Efficient liquid cooling two-stage heat exchanger

Abstract

The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a high-efficiency liquid cooling double-stage heat exchanger which comprises a lower frame, a uniform-temperature liquid cooling plate, an upper frame and a uniform-temperature liquid cooling head. The uniform-temperature liquid cooling plate comprises a uniform-temperature liquid cooling top plate and a uniform-temperature liquid cooling bottom plate, upper liquid cooling holes are formed in the uniform-temperature liquid cooling top plate, and lower liquid cooling holes are formed in the uniform-temperature liquid cooling bottom plate. The upper liquid cooling holes of the uniform-temperature liquid cooling plates are sequentially communicated to form a first liquid cooling heat exchange channel, and the lower liquid cooling holes of the uniform-temperature liquid cooling plates are sequentially communicated to form a second liquid cooling heat exchange channel. According to the efficient liquid-cooling double-stage heat exchanger provided by the invention, after the uniform-temperature liquid-cooling plate is vacuumized, the heat of the chip is efficiently transferred to the first liquid-cooling heat exchange channel and the second liquid-cooling heat exchange channel, and the first liquid-cooling heat exchange channel and the second liquid-cooling heat exchange channel form a double-cavity liquid-cooling structure, so that the chip is rapidly and effectively cooled; therefore, the high-power chip can work normally at a stable temperature, and normal use of the high-power chip is ensured.

Description

TECHNICAL FIELD

[0001] The utility model belongs to heat dissipation device technical field, especially, relate to a high -efficient liquid cooling double -step heat exchanger. BACKGROUND

[0002] With the promotion of various communication and industrial electronic product performance, lead to chip power is bigger and bigger, heat flux is also higher and higher, need heat dissipation guarantee chip performance release. Chip with the performance is higher the more heat is caused, therefore heat dissipation device plays extremely important to electronic product.

[0003] The existing radiator passes through single cavity liquid cooling structure, passes through water cooling channel and takes away the heat in chip to reach the purpose of cooling, but this cooling mode heat dissipation efficiency is not high, can only satisfy the heat dissipation demand of low -power chip, and cannot satisfy the heat dissipation demand of high -power chip, influence high -power chip's normal use. UTILITY MODEL CONTENTS

[0004] The utility model discloses a high -efficient liquid cooling double -step heat exchanger, aims at solving the technical problem of the heat dissipation efficiency in prior art is not high, can only satisfy the heat dissipation demand of low -power chip, and cannot satisfy the heat dissipation demand of high -power chip, influence high -power chip's normal use.

[0005] To realize above -mentioned purpose, the high -efficient liquid cooling double -step heat exchanger provided by the utility model embodiment, including lower frame, uniform temperature liquid cooling board, upper frame and uniform temperature liquid cooling head, the lower frame, uniform temperature liquid cooling board, upper frame, uniform temperature liquid cooling head are sequentially arranged from bottom to top, the lower frame is set up in the bottom of uniform temperature liquid cooling board, and is connected with uniform temperature liquid cooling board, the upper frame is set up in the top of uniform temperature liquid cooling board, and is connected with uniform temperature liquid cooling board, the uniform temperature liquid cooling head is set up in the top side of uniform temperature liquid cooling board, and is connected with uniform temperature liquid cooling board;

[0006] The uniform temperature liquid cooling board includes uniform temperature liquid cooling top plate and uniform temperature liquid cooling bottom plate, the uniform temperature liquid cooling top plate is set up in the top side of the uniform temperature liquid cooling bottom plate, and is connected with the uniform temperature liquid cooling bottom plate, the uniform temperature liquid cooling top plate is equipped with upper liquid cooling hole, the upper liquid cooling hole is equipped with a plurality of, and is parallelly arranged, the uniform temperature liquid cooling bottom plate is equipped with lower liquid cooling hole, the lower liquid cooling hole is equipped with a plurality of, and is parallelly arranged, the uniform temperature liquid cooling board is equipped with a plurality of, and is evenly arranged, each uniform temperature liquid cooling is coincidently arranged, the upper liquid cooling hole of each uniform temperature liquid cooling board is sequentially connected, and forms first liquid cooling heat exchange channel, the lower liquid cooling hole of each uniform temperature liquid cooling board is sequentially connected, and forms second liquid cooling heat exchange channel, the first liquid cooling heat exchange channel is arranged above the second liquid cooling heat exchange channel.

[0007] As the optional scheme of the utility model, the upper liquid cooling hole and the lower liquid cooling hole are diamond-shaped.

[0008] As optional scheme of the utility model, the first liquid cooling heat exchange channel is provided with multiple and is evenly arranged on the uniform temperature liquid cooling top plate, multiple first liquid cooling heat exchange channels are arranged in parallel.

[0009] As optional scheme of the utility model, the second liquid cooling heat exchange channel is provided with multiple and is evenly arranged on the uniform temperature liquid cooling bottom plate, multiple second liquid cooling heat exchange channels are arranged in parallel.

[0010] As optional scheme of the utility model, the uniform temperature liquid cooling head is provided with two and is fixedly connected on the uniform temperature liquid cooling plate, two uniform temperature liquid cooling heads are arranged in parallel and are spaced.

[0011] As optional scheme of the utility model, the uniform temperature liquid cooling plate top is provided with positioning groove, the positioning groove is provided with two and is arranged in parallel and is spaced, the positioning groove is positionally corresponding with the uniform temperature liquid cooling head, the uniform temperature liquid cooling head is fixedly installed in the positioning groove and is fixedly connected with the uniform temperature liquid cooling plate.

[0012] The high-efficiency liquid cooling double-stage heat exchanger provided by the utility model has one or more of the following technical effects:

[0013] The high-efficiency liquid cooling double-stage heat exchanger provided by the utility model has one or more of the following technical effects: BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor.

[0015] Figure 1 The utility model provides the stereogram of high-efficiency liquid cooling double-stage heat exchanger.

[0016] Figure 2The utility model provides a high -efficient liquid cooling double -stage heat exchanger's three -dimensional view.

[0017] Figure 3 The utility model provides a high -efficient liquid cooling double -stage heat exchanger's even temperature liquid cooling plate and even temperature liquid cooling head separation state's structural schematic diagram.

[0018] Figure 4 The utility model provides a high -efficient liquid cooling double -stage heat exchanger's even temperature liquid cooling plate and even temperature liquid cooling head separation state's structural schematic diagram.

[0019] Figure 5 The utility model provides a high -efficient liquid cooling double -stage heat exchanger's even temperature liquid cooling plate's structural schematic diagram.

[0020] In the drawing, various reference signs:

[0021] 1, lower frame, 2, even temperature liquid cooling plate, 3, upper frame, 4, even temperature liquid cooling head,

[0022] 21, even temperature liquid cooling top plate, 22, even temperature liquid cooling bottom plate, 23, upper liquid cooling hole, 24, lower liquid cooling hole, 25, first liquid cooling heat exchange channel, 26, second liquid cooling heat exchange channel, 27, positioning groove. DETAILED DESCRIPTION

[0023] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the embodiments of the utility model, and cannot be understood as limiting the utility model.

[0024] In the description of the embodiments of the utility model, it should be understood that the orientation or position relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the embodiments of the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0025] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the embodiments of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0026] In the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0027] In one embodiment of the present application, as shown in Figures 1-5 The high-efficiency liquid cooling double-stage heat exchanger comprises a lower frame 1, a uniform temperature liquid cooling plate 2, an upper frame 3 and a uniform temperature liquid cooling head 4. The lower frame 1, the uniform temperature liquid cooling plate 2, the upper frame 3 and the uniform temperature liquid cooling head 4 are sequentially arranged from bottom to top. The lower frame 1 is arranged at the bottom of the uniform temperature liquid cooling plate 2 and is fixedly connected with the uniform temperature liquid cooling plate 2. The upper frame 3 is arranged at the top of the uniform temperature liquid cooling plate 2 and is fixedly connected with the uniform temperature liquid cooling plate 2. The uniform temperature liquid cooling head 4 is arranged at the top side of the uniform temperature liquid cooling plate 2 and is fixedly connected with the uniform temperature liquid cooling plate 2.

[0028] The uniform temperature liquid cooling plate 2 comprises a uniform temperature liquid cooling top plate 21 and a uniform temperature liquid cooling bottom plate 22. The uniform temperature liquid cooling top plate 21 is arranged at the top side of the uniform temperature liquid cooling bottom plate 22 and is fixedly connected with the uniform temperature liquid cooling bottom plate 22. The uniform temperature liquid cooling top plate 21 is provided with upper liquid cooling holes 23, and a plurality of upper liquid cooling holes 23 are arranged in parallel. The uniform temperature liquid cooling bottom plate 22 is provided with lower liquid cooling holes 24, and a plurality of lower liquid cooling holes 24 are arranged in parallel. A plurality of uniform temperature liquid cooling plates 2 are arranged and are uniformly arranged, and each uniform temperature liquid cooling plate 2 is arranged in a superposed manner. The upper liquid cooling holes 23 of each uniform temperature liquid cooling plate 2 are sequentially connected and form a first liquid cooling heat exchange channel 25. The lower liquid cooling holes 24 of each uniform temperature liquid cooling plate 2 are sequentially connected and form a second liquid cooling heat exchange channel 26, and the first liquid cooling heat exchange channel 25 is arranged above the second liquid cooling heat exchange channel 26.

[0029] The high-efficiency liquid cooling double-stage heat exchanger provided in the present application can efficiently transfer the heat of the chip to the first liquid cooling heat exchange channel 25 and the second liquid cooling heat exchange channel 26 after the uniform temperature liquid cooling plate 2 is vacuumized, and the first liquid cooling heat exchange channel 25 and the second liquid cooling heat exchange channel 26 form a double-cavity liquid cooling structure, so that the chip can be rapidly and effectively cooled, and the high-power chip can work normally at a stable temperature and ensure the normal use of the high-power chip.

[0030] In another embodiment of the present application, the upper liquid cooling holes 23 and the lower liquid cooling holes 24 of the high-efficiency liquid cooling double-stage heat exchanger are in the shape of a diamond, and the heat dissipation efficiency is improved.

[0031] In another embodiment of the utility model, the first liquid cooling heat exchange channel 25 of high -efficient liquid cooling double -stage heat exchanger is equipped with a plurality, and evenly set up in the temperature -equalizing liquid cooling top plate 21, a plurality of first liquid cooling heat exchange channel 25 parallelly arranged.

[0032] In another embodiment of the utility model, the second liquid cooling heat exchange channel 26 of high -efficient liquid cooling double -stage heat exchanger is equipped with a plurality, and evenly set up in the temperature -equalizing liquid cooling bottom plate 22, a plurality of second liquid cooling heat exchange channel 26 parallelly arranged. Through setting up a plurality of second liquid cooling heat exchange channel 26, improved the heat dissipation efficiency.

[0033] In another embodiment of the utility model, the temperature -equalizing liquid cooling head 4 of high -efficient liquid cooling double -stage heat exchanger is equipped with two, and is fixedly connected in the temperature -equalizing liquid cooling plate 2, two temperature -equalizing liquid cooling head 4 parallel, interval arrangement. Two temperature -equalizing liquid cooling head 4 simultaneously take away the heat in the temperature -equalizing liquid cooling plate 2, and improved the heat dissipation efficiency. Two temperature -equalizing liquid cooling head 4 forms phase difference through first liquid cooling heat exchange channel 25 and second liquid cooling heat exchange channel 26, and the temperature -equalizing liquid cooling bottom plate 22 and the temperature -equalizing liquid cooling top plate 21 are same plate material, and the temperature -equalizing liquid cooling bottom plate 22 quickly transmits heat upward by liquid, and then the first liquid cooling heat exchange channel 25 of upper temperature -equalizing liquid cooling top plate 21 is quickly cooled to reach high -performance heat dissipation.

[0034] In another embodiment of the utility model, the temperature -equalizing liquid cooling plate 2 top of high -efficient liquid cooling double -stage heat exchanger is equipped with positioning groove 27, positioning groove 27 is equipped with two, and parallel, interval arrangement, and positioning groove 27 and temperature -equalizing liquid cooling head 4 position correspond, and temperature -equalizing liquid cooling head 4 is fixedly installed in positioning groove 27, and is fixedly connected with temperature -equalizing liquid cooling plate 2.

[0035] The high -efficient liquid cooling double -stage heat exchanger provided by the application can efficiently transmit the heat of the chip to the first liquid cooling heat exchange channel 25 and the second liquid cooling heat exchange channel 26 after the temperature -equalizing liquid cooling plate 2 is evacuated, and the first liquid cooling heat exchange channel 25 and the second liquid cooling heat exchange channel 26 form a double-cavity liquid cooling structure, thereby rapidly and effectively cooling the chip, so that the high-power chip can work normally at a stable temperature, and the normal use of the high-power chip is ensured.

[0036] The above only is the preferred embodiment of the utility model, and does not limit the utility model, and any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A high-efficiency liquid-cooled double-stage heat exchanger, characterized in that, The device comprises a lower frame, a uniform temperature liquid cooling plate, an upper frame and a uniform temperature liquid cooling head, which are arranged in sequence from bottom to top. The uniform temperature liquid cooling plate comprises a uniform temperature liquid cooling top plate and a uniform temperature liquid cooling bottom plate, the uniform temperature liquid cooling top plate is arranged on the top side of the uniform temperature liquid cooling bottom plate and connected with the uniform temperature liquid cooling bottom plate, the uniform temperature liquid cooling top plate is provided with upper liquid cooling holes, the upper liquid cooling holes are provided in multiple and arranged in parallel, the uniform temperature liquid cooling bottom plate is provided with lower liquid cooling holes, the lower liquid cooling holes are provided in multiple and arranged in parallel, the uniform temperature liquid cooling plate is provided in multiple and arranged uniformly, each uniform temperature liquid cooling plate is arranged in coincidence, the upper liquid cooling holes of each uniform temperature liquid cooling plate are connected in sequence and form a first liquid cooling heat exchange channel, the lower liquid cooling holes of each uniform temperature liquid cooling plate are connected in sequence and form a second liquid cooling heat exchange channel, the first liquid cooling heat exchange channel is arranged above the second liquid cooling heat exchange channel.

2. The high-efficiency liquid cooling double-stage heat exchanger according to claim 1, characterized in that, The upper liquid cooling holes and the lower liquid cooling holes are in the shape of diamonds.

3. The high-efficiency liquid cooling double-stage heat exchanger according to claim 1, characterized in that, The first liquid cooling heat exchange channels are provided in multiple and arranged uniformly on the uniform temperature liquid cooling top plate, and multiple first liquid cooling heat exchange channels are arranged in parallel.

4. The high-efficiency liquid cooling double-stage heat exchanger according to claim 1, characterized in that, The second liquid cooling heat exchange channels are provided in multiple and arranged uniformly on the uniform temperature liquid cooling bottom plate, and multiple second liquid cooling heat exchange channels are arranged in parallel.

5. The high-efficiency liquid cooling double-stage heat exchanger according to claim 1, characterized in that, The uniform temperature liquid cooling head is provided in two and fixedly connected with the uniform temperature liquid cooling plate, and two uniform temperature liquid cooling heads are arranged in parallel and at intervals.

6. The high-efficiency liquid cooling double-stage heat exchanger according to claim 5, characterized in that, The uniform temperature liquid cooling plate is provided with positioning grooves on the top, the positioning grooves are provided in two and arranged in parallel and at intervals, the positioning grooves correspond to the positions of the uniform temperature liquid cooling head, the uniform temperature liquid cooling head is fixedly installed in the positioning grooves and fixedly connected with the uniform temperature liquid cooling plate.

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