Automatic laser resistance trimming machine for thick film chip resistor

Abstract

The utility model discloses an automatic laser resistance trimming machine for a thick film chip resistor, and relates to the technical field of thick film chip processing. The device comprises a fixing mechanism, the fixing mechanism comprises a supporting plate fixedly connected to the inner wall of the resistor trimming machine, the top of the supporting plate is fixedly connected with a placing box, and the inner wall of the placing box is fixedly connected with a fixing seat. According to the utility model, the accurate position of the thick film wafer can be ensured through the fixing mechanism, so that laser can accurately act on a preset cutting area, the accuracy of a laser cutting path is ensured, the resistance value of the resistor after resistance adjustment meets the design requirement, the micro displacement of the thick film wafer during cutting of the thick film wafer is effectively avoided, and the cutting quality of the thick film wafer is improved. Therefore, the cutting position is deviated, the resistance value precision of the resistor is influenced, meanwhile, the thick film wafer can quickly reach the correct processing position, extra time for position adjustment is not needed, the processing preparation time of each wafer can be shortened, and the overall production efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of thick film wafer processing technology, and in particular relates to an automated laser trimming machine for thick film wafer resistors. Background Technology

[0002] Laser trimming is an important process in the electronics manufacturing industry. By focusing a laser beam onto a thick-film wafer resistor, some material is removed by vaporization or melting, achieving high-precision adjustment of the resistance value. It has the characteristics of non-contact processing, fine control, high speed, and adaptability to complex circuits, which effectively ensures the performance stability and reliability of electronic devices such as sensors and integrated circuits.

[0003] Some existing laser trimming machines are not convenient for quickly centering and fixing thick film wafers on the placement stage, which may require operators to spend extra time adjusting the position, thus increasing the wafer processing preparation time and the overall processing time. Utility Model Content

[0004] The purpose of this invention is to provide an automated laser trimming machine for thick film wafer resistors. By incorporating a fixing mechanism, it solves the problem that some existing laser trimming machines are inconvenient for quickly centering and fixing thick film wafers on the placement stage.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to an automated laser trimming machine for thick-film wafer resistors, comprising a trimming machine equipped with a fixing mechanism and a moving mechanism.

[0007] The fixing mechanism includes a support plate fixedly connected to the inner wall of the resistance adjuster. A placement box is fixedly connected to the top of the support plate. A fixing seat is fixedly connected to the inner wall of the placement box. A fixing plate is fixedly connected to the top of the fixing seat. Several slide rails are fixedly connected to the top of the fixing plate. Slider blocks are slidably connected to the slide rails. L-shaped plates are fixedly connected to the top of the sliders. Several sliding grooves are opened on the top of the placement box. Support rods are fixedly connected to the top of the L-shaped plates. The tops of the support rods extend to the top of the placement box and are slidably connected to the corresponding sliding grooves. Positioning rings are rotatably connected to the tops of the support rods.

[0008] Furthermore, a hydraulic cylinder is fixedly connected to the inner bottom wall of the placement box, and a movable plate is fixedly connected to the output shaft of the hydraulic cylinder.

[0009] Furthermore, a number of connecting rods are fixedly connected to the top of the movable plate one, and a number of connecting plates are hinged to the top of the movable plate one.

[0010] Further, the top ends of the connecting rods all extend to the interior of the fixing base and are in sliding connection with the fixing base, and the connecting plates all are hinged to the corresponding L-shaped plates away from the side of the moving plate one.

[0011] Further, the moving mechanism comprises a first moving assembly and a second moving assembly, the first moving assembly comprises a plurality of slide rods fixedly connected to the inner wall of the resistance adjusting machine, a moving plate two is in sliding connection with the slide rods, a hydraulic cylinder two is fixedly connected to the rear inner wall of the resistance adjusting machine, and the output shaft of the hydraulic cylinder two is fixedly connected with the moving plate two.

[0012] Further, the front side of the moving plate two is fixedly connected with a driving box, and the front side of the moving plate two is fixedly connected with a motor, and the motor is located on the right side of the driving box.

[0013] Further, the output shaft of the motor is fixedly connected with a threaded rod through a shaft coupler, the left end of the threaded rod extends to the left inner wall of the driving box and is in rotary connection with the driving box, and an internally-threaded block is in threaded connection with the threaded rod.

[0014] Further, the internally-threaded block is in sliding connection with the inner wall of the driving box, the bottom of the internally-threaded block extends to the bottom of the driving box, the bottom of the internally-threaded block is fixedly connected with a mounting seat, and the bottom of the mounting seat is fixedly connected with a laser.

[0015] The utility model has the following beneficial effects:

[0016] 1. By setting up the fixed mechanism, starting hydraulic cylinder one, hydraulic cylinder one drives moving plate one to move, moving plate one moves and drives connecting rod to move, moving plate one moves and drives connecting plate to move, connecting plate moves and drives L-shaped plate to move, L-shaped plate moves and drives sliding block to slide on the slide rail, L-shaped plate moves and drives support rod to slide in the sliding groove, support rod moves and drives positioning ring to move, the fixed mechanism can ensure that the thick film wafer position is accurate, the laser can accurately act on the predetermined cutting area, the accuracy of the laser cutting path is guaranteed, the resistance value after resistance adjustment meets the design requirement, effectively avoids that the thick film wafer is slightly displaced when cutting the thick film wafer, thereby causing the cutting position to deviate, affecting the resistance value precision, simultaneously can make the thick film wafer reach correct processing position rapidly, need not spend additional time to adjust position, can shorten the processing preparation time of each wafer, thereby improving the overall production efficiency.

[0017] 2, by setting the moving mechanism, start the motor, the motor drives the threaded rod to rotate, the threaded rod rotates and drives the inner threaded block to move, the inner threaded block moves and drives the mounting seat to move, the mounting seat moves and drives the laser to move, start the hydraulic cylinder two, the hydraulic cylinder two drives the moving plate two to slide on the slide rod, the moving plate two moves and drives the drive box to move, the drive box moves and drives the inner threaded block to move, the inner threaded block moves and drives the laser to move through the mounting seat, the moving mechanism makes the laser move in two axial directions, so that the mounting seat can easily reach different positions in the working area, and then the laser can be accurately positioned to the small position of the resistance that needs to be cut, so as to ensure the accuracy of the cutting position, improve the resistance adjustment precision, and allow the laser to cut or mark complex patterns, so as to realize fine and diversified adjustment of resistance value and meet some special circuit design requirements.

[0018] Of course, any product implementing the present application does not necessarily need to achieve all the advantages described above. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0020] Figure 1 It is the overall structure schematic diagram of the present application;

[0021] Figure 2 It is the top view sectional structure schematic diagram of the present application;

[0022] Figure 3 It is the structure schematic diagram of the slide rod of the present application;

[0023] Figure 4 It is the structure schematic diagram of the drive box of the present application;

[0024] Figure 5 It is the structure schematic diagram of the placing box of the present application;

[0025] Figure 6 It is the structure schematic diagram of the moving plate one of the present application;

[0026] Figure 7 It is the enlarged structure schematic diagram of A in the present application. Figure 5

[0027] In the drawings, the component list represented by each number is as follows:

[0028] ​1, resistance machine; 2, fixed mechanism; 3, moving mechanism; 21, support plate; 22, placement box; 23, fixed seat; 24, fixed plate; 25, slide rail; 26, sliding block; 27, L-shaped plate; 28, sliding groove; 29, support rod; 210, positioning ring; 211, hydraulic cylinder one; 212, moving plate one; 213, connecting rod; 214, connecting plate; 31, slide rod; 32, moving plate two; 33, hydraulic cylinder two; 34, drive box; 35, motor; 36, threaded rod; 37, internal threaded block; 38, mounting seat; 39, laser. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0030] Please refer to Figures 1-7The utility model discloses a thick film wafer resistance automation laser resistance adjusting machine, including resistance adjusting machine 1, be provided with fixed establishment 2 and moving mechanism 3 on resistance adjusting machine 1, fixed establishment 2 includes the support plate 21 of fixed connection in the inner wall of resistance adjusting machine 1, the top fixed connection of support plate 21 has the placing box 22, the inner wall fixed connection of placing box 22 has the fixed seat 23, the top fixed connection of fixed seat 23 has the fixed plate 24, the top fixed connection of fixed plate 24 has a plurality of slide rails 25, a plurality of slide rails 25 all slidingly connected have the sliding block 26, the top of a plurality of sliding blocks 26 all fixed connection has L-shaped board 27, the top of placing box 22 is set up a plurality of slide grooves 28, a plurality of L-shaped boards 27 all fixed connection has the support rod 29 on the top, a plurality of support rods 29 all extend to the top of placing box 22 and with corresponding slide groove 28 slidingly connected on the top end, a plurality of support rods 29 all rotationally connected have the positioning ring 210 on the top end, the inner bottom wall fixed connection of placing box 22 has hydraulic cylinder no. 211, the output shaft fixed connection of hydraulic cylinder no. 211 has moving plate no. 212, the top fixed connection of moving plate no. 212 has a plurality of connecting rods 213, the top hinged of moving plate no. 212 has a plurality of connecting plates 214, the top end of a plurality of connecting rods 213 all extend to the inside of fixed seat 23 and with fixed seat 23 slidingly connected, a plurality of connecting plates 214 away from moving plate no. 212's one side all with corresponding L-shaped board 27 hinged, can ensure thick film wafer position accuracy through fixed establishment 2, make laser can accurately act in the cutting area of prearranging, guarantee the accuracy of laser cutting path, make the resistance value after adjusting resistance meet the design requirement, effectively avoid when cutting thick film wafer to cause thick film wafer to have tiny displacement, thereby lead to cutting position deviation, influence resistance's resistance precision, can let thick film wafer reach correct processing position rapidly simultaneously, need not spend additional time to carry out position adjustment, can shorten the processing preparation time of each wafer, thereby improve overall production efficiency.

[0031] The moving mechanism 3 comprises a first moving assembly and a second moving assembly, the first moving assembly comprises a plurality of slide rods 31 fixedly connected to the inner wall of the resistance adjusting machine 1, a moving plate two 32 is slidably connected to the plurality of slide rods 31, a hydraulic cylinder two 33 is fixedly connected to the rear inner wall of the resistance adjusting machine 1, the output shaft of the hydraulic cylinder two 33 is fixedly connected with the moving plate two 32, a drive box 34 is fixedly connected to the front side of the moving plate two 32, a motor 35 is fixedly connected to the front side of the moving plate two 32, the motor 35 is located on the right side of the drive box 34, the output shaft of the motor 35 is fixedly connected with a threaded rod 36 through a shaft coupling, the left end of the threaded rod 36 extends to the left inner wall of the drive box 34 and is rotatably connected with the drive box 34, an internally threaded block 37 is threadedly connected to the threaded rod 36, the internally threaded block 37 is slidably connected with the inner wall of the drive box 34, the bottom of the internally threaded block 37 extends to the bottom of the drive box 34, a mounting seat 38 is fixedly connected to the bottom of the internally threaded block 37, a laser device 39 is fixedly connected to the bottom of the mounting seat 38, the laser device 39 can move in two axial directions through the moving mechanism 3, so that the mounting seat 38 can easily reach different positions in the working area, and then the laser device 39 can be accurately positioned to a small position that needs to be cut on the resistance, thereby ensuring the accuracy of the cutting position, improving the resistance adjusting precision, and allowing the laser device 39 to cut or mark complex patterns, thereby realizing fine and diversified adjustment of the resistance value and meeting some special circuit design requirements.

[0032] One specific application of the embodiment is: starting the hydraulic cylinder one 211, the hydraulic cylinder one 211 drives the moving plate one 212 to move, the moving plate one 212 drives the connecting rod 213 to move when moving, and then the moving plate one 212 moves away from or approaches the fixed seat 23, the moving plate one 212 drives the connecting plate 214 to move when moving, the connecting plate 214 drives the L-shaped plate 27 to move when moving, the L-shaped plate 27 drives the sliding block 26 to slide on the sliding rail 25 when moving, the L-shaped plate 27 is limited by the sliding block 26 and the sliding rail 25, the L-shaped plate 27 drives the supporting rod 29 to slide in the sliding groove 28 when moving, the supporting rod 29 drives the positioning ring 210 to move when moving, so as to position and clamp the thick film wafer through the positioning ring 210, so that the thick film wafer can be quickly positioned and clamped in the center on the top of the placing box 22.

[0033] The motor 35 is started, the motor 35 drives the threaded rod 36 to rotate, the threaded rod 36 drives the inner threaded block 37 to slide in the inside of the drive box 34 when rotating, the drive box 34 limits the inner threaded block 37, converts the rotary motion of the inner threaded block 37 into linear motion, the inner threaded block 37 drives the mounting seat 38 to move when moving, the mounting seat 38 drives the laser 39 to move when moving, the hydraulic cylinder two 33 is started, the hydraulic cylinder two 33 drives the moving plate two 32 to slide on the slide rod 31, the slide rod 31 limits and supports the moving plate two 32 at the same time, thereby reducing the stress of the hydraulic cylinder two 33, the moving plate two 32 drives the drive box 34 to move when moving, the drive box 34 drives the inner threaded block 37 to move when moving, the mounting seat 38 drives the laser 39 to move when the inner threaded block 37 moves, so that the laser 39 can move in two axial directions, so that the laser 39 can be accurately positioned to the small position that needs to be cut on the resistance, thereby ensuring the accuracy of the cutting position and improving the resistance adjusting precision.

[0034] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0035] The preferred embodiments of the above disclosed application are only used to help explain the application. The preferred embodiments do not describe all the details, nor limit the application to the specific embodiments described. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and specifically describes these embodiments in order to better explain the principles and practical application of the application, so that those skilled in the art can well understand and utilize the application. The application is limited by the claims and their entire scope and equivalents.

Claims

1. A thick film chip resistor automatic laser resistance trimming machine, comprising a resistance trimming machine (1), a fixing mechanism (2) and a moving mechanism (3) are arranged on the resistance trimming machine (1), characterized in that: the fixing mechanism (2) comprises a support plate (21) fixedly connected to the inner wall of the resistance trimming machine (1), the top of the support plate (21) is fixedly connected with a placing box (22), the inner wall of the placing box (22) is fixedly connected with a fixing seat (23), the top of the fixing seat (23) is fixedly connected with a fixing plate (24), the top of the fixing plate (24) is fixedly connected with a plurality of sliding rails (25), a plurality of sliding rails (25) are slidably connected with a sliding block (26), the top of a plurality of sliding blocks (26) is fixedly connected with an L-shaped plate (27), a plurality of L-shaped plates (27) are fixedly connected with a support rod (29) on the top, and the top of a plurality of support rods (29) extends to the top of the placing box (22) and is slidably connected with the corresponding sliding groove (28), and the top of a plurality of support rods (29) is rotatably connected with a positioning ring (210).

2. The thick film chip resistor automated laser trimming machine of claim 1, wherein, The inner bottom wall of the placing box (22) is fixedly connected with a hydraulic cylinder (211), and the output shaft of the hydraulic cylinder (211) is fixedly connected with a moving plate (212).

3. The thick film chip resistor automated laser trimming machine of claim 2, wherein, The top of the moving plate (212) is fixedly connected with a plurality of connecting rods (213), and the top of the moving plate (212) is hingedly connected with a plurality of connecting plates (214).

4. The thick film chip resistor automated laser trimming machine of claim 3, wherein, The top of a plurality of connecting rods (213) extends to the inside of the fixing seat (23) and is slidably connected with the fixing seat (23), and a plurality of connecting plates (214) are hingedly connected with the corresponding L-shaped plate (27) away from the moving plate (212).

5. The thick film chip resistor automated laser trimming machine of claim 4, wherein, The moving mechanism (3) comprises a first moving assembly and a second moving assembly, the first moving assembly comprises a plurality of sliding rods (31) fixedly connected to the inner wall of the resistance trimming machine (1), a plurality of sliding rods (31) are slidably connected with a moving plate (32), the rear inner wall of the resistance trimming machine (1) is fixedly connected with a hydraulic cylinder (33), and the output shaft of the hydraulic cylinder (33) is fixedly connected with the moving plate (32).

6. The thick film chip resistor automated laser trimming machine of claim 5, wherein, The front side of the moving plate (32) is fixedly connected with a drive box (34), the front side of the moving plate (32) is fixedly connected with a motor (35), and the motor (35) is located on the right side of the drive box (34).

7. The thick film chip resistor automated laser trimming machine of claim 6 wherein, The output shaft of the motor (35) is fixedly connected with a threaded rod (36) through a shaft coupler, the left end of the threaded rod (36) extends to the left inner wall of the drive box (34) and is rotatably connected with the drive box (34), and the threaded rod (36) is threadedly connected with an internal threaded block (37).

8. The thick film chip resistor automated laser trimming machine of claim 7, wherein, The internal threaded block (37) is slidably connected with the inner wall of the drive box (34), the bottom of the internal threaded block (37) extends to the bottom of the drive box (34), the bottom of the internal threaded block (37) is fixedly connected with a mounting seat (38), and the bottom of the mounting seat (38) is fixedly connected with a laser (39).

Images