OCR code scanning and edge detection automatic adjusting mechanism
By designing an automatic adjustment mechanism for OCR scanning and edge detection, combined with cylinders, servo motors, and pulley transmission mechanisms, the problem of insufficient applicability to wafers of different sizes in existing technologies has been solved, enabling effective scanning and edge detection for 8-inch and 12-inch wafers.
Patent Information
- Application Number
- CN202423182626.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-23
AI Technical Summary
In existing technologies, OCR scanning and edge detection are usually performed by different institutions, and cannot be adapted to wafers of different sizes, resulting in insufficient applicability.
An automatic adjustment mechanism for OCR scanning and edge detection was designed. By using a size adjustment cylinder and a rotary servo motor in conjunction with a synchronous belt pulley transmission mechanism, OCR scanning and edge detection of wafers of different sizes can be achieved. A laser sensor and a wafer reader work together to determine the wafer position and read the code.
It improves the applicability of OCR scanning and edge detection, and can adapt to 8-inch and 12-inch wafers, realizing wafer traceability and location determination.
Smart Images
Figure CN223680066U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer processing technical field, concretely is a kind of OCR code scanning and edge detection automatic adjusting mechanism. BACKGROUND
[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, generally presents circular sheet shape.Wafer usually needs to carry out OCR code scanning and edge detection before downstream operation, to ensure that wafer has preset state, to facilitate downstream continuous standardization operation.OCR code scanning is to read the code on wafer by wafer code reader, to realize the traceability of wafer.
[0003] Semiconductor industry often determines the position of wafer by notch, realizes the edge of wafer.Notch refers to a corner defect intentionally formed on wafer.At present, optical laser sensor is often used in edge detection in process.Specifically, wafer is placed on sample stage, suppose laser is blocked by wafer at this time, wafer starts to rotate, when rotating to notch position, laser can be captured by laser collector through notch, so, the position information of wafer can be obtained by calculation.
[0004] In prior art, OCR code scanning and edge detection are usually carried out by different mechanisms separately, and position is fixed, cannot be used for wafer of different sizes.
[0005] Therefore, the utility model provides a kind of OCR code scanning and edge detection automatic adjusting mechanism to solve above-mentioned problems. UTILITY MODEL CONTENT
[0006] In view of the deficiencies of prior art, the utility model provides a kind of OCR code scanning and edge detection automatic adjusting mechanism, solves above-mentioned problems.
[0007] To achieve the above object, the utility model is realized by the following technical scheme: a kind of OCR code scanning and edge detection automatic adjusting mechanism, including base, the outside of the base is provided with OCR wafer code reader, laser sensor, wafer, wafer adsorption turntable, size adjustment cylinder, negative pressure interface, rotating servo motor, synchronous pulley transmission mechanism, pulley tensioning assembly, first limiting mechanism, second limiting mechanism, the base is used to install and connect each component.
[0008] Preferably, the OCR wafer code reader is fixedly installed on the top of base, and the laser sensor is fixedly installed on the side of OCR wafer code reader.
[0009] Preferably, the wafer adsorption turntable is arranged on the top of base, and the wafer is placed above the wafer adsorption turntable.
[0010] Preferably, the synchronous pulley transmission mechanism is composed of two pulleys and an outer winding belt, the large pulley is fixedly installed on the bottom base of the size adjusting cylinder through a rotating shaft, and the small pulley is fixedly installed on the output end of the rotating servo motor.
[0011] Preferably, the rotating servo motor is fixedly installed on the top of the belt pulley tensioning assembly arranged on the top of the base.
[0012] Preferably, the first limiting mechanism is arranged on the side of the size adjusting cylinder, and the second limiting mechanism is arranged on the side of the OCR wafer code reader.
[0013] Beneficial effects
[0014] The utility model provides a kind of OCR code scanning and edge detection automatic adjustment mechanism.Compared with prior art, it has the following beneficial effects:
[0015] 1、The OCR code scanning and edge detection automatic adjustment mechanism, by cooperating with the servo mechanism, laser sensor and wafer code reader of cylinder, can perform OCR code scanning and edge detection on wafers of different sizes (8 inches, 12 inches), greatly improving the applicability of OCR code scanning and edge detection. DETAILED DESCRIPTION
[0016] To more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the following will briefly introduce the drawings needed to be used in the description of embodiments or prior art. Obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from these drawings without creative labor.
[0017] Fig. 1 It is the structure front view of the utility model;
[0018] Fig. 2 It is the structure plan view of the utility model.
[0019] In the figure: 1, base; 2, OCR wafer code reader; 3, laser sensor; 4, wafer; 5, wafer suction turntable; 6, size adjusting cylinder; 7, negative pressure interface; 8, rotating servo motor; 9, synchronous pulley transmission mechanism; 10, belt pulley tensioning assembly; 11, first limiting mechanism; 12, second limiting mechanism. DETAILED DESCRIPTION
[0020] It should be noted that in the description of the embodiments of the present application, the terms "front, back, left, right, top, bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0021] The present application will be further described in detail below with the aid of drawings and examples.
[0022] Referring to Figs. 1-2 The embodiments of the present application provide an OCR code scanning and edge detection automatic adjustment mechanism, which comprises a base 1, an OCR wafer code reader 2, a laser sensor 3, a wafer 4, a wafer adsorption turntable 5, a size adjustment cylinder 6, a negative pressure interface 7, a rotary servo motor 8, a synchronous pulley transmission mechanism 9, a pulley tensioning assembly 10, a first limiting mechanism 11 and a second limiting mechanism 12 are arranged on the outer side of the base 1. The base 1 is used for mounting and connecting various components. The OCR wafer code reader 2 is fixedly installed on the top of the base 1, and the laser sensor 3 is fixedly installed on the side of the OCR wafer code reader 2. The wafer adsorption turntable 5 is arranged on the top of the base 1, and the wafer 4 is placed above the wafer adsorption turntable 5. The synchronous pulley transmission mechanism 9 is composed of two pulleys and a belt wound outside, the large pulley is fixedly installed on the bottom of the size adjustment cylinder 6 through the rotating shaft, and the small pulley is fixedly installed on the output end of the rotary servo motor 8. The rotary servo motor 8 is fixedly installed on the top of the pulley tensioning assembly 10, and the pulley tensioning assembly 10 is arranged on the top of the base 1. The first limiting mechanism 11 is arranged on the side of the size adjustment cylinder 6, and the second limiting mechanism 12 is arranged on the side of the OCR wafer code reader 2.
[0023] In the present embodiment, when the size adjustment cylinder 6 is reset, the OCR wafer code reader 2 and the laser sensor 3 are at the 8-inch wafer scanning position, the 8-inch wafer is placed on the wafer adsorption turntable 5 by the mechanical hand, the wafer adsorption turntable 5 is ON, the servo motor 8 drives the wafer adsorption turntable 5 to rotate through the synchronous pulley transmission mechanism 9, the laser sensor 3 captures the laser through the gap, and the position information of the wafer is obtained by calculation. After the wafer position information is determined, rotate a certain angle to make the wafer code under the OCR wafer code reader 2, the OCR wafer code reader 2 reads the wafer code, and realizes the traceability of the wafer.
[0024] The size adjusting cylinder 6 moves forward to the position, the OCR wafer code reader 2 and the laser sensor 3 are at the 12-inch wafer scanning position, the 12-inch wafer is placed on the wafer adsorption turntable 5 by the mechanical hand, the wafer adsorption turntable 5 is ON, the servo motor 8 drives the wafer adsorption turntable 5 to rotate through the synchronous belt gear transmission mechanism 9, the laser sensor 3 captures the laser through the gap, the position information of the wafer is obtained by calculation, after the position information of the wafer is determined, the wafer code is rotated to the position below the OCR wafer code reader 2, the wafer code is read by the OCR wafer code reader 2, and the wafer traceability is realized.
[0025] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.
[0026] Working principle: when the size adjusting cylinder 6 is reset, the OCR wafer code reader 2 and the laser sensor 3 are at the 8-inch wafer scanning position, the 8-inch wafer is placed on the wafer adsorption turntable 5 by the mechanical hand, the wafer adsorption turntable 5 is ON, the servo motor 8 drives the wafer adsorption turntable 5 to rotate through the synchronous belt gear transmission mechanism 9, the laser sensor 3 captures the laser through the gap, the position information of the wafer is obtained by calculation, after the position information of the wafer is determined, the wafer code is rotated to the position below the OCR wafer code reader 2, the wafer code is read by the OCR wafer code reader 2, and the wafer traceability is realized.
[0027] The size adjusting cylinder 6 moves forward to the position, the OCR wafer code reader 2 and the laser sensor 3 are at the 12-inch wafer scanning position, the 12-inch wafer is placed on the wafer adsorption turntable 5 by the mechanical hand, the wafer adsorption turntable 5 is ON, the servo motor 8 drives the wafer adsorption turntable 5 to rotate through the synchronous belt gear transmission mechanism 9, the laser sensor 3 captures the laser through the gap, the position information of the wafer is obtained by calculation, after the position information of the wafer is determined, the wafer code is rotated to the position below the OCR wafer code reader 2, the wafer code is read by the OCR wafer code reader 2, and the wafer traceability is realized.
[0028] It should be noted that, in this text, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.
[0029] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary and that changes can be made in detail without departing from the principles and spirit of the application. The scope of the application is therefore defined by the appended claims and their equivalents.
Claims
1. An OCR code scanning and edge detection automatic adjustment mechanism, comprising a base (1), characterized in that: The outer side of the base (1) is provided with an OCR wafer code reader (2), a laser sensor (3), a wafer (4), a wafer adsorption turntable (5), a size adjustment cylinder (6), a negative pressure interface (7), a rotary servo motor (8), a synchronous pulley transmission mechanism (9), a pulley tensioning assembly (10), a first limiting mechanism (11), and a second limiting mechanism (12). The base (1) is used for mounting and connecting various components.
2. The OCR code scanning and edge detection automatic adjustment mechanism according to claim 1, characterized in that: The OCR wafer code reader (2) is fixedly installed on the top of the base (1), and the laser sensor (3) is fixedly installed on the side of the OCR wafer code reader (2).
3. The OCR code scanning and edge detection automatic adjustment mechanism according to claim 1, wherein: The wafer adsorption turntable (5) is arranged on the top of the base (1), and the wafer (4) is placed above the wafer adsorption turntable (5).
4. The OCR code scanning and edge detection automatic adjustment mechanism according to claim 1, wherein: The synchronous pulley transmission mechanism (9) is composed of two pulleys and a belt wound outside. The large pulley is fixedly installed on the bottom of the size adjustment cylinder (6) through a rotating shaft, and the small pulley is fixedly installed on the output end of the rotary servo motor (8).
5. The OCR code scanning and edge detection automatic adjustment mechanism according to claim 1, wherein: The rotary servo motor (8) is fixedly installed on the top of the pulley tensioning assembly (10), and the pulley tensioning assembly (10) is arranged on the top of the base (1).
6. The OCR code scanning and edge detection automatic adjustment mechanism according to claim 1, wherein: The first limiting mechanism (11) is arranged on the side of the size adjustment cylinder (6), and the second limiting mechanism (12) is arranged on the side of the OCR wafer code reader (2).