Semiconductor testing device and sorting machine
By using an adjustable-angle sensor in a semiconductor testing machine to detect the presence or absence of chips, the problem of chip loss is solved, testing efficiency and compatibility are improved, and costs are reduced.
Patent Information
- Application Number
- CN202423134466.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-18
AI Technical Summary
Existing semiconductor testing machines are prone to chip loss during chip removal, leading to overlapping testing, damage to chips or equipment, and visual inspection methods are slow to respond, have poor compatibility, and are costly.
The presence or absence of a chip is detected by a sensor mounted on the upper side of the test stand at an adjustable angle. The sensor sends a detection signal by tilting, and the presence of the chip is determined by combining it with a self-reflecting fiber optic or photoelectric sensor, which simplifies the structure and reduces costs.
It enables rapid detection response, improves compatibility, reduces costs, is easy to install and replace, and adapts to different chip specifications and array arrangements.
Smart Images
Figure CN223679374U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor testing, in particular to a semiconductor testing device and a handler. BACKGROUND
[0002] A semiconductor testing machine is a device for testing the performance of semiconductor chips, and a plurality of semiconductor chips can be tested simultaneously in its testing area at a time. After the testing is completed, the batch of semiconductor chips is removed, and another batch of semiconductor chips is loaded into the testing area for continuous testing. However, during the removal of the semiconductor chips, the semiconductor chips are occasionally left in the testing area without being removed. As a result, multiple chips overlap in the subsequent testing process, which can cause damage to the semiconductor chips, abnormal test results, and even damage to the semiconductor testing machine during the compression testing process.
[0003] Therefore, some semiconductor testing machines are integrated with chip presence detection technology. One common chip presence detection technology is visual detection. Specifically, a light source and a camera are arranged above the testing area, and a mechanism adjustable in three-dimensional directions is provided to enable the camera to be aligned with the testing area and to adjust the focal length to clearly capture the image of the testing area. Then, the captured image is transmitted to an identification analysis system for analysis, which can determine whether there are chips in the testing area and output the result for the next action.
[0004] However, the above-mentioned existing technology using visual detection has a slow signal transmission and processing process, which affects production efficiency. Moreover, since the semiconductor testing machine can test chips of different sizes, the recognition compatibility of the camera is required to be high. The above-mentioned detection method is not suitable for some special specification chips and has poor compatibility. In addition, the camera and light source used in the above-mentioned detection method have high cost and complex structure, and the assembly and adjustment process is also complicated.
[0005] Therefore, it is necessary to provide a new technical solution to overcome the deficiencies of the prior art. CONTENT OF THE INVENTION
[0006] Based on this, the present application provides a semiconductor testing device and a handler to overcome the problems of slow detection response, poor compatibility, complex structure, and high cost in the prior art.
[0007] To this end, the application adopts the following technical scheme: a semiconductor testing device, comprising a testing seat for accommodating semiconductor chips and a testing head assembly cooperating with the testing seat to test the semiconductor chips, wherein the semiconductor testing device further comprises a chip presence / absence detection device, the chip presence / absence detection device comprising a mounting seat and a plurality of sensors, the chip presence / absence detection device being mounted beside the testing head assembly by the mounting seat, the plurality of sensors being located above the side of the testing seat, the plurality of sensors being inclined towards the testing seat to send detection signals to detect whether the testing seat has semiconductor chips, and the sensors being provided with an adjustable angle to adjust the sending angle of the detection signals.
[0008] In some embodiments, the chip presence / absence detection device comprises a sensor mounting plate, the sensors being mounted on the sensor mounting plate and being able to swing within a preset angle range relative to the sensor mounting plate.
[0009] In some embodiments, the sensors comprise connecting portions for being fixed to the sensor mounting plate, one of the connecting portions and the sensor mounting plate being provided with a long strip-shaped hole allowing the sensors to swing and adjust.
[0010] In some embodiments, corresponding to each sensor, the long strip-shaped hole is at least two, and the length directions of the two long strip-shaped holes are perpendicular.
[0011] In some embodiments, the long strip-shaped hole is formed on the connecting portion, the sensor mounting plate being provided with a fixing hole corresponding to the long strip-shaped hole, and the sensor being fixed to the sensor mounting plate by being locked in the fixing hole through the long strip-shaped hole by a locking member.
[0012] In some embodiments, at least two sensors are mounted on each sensor mounting plate, and the chip presence / absence detection device comprises at least two groups symmetrically located on both sides of the testing seat.
[0013] In some embodiments, the chip presence / absence detection device comprises a testing plate, the testing plate being provided with a plurality of mounting positions, and the sensor mounting plate being selectively mounted on one or more of the plurality of mounting positions.
[0014] In some embodiments, the testing plate is provided with an elongated adjusting hole for adjusting the mounting position of the testing plate.
[0015] In some embodiments, the chip presence / absence detection device comprises a connecting shaft connected between the mounting seat and the testing plate, and the testing plate being able to be mounted at different positions of the connecting shaft to change the mounting height of the sensors.
[0016] The application also adopts the following technical scheme: a sorting machine, comprising a feeding device, a collecting device and the semiconductor testing device as described in any one of the above embodiments, the feeding device is used to feed the semiconductor chips to be tested into the semiconductor testing device, the semiconductor chips to be tested are tested by cooperation of the test head assembly and the test seat, and the collecting device is used to classify and recycle the semiconductor chips after testing, wherein the chip presence / absence detection device is configured to detect whether there is a semiconductor chip left in the test seat after the semiconductor chip is removed from the test seat.
[0017] The semiconductor testing device provided by the application comprises a chip presence / absence detection device, the chip presence / absence detection device comprises a mounting seat and a plurality of sensors, the chip presence / absence detection device is mounted beside the test head assembly by the mounting seat, the plurality of sensors are located above the side of the test seat, the plurality of sensors are inclined to send detection signals towards the test seat to detect whether there is a semiconductor chip in the test seat, and the sensors are set to be angle-adjustable to adjust the sending angle of the detection signals. The semiconductor testing device provided by the application adopts sensors for detection, has fast detection response speed and small delay time; the angle of the sensors is adjustable, so that the detection requirements of different chips and different arrays can be met, the detection compatibility is high and is not affected by the size of the chip; and the semiconductor testing device is easy to quickly install and replace, and has low cost. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.
[0019] Figure 1 It is a perspective view of the semiconductor testing device of the application.
[0020] Figure 2 It is a side view of a group of chip presence / absence detection devices in the semiconductor testing device of the application.
[0021] Figure 3 It is a perspective assembly view of a group of chip presence / absence detection devices in the semiconductor testing device of the application.
[0022] Figure 4 It is a perspective assembly view of a group of chip presence / absence detection devices in the semiconductor testing device of the application.
[0023] Figure 5 It is an exploded perspective view of a group of chip presence / absence detection devices in the semiconductor testing device of the application.
[0024] Figure 6 The figure is a perspective view of the semiconductor testing device from another angle.
[0025] The reference numbers of the components are as follows: 100, semiconductor testing device; 10, rack; 20, testing head assembly; 30, testing seat; 40, chip presence / absence detection device; 1, mounting seat; 2, connecting shaft; 21, fixing block; 3, sensor; 31, connecting part; 310, long strip-shaped hole; 4, sensor mounting plate; 410, fixing hole; 5, testing plate; 510, long-shaped adjusting hole; 52, mounting position; 53, mode mark. DETAILED DESCRIPTION
[0026] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced without using some or all of these specific details. In other instances, well-known process steps have not been described in detail in order to avoid obscuring the present application.
[0027] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there can be a middle component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there can be a middle component. The terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used in the description of the present application are for the purpose of illustration only and do not indicate the only orientation of the implementation.
[0028] In addition, the terms "first", "second", etc. are used only for the purpose of description and should not be understood as indicating or implying relative importance or a specific number of the technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0029] In the present application, unless specifically defined and limited otherwise, the first feature is "on", "under", "above" or "over" the second feature can be that the first feature is in direct contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, the first feature is "on", "above" and "over" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature is "under", "below" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.
[0030] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the specification of the present application includes any and all combinations of one or more related listed items.
[0031] Please refer to Figures 1 to 6 As shown, the present application provides a semiconductor testing device 100. The semiconductor testing device 100 at least includes a testing head assembly 20, a testing seat 30 and a chip presence detection device 40. The testing seat 30 is used to accommodate semiconductor chips, and the testing head assembly 20 cooperates with the testing seat 30 to test the semiconductor chips. The chip presence detection device 40 is used to detect whether there is a chip in the testing seat 30. The chip presence detection device 40 includes a mounting seat 1 and a plurality of sensors 3, and the chip presence detection device 40 is mounted beside the testing head assembly 20 by the mounting seat 1. The plurality of sensors 3 are located above the side of the testing seat 30, and the plurality of sensors 3 are inclined towards the testing seat 30 to send detection signals to detect whether there is a semiconductor chip in the testing seat 30. The sensor 3 is arranged to be angle-adjustable to adjust the sending angle of the detection signal.
[0032] The semiconductor testing device 100 provided by the present application adopts the sensor 3 for detection, and the detection response speed is fast and the delay time is short; the angle of the sensor 3 is adjustable, which can meet the detection needs of different specifications of chips and different array arrangements, and the detection compatibility is relatively high and is not affected by the size of the chip; moreover, the structure is simple, easy to quickly install and replace, and the cost is relatively low.
[0033] Please refer to Figure 1As shown, in this embodiment, the semiconductor testing apparatus 100 includes a frame 10, which includes a plurality of support legs and a plate supported by the support legs. A test head assembly 20 is movably connected to the frame 10 and can move toward and away from the test socket 30. A chip presence / absence detection device 40 is located below the plate of the frame 10 and connected to the plate of the frame 10. The chip presence / absence detection device 40 is located beside the test head assembly 20. Since the test head assembly 20 and the test socket 30 are directly opposite each other, the chip presence / absence detection device 40 is located beside the test head assembly 20, that is, above and to the side of the test socket 30. This arrangement of the chip presence / absence detection device 40 does not hinder the testing of the test head assembly 20 and the test socket 30. During use after the chip presence / absence detection device 40 is installed, its position usually does not need to be changed to achieve normal testing.
[0034] like Figure 1 As shown, in this embodiment, the chip presence / absence detection device 40 includes two sets symmetrically located on both sides of the test socket 30, each set corresponding to the detection of half of the test socket 30. The detection signal sent by the chip presence / absence detection device 40 is as follows: Figure 1 As shown by the dashed line, it covers all the placement slots in the test socket 30 used to accommodate semiconductor chips. The chip presence / absence detection device 40 is not limited to two sets. In some embodiments, only one set may be provided, with its detection signal covering the entire area of the test socket 30; in other embodiments, three, four, or more sets of chip presence / absence detection devices 40 may be provided to detect different areas of the test socket 30. In this embodiment, the sensor 3 is a self-reflecting fiber optic sensor. The emitted signal is reflected back from the surface of the object, and the presence or absence of a chip can be determined based on the received reflected signal. Specifically, for example, since the signal transmission distance differs when there is a chip in the test socket 30 and when there is no chip, the sensor 3 can determine the presence or absence of a chip by calculating the distance based on the received reflected signal; furthermore, since the intensity and other parameters of the reflected signal also differ when there is a chip in the test socket 30 and when there is no chip, the sensor 3 can also determine the presence or absence of a chip based on the intensity and other parameters of the received reflected signal. In other embodiments, the sensor 3 may be a photoelectric sensor or other types of sensors.
[0035] Please see Figure 2As shown, the angle of the sensor 3 can be adjusted to ensure that the entire area of the test seat 30 can be covered to achieve detection without dead angle. In the embodiment, the chip presence / absence detection device 40 includes a sensor mounting plate 4, and the sensor 3 is mounted on the sensor mounting plate 4, and the sensor 3 can swing within a preset angle range relative to the sensor mounting plate 4. Specifically, the sensor 3 includes a connecting portion 31 for fixing with the sensor mounting plate 4, and one of the connecting portion 31 and the sensor mounting plate 4 is provided with an elongated hole 310 allowing the sensor 3 to swing for adjustment. In the embodiment, the connecting portion 31 is a fixed connecting piece, and the sensor 3 is clamped between the fixed connecting piece and the sensor mounting plate 4 to achieve fixation. In some embodiments, the connecting portion 31 can be a component integrated with the sensor 3, for example, a part structure extending from a housing included by the sensor 3; in other embodiments, the connecting portion 31 can also be a component separate from the sensor 3, which is fixed with the sensor mounting plate 4 to press-fit the sensor 3. In the embodiment, the elongated hole 310 is provided on the connecting portion 31, and the sensor mounting plate 4 is provided with a fixing hole 410 corresponding to the elongated hole 310, and the fixing hole 410 is circular. When a locking member such as a screw is passed through the elongated hole 310 and connected to the fixing hole 410, and the locking member has not been locked, the sensor 3 and the connecting portion 31 can be rotated by a certain angle to achieve angle adjustment. At this time, the elongated hole 310 can relatively slide relative to the locking member such as the screw, that is, the locking member such as the screw relatively slides in the elongated hole 310. The sliding range is determined by the length of the elongated hole 310, and the relative ends of the locking member such as the screw and the elongated hole 310 are the limit positions at both ends of the sliding range. After the angle adjustment is completed, the locking member such as the screw is further locked to fix the sensor 3. In the embodiment, the adjustable angle range of each sensor 3 is 30°, that is, the included angle range of the sensor 3 between the two limit positions is 30°.
[0036] In the embodiment, corresponding to each sensor 3, the long strip-shaped hole 310 is at least two, that is, at least two fixing positions are adopted to fix the sensor 3 more reliably. Since the movement path of the connecting portion 31 at different positions is different during angle adjustment, the length direction of the two long strip-shaped holes 310 is set to be different. In the embodiment, the length direction of the two long strip-shaped holes 310 is perpendicular. The above embodiment is described by taking that the long strip-shaped hole 310 is arranged on the connecting portion 31 as an example, and in other embodiments, the long strip-shaped hole 310 can also be arranged on the sensor mounting plate 4. In the embodiment, at least two sensors 3 are mounted on each sensor mounting plate 4, the plurality of sensors 3 are arranged in the up-down direction, and are all arranged in an inclined manner. The sensor 3 located at the lower side of the plurality of sensors 3 has a detection range corresponding to the area close to the side of the test seat 30; the sensor 3 located at the upper side of the plurality of sensors 3 has a detection range corresponding to the area close to the middle of the test seat 30. The angle of each sensor 3 can be adjusted individually. The number of sensors 3 on each sensor mounting plate 4 can be set according to the range to be detected and the array arrangement of the semiconductor chips on the test seat 30.
[0037] Please refer to Figures 2 to 6 In the embodiment, the chip presence / absence detection device 40 further comprises a connecting shaft 2, a fixing block 21 and a test plate 5. The upper end of the connecting shaft 2 is fixedly connected to the mounting seat 1. The fixing block 21 is connected to the connecting shaft 2 and can move up and down along the connecting shaft 2 and be locked and fixed at any position or a plurality of preset positions. The test plate 5 is fixedly connected to the fixing block 21 to move up and down along the connecting shaft 2 with the fixing block 21 and be locked and fixed at any position or a plurality of preset positions of the connecting shaft 2. That is, the connecting shaft 2 is connected between the mounting seat 1 and the test plate 5, and the test plate 5 can be mounted at different positions of the connecting shaft 2 to change the mounting height of the sensor 3. Further, the connecting shaft 2 has a plurality of gear position scale marks to guide the debugging personnel to debug the sensor 3 to the appropriate height.
[0038] Please continue to refer to Figures 2 to 6 As shown in the figure, the test plate 5 is provided with a plurality of mounting positions 52, and the sensor mounting plate 4 can be selectively mounted on one or more of the plurality of mounting positions 52. The mounting position 52 can be a mounting hole or other mounting structure, which can realize the fixation of the sensor mounting plate. By arranging a plurality of mounting positions 52, the sensor mounting plate 4 can be selectively mounted on one or more of the plurality of mounting positions 52, so as to match the detection of the test seat 30 with different array modes. Please refer to Figure 3 and Figure 5As shown, in the present embodiment, the test plate 5 is provided with a mode identifier 53 matching the array arrangement mode of the semiconductor chips accommodated by the test seat 30. For example, if the semiconductor chips accommodated by the test seat 30 are in a 1x2 or 1x4 array, only one of the mounting positions 52 marked with 1x2 or 1x4 is equipped with the sensor mounting plate 4 and the sensor 3; for another example, if the semiconductor chips accommodated by the test seat 30 are in a 2x2 or 2x4 array, two of the mounting positions 52 on the two sides are respectively equipped with the sensor mounting plate 4 and the sensor 3. Such arrangement makes the chip presence / absence detection device 40 more compatible, and facilitates quick installation and replacement.
[0039] Referring to Figure 4 and Figure 6 As shown, in the present embodiment, the test plate 5 is provided with an elongated adjustment hole 510 for adjusting the mounting position of the test plate 5. The elongated adjustment hole 510 is horizontally arranged, and can achieve a certain adjustment range of the test plate 5 in the horizontal direction. Specifically, the fixed block 21 is provided with a pair of screw holes, the elongated adjustment hole 510 corresponds to the pair of screw holes, and the length of the elongated adjustment hole 510 is greater than the distance between the pair of screw holes, so that the test plate 5 has a horizontal adjustment space. By connecting the screw to the screw hole through the elongated adjustment hole 510, and after adjusting the test plate 5 to the appropriate position in the left and right directions when the screw is not locked, locking the screw can complete the fixation. As described above, the test plate 5 can be adjusted in the vertical direction, i.e., the longitudinal direction, along the connecting shaft 2, and combined with the horizontal adjustment achieved by the elongated adjustment hole 510, the adjustment can be achieved in two directions perpendicular to each other, which can meet the detection requirements of semiconductor chips of different specifications and different arrangements.
[0040] In the present embodiment, the semiconductor test device 100 is used to detect the RTC (Real-Time Clock) function of the semiconductor chips. Of course, in other embodiments, the semiconductor test device 100 is also used to detect other performances of the semiconductor chips.
[0041] Further, the present application also provides a handler. The handler comprises a feeding device, a collecting device, and the semiconductor test device 100 as described in any of the above embodiments. The feeding device is used to feed the semiconductor chips to be tested into the semiconductor test device 100, the semiconductor chips to be tested are tested by the cooperation of the test head assembly 20 and the test seat 30, and the collecting device is used to classify and collect the tested semiconductor chips. The chip presence / absence detection device 40 is configured to detect whether there is a semiconductor chip left in the test seat 30 after the semiconductor chip is removed from the test seat 30. In some embodiments, the chip presence / absence detection device 40 can also be configured to detect whether there is a semiconductor chip missing in the test seat 30 after the semiconductor chip is assembled into the test seat 30.
[0042] From the above description of the specific embodiments, it can be known that the semiconductor testing device 100 provided by the application includes a chip presence / absence detection device 40, the chip presence / absence detection device 40 includes a mounting seat 1 and a plurality of sensors 3, the chip presence / absence detection device 40 is installed on the side of the testing head assembly 20 through the mounting seat 1, the plurality of sensors 3 are located above the side of the testing seat 30, the plurality of sensors 3 are inclined to send detection signals to the testing seat 30, so as to detect whether there is a semiconductor chip in the testing seat 30, and the sensor 3 is arranged to be angle-adjustable, so as to adjust the sending angle of the detection signal. The semiconductor testing device 100 provided by the application adopts the sensor 3 to perform detection, and the detection response speed is fast and the delay time is small; the angle of the sensor 3 is adjustable, so that the detection requirements of different chips and different arrays can be met, the detection compatibility is high, and the detection is not affected by the size of the chip; and the semiconductor testing device 100 is easy to install and replace, and the cost is low.
[0043] The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, it should be considered that they are within the scope of the present application.
[0044] The above embodiments only express several implementation manners of the application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be pointed out that, for ordinary skilled in the art, without departing from the concept of the application, a number of modifications and improvements can be made, which are all within the protection scope of the application. Therefore, the patent protection scope of the application should be subject to the appended claims.
Claims
1. A semiconductor testing apparatus comprising a test socket (30) for receiving a semiconductor chip and a test head assembly (20) for cooperating with the test socket (30) to test the semiconductor chip, characterized in that, The semiconductor testing device (100) further comprises a chip presence / absence detection device (40), which comprises a mounting base (1) and a plurality of sensors (3). The chip presence / absence detection device (40) is mounted beside the testing head assembly (20) by the mounting base (1), and the plurality of sensors (3) are located above the sides of the testing seat (30) and are inclined towards the testing seat (30) to send detection signals to detect whether there is a semiconductor chip in the testing seat (30). The sensors (3) are provided with an adjustable angle to adjust the sending angle of the detection signals.
2. The semiconductor testing apparatus according to claim 1, wherein The chip presence / absence detection device (40) comprises a sensor mounting plate (4), and the sensors (3) are mounted on the sensor mounting plate (4) and can swing within a preset angle range relative to the sensor mounting plate (4).
3. The semiconductor testing apparatus according to claim 2, wherein The sensor (3) comprises a connecting portion (31) for fixing with the sensor mounting plate (4), and one of the connecting portion (31) and the sensor mounting plate (4) is provided with an elongated hole (310) allowing the sensor (3) to swing and adjust.
4. The semiconductor testing apparatus according to claim 3, wherein Corresponding to each sensor (3), there are at least two elongated holes (310), and the length directions of the two elongated holes (310) are perpendicular.
5. The semiconductor testing apparatus according to claim 3, wherein The elongated hole (310) is provided on the connecting portion (31), and the sensor mounting plate (4) is provided with a fixing hole (410) corresponding to the elongated hole (310). The sensor (3) is fixed on the sensor mounting plate (4) by locking the fixing hole (410) through the elongated hole (310) with a locking member.
6. The semiconductor testing apparatus according to any one of claims 2 to 5, wherein At least two sensors (3) are mounted on each sensor mounting plate (4), and the chip presence / absence detection device (40) comprises at least two groups symmetrically located on both sides of the testing seat (30).
7. The semiconductor testing apparatus according to claim 2, wherein The chip presence / absence detection device (40) comprises a testing plate (5), and the testing plate (5) is provided with a plurality of mounting positions (52). The sensor mounting plate (4) can be selectively mounted on one or more of the plurality of mounting positions (52).
8. The semiconductor testing apparatus according to claim 7, wherein The testing plate (5) is provided with an elongated adjustment hole (510) for adjusting the mounting position (52) of the testing plate (5).
9. The semiconductor testing apparatus according to claim 7, wherein The chip presence / absence detection device (40) comprises a connecting shaft (2) connected between the mounting base (1) and the testing plate (5). The testing plate (5) can be mounted at different positions of the connecting shaft (2) to change the mounting height of the sensor (3).
10. A sorter characterized by The semiconductor testing device (100) as claimed in any one of claims 1 to 9, comprising a feeding device configured to feed a semiconductor chip to be tested into the semiconductor testing device (100), wherein the semiconductor chip to be tested is tested by cooperation of the testing head assembly (20) and the testing seat (30), and a collecting device configured to collect the tested semiconductor chip, wherein the chip presence detection device (40) is configured to detect whether there is a semiconductor chip left in the testing seat (30) after the semiconductor chip is removed from the testing seat (30).