Pressing device of three-temperature sorting machine

Abstract

The utility model relates to a pressing device of a three-temperature sorting machine. The pressing device comprises a pushing assembly and a pressing assembly, the temperature swing adsorption part is driven by the pushing assembly, and the temperature swing adsorption part comprises a pressing head, a heat conduction module for heating the pressing head and a cold conduction module for cooling the pressing head; the pressing head comprises a mounting plate and an adsorption pressing piece connected with or disconnected from the mounting plate, the mounting plate is provided with a wiring groove formed by sinking inwards from the surface of the mounting plate, the adsorption pressing piece is provided with an adsorption rod penetrating through the surface of the adsorption pressing piece, and the adsorption rod is communicated with the wiring groove; the heat conduction module, the cold conduction module and the pressure head are separately arranged, and through the detachable connection structure of the adsorption pressing sheet and the mounting plate, when disassembly, maintenance and replacement are needed, only the adsorption pressing sheet is disassembled, disassembly of other parts is avoided, and the replacement efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor testing, and in particular to a three-temperature handler pressing device. BACKGROUND

[0002] At present, most of the chip testing can be carried out by automatic testing equipment, but a small part of the chips need to be tested at high temperature, low temperature and normal temperature. The three-temperature handler can be used for normal temperature, high temperature and low temperature testing of chips. When testing, a pressing device is needed to adsorb and place the semiconductor chip on the test station. In order to prevent the semiconductor chip from losing temperature during movement, the semiconductor chip needs to be continuously heated or cooled.

[0003] According to Chinese patent CN220418674U, a three-temperature chip testing handler pressing device is disclosed. The device includes a heating device and a pressing head provided at the upper end of the heating device. The heating device is fixedly installed on a preset mechanical arm. The pressing head includes a pressing plate, a first sensor and a first heat conduction sheet. The pressing plate is fixedly connected to the heating device by a first fixing screw. A plurality of suction heads are uniformly arranged at one end of the pressing plate, and the suction heads are provided with suction holes. The suction heads are used to suck and blow the chips. The first heat conduction sheet is installed at the other end of the pressing plate and located between the pressing plate and the heating device. The first sensor is embedded in the pressing plate. However, a large number of components such as sensors, plugs and heat conduction sheets are still installed in the pressing head of the device. When the pressing head needs to be maintained and replaced, these components need to be replaced synchronously. After reinstallation, each component needs to be repositioned and debugged, which is more complicated and reduces the replacement efficiency.

[0004] Therefore, it is necessary to develop a three-temperature handler pressing device to solve the above problems. CONTENT OF THE UTILITY MODEL

[0005] The utility model aims at providing a three-temperature handler pressing device which is convenient to maintain and replace.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a three-temperature handler pressing device, comprising:

[0007] A pushing assembly;

[0008] A temperature-variable adsorption part driven by the pushing assembly, comprising a pressing head, a heat conduction module for heating the pressing head and a heat dissipation module for cooling the pressing head.

[0009] The pressing head comprises a mounting plate and an adsorption pressing sheet connected or disconnected with the mounting plate. The mounting plate has a wiring groove recessed inward from its surface. The adsorption pressing sheet is provided with an adsorption rod penetrating through its surface. The adsorption rod is in communication with the wiring groove.

[0010] Further, the adsorption pressing piece is attached to the lower surface of the mounting plate, and is connected to the mounting plate by bolts or screws.

[0011] Further, the upper surface of the adsorption pressing piece has a contact protrusion formed outward from the surface thereof, and the contact protrusion has the same shape as the partial shape of the wiring groove.

[0012] Further, the adsorption pressing piece is attached to the lower surface of the mounting plate, and is connected to the mounting plate by bolts or screws.

[0013] Further, the contact protrusion extends into the wiring groove.

[0014] Further, the wiring groove is provided with a temperature sensor, and the upper and lower surfaces of the temperature sensor are attached to the mounting plate and the contact protrusion, respectively.

[0015] Further, the wiring groove is further provided with an adsorption pipeline, which is arranged along the wiring groove and is in communication with the adsorption rod.

[0016] Further, the pressing head is made of copper.

[0017] Further, the heat-conducting module is made of temperature-conducting material, and is internally provided with heating wires or heating sheets.

[0018] Further, the heat-conducting module is made of temperature-conducting material, and is internally provided with heating wires or heating sheets.

[0019] Compared with the prior art, the three-temperature sorting machine pressing device has the characteristics of being convenient to maintain and replace, the heat-conducting module and the heat-dissipating module are arranged separately from the pressing head, and the adsorption pressing piece is detachably connected to the mounting plate, so that when maintenance or replacement is needed, only the adsorption pressing piece needs to be disassembled, thereby avoiding disassembly of other components and improving the replacement efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings, wherein:

[0021] Figure 1 is a three-dimensional structure schematic view of the three-temperature sorting machine pressing device of the present application;

[0022] Figure 2 is Figure 1Partial structure diagram of push assembly of three-temperature sorting machine down-pressing device shown in the figure;

[0023] Figure 3 For Figure 1 Partial structure diagram of floating part and temperature swing adsorption part of three-temperature sorting machine down-pressing device shown in the figure;

[0024] Figure 4 For Figure 3 Explosive structure diagram of pressure head of three-temperature sorting machine down-pressing device shown in the figure;

[0025] Figure 5 For Figure 4 Another angle explosive structure diagram of pressure head of three-temperature sorting machine down-pressing device shown in the figure.

[0026] In the figure: 1, support; 2, push assembly; 3, floating part; 4, temperature swing adsorption part; 11, first support; 12, second support; 13, fixed sliding block; 21, driving motor; 22, lifting part; 23, transmission wheel; 24, passive wheel; 25, transmission belt; 26, fixed rail; 27, inductive sheet; 28, sensor; 29, screw rod; 31, connecting piece; 32, floating cylinder part; 41, heat conduction module; 42, heat dissipation module; 43, pressure head; 421, refrigerant inlet; 422, refrigerant outlet; 431, mounting plate; 432, adsorption pressing piece; 433, wiring groove; 434, contact protrusion; 435, adsorption rod; 44, temperature sensor; 45, adsorption pipeline. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] Please refer to Figures 1 to 5 The present application is a three-temperature sorting machine down-pressing device, which comprises a support 1, a push assembly 2 mounted on the support 1, a floating part 3 driven by the push assembly 2, and a temperature swing adsorption part 4 mounted on the floating part 3.

[0029] Please refer to Figure 1 The support 1 comprises a first support 11 and a second support 12. The first support 11 is mounted on the equipment and used to support the second support 12 and the push assembly 2. The second support 12 is mounted above the first support 11, and its bottom is fixedly connected with the top of the first support 11, and its top extends vertically upward. The push assembly 2 is mounted on the second support 12.

[0030] Please refer toFigures 1 to 2 The pushing assembly 2 comprises a driving motor 21, a lifting part 22 driven by the driving motor 21, the driving motor 21 is installed on the top of the second support 12 and connected with a transmission wheel 23, the lifting part 22 is internally provided with a lead screw 29, the top of the lead screw 29 is sleeved with a driven wheel 24, the driven wheel 24 is located on one side of the transmission wheel 23, the driven wheel 24 and the transmission wheel 23 are circumferentially provided with a transmission belt 25, the driving motor 21 drives the lead screw 29 to rotate through the transmission wheel 23, the driven wheel 24 and the transmission belt 25, and the lifting part 22 moves vertically along the lead screw 29, specifically, the top of the lifting part 22 is located in the second support, and the bottom of the lifting part 22 extends vertically downward into the first support 11.

[0031] Please refer to Figures 2 to 3 The first support 11 is installed with a fixed sliding block 13, the number of the fixed sliding blocks 13 is one pair and oppositely arranged, both sides of the lifting part 22 are provided with fixed rails 26, the fixed rails 26 vertically extend from the bottom to the top of the lifting part 22, the pair of fixed rails 26 are movably connected with the pair of fixed sliding blocks 13, and the lifting part 22 is movably connected with the fixed sliding blocks 13 through the fixed rails 26, so that the vertical movement of the lifting part 22 is ensured.

[0032] The outer side surface of the lifting part 22 is fixedly installed with an inductive sheet 27, and the outer side is provided with a sensor 28, the sensor 28 is used for receiving the position information of the inductive sheet 27, preferably, the inductive sheet 27 is installed on the top end of the lifting part 22, the bottom of the sensor 28 is fixedly connected with the first support 11, and the top of the sensor 28 is fixedly connected with the second support 12.

[0033] Please refer to Figure 3 The floating part 3 comprises a connecting piece 31 and a floating cylinder part 32 installed on the connecting piece 31, the top of the connecting piece 31 is fixedly connected with the lifting part 22, and the top of the connecting piece 31 is connected with the floating cylinder part 32, the floating cylinder part 32 is a prior art, and thus will not be explained in detail, and the floating cylinder part 32 can drive the temperature changing head 4 to accurately butt joint with the semiconductor material.

[0034] Please refer to Figures 3 to 5The temperature swing adsorption part 4 comprises a heat conduction module 41, a heat conduction module 42 attached to the heat conduction module 41, and a pressure head 43 connected to the heat conduction module 42. The upper surface of the heat conduction module 41 is fixedly connected to the floating part 3, and the lower surface is fixedly connected to the heat conduction module 42. The heat conduction module 41 is made of a certain temperature-conducting material, and has heating wires or heating sheets inside, which generate heat when electrified. The heat conduction module 42 is located below the heat conduction module 41 and is made of a certain temperature-conducting material. The heat conduction module 42 is provided with a refrigerant inlet 421 and a refrigerant outlet 422, and a refrigerant flow channel (not shown) inside the heat conduction module 42. The refrigerant flow channel extends zigzag in the heat conduction module 42. One end of the refrigerant inlet 421 is in communication with the refrigerant flow channel, and the other end extends outward to connect with a refrigeration device (not shown). One end of the refrigerant outlet 422 is in communication with the refrigerant flow channel, and the other end extends outward to connect with the refrigeration device.

[0035] Please refer to Figures 4 to 5 The pressure head 43 is made of metal, preferably copper. It comprises a mounting plate 431 and an adsorption pressing sheet 432 connected to the mounting plate 431. The upper surface of the mounting plate 431 is attached to the lower surface of the heat conduction module 42, and the lower surface is provided with a wiring slot 433, which is a T-shaped slot formed by recessing inward from the lower surface of the mounting plate 431. The adsorption pressing sheet 432 is located on the lower surface of the mounting plate 431. Specifically, the upper surface of the adsorption pressing sheet 432 has a contact protrusion 434 protruding outward from its surface. The shape of the contact protrusion 434 is the same as the shape of the wiring slot 433. The number of adsorption pressing sheets 432 can be changed according to requirements. In this embodiment, there are a pair of adsorption pressing sheets 432, one on each end of the mounting plate 431, connected to the lower surface of the mounting plate 431 by bolts or screws, with the contact protrusions 434 extending into the wiring slot 433.

[0036] The adsorption pressing sheet 432 is provided with an adsorption rod 435, one end of which is in communication with the wiring slot 433, and the other end extends vertically outward through the adsorption pressing sheet 432.

[0037] A temperature sensor 44 is arranged in the wiring slot 433, with its upper and lower surfaces attached to the mounting plate 431 and the contact protrusion 434 respectively, for sensing the temperature of the pressure head 43.

[0038] An adsorption pipeline 45 is also arranged in the wiring slot 433, in line with the adsorption rod 435.

[0039] The three-temperature sorting machine lower pressing device has the characteristics of convenient maintenance and replacement, the heat conduction module and the heat conduction module are arranged separately from the pressing head, and then the detachable connection structure of the adsorption pressing sheet and the mounting plate is used, when maintenance and replacement are needed, only the adsorption pressing sheet is disassembled, other parts are avoided from being disassembled, and the replacement efficiency is improved.

[0040] The three-temperature sorting machine lower pressing device has the characteristics of convenient maintenance and replacement, the heat conduction module and the heat conduction module are arranged separately from the pressing head, and then the detachable connection structure of the adsorption pressing sheet and the mounting plate is used, when maintenance and replacement are needed, only the adsorption pressing sheet is disassembled, other parts are avoided from being dissembled, and the replacement efficiency is improved.

[0041] The three-temperature sorting machine lower pressing device has the characteristics of convenient maintenance and replacement, the heat conduction module and the heat conduction module are arranged separately from the pressing head, and then the detachable connection structure of the adsorption pressing sheet and the mounting plate is used, when maintenance and replacement are needed, only the adsorption pressing sheet is disassembled, other parts are avoided from being dissembled, and the replacement efficiency is improved.

Claims

1. A three-temperature sorter hold-down apparatus, characterized by, It includes: Pushing assembly (2); Variable temperature adsorption part (4) driven by the pushing assembly (2), the variable temperature adsorption part (4) includes pressure head (43), heat conduction module (41) for heating the pressure head (43), cold conduction module (42) for cooling the pressure head (43); The pressure head (43) includes a mounting plate (431), an adsorption pressing sheet (432) connected or disconnected with the mounting plate (431), the mounting plate (431) has a wiring slot (433) formed by recessing inward from its surface, the adsorption pressing sheet (432) is provided with an adsorption rod (435) penetrating its surface, and the adsorption rod (435) is communicated with the wiring slot (433).

2. The three-temperature sorter hold-down apparatus of claim 1, wherein, The upper surface of the adsorption pressing sheet (432) is attached to the lower surface of the mounting plate (431), and is connected with the mounting plate (431) by bolts or screws.

3. The three-temperature sorter hold-down apparatus of claim 1, wherein, The upper surface of the adsorption pressing sheet (432) has a contact protrusion (434) formed by protruding outward from its surface, and the shape of the contact protrusion (434) is the same as the local shape of the wiring slot (433).

4. The three-temperature sorter hold-down apparatus of claim 3, wherein, The number of the adsorption pressing sheet (432) is a pair, which is respectively located at both ends of the mounting plate (431).

5. The three-temperature sorter hold-down apparatus of claim 4, wherein, The contact protrusion (434) extends into the wiring slot (433).

6. The three-temperature sorter hold-down apparatus of claim 4, wherein, The wiring slot (433) is provided with a temperature sensor (44), and the upper and lower surfaces of the temperature sensor (44) are respectively attached to the mounting plate (431) and the contact protrusion (434).

7. The three-temperature sorter hold-down apparatus of claim 1, wherein, The wiring slot (433) is also provided with an adsorption pipeline (45), which is arranged along the wiring slot (433) and communicated with the adsorption rod (435).

8. The three-temperature sorter hold-down apparatus of claim 1, wherein, The pressure head (43) is made of copper.

9. The three-temperature sorter hold-down apparatus of claim 1, wherein, The heat conduction module (41) is made of temperature conducting material, and is provided with heating wire or heating sheet inside.

10. The three-temperature sorter hold-down apparatus of claim 1, wherein, The cold conduction module (42) is located below the heat conduction module (41) and is made of temperature conducting material, and is provided with a refrigerant flow channel, which extends tortuously in the cold conduction module (42).

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