Wafer guide driving mechanism and wafer guide device

Abstract

The utility model discloses a wafer guide sheet driving mechanism and a wafer guide sheet device, the wafer guide sheet driving mechanism comprises a pedestal, a driving member, a transmission assembly, a first clamping hand and a second clamping hand, the fixed end of the driving member is installed on the pedestal, and the driving end of the driving member is connected with the transmission assembly; the first clamping hand and the second clamping hand are both installed on the base, and the first clamping hand and the second clamping hand are each provided with a wafer guide groove used for bearing one side of a wafer; the transmission assembly comprises a driving gear, a first driven gear, a transmission gear set and a second driven gear, the driving gear is installed at the driving end of the driving part, the first driven gear is meshed with the driving gear, and the input end of the transmission gear set is meshed with the first driven gear; and the second driven gear is meshed with the output end of the transmission gear set and is arranged on the second clamping hand. The wafer guide piece driving mechanism drives the first clamping hand and the second clamping hand to synchronously and reversely rotate through the cooperation of the driving piece and the transmission assembly, and has the effects of small occupied space and high transmission precision.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a wafer guiding piece driving mechanism and wafer guiding piece device. BACKGROUND

[0002] In the processing of wafers, sometimes only part of the wafers in the wafer box needs to be selected according to requirements. For example, in a common case, different process flows are required for wafers in odd-numbered slots and wafers in even-numbered slots in the wafer box, and in this case, only wafers in odd-numbered slots or only wafers in even-numbered slots need to be selected.

[0003] In order to avoid contamination of wafers during guiding, a wafer guiding machine is currently used to guide wafers in a wafer box. The existing wafer guiding machine generally includes a driving assembly, two rotating grippers, and a lifting support. The wafer box containing wafers is placed on the lifting support, and the wafers in the wafer box are guided by the cooperation of the driving assembly, the two rotating grippers, and the lifting support.

[0004] However, the existing driving assembly mostly drives the two rotating grippers to rotate through a synchronous belt transmission mode, which has the problems of large occupied space and low transmission accuracy. SUMMARY

[0005] To solve the problems in the related art, the utility model aims to provide a wafer guiding piece driving mechanism to solve the problems of large occupied space and low transmission accuracy of the driving assembly in the prior art. In addition, the utility model also provides a wafer guiding piece device including the wafer guiding piece driving mechanism.

[0006] To achieve the above-mentioned purpose, the utility model embodiment adopts the following technical solutions:

[0007] A wafer guiding piece driving mechanism includes a base, a driving member, a transmission assembly, a first gripper, and a second gripper, wherein:

[0008] The fixed end of the driving member is installed on the base, and the driving end of the driving member is connected to the transmission assembly;

[0009] The first gripper and the second gripper are both rotatably and spacedly installed on the base, and the first gripper and the second gripper are both provided with a plurality of guiding piece grooves on the side for carrying wafers, and the driving member is configured to drive the first gripper and the second gripper to synchronously and reversely rotate through the transmission assembly;

[0010] The transmission assembly comprises a driving gear, a first driven gear, a transmission gear set and a second driven gear, the driving gear is installed on the driving end of the driving member, the first driven gear is engaged with the driving gear and is installed on the first clamping hand, the input end of the transmission gear set is engaged with the first driven gear, and the second driven gear is engaged with the output end of the transmission gear set and is installed on the second clamping hand.

[0011] Optionally, the transmission gear set comprises a first transmission gear, a first transition gear, a second transition gear and a second transmission gear which are rotatably installed on the base, the first transmission gear is engaged with the first driven gear, the first transition gear is engaged with the first transmission gear, the second transition gear is engaged with the first transition gear, and the second transmission gear is engaged with the second transition gear.

[0012] Optionally, the installation heights of the first driven gear and the second driven gear are the same, and the sizes and the number of teeth of the first driven gear and the second driven gear are the same.

[0013] Optionally, the installation heights of the first transmission gear and the second transmission gear are the same, and the sizes and the number of teeth of the first transmission gear and the second transmission gear are the same.

[0014] Optionally, the installation heights of the first transition gear and the second transition gear are the same, and the sizes and the number of teeth of the first transition gear and the second transition gear are the same.

[0015] Optionally, the base is provided with a first installation slot and a second installation slot, and the first transition gear and the second transition gear are respectively detachably arranged on the first installation slot and the second installation slot.

[0016] Optionally, the first clamping hand and the second clamping hand each comprise a clamping hand body, a plurality of avoiding grooves are formed in one side of the clamping hand body and extend through the thickness direction of the clamping hand body and are used for avoiding part of silicon wafers in a silicon wafer box, and at least one side of each avoiding groove is provided with a wafer supporting groove for supporting the remaining part of silicon wafers in the same silicon wafer box.

[0017] Optionally, the other side of the clamping hand body relative to the side provided with the avoiding grooves and the wafer supporting grooves is provided with a loading and unloading groove for supporting all the silicon wafers in the same silicon wafer box, and the number of the loading and unloading grooves is equal to the sum of the number of the avoiding grooves and the number of the wafer supporting grooves.

[0018] Optionally, the clamping hand body is a cuboid structure, and the wafer supporting grooves and the loading and unloading groove are on the same side of the clamping hand body.

[0019] Optionally, the wafer supporting grooves and the loading and unloading groove are inclined grooves.

[0020] The wafer supporting grooves and the loading and unloading groove are inclined grooves.

[0021] 1. The first gripper and the second gripper are driven to rotate reversely synchronously by the cooperation of the driving member and the transmission assembly, and the effect of small occupied space and high transmission precision is achieved.

[0022] 2. The installation position, size and tooth number of the first driven gear and the second driven gear are controlled, the transmission precision is ensured, and the effect of high transmission precision is achieved.

[0023] 3. The installation position, size and tooth number of the first transmission gear, the first transition gear, the second transition gear and the second transmission gear are controlled, the transmission precision is ensured, and the effect of high transmission precision is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate and understand the technical scheme in the embodiments of the present application, the drawings needed in the background art and embodiment description of the present application will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present application and the drawings without creative labor.

[0025] Fig. 1 is a structural schematic diagram of a wafer guide piece driving mechanism provided by the embodiments of the present application;

[0026] Fig. 2 is a structural schematic diagram of a wafer guide piece driving mechanism provided by the embodiments of the present application;

[0027] Fig. 3 is a structural schematic diagram of a wafer guide piece driving mechanism provided by the embodiments of the present application;

[0028] Fig. 4 is a structural schematic diagram of a wafer guide piece driving mechanism provided by the embodiments of the present application; DETAILED DESCRIPTION

[0029] The present application will be further described in detail below with reference to the drawings.

[0030] For the convenience of understanding the utility model, the utility model will be described more fully below with reference to the relevant drawings. The preferred embodiments of the utility model are shown in the drawings. However, the utility model can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on another component or there can be a middle component. When a component is considered "connected" to another component, it can be directly connected to another component or there can be a middle component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as understood by those skilled in the art of the technology to which the utility model belongs. The terms used in the specification of the utility model herein are only for the purpose of describing the specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] Please refer to Figs. 1 to 4 The embodiment provides a wafer guide piece driving mechanism, which comprises a base 1, a driving piece 2, a transmission assembly 3, a first clamping hand 4 and a second clamping hand 5, wherein:

[0032] The fixed end of the driving piece 2 is installed on the base 1, and the driving end of the driving piece 2 is connected with the transmission assembly 3;

[0033] The first clamping hand 4 and the second clamping hand 5 are both rotatably and spacedly installed on the base 1, the first clamping hand 4 and the second clamping hand 5 are both provided with a plurality of guide piece grooves for bearing one side of a wafer, and the driving piece 2 is configured to drive the first clamping hand 4 and the second clamping hand 5 to synchronously and reversely rotate through the transmission assembly 3;

[0034] The transmission assembly 3 comprises a driving gear 30, a first driven gear 31, a transmission gear set 32 and a second driven gear 33, the driving gear 30 is installed on the driving end of the driving piece 2, the first driven gear 31 is engaged with the driving gear 30 and installed on the first clamping hand 4, the input end of the transmission gear set 32 is engaged with the first driven gear 31, and the second driven gear 33 is engaged with the output end of the transmission gear set 32 and installed on the second clamping hand 5.

[0035] It can be seen that the driving piece 2 and the transmission assembly 3 are matched to drive the first clamping hand 4 and the second clamping hand 5 to synchronously and reversely rotate, having the effects of small space occupation and high transmission precision.

[0036] As an implementation form, the transmission gear set 32 comprises a first transmission gear 320 rotatably mounted on the base 1, a first transition gear 321, a second transition gear 322 and a second transmission gear 323, the first transmission gear 320 is engaged with the first driven gear 31, the first transition gear 321 is engaged with the first transmission gear 320, the second transition gear 322 is engaged with the first transition gear 321, and the second transmission gear 323 is engaged with the second transition gear 322.

[0037] It can be seen that through the cooperation of the first transmission gear 320, the first transition gear 321, the second transition gear 322 and the second transmission gear 323, the effects of compact structure, small space occupation and high transmission precision are achieved.

[0038] As an implementation form, the installation heights of the first driven gear 31 and the second driven gear 33 are the same, and the sizes and the number of teeth of the first driven gear 31 and the second driven gear 33 are the same.

[0039] It can be seen that by controlling the installation positions, sizes and number of teeth of the first driven gear 31 and the second driven gear 33, the transmission precision is ensured, and the effect of high transmission precision is achieved.

[0040] As an implementation form, the installation heights of the first transmission gear 320 and the second transmission gear 323 are the same, and the sizes and the number of teeth of the first transmission gear 320 and the second transmission gear 323 are the same.

[0041] Specifically, the installation heights of the first transition gear 321 and the second transition gear 322 are the same, and the sizes and the number of teeth of the first transition gear 321 and the second transition gear 322 are the same.

[0042] It can be seen that by controlling the installation positions, sizes and number of teeth of the first transmission gear 320, the first transition gear 321, the second transition gear 322 and the second transmission gear 323, the transmission precision is ensured, and the effect of high transmission precision is achieved.

[0043] As an implementation form, the base 1 is provided with a first mounting groove 10 and a second mounting groove 11, and the first transition gear 321 and the second transition gear 322 are respectively detachably arranged on the first mounting groove 10 and the second mounting groove 11.

[0044] It can be seen that through the arrangement of the first mounting groove 10 and the second mounting groove 11, the first transition gear 321 and the second transition gear 322 of different sizes can be replaced to adjust the transmission ratio, and the effect of wide application range is achieved.

[0045] As an implementation, the first gripper 4 and the second gripper 5 each comprise a gripper body 6, and a plurality of avoiding grooves 60 are formed on one side of the gripper body 6 and used for avoiding part of the silicon wafers in the silicon wafer box.

[0046] Specifically, the other side of the gripper body 6 relative to the side where the avoiding grooves 60 and the dividing grooves 61 are arranged is provided with a plurality of loading and unloading grooves 62 used for supporting all the silicon wafers in the same silicon wafer box, and the number of the loading and unloading grooves 62 is equal to the sum of the number of the avoiding grooves 60 and the number of the dividing grooves 61.

[0047] Specifically, the gripper body 6 is a cuboid structure, and the dividing grooves 61 and the loading and unloading grooves 62 are on the same side of the gripper body 6.

[0048] Specifically, the dividing grooves 61 and the loading and unloading grooves 62 are inclined grooves.

[0049] It can be seen that the structure of the gripper body 6 is simple and ingenious, and the silicon wafers in the same silicon wafer box can be partially selected, the whole silicon wafer selection and conversion process is safe and reliable, manpower is saved, and the working efficiency is high.

[0050] In the embodiments disclosed in the present application, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, "connecting" can be fixed connection, or detachable connection, or integrated connection; "connecting" can be directly connected, or indirectly connected through an intermediate medium. For ordinary skilled in the art, the specific meaning of the above terms in the embodiments disclosed in the present application can be understood according to the specific circumstances.

[0051] The above embodiments only illustrate the basic principles and characteristics of the present application, and the present application is not limited by the above examples. Without departing from the spirit and scope of the present application, various changes and modifications can be made to the present application, and these changes and modifications all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer guide drive mechanism, characterized in that, The wafer guide piece driving mechanism comprises a base, a driving piece, a transmission assembly, a first clamping hand and a second clamping hand, wherein: The fixed end of the driving piece is mounted on the base, and the driving end of the driving piece is connected with the transmission assembly; The first clamping hand and the second clamping hand are rotatably and spacedly mounted on the base, and each of the first clamping hand and the second clamping hand is provided with a plurality of guide piece grooves for carrying one side of a wafer, and the driving piece is configured to drive the first clamping hand and the second clamping hand to synchronously and reversely rotate through the transmission assembly; The transmission assembly comprises a driving gear, a first driven gear, a transmission gear set and a second driven gear, the driving gear is mounted on the driving end of the driving piece, the first driven gear is engaged with the driving gear and mounted on the first clamping hand, the input end of the transmission gear set is engaged with the first driven gear, and the second driven gear is engaged with the output end of the transmission gear set and mounted on the second clamping hand.

2. The wafer tab drive mechanism of claim 1, wherein, The transmission gear set comprises a first transmission gear, a first transition gear, a second transition gear and a second transmission gear which are rotatably mounted on the base, the first transmission gear is engaged with the first driven gear, the first transition gear is engaged with the first transmission gear, the second transition gear is engaged with the first transition gear, and the second transmission gear is engaged with the second transition gear.

3. The wafer tab drive mechanism of claim 1, wherein, The first driven gear and the second driven gear have the same installation height, and the first driven gear and the second driven gear have the same size and tooth number.

4. The wafer tab drive mechanism of claim 2, wherein, The first transmission gear and the second transmission gear have the same installation height, and the first transmission gear and the second transmission gear have the same size and tooth number.

5. The wafer tab drive mechanism of claim 2, wherein, The first transition gear and the second transition gear have the same installation height, and the first transition gear and the second transition gear have the same size and tooth number.

6. The wafer tab drive mechanism of claim 2, wherein, The base is provided with a first mounting groove and a second mounting groove, and the first transition gear and the second transition gear are respectively detachably arranged on the first mounting groove and the second mounting groove.

7. The wafer tab drive mechanism of claim 1, wherein, The first clamping hand and the second clamping hand each comprise a clamping hand body, one side of the clamping hand body is provided with a plurality of avoiding grooves which penetrate through the thickness direction of the clamping hand body and are used for avoiding part of silicon wafers in a silicon wafer box, and at least one side of each avoiding groove is provided with a wafer supporting groove which is arranged on the clamping hand body and is used for supporting the remaining part of silicon wafers in the same silicon wafer box.

8. The wafer tab drive mechanism of claim 7, wherein, The other side of the clamping hand body relative to the side provided with the avoiding grooves and the wafer supporting grooves is provided with a loading and unloading groove which is used for supporting all silicon wafers in the same silicon wafer box, and the number of the loading and unloading grooves is equal to the sum of the number of the avoiding grooves and the number of the wafer supporting grooves.

9. The wafer tab drive mechanism of claim 7, wherein, The clamping hand body is a cuboid structure, and the wafer supporting grooves and the loading and unloading grooves are arranged on the same side of the clamping hand body.

10. The wafer tab drive mechanism of claim 7, wherein, The wafer supporting grooves and the loading and unloading grooves are inclined grooves.

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