve continuous temperature regulation, thus enhancing the user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a temperature adjusting device applied to a backpack, which comprises a shell and at least one temperature adjusting component, the temperature adjusting component is embedded in the shell, one end of the temperature adjusting component is exposed on the outer surface of the shell, the shell is provided with a connecting part, the connecting part is used for connecting the backpack, and the temperature adjusting component is embedded in the shell. The temperature adjusting device is small in size, can be connected to the backpack, is convenient for a user to carry and use, and provides a continuous temperature adjusting effect for the user.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to temperature adjusting device technical field, especially related to a temperature adjusting device applied to backpack. BACKGROUND

[0002] In the case of high temperature in summer, people need to cool the body, and the common cooling device on the market is an ice block cooling system, which works by using an ice water mixture as a cold source, circulating the ice water in the cooling pipeline through a circulating pump to absorb heat, and people can wear the ice block cooling system on their bodies to reduce the temperature of the human body.

[0003] However, this method requires a special water tank and circulating pump, increasing the volume and weight of the ice block cooling system, and at the same time, the duration of the ice water is limited, and the ice water needs to be replenished or replaced regularly, making it difficult to achieve continuous cooling and causing inconvenience to users. INVENTION CONTENTS

[0004] In order to overcome the shortcomings of the prior art, the utility model provides a temperature adjusting device applied to backpack, which has a small volume and can be connected to a backpack, making it convenient for users to carry and use, and providing continuous temperature adjustment effect for users.

[0005] The utility model solves the technical problems by adopting the following technical scheme:

[0006] A temperature adjusting device applied to backpack, comprising a shell and at least one temperature adjusting component, the temperature adjusting component is embedded in the shell, one end of the temperature adjusting component is exposed on the outer surface of the shell, a connecting part is provided on the shell, and the connecting part is used for connecting the backpack.

[0007] Further, the temperature adjusting component comprises a semiconductor sheet, a fan and an outer frame, the outer frame is provided with an inner cavity, the semiconductor sheet and the fan are arranged in the inner cavity, the semiconductor sheet has a Peltier effect, one end of the semiconductor sheet is exposed on the outer surface of the outer frame, the other end of the semiconductor sheet is provided with a heat sink, the fan is arranged on the side of the heat sink away from the semiconductor sheet, and the outer frame is provided with an exhaust port.

[0008] Further, the bottom of the outer frame is provided with an extended first wind baffle, the side of the shell is provided with a ventilation opening, the inside of the ventilation opening is provided with a second wind baffle on both sides, when the temperature adjusting component is embedded in the shell, the first wind baffle and the second wind baffle form an exhaust passage.

[0009] Further, the top of the outer frame is provided with a temperature guide sheet, and the temperature guide sheet covers one end of the semiconductor sheet exposed on the outer surface of the outer frame.

[0010] Further, the outer frame comprises a first outer frame and a second outer frame, the side of the first outer frame is provided with a reverse buckle, the side of the temperature guide sheet is provided with a clamping groove, the first outer frame and the temperature guide sheet are connected through the clamping groove and the reverse buckle.

[0011] Further, the temperature adjusting device further comprises a control mainboard, the shell is provided with a mounting groove and a cover plate for closing or opening the mounting groove, the control mainboard is arranged in the mounting groove, and at least one notch is arranged on the cover plate, and the control mainboard can be electrically connected to the temperature adjusting assembly through the notch.

[0012] Further, the control mainboard is provided with a charging interface, and the charging interface is exposed on the cover plate.

[0013] Further, the shell comprises an upper shell and a bottom shell, the upper shell is provided with at least one through hole, and the temperature adjusting assembly is embedded in the through hole.

[0014] Further, the upper shell is provided with a plurality of second connecting columns, the bottom shell is provided with a plurality of second connecting holes, the second connecting columns are matched with the second connecting holes, and the temperature adjusting assembly is arranged between the bottom shell and the upper shell.

[0015] Further, the upper shell is divided into four mounting areas, the four mounting areas are provided with temperature adjusting assemblies, the four mounting areas are arranged in two rows and two columns, and adjacent two mounting areas are connected through connecting pieces.

[0016] The present application has the following advantages:

[0017] The utility model provides a temperature adjusting device applied to backpack, the temperature adjusting device includes shell and temperature adjusting assembly embedded on shell, and the temperature adjusting device has smaller volume, can be connected to backpack, is convenient for user to carry and use, provides continuous temperature adjusting effect for user. ACCOUT OF DRAWINGS

[0018] Figure 1 It is the whole schematic diagram of the temperature adjusting device of the utility model;

[0019] Figure 2 It is another angle schematic diagram of the temperature adjusting device of the utility model;

[0020] Figure 3 It is the schematic diagram of shell in the temperature adjusting device of the utility model;

[0021] Figure 4 It is the explosion drawing of the temperature adjusting device of the utility model;

[0022] Figure 5 is another angle of the explosion of the temperature adjusting device of the utility model;

[0023] Figure 6 is the schematic diagram of the upper shell of the temperature adjusting device of the utility model;

[0024] Figure 7 is the schematic diagram of the temperature adjusting assembly of the temperature adjusting device of the utility model;

[0025] Figure 8 is the schematic diagram of the temperature adjusting assembly of the temperature adjusting device of the utility model;

[0026] Figure 9 is the schematic diagram of the temperature adjusting device of the utility model applied to the backpack;

[0027] Explanation of reference signs:

[0028] 1, shell; 11, air vent; 111, second wind baffle; 12, mounting groove; 121, first connecting column; 13, cover plate; 131, first connecting hole; 132, notch; 14, control mainboard; 15, charging interface; 16, upper shell; 161, through hole; 162, connecting piece; 163, connecting part; 164, mounting area; 165, second connecting column; 17, bottom shell; 171, second connecting hole; 18, flexible pad;

[0029] 2, temperature adjusting assembly; 21, semiconductor sheet; 22, fan; 221, base; 2211, third connecting hole; 222, fan blade; 223, upper cover; 24, outer frame; 241, first outer frame; 2411, reverse buckle; 242, second outer frame; 2421, third connecting column; 243, first wind baffle; 244, exhaust port; 25, heat sink; 26, temperature guide sheet; 261, clamping groove;

[0030] 3, backpack. DETAILED DESCRIPTION

[0031] The specific embodiment is only an explanation of the utility model, and is not a limitation of the utility model, and those skilled in the art can make modifications without creative contribution according to the needs after reading the specification, but as long as it is within the scope of the claims of the utility model, it is protected by the patent law.

[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0033] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0034] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In some descriptions of the application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0035] The utility model provides a temperature regulation device for backpack, the temperature regulation device includes shell and the temperature regulation component of embedding on the shell, temperature regulation device has smaller volume, can connect on the backpack, it is convenient for user to carry and use to provide the continuous temperature regulation effect for user.

[0036] Referring Figures 1 to 9 , the embodiment provides a temperature regulation device for backpack 3, the temperature regulation device includes shell 1 and at least one temperature regulation component 2, the temperature regulation component 2 is embedded in shell 1, one end of the temperature regulation component 2 is exposed on the outer surface of shell 1, and the shell 1 is provided with a connecting portion 163, and the connecting portion 163 is used to connect the backpack 3.

[0037] In the embodiment, the temperature regulation component 2 includes a semiconductor sheet 21, a fan 22 and an outer frame 24, the outer frame 24 is provided with an inner cavity, the semiconductor sheet 21 and the fan 22 are arranged in the inner cavity, the semiconductor sheet 21 has a Peltier effect, one end of the semiconductor sheet 21 is exposed on the outer surface of the outer frame 24, the other end of the semiconductor sheet 21 is provided with a heat sink 25, the fan 22 is arranged on the side of the heat sink 25 away from the semiconductor sheet 21, and the outer frame 24 is provided with an exhaust port 244.

[0038] It should be particularly pointed out that by controlling the direction of current in the semiconductor refrigeration sheet, heat can flow from one end to the other end, thereby achieving the effect of cooling or heating.

[0039] For the convenience of description, taking the temperature adjusting device to achieve the cooling effect as an example, it is assumed that one end of the semiconductor sheet 21 exposed on the outer surface of the shell 1 is taken as the cooling end, and when the semiconductor sheet 21 is electrified, the cooling end will absorb heat, so that the temperature of the end part is reduced; at the same time, the other end of the semiconductor sheet 21 is taken as the heating end, which will release heat, so that the temperature of the end part is increased, therefore, it is necessary to set the heat sink 25 and the fan 22 at the heating end, so that the hot air in the inner cavity can be discharged through the exhaust port 244 to help complete the heat release work.

[0040] Further, the bottom of the outer frame 24 is provided with the extended first wind baffle 243, the side of the shell 1 is provided with the ventilation port 11, and the inside of the ventilation port 11 is provided with the second wind baffle 111 on both sides, when the temperature adjusting assembly 2 is embedded in the shell 1, the first wind baffle 243 and the second wind baffle 111 form an exhaust channel, when the temperature adjusting device provided by the embodiment is used to perform the cooling function, the hot air in the temperature adjusting assembly 2 can be discharged to the outside atmosphere in turn through the exhaust port 244, the exhaust channel and the ventilation port 11.

[0041] Preferably, the top of the outer frame 24 is provided with the temperature guide sheet 26, and the temperature guide sheet 26 covers one end of the semiconductor sheet 21 exposed on the outer surface of the outer frame. Specifically, the temperature guide sheet 26 is made of a metal material with good temperature guide characteristics. In actual application, the metal material can be selected from hardware materials or soft copper sheets, which can all provide good temperature guide characteristics to transfer the temperature to the user, and the soft copper sheet also has the characteristics of easy deformation, which can be fitted to the ergonomic curve of the human body to improve the user experience.

[0042] Further, the outer frame 24 includes the first outer frame 241 and the second outer frame 242, the side of the first outer frame 241 is provided with the inverted buckle 2411, and the side of the temperature guide sheet 26 is provided with the clamping groove 261, and the first outer frame 241 and the temperature guide sheet 26 are connected through the clamping groove 261 and the inverted buckle 2411.

[0043] Preferably, the fan 22 includes the base 221, the fan blade 222 and the upper cover 223, the base 221 is fixedly connected to the inner side of the bottom of the outer frame 24, and the upper cover 223 is fixedly connected with the base 221 to form a containing cavity, the fan 22 is arranged in the containing cavity, and the heat sink 25 is arranged on the top of the upper cover 223.

[0044] Specifically, the base 221 is provided with the third connecting hole 2211, and the second outer frame 242 is provided with the third connecting column 2421, and the base 221 is fixed on the second outer frame 242 through the cooperation of the third connecting column 2421 and the third connecting hole 2211.

[0045] By setting the base 221 and the upper cover 223 to wrap the fan 22, the heat sink 25 can be prevented from contacting the fan blade 222, and the normal work of the fan blade 222 is ensured to be free from interference.

[0046] In the embodiment, the temperature adjusting device further comprises a control mainboard 14, the shell 1 is provided with a mounting groove 12 and a cover plate 13 for closing or opening the mounting groove 12, the control mainboard 14 is arranged in the mounting groove 12, and the cover plate 13 is provided with at least one notch 132, and the control mainboard 14 can be electrically connected to the temperature adjusting assembly 2 through the notch 132.

[0047] Further, the control mainboard 14 is provided with a charging interface 15, and the charging interface 15 is exposed on the cover plate 13, a charging wire is connected to the charging interface 15 and an external power supply device, and the control mainboard 14 can be provided with working voltage. The external power supply device mainly refers to a mobile power supply device which can move together with the backpack 3 to continuously supply power to the temperature adjusting device.

[0048] Further, the mounting groove 12 is provided with a first connecting column 121, the cover plate 13 is provided with a first connecting hole 131, and the first connecting column 121 is matched with the first connecting hole 131.

[0049] Through the cooperation of the first connecting column 121 and the first connecting hole 131, the cover plate 13 and the mounting groove 12 are connected, and the cover plate 13 can close or open the mounting groove 12.

[0050] Preferably, the shell 1 comprises an upper shell 16, the upper shell 16 is provided with at least one through hole 161, and the temperature adjusting assembly 2 is embedded in the through hole 161.

[0051] Further, the shell 1 further comprises a bottom shell 17, the upper shell 16 is provided with a plurality of second connecting columns 165, the bottom shell 17 is provided with a plurality of second connecting holes 171, the second connecting columns 165 are matched with the second connecting holes 171, and the temperature adjusting assembly 2 is arranged between the bottom shell 17 and the upper shell 16.

[0052] By inserting the second connecting column 165 into the second connecting hole 171, the upper shell 16 and the bottom shell 17 are fixedly connected, and the temperature adjusting assembly 2 is fixed between the upper shell 16 and the bottom shell 17.

[0053] In the embodiment, the upper shell 16 is provided with four mounting holes, and the temperature adjusting assembly 2 is arranged in each of the four mounting holes.

[0054] Further, the upper shell 16 away from the bottom shell 17 is provided with a flexible pad 18, the upper shell 16 and the bottom shell 17 are made of rigid materials, and the flexible pad 18 is made of a flexible material.

[0055] Preferably, the upper shell 16 and the flexible pad 18 in the embodiment are connected by adhesive.

[0056] When the temperature adjusting device provided by the embodiment is applied to the backpack 3, the upper shell 16 and the bottom shell 17 made of rigid material have the characteristic of not being easily deformed, which can enhance the durability of the temperature adjusting device; the flexible pad 18 made of flexible material can be attached to the back of the human body, improving the comfort of the user.

[0057] Further, the upper shell 16 is divided into four installation areas 164, each of which is provided with a temperature adjusting assembly 2, and the four installation areas 164 are arranged in two rows and two columns, and adjacent two installation areas 164 are connected by a connecting piece 162. The temperature adjusting assembly 2 of the four installation areas 164 is connected to the control mainboard 14, which can simultaneously cool or heat to adjust the temperature of multiple areas.

[0058] In actual application, the size of the temperature adjusting device can be customized according to the size of the backpack 3 or the needs of the user, such as one, two, three, five or six installation areas 164, and the number of temperature adjusting assemblies 2 is adapted to the number of installation areas 164.

[0059] It should be particularly noted that the connecting piece 162 is made of soft plastic material, which has certain buffering force and elasticity. By using the connecting piece 162 to connect the four installation areas 164, the different installation areas 164 can be adjusted to adapt to the body shape of different users. The connecting piece 162 made of flexible material can allow the different areas of the shell 1 to have certain bending and stretching, so as to better adapt to the natural curve of the human body, to ensure the comfort and functionality when worn.

[0060] In the embodiment, the shell 1 is provided with a protruding edge extending towards the bottom shell 17, which serves as a connecting part 163 for connecting with the backpack 3.

[0061] When the temperature adjusting device of the embodiment needs to be connected with the backpack 3, the protruding edge is sewn on the back of the backpack 3, so as to realize the fixed connection of the backpack 3 and the temperature adjusting device.

[0062] In another embodiment, a zipper is sewn on the protruding edge, and correspondingly, the backpack 3 to which the temperature adjusting device of the embodiment is applied needs to be provided with a matching zipper, so that the backpack 3 and the temperature adjusting device can be connected in a detachable manner through the zipper.

[0063] It can be understood that those skilled in the art can combine various embodiments in the above embodiments to obtain various technical solutions of the embodiments.

[0064] The above merely describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature regulation device for use in backpacks, characterized in that, The device includes a housing and at least one temperature regulating component. The temperature regulating component is embedded in the housing, with one end exposed on the outer surface of the housing. The housing has a connecting portion for connecting a backpack. The temperature regulating component includes a semiconductor chip, a fan, and an outer frame. The outer frame has an inner cavity, in which the semiconductor chip and the fan are located. The semiconductor chip exhibits the Peltier effect, with one end exposed on the outer surface of the outer frame and a heat sink at the other end. The fan is located on the side of the heat sink away from the semiconductor chip. The outer frame has an exhaust port.

2. The temperature regulation device for a backpack as described in claim 1, characterized in that, The bottom of the outer frame is provided with an extended first wind deflector, and the side of the outer shell is provided with a vent. The inner sides of the vent are provided with second wind deflectors. When the temperature regulating component is embedded in the outer shell, the first wind deflector and the second wind deflector form an exhaust channel.

3. The temperature regulation device for a backpack as described in claim 1, characterized in that, A thermally conductive sheet is provided on the top of the outer frame, and the thermally conductive sheet covers one end of the semiconductor wafer exposed on the outer surface of the outer frame.

4. A temperature regulating device for a backpack as described in claim 3, characterized in that, The outer frame includes a first outer frame and a second outer frame. The side of the first outer frame is provided with a buckle, and the side of the temperature-conducting sheet is provided with a slot. The connection between the first outer frame and the temperature-conducting sheet is achieved through the slot and the buckle.

5. A temperature regulating device for a backpack as described in claim 1, characterized in that, The temperature regulating device also includes a control motherboard. The housing is provided with a mounting slot and a cover plate for closing or opening the mounting slot. The control motherboard is located in the mounting slot. The cover plate is provided with at least one notch. The control motherboard can be electrically connected to the temperature regulating component through the notch.

6. A temperature regulating device for a backpack as described in claim 5, characterized in that, The control motherboard is equipped with a charging interface, which is exposed on the cover plate.

7. A temperature regulating device for a backpack as described in claim 1, characterized in that, The outer shell includes an upper shell and a bottom shell. The upper shell is provided with at least one through hole, and the temperature regulating component is embedded in the through hole.

8. A temperature regulating device for a backpack as described in claim 7, characterized in that, The upper shell is provided with multiple second connecting posts, and the bottom shell is provided with multiple second connecting holes. The second connecting posts are adapted to the second connecting holes, and the temperature adjustment component is located between the bottom shell and the upper shell.

9. A temperature regulating device for a backpack as described in claim 7, characterized in that, The upper shell is divided into four installation areas, each of which is equipped with a temperature regulation component. The four installation areas are arranged in two rows and two columns, and adjacent installation areas are connected by connectors.