Component mounting structure and packaging device

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a component mounting structure and a packaging device. The component mounting structure comprises a substrate which comprises a front surface and a back surface which are oppositely distributed along a first direction, and the front surface of the substrate is provided with a projection structure; the component is attached to the front face of the substrate in the first direction, the component comprises a component body and a conductive terminal connected to the side face of the component body, the side face, away from the component body, of the conductive terminal is provided with a clamping groove, and at least part of the protruding structure is located in the clamping groove. According to the utility model, the problem of solder paste bridging adhesion between adjacent components is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a component mounting structure and a packaged device. BACKGROUND

[0002] Traditional high-density SIP (System In a Package) structures usually adopt a tiled manner to package active devices and passive devices such as RLC (i.e., a circuit structure composed of resistance R, inductance L, and capacitance C), inductance, and crystal oscillator together. The overall thickness of the package is determined by the size of the large-size components. The size of the tiled components, the alignment accuracy of the mounting position of the components on the substrate, and the spacing distance between adjacent components are important factors affecting the miniaturization of single-package products.

[0003] To meet the needs of terminal customers for the miniaturization of single-package products, current designs can only rely on the unlimited reduction of the spacing between adjacent tiled components. However, when the spacing between adjacent components is too small, for example, exceeds the design specification, tin bridges may occur between adjacent components, thereby affecting product quality and leading to a decrease in the yield of packaged products.

[0004] Therefore, how to improve the accuracy of the mounting position of components on the substrate while reducing the problem of adhesion bridges between adjacent components caused by solder paste, thereby ensuring the quality and yield of packaged products, is a technical problem that needs to be solved. SUMMARY

[0005] The utility model provides a component mounting structure and a packaged device for improving the accuracy of the mounting position of components on the substrate while reducing the problem of adhesion bridges between adjacent components caused by solder paste, thereby ensuring the quality and yield of packaged products.

[0006] According to some embodiments, the utility model provides a component mounting structure, comprising:

[0007] a substrate including a front surface and a back surface oppositely distributed along a first direction, the front surface of the substrate having a protruding structure;

[0008] a component mounted on the front surface of the substrate along the first direction, the component including a component body and a conductive terminal connected to the side surface of the component body, the conductive terminal having a clamping groove on the side surface facing away from the component body, and the protruding structure being at least partially located in the clamping groove.

[0009] In some embodiments, further comprising:

[0010] A solder layer is located between the front surface of the substrate and the conductive terminal of the component, and part of the solder layer extends into the clamping groove.

[0011] In some embodiments, the front surface of the substrate has a plurality of the protruding structures arranged at intervals, and the conductive terminal in the component has a plurality of the clamping grooves corresponding to the plurality of the protruding structures one by one on the side surface away from the device body.

[0012] In some embodiments, the component includes two conductive terminals connected to opposite sides of the device body along a second direction, and each of the conductive terminals has one clamping groove on the side surface away from the device body.

[0013] The front surface of the substrate has two protruding structures arranged at intervals along the second direction, and the two protruding structures correspond to the two clamping grooves in the component one by one.

[0014] In some embodiments, the protruding structure is a conductive bump, and the conductive bump is in electrical connection with the inner wall of the clamping groove.

[0015] In some embodiments, the height of the clamping groove along the first direction is greater than the thickness of the protruding structure along the first direction.

[0016] In some embodiments, the conductive terminal is connected to the side surface of the device body along a second direction, and the second direction is perpendicular to the first direction.

[0017] The side surface away from the device body of the conductive terminal also has a glue-containing groove, and the glue-containing groove is arranged at intervals along a third direction with the clamping groove, the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.

[0018] In some embodiments, the component includes two conductive terminals connected to opposite sides of the device body along a second direction, and each of the conductive terminals has at least one glue-containing groove on the side surface away from the device body.

[0019] The glue-containing grooves in the two conductive terminals are symmetrically distributed about the device body.

[0020] In some embodiments, the side wall of the glue-containing groove is obliquely intersected with the front surface of the substrate.

[0021] In some embodiments, the side wall of the glue-containing groove is an arc-shaped side wall or a planar side wall.

[0022] According to another embodiment, the utility model also provides a packaging device, including the component mounting structure as described above.

[0023] The component mounting structure and the packaging device provided by the utility model have the advantages that the protruding structure is arranged on the front surface of the substrate, and the clamping groove is arranged in the conductive terminal of the end portion of the component, so that the clamping groove and the protruding structure are matched, the position of the component on the front surface of the substrate is positioned through the alignment of the clamping groove and the protruding structure, the accuracy of the mounting position of the component on the substrate is ensured, the tin paste bridging and sticking problem caused by the too close distance between adjacent components due to the deviation of the mounting position of the component is avoided, the clamping groove can also accommodate the tin paste used for connecting the component and the substrate, the amount of tin paste overflowing the component is reduced, the bridging problem between adjacent components due to tin paste sticking is further avoided, and the performance of the component mounting structure and the yield of the packaging product are further improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a sectional view of the component mounting structure in the embodiment of the utility model,

[0025] Figure 2 is a top view of the component mounting structure in the embodiment of the utility model,

[0026] Figure 3 is a sectional view of the component in the embodiment of the utility model,

[0027] Figure 4 is another sectional view of the component mounting structure in the embodiment of the utility model,

[0028] Figure 5 is another top view of the component mounting structure in the embodiment of the utility model,

[0029] Figure 6 is another sectional view of the component in the embodiment of the utility model. DETAILED DESCRIPTION

[0030] The component mounting structure and the packaging device provided by the utility model will be described in detail in combination with the drawings.

[0031] The embodiment provides a component mounting structure, Figure 1 is a sectional view of the component mounting structure in the embodiment of the utility model, Figure 2 is a top view of the component mounting structure in the embodiment of the utility model, Figure 3is a sectional view of a component in the embodiment of the utility model. As shown in the figure, Figures 1-3 The component mounting structure comprises:

[0032] The substrate 10 comprises a front surface 101 and a back surface 102 oppositely distributed along a first direction D1, and the front surface 101 of the substrate 10 is provided with a protruding structure 13;

[0033] The component is mounted on the front surface 101 of the substrate 10 along the first direction D1, and the component comprises a component body 11 and a conductive terminal 12 connected to the side of the component body 11, the side of the conductive terminal 12 away from the component body 11 is provided with a clamping groove 16, and the protruding structure 13 is at least partially located in the clamping groove 16.

[0034] Specifically, the substrate 10 can be but is not limited to a PCB circuit board. The substrate 10 comprises a front surface 101 and a back surface 102 oppositely distributed along the first direction D1, and the inside of the substrate 10 is provided with a rewiring layer 14. The front surface 101 of the substrate 10 is provided with at least one protruding structure 13. The component is mounted on the front surface 101 of the substrate 10 through a solder layer 15. The component comprises the component body 11 and the conductive terminal 12 distributed on the end of the component body 11 along the second direction D2 and electrically connected to the component body 11, the conductive terminal 12 is electrically connected to the rewiring layer 14 in the substrate 10, so that the transmission of electrical signals between the component body 11 and the rewiring layer 14 can be realized through the conductive terminal 12. In an example, the component can be an active component or a passive component. The side of the conductive terminal 12 away from the component body 11 is provided with the clamping groove 16, the shape and size of the clamping groove 16 match the shape and size of the protruding structure 13 on the substrate 10, so that the protruding structure 13 can be at least partially inserted into the inside of the clamping groove 16. In an example, the component mounting structure comprises a plurality of components spaced apart along the second direction D2, and the second direction D2 is perpendicular to the first direction D1 (for example, the second direction D2 is parallel to the front surface 101 of the substrate 10).

[0035] In the embodiment, the protruding structure 13 is arranged on the substrate 10, and the clamping groove 16 matching the protruding structure 13 is arranged in the conductive terminal 12 at the end of the component, so that the position of the component on the front surface 101 of the substrate 10 can be positioned by the alignment of the clamping groove 16 and the protruding structure 13, the accuracy of the mounting position of the component on the substrate is ensured, and the tin paste bridging and sticking problem caused by the proximity between adjacent components due to the deviation of the mounting position of the component is avoided. Moreover, in the reflow soldering process, the clamping groove 16 can also accommodate the tin paste overflowing from between the component and the substrate, reduce the amount of tin paste overflowing to the outside of the component, thereby further avoiding the bridging problem between adjacent components due to tin paste sticking, and further improving the performance of the component mounting structure and the yield of the packaging product.

[0036] In an example, the clamping groove 16 is only located at the bottom end of the conductive terminal 12, that is, the clamping groove 16 does not penetrate the conductive terminal 12 along the first direction D1, thereby avoiding occupying too much space on the conductive terminal 12 and ensuring the electrical connection performance of the conductive terminal 12.

[0037] In another example, the clamping groove 16 penetrates the conductive terminal 12 along the first direction, thereby increasing the internal space of the clamping groove 16 to accommodate more tin paste and further avoid the sticking and bridging problem between adjacent components.

[0038] In some embodiments, the component mounting structure further comprises:

[0039] The solder layer 15 is located between the front surface 101 of the substrate 10 and the conductive terminal 12 of the component, and part of the solder layer 15 extends into the clamping groove 16.

[0040] For example, after the tin paste is applied on the front surface 101 of the substrate 10, the component is mounted on the tin paste material on the substrate 10, and then the reflow soldering process is performed to form the solder layer 15 connecting the substrate 10 and the conductive terminal. In the reflow soldering process, part of the tin paste enters the clamping groove 16, so that the solidified solder layer 15 extends into the clamping groove 16.

[0041] In some embodiments, the front surface 101 of the substrate 10 has a plurality of protruding structures 13 arranged at intervals, and the conductive terminal 12 in the component has a plurality of clamping grooves 16 corresponding to the plurality of protruding structures 13 on the side surface away from the component body 11.

[0042] Specifically, by providing multiple raised structures 13 and multiple corresponding slots 16, alignment of the components with the mounting positions on the substrate 10 can be achieved from multiple directions. Furthermore, the multiple slots 16 can accommodate more solder paste, further preventing solder paste adhesion between adjacent components. In this specific embodiment, "multiple" refers to two or more.

[0043] In some embodiments, the component includes two conductive terminals 12 connected to opposite sides of the device body 11 along a second direction D2, each conductive terminal 12 having a slot 16 on its side away from the device body 11, and the second direction D2 intersecting perpendicularly with the first direction D1.

[0044] The front side 101 of the substrate 10 has two protrusions 13 arranged at intervals along the second direction D2, and the two protrusions 13 correspond one-to-one with the two slots 16 in the component.

[0045] For example, such as Figures 1-3 As shown, the component includes two conductive terminals 12 distributed along the second direction D2 on opposite sides of the component body 11, and two locking slots 16 distributed one-to-one in the two conductive terminals 12, and the two locking slots 16 are symmetrically distributed about the component body 11. The front surface 101 of the substrate 10 has two protrusions 13 spaced apart along the second direction D2, and the two protrusions 13 correspond one-to-one with the two locking slots 16 in the component, so that each protrusion 13 can be at least partially inserted into its corresponding locking slot 16. By providing two locking slots 16 symmetrically distributed about the component body 11 and two protrusions 13 corresponding one-to-one with the two locking slots 16, the position of the component on the front surface 101 of the substrate 10 can be better defined, and more solder paste can be accommodated while improving the uniformity of the solder paste distribution around the component, thereby further avoiding solder paste adhesion problems between adjacent components.

[0046] In some embodiments, the protrusion structure 13 is a conductive bump, and the conductive bump is electrically connected to the inner wall of the slot 16.

[0047] For example, the inner wall of the clamping groove 16 comprises a side wall distributed along the first direction D1 and a bottom wall distributed along the second direction D2. In an example, the side wall of the clamping groove 16 can be a planar side wall or an arc-shaped side wall. The protruding structure 13 is in contact with the inner wall of the clamping groove 16 and is electrically connected with the redistribution layer 14 in the substrate 10, so that the electrical connection between the device body 11 and the redistribution layer 14 can be realized through the protruding structure 13 and the clamping groove 16 in the conductive terminal 12, thereby further improving the stability and reliability of the electrical connection between the device body 11 and the redistribution layer 14. In an example, the conductive bump can be a copper bump.

[0048] In other embodiments, the protruding structure 13 is an insulating bump, and the insulating bump is in contact with or not in contact with the inner wall of the clamping groove 16, so that the protruding structure 13 only plays a positioning role, thereby helping to simplify the manufacturing process of the component mounting structure and reduce the parasitic capacitance effect inside the component mounting structure.

[0049] In some embodiments, the height of the clamping groove 16 along the first direction D1 is greater than the thickness of the protruding structure 13 along the first direction D1. The width of the clamping groove 16 along the third direction D3 is greater than the width of the protruding structure 13 along the third direction D3, the third direction D3 intersects the first direction D1 perpendicularly, and the third direction D3 intersects the second direction D2 perpendicularly, so that there is still a gap between the inner wall of the clamping groove 16 and the protruding structure 13 after the protruding structure 13 is inserted into the clamping groove 16. On the one hand, it can prevent the alignment error between the protruding structure 13 and the clamping groove 16; on the other hand, it also reserves more space for the tin paste, thereby further avoiding the tin paste adhesion problem between adjacent components.

[0050] Figure 4 is another sectional view of the component mounting structure in the specific embodiment of the utility model, Figure 5 is another top view of the component mounting structure in the specific embodiment of the utility model, Figure 6 is another sectional view of the component in the specific embodiment of the utility model. In other embodiments, as shown in Figures 4-6 the conductive terminal 12 is connected to the side surface of the device body 11 along the second direction D2, and the second direction D2 intersects the first direction D1 perpendicularly;

[0051] The side of the conductive terminal 12 facing away from the device body 11 also has a glue accommodating groove 40, which is arranged along a third direction D3 and is perpendicular to the first direction D1 and the second direction D2.

[0052] For example, as shown in Figures 4-6 The side of the conductive terminal 12 facing away from the device body 11 is provided with the clamping groove 16 and the glue accommodating groove 40, and the clamping groove 16 and the glue accommodating groove 40 are arranged along the third direction D3. The clamping groove 16 is used for aligning with the protruding structure 13 on the substrate 10 and accommodating the excess solder paste in the reflow soldering process, and the glue accommodating groove 40 is used for accommodating the excess solder paste in the reflow soldering process, so that more solder paste can be accommodated, further avoiding the problem of adhesion between adjacent components. At the same time, by providing the clamping groove 16 and the glue accommodating groove 40, the gas in the solder paste in the reflow soldering process can be timely discharged, the holes in the solder layer 15 formed after the solder paste is solidified are reduced, and the connection strength between the substrate 10 and the component is improved. In an example, part of the solder layer 15 extends into the clamping groove 16 and the glue accommodating groove 40.

[0053] In some embodiments, the component includes two conductive terminals 12 connected to the opposite sides of the device body 11 along the second direction D2, and each conductive terminal 12 has at least one glue accommodating groove 40 on the side facing away from the device body 11.

[0054] The glue accommodating grooves 40 in the two conductive terminals 12 are symmetrically distributed about the device body 11.

[0055] For example, as shown in Figures 4-6 Each of the conductive terminals 12 is provided with one clamping groove 16 and one glue accommodating groove 40, and the clamping grooves 16 in the two conductive terminals 12 are symmetrically distributed about the device body 11, and the glue accommodating grooves 40 in the two conductive terminals 12 are also symmetrically distributed about the device body 11, so as to further uniformly distribute the solder layer 15.

[0056] In an example, the width of the clamping groove 16 along the third direction D3 is greater than the width of the glue accommodating groove 40 along the third direction D3, so as to quickly and intuitively distinguish the clamping groove 16 and the glue accommodating groove 40, and avoid occupying too much space in the conductive terminal 12.

[0057] In some embodiments, the side wall of the glue accommodating groove 40 is obliquely intersected with the front surface 101 of the substrate 10.

[0058] For example, as shown in Figure 4 The angle between the side wall of the glue groove 40 and the front surface 101 of the substrate 10 is greater than 0 degrees and less than 90 degrees, and the side wall of the glue groove 40 is inclined upward relative to the front surface of the substrate 10, so that in the reflow soldering process, the side wall of the glue groove 40 can climb tin, that is, the tin paste climbing outward along the side wall of the glue groove 40, thereby increasing the distance between the tin paste on the side surfaces of two adjacent components, and further reducing the risk of bridging between two adjacent components by tin paste.

[0059] In some embodiments, the side wall of the glue groove 40 is an arc-shaped side wall or a planar side wall. Among them, Figure 6 (a) in FIG. 4 is a structural schematic diagram of the planar side wall of the glue groove 40, Figure 6 (b) in FIG. 5 is a structural schematic diagram of the arc-shaped side wall of the glue groove 40.

[0060] The specific embodiment also provides a packaged component, which comprises the component mounting structure as described above, and refers to Figures 1-6 .

[0061] The component mounting structure and the packaged component provided by the specific embodiment can position the position of the component on the front surface of the substrate through the alignment of the clamping groove and the protruding structure, ensure the accuracy of the mounting position of the component on the substrate, and avoid the tin paste bridging problem caused by the close distance between adjacent components due to the deviation of the mounting position of the component. Moreover, the clamping groove can also accommodate the tin paste used to connect the component and the substrate, reduce the amount of tin paste overflowing from the component, thereby further avoiding the bridging problem between adjacent components caused by tin paste adhesion, and further improving the performance of the component mounting structure and the yield of the packaged product.

[0062] The above only describes the preferred embodiments of the present application, and it should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A component mounting structure characterized by comprising: The device component mounting structure comprises: a substrate comprising a front surface and a back surface oppositely distributed along a first direction, the front surface of the substrate having a protruding structure thereon; a device component mounted on the front surface of the substrate along the first direction, the device component comprising a device body and a conductive terminal connected to a side surface of the device body, the conductive terminal having a clamping groove on the side surface thereof away from the device body, and the protruding structure being at least partially located in the clamping groove.

2. The component mounting structure according to claim 1, wherein Further comprising: a solder layer located between the front surface of the substrate and the conductive terminal of the device component, and part of the solder layer extending into the clamping groove.

3. The component mounting structure according to claim 1, wherein The front surface of the substrate has a plurality of protruding structures arranged at intervals, and the side surface of the conductive terminal of the device component away from the device body has a plurality of clamping grooves corresponding to the plurality of protruding structures one by one.

4. The component mounting structure according to Claim 1, wherein The device component comprises two conductive terminals connected to opposite sides of the device body along a second direction, and each of the conductive terminals has one clamping groove on the side surface thereof away from the device body, the second direction being perpendicular to the first direction; The front surface of the substrate has two protruding structures arranged at intervals along the second direction, and the two protruding structures correspond to the two clamping grooves of the device component one by one.

5. The component mounting structure according to Claim 1, wherein The protruding structure is a conductive bump, and the conductive bump is in electrical connection with the inner wall of the clamping groove.

6. The component mounting structure according to Claim 1, wherein The height of the clamping groove along the first direction is greater than the thickness of the protruding structure along the first direction.

7. The component mounting structure according to Claim 1, wherein The conductive terminal is connected to the side surface of the device body along a second direction, the second direction being perpendicular to the first direction; The side surface of the conductive terminal away from the device body further has a glue-containing groove, the glue-containing groove being arranged at intervals with the clamping groove along a third direction, the third direction being perpendicular to the first direction, and the third direction being perpendicular to the second direction.

8. The component mounting structure according to Claim 7, wherein The device component comprises two conductive terminals connected to opposite sides of the device body along a second direction, and each of the conductive terminals has at least one glue-containing groove on the side surface thereof away from the device body; The glue-containing grooves of the two conductive terminals are symmetrically distributed about the device body.

9. The component mounting structure according to Claim 7, wherein The side wall of the glue-containing groove is obliquely intersected with the front surface of the substrate.

10. The component mounting structure according to Claim 7, wherein The side wall of the glue-containing groove is an arc-shaped side wall or a planar side wall.

11. A packaged device, comprising: The device component mounting structure as claimed in claim 1 is included.

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