Chip-type multi-terminal multilayer ceramic filter

Abstract

The utility model relates to a chip-type multi-terminal multilayer ceramic filter. According to the chip-type multi-terminal multilayer ceramic filter, the plurality of terminal electrodes (the first leading-out parts) and the grounding electrode (the second leading-out parts) of the waist part of the chip-type multi-terminal multilayer ceramic filter are all adjusted at the edge of the same side of the chip from the two ends of the length of the chip and the two opposite sides of the waist part, so that the path of current in the chip can be greatly reduced; meanwhile, because the plurality of external electrodes are close to each other, the ESR and ESL of the chip can be greatly reduced, and because the external electrodes are all arranged on the same side of the chip, the mounting quantity of the chip on a PCB can be increased, the mounting density can be improved, and the squeal problem of the chip can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip multi-terminal multilayer ceramic filter, in particular to a structure design of chip multi-terminal multilayer ceramic filter. BACKGROUND

[0002] As shown in Figure 1 and Figure 2 , the chip three-terminal multilayer ceramic filter 100 is usually composed of a plurality of layers of dielectric film 120 and metal inner electrodes 110 alternately stacked. Unlike the traditional chip multilayer ceramic capacitor, which exposes inner electrodes of different polarities at both ends of the length direction of the stacked body, the structural feature of this capacitor is that the inner electrodes 110 of the same polarity are drawn out at both ends of the length direction of the stacked body, and the end electrodes 130 are burned on both ends; in addition, an important feature of the structure of the chip three-terminal multilayer ceramic filter is that the inner electrodes 110a are also exposed at both ends of the waist, and after the waist is burned, the ground electrodes (not shown) are formed.

[0003] However, the chip three-terminal multilayer ceramic filter in the prior art still has the following problems:

[0004] 1. Long current path, affecting high frequency characteristics. In the traditional chip three-terminal multilayer ceramic filter, electrodes are drawn out at both ends in the length direction to form input electrodes, and electrodes are drawn out at the waist position to form ground electrodes. The current flows in from both ends and out at the ground electrode, so the current path is relatively long. This results in a large equivalent series resistance (ESR) and equivalent series inductance (ESL) of the filter, which significantly limits the performance of the filter in high frequency filtering.

[0005] 2. Waste of external electrode material. The three-terminal filter needs to be attached with basic end electrodes in the length direction and the waist direction, and then electroplated with a nickel layer and a tin layer on the surface to ensure the stability of soldering with the solder pad. However, the input electrodes and ground electrodes need to be attached, dried and burned multiple times, resulting in low production efficiency. At the same time, due to multiple burnings, the burn-in stress of the external electrodes will be greatly increased, which may cause the ceramic body of the chip to crack. In addition, the utilization rate of the external electrode material of the five non-soldered surfaces of the filter is very low, causing material waste and increasing the manufacturing cost.

[0006] 3. Reliability problem of external electrodes. If the basic external electrodes are too narrow, too thin or not dense enough, it may cause the external electrodes to fall off during use or reduce the product reliability due to nickel penetration during nickel plating. In severe cases, it may also cause tin explosion, which may cause short circuit of adjacent elements, greatly affecting the safety and reliability of the capacitor.

[0007] 4. The piezoelectric effect caused by the whistling problem, in the process of mounting, due to the coincidence of the chip mounting surface and the laminated surface, the piezoelectric effect of the dielectric material will cause the electrostriction phenomenon, and then cause the "whistling" problem, especially after the capacitor is powered on. This phenomenon not only has a negative impact on user experience, but also may cause mechanical stability problems.

[0008] 5. Due to the existence of the input electrode and the ground electrode, the effective electrode pattern area of the filter is relatively low by about 20-30% compared with the capacity of the conventional multilayer ceramic capacitor of the same size, which affects the high-frequency filtering effect. Practical new type content

[0009] Therefore, the present application provides a chip type multi-terminal multilayer ceramic filter which can solve the above technical problems.

[0010] The above-mentioned purpose of the present application is realized by the following technical scheme:

[0011] The present application provides a chip type multi-terminal multilayer ceramic filter, comprising a laminated body and an external electrode, the laminated body comprising laminated dielectric layers, and first and second internal electrode layers which are arranged in an interleaved and opposite manner between the dielectric layers and do not coincide with the edges of the dielectric layers, the dielectric layers being rectangular in shape;

[0012] The first internal electrode layer comprises a first effective electrode pattern area and at least two first lead-out portions, the first effective electrode pattern area being rectangular in shape, and the first lead-out portions being led out from one side of the first effective electrode pattern area and extending to the edge of the dielectric layer in a direction perpendicular to the side;

[0013] The second internal electrode layer comprises a second effective electrode pattern area and at least one second lead-out portion, the second effective electrode pattern area overlapping the projection of the first effective electrode pattern area in the stacking direction; the second lead-out portion being led out from a side of the second effective electrode pattern area and extending to the edge of the dielectric layer in a direction perpendicular to the side;

[0014] The second lead-out portion and the first lead-out portion are arranged in an interleaved manner on the same side of the laminated body, and their projections do not coincide;

[0015] The external electrode comprises a first external electrode and a second external electrode formed on one side surface of the laminated body, the first external electrode covering the corresponding first lead-out portion, and the second external electrode covering the second lead-out portion.

[0016] In an exemplary embodiment, the number of first lead-out portions is the same as that of second lead-out portions, or the number of first lead-out portions is one more than that of second lead-out portions.

[0017] In an exemplary embodiment, the first lead-out portion includes two, the second lead-out portion includes one, the first lead-out portion is arranged at 1 / 3 and 3 / 3 of the three equal parts of the length of the electrode, and the second lead-out portion is arranged at 2 / 3 of the three equal parts of the length of the electrode in the second effective electrode pattern area.

[0018] In an exemplary embodiment, the number of the first lead-out portion and the second lead-out portion is greater than or equal to two, and the total number of the first lead-out portion and the second lead-out portion is n, where n is an integer greater than 3; the first lead-out portion and the second lead-out portion are alternately arranged at each part of the n equal parts of the length of the electrode in the first effective electrode pattern area or the second effective electrode pattern area.

[0019] In an exemplary embodiment, for the side of the first lead-out portion, a first arc-shaped transition is formed between the side and the side leading out from the first effective electrode pattern area, or the adjacent side of the side leading out from the first effective electrode pattern area is located on the same straight line.

[0020] For the side of the second lead-out portion, a second arc-shaped transition is formed between the side and the side leading out from the second effective electrode pattern area, or the adjacent side of the side leading out from the second effective electrode pattern area is located on the same straight line.

[0021] In an exemplary embodiment, the angle of the first arc-shaped transition and the second arc-shaped transition is 10° to 30°, and the radius of curvature is 0.01 mm to 0.5 mm.

[0022] In an exemplary embodiment, a third arc-shaped transition is formed at the angle where the first effective electrode pattern area and the second effective electrode pattern area do not contact the dielectric layer.

[0023] In an exemplary embodiment, the long side direction of the first effective electrode pattern area is the same as the long side direction of the dielectric layer.

[0024] In an exemplary embodiment, the first lead-out portion is led out from the long side of the first effective electrode pattern area and extends to the short side edge of the dielectric layer along the short side direction thereof; and the second lead-out portion is led out from the long side direction of the second effective electrode pattern area and extends to the short side edge of the dielectric layer along the short side direction thereof.

[0025] In an exemplary embodiment, the structure of the external electrode is selected from any one of the following:

[0026] One layer of external electrode structure, two layers of external electrode structure, three layers of external electrode structure, four layers of external electrode structure, five layers of external electrode structure, six layers of external electrode structure.

[0027] The present application has the following advantages:

[0028] 1. The external electrode is entirely covered by the end, which becomes only one side with the internal electrode exposed, adheres to the basic external electrode, and is electroplated with a nickel layer and a tin layer on the basic external electrode. The external electrode is changed from four to three, which can greatly save unnecessary waste of the external electrode on the non-soldering surface of the chip. Moreover, the three external electrodes are on the same side, and the technical means can realize the adhesion of the basic end electrode at one time, greatly improving the production efficiency and reducing the manufacturing cost.

[0029] 2. The length direction of the chip is changed from the end to the exposed ceramic body without the external electrode, which saves the size space occupied by the original external electrode, increases the ceramic body space, and is beneficial to the development of larger capacity.

[0030] 3. At the same time, due to the cancellation of the end external electrode, the wiring on the PCB board is improved, the distance and space occupation between the pads are reduced, and the consumption of tin paste is reduced, thereby improving the effective mounting area of the PCB board.

[0031] 4. Since the internal electrode is exposed from one end of the chip to one end of the width, the other surfaces are ceramic bodies, which can greatly improve the risk of nickel penetration in the electroplating process. Since there is only one soldering surface and the other surfaces are ceramic bodies, the risk of tin explosion is greatly reduced, and the risk of short circuit caused by the connection of the tin layer of adjacent components due to tin explosion is also reduced.

[0032] 5. Since the external electrode lead-out end is adjusted from the length of the chip to the width direction of the chip, the current path in the chip is greatly shortened, which can greatly improve the ESR and ESL of the chip. At the same time, in order to further reduce the ESR and ESL, the lead-out electrode can be adjusted from the traditional four electrodes distributed in the length and width directions to three electrodes, four electrodes, five electrodes, six electrodes, seven electrodes, eight electrodes, nine electrodes, ten electrodes, or n electrodes on one side of the width, which can greatly reduce the ESR and ESL of the chip and improve the high-frequency filtering effect.

[0033] 6. Since the external electrode lead-out end is adjusted from the length of the chip to the width direction of the chip, and the chip mounting surface and the lamination surface are not in the same plane, the howling problem caused by the piezoelectric effect of the surface mount capacitor can be greatly improved.

[0034] 7. Since the adhesion of the basic external electrode is only in the width direction of the chip, only the adhesion stress appears on one side of the chip after adhesion, which can relieve the mechanical stress of the chip during multiple end adhesion and prevent short circuit caused by excessive stress cracking of the end.

[0035] Preferably, the number of the first lead-out portion and the second lead-out portion, the arc-shaped transition portion of the lead-out electrode, and the outer electrode structure design can be combined in any way to achieve a more optimal design to meet application requirements. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figures 1-2 FIG. 1 is a structural schematic diagram of a conventional chip-type three-terminal multilayer ceramic filter;

[0037] Figures 3-4 FIG. 2 is a structural schematic diagram of a chip-type multi-terminal multilayer ceramic filter in an exemplary embodiment;

[0038] Figures 5-16 FIG. 3 is a structural schematic diagram of a dielectric layer and an inner electrode layer of a chip-type multi-terminal multilayer ceramic filter in an exemplary embodiment.

[0039] BRIEF DESCRIPTION OF DRAWINGS

[0040] 200, chip-type multi-terminal multilayer ceramic filter;

[0041] 210, laminated body; 220, dielectric layer; 230, inner electrode layer; 231, first inner electrode layer; 231a, first effective electrode pattern area; 231b, first lead-out portion; 231c, first arc-shaped transition portion; 232, second inner electrode layer; 232a, second effective electrode pattern area; 232b, second lead-out portion; 232c, second arc-shaped transition portion; 233, third arc-shaped transition portion; 241, first outer electrode; 242, second outer electrode. DETAILED DESCRIPTION

[0042] In order to make the above objectives, features and advantages of the present application more apparent, the specific embodiments of the present application are described in detail below. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many different ways other than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0043] In the description of the application, it should be understood that, if there are these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0044] In addition, if there are these terms "first", "second", these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this application, unless otherwise explicitly specified and limited, if there are terms such as "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0046] In this application, unless otherwise explicitly specified and limited, if there are similar descriptions such as "first feature on or under the second feature", the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0047] To solve the technical problems in the background art, the embodiment of the present application provides a chip multi-terminal multilayer ceramic filter, and the structure of the chip multi-terminal multilayer ceramic filter is improved based on the structure of the chip three-terminal multilayer ceramic filter in the background art, that is, the chip multi-terminal multilayer ceramic filter includes input electrodes and ground electrodes, and meanwhile, the chip multi-terminal multilayer ceramic filter can further include more groups of input electrodes and ground electrodes.

[0048] As shown in Figures 3-5 In an embodiment, the chip multi-terminal multilayer ceramic filter 200 includes a laminated body 210 and external electrodes (241 and 242), wherein the laminated body 210 includes laminated dielectric layers 220 and interleaved internal electrode layers 230 arranged between the dielectric layers 220.

[0049] In the embodiment, the dielectric layers 220 are rectangular, and the laminated body 210 formed by the laminated dielectric layers 220 is a cuboid. The dielectric layers 220 are usually ceramic materials and play an insulating role to ensure the electrical insulation between the internal electrode layers 230. The internal electrode layers 230 are arranged between the dielectric layers 220 and arranged according to a specific pattern. Adjacent internal electrode layers 230 are opposite to each other but not in direct contact. The opposite internal electrode layers 230 are connected to the positive and negative electrodes of a circuit to form a capacitor structure.

[0050] As shown in Figures 3-5 The internal electrode layers 230 include interleaved first internal electrode layers 231 and second internal electrode layers 232 arranged between the dielectric layers 220. The first internal electrode layers 231 include a first effective electrode pattern area 231a and two first lead-out portions 231b. The first effective electrode pattern area 231a is rectangular, and its long side direction is consistent with the long side direction of the dielectric layer 220, or the long side direction of the first effective electrode pattern area 231a can be opposite to the long side direction of the dielectric layer 220 in other embodiments. The first effective electrode pattern area 231a is located inside the dielectric layer 220, and its area is smaller than the first effective electrode pattern area of the dielectric layer 220, so the long side and short side edges of the first effective electrode pattern area 231a do not coincide with the outer edges of the dielectric layer 220. The two first lead-out portions 231b are led out from the same long side of the first effective electrode pattern area 231a and extend to the edge of the dielectric layer 220a along a direction perpendicular to the long side.

[0051] The second internal electrode layer 232 includes a second effective electrode pattern area 232a and a second lead-out portion 232b. The second effective electrode pattern area 232a overlaps the projection of the first effective electrode pattern area 231a in the stacking direction, i.e., the shape and size of the first effective electrode pattern area 231a and the second effective electrode pattern area 232a are also the same. The second lead-out portion 232b is led out from the long side of the second effective electrode pattern area 232a and extends to the edge of the dielectric layer 220a in a direction perpendicular to the long side.

[0052] In the present embodiment, the two first lead-out portions 231b and the second lead-out portion 232b are located on the same side of the laminate 210, and the second lead-out portion 232b is located between the two first lead-out portions 231b.

[0053] The external electrode of the present embodiment includes two first external electrodes 241 and a second external electrode 242 formed on one side surface of the laminate 210. The two first external electrodes 241 respectively cover the corresponding first lead-out portions 231b, and the second external electrode 242 covers the second lead-out portion 232b.

[0054] In a preferred embodiment, the two first lead-out portions 231b are symmetrically arranged left and right, and the second lead-out portion 232b is located at a position between the two first lead-out portions 231b, and the distance between the second lead-out portion 232b and the two first lead-out portions 231b is the same.

[0055] Based on the same inventive concept, in other embodiments, the first lead-out portion 231b and the second lead-out portion 232b can also be arranged at the short side edges of the first effective electrode pattern area 231a and the second effective electrode pattern area 231a and extend to coincide with the outer edge of the dielectric layer 220 in the direction of the long side of the effective electrode pattern area 231.

[0056] In the following embodiments of the present application, the first lead-out portion 231b and the second lead-out portion 232b are exemplified as being led out from the long side of the effective electrode pattern area, and the following embodiments also apply to the case where the first lead-out portion 231b and the second lead-out portion 232b are led out from the short side of the effective electrode pattern area. The application of the additional technical features of the following embodiments to the case where the first lead-out portion 231b is led out from the short side of the effective electrode pattern area and the second lead-out portion 232b is led out from the short side of the effective electrode pattern area is also within the scope of protection of the present application.

[0057] In the embodiment, by adjusting two end electrodes (the first lead-out part 231b) and the ground electrode (the second lead-out part 232b) of the waist part from the opposite two side edges of the chip and the opposite two sides of the waist part to the same side edge of the chip, the current path in the chip can be greatly reduced, and the mounting area of the chip can be greatly reduced due to the close distance between the three external electrodes, the mounting capacity of the PCB is increased, and the mounting density is improved.

[0058] Compared with the prior art, the chip multi-terminal multilayer ceramic filter has the following advantages:

[0059] 1. The external electrode is covered by the end, which is changed to only one side with the internal electrode exposed, adhered to the basic external electrode, and plated with a nickel layer and a tin layer on the basic external electrode. The external electrode is changed from four to three, which can greatly save the unnecessary waste of the non-soldering surface external electrode of the chip. Moreover, the three external electrodes are on the same side, and the basic end electrode can be adhered at one time through technical means, which greatly improves the production efficiency and reduces the manufacturing cost.

[0060] 2. The length direction of the chip is changed from the end to the exposed ceramic body without the external electrode, the size space occupied by the original external electrode is saved, the ceramic body space is increased, and the development of larger capacity is facilitated.

[0061] 3. At the same time, due to the cancellation of the end external electrode, the wiring on the PCB is improved, the distance and space occupation between the pads and the consumption of the solder paste are reduced, and the effective mounting area of the PCB is improved.

[0062] 4. Since the internal electrode is exposed from one end of the chip to one end of the width, the other surfaces are ceramic bodies, which can greatly improve the risk of nickel penetration during plating. Since there is only one soldering surface and the other surfaces are ceramic bodies, the risk of tin explosion is greatly reduced, and the risk of short circuit of the external electrode caused by the connection of the tin layer of the adjacent components due to tin explosion is also reduced.

[0063] 5. Since the external electrode lead-out end is adjusted from the length of the chip to the width direction of the chip, the current path in the chip is greatly shortened, which can greatly improve the ESR and ESL of the chip. In order to further reduce the ESR and ESL, the lead-out electrode can be adjusted from the traditional four electrodes distributed in the length and width directions to three electrodes, four electrodes, five electrodes, six electrodes, seven electrodes, eight electrodes, nine electrodes, ten electrodes or n electrodes on one side of the width, which can greatly reduce the ESR and ESL of the chip and improve the high-frequency filtering effect.

[0064] 6. The external electrode lead-out end is adjusted by the length of the chip to be lead out in the width direction of the chip, and the chip mounting surface and the lamination surface are not in the same plane, which can greatly improve the problem of squeal caused by the piezoelectric effect of the surface mount capacitor.

[0065] 7. The adhesion of the base external electrode is only in the width direction of the chip, and after adhesion, only adhesion stress appears on one side of the chip, which can relieve the mechanical stress of the chip after multiple adhesion, prevent short circuit caused by excessive stress of the end head and crack.

[0066] In other embodiments, the number of first lead-out portions 231b can also be more, the number of second lead-out portions 232b can also be more than one, and the number of second lead-out portions 232b can be the same as the number of first lead-out portions 231b, or the number of first lead-out portions 231b can be one more than the number of second lead-out portions 232b.

[0067] In specific embodiments, the specific pattern of the first lead-out portion 231b can also have various settings, for example, in the Figures 3-5 embodiment, the two side edges of the first lead-out portion 231b do not overlap with the short edge of the first effective electrode pattern area 231a. In the Figure 7 embodiment, one side edge of the first lead-out portion 231b is on the same straight line as one short edge of the first effective electrode pattern area 231a. In the embodiment in which the second lead-out portion 232b includes multiple, one side edge thereof can also be on the same straight line as the short edge of the second effective electrode pattern area 232a.

[0068] In preferred embodiments, for the side edge of the first lead-out portion 231b, the first arc-shaped transition portion 231c is formed between the side edge and the side edge led out from the first effective electrode pattern area 231a, or the adjacent side edge of the side edge led out from the first effective electrode pattern area 231a is on the same straight line; for the side edge of the second lead-out portion 232b, the second arc-shaped transition portion 232c is formed between the side edge and the side edge led out from the second effective electrode pattern area 232a, or the adjacent side edge of the side edge led out from the second effective electrode pattern area 232a is on the same straight line.

[0069] In a specific embodiment, as Figures 6-7 shown, one side edge or both side edges of the first lead-out portion 231b are not on the same straight line as the short edge of the first effective electrode pattern area 231a, and the first arc-shaped transition portion 231c is formed between the side edge and the adjacent long edge of the first effective electrode pattern area 231a. The second arc-shaped transition portion 232c is formed between the two side edges of the second lead-out portion 232b and the adjacent long edge of the second effective electrode pattern area 232a.

[0070] In this embodiment, by changing the right-angled angle between the effective electrode pattern area and the lead-out portion to an arc-shaped transition portion, this design increases the contact width between the lead-out portion and the effective electrode pattern area, and the contact edge transitions smoothly, which can improve the internal stress of the local electrode. At the same time, the design of the first and second arc-shaped transition portions can improve the situation where the diaphragm cannot be completely adhered at the right angle, and the presence of gaps in the dielectric diaphragm at the right angle can easily lead to delamination. The first and second arc-shaped transition portions can also improve the problem of charge concentration, and reduce the tip discharge caused by charge concentration at the right angle.

[0071] Preferably, the angle between the first arc-shaped transition portion 231c and the second arc-shaped transition portion 232c is 10° to 30°, and the radius of curvature is 0.01mm to 0.5mm. In this embodiment, the arc-shaped transition portion refers to the connection between adjacent side edges that changes from a right angle to an arc-shaped transition.

[0072] like Figure 8 As shown, in one embodiment, the four corners of the first effective electrode pattern region 231a and the second effective electrode pattern region 231b that are not in contact with the dielectric layer 220 form a third arc-shaped transition portion 233. In this embodiment, by changing the conventional right-angled edge of the inner electrode to an arc-shaped design, the internal stress at the four corners can be improved, and the tip discharge caused by charge concentration at the right angle can be mitigated.

[0073] In embodiments where the structure of the second lead-out portion 232b includes a greater number of input electrodes and ground electrodes, such as... Figure 9 As shown, each of the first lead-out portions 231b and the second lead-out portions 232b comprises two, and are staggered on the same side of the laminate 210. For the side of the first lead-out portion 231b, a first arc-shaped transition portion 231c is formed between it and the side extending from the first effective electrode pattern region 231a, or it is located on the same straight line as the adjacent side of the side extending from the first effective electrode pattern region 231a. Specifically, in Figure 9 In one embodiment, one of the first leads 231b is located at the edge of the first effective electrode pattern region 231a, with one side of the lead 231b aligned with one side of the first effective electrode pattern region 231a. The other side of the lead 231b, along with both sides of the other lead 231b, forms a first arc-shaped transition portion 231c with the side extending from the first effective electrode pattern region 231a. The second lead 232b is symmetrically disposed to the first lead 231b, and will not be described further here.

[0074] In an embodiment where the structure of the second lead-out portion 232b includes one, such as Figure 8 and Figure 10As shown, the first lead-out portions 231b and the second lead-out portions 232b are staggered and arranged on the same side of the stack 210. The first lead-out portions 231b are located at the 1 / 3 and 3 / 3 positions of the four equal parts of the electrode length of the first effective electrode pattern area 231a, respectively. The second lead-out portions 232b are located at the 2 / 3 position of the four equal parts of the electrode length of the second effective electrode pattern area 232a, and the distance between the two first lead-out portions 231b is the same.

[0075] In the embodiment in which the number of input electrodes and the number of ground electrodes, i.e., the number of the second lead-out portions 232b, is more than two, as shown in FIG. 6, the first lead-out portions 231b and the second lead-out portions 232b each include two and are staggered and arranged on the same side of the stack 210. The first lead-out portions 231b are located at the 1 / 4 and 3 / 4 positions of the five equal parts of the electrode length of the first effective electrode pattern area 231a, respectively. The second lead-out portions 232b are located at the 2 / 4 and 4 / 4 positions of the five equal parts of the electrode length of the second effective electrode pattern area 232a. Figure 11

[0076] In other embodiments, the number of the first lead-out portions 231b and the number of the second lead-out portions 232b can each be greater than or equal to two. The total number of the first lead-out portions 231b and the second lead-out portions 232b is n, where n is an integer greater than 3. n can be an odd number, i.e., the number of the first lead-out portions 231b is one more than the number of the second lead-out portions 232b, for example, n is 5, 7, 9, etc. n can also be an even number, for example, n is 6, 8, 10, etc., i.e., the number of the first lead-out portions 231b is the same as the number of the second lead-out portions 232b. The first lead-out portions 231b and the second lead-out portions 232b are alternately arranged at each of the n equal parts of the electrode length of the first effective electrode pattern area 231a or the second effective electrode pattern area 232a.

[0077] As shown in FIG. 7, in a specific embodiment, the number of the first lead-out portions 231b is three, and the second lead-out portions 232b include two and are staggered and arranged on the same side of the stack 210. The first lead-out portions 231b are located at the 1 / 5, 3 / 5, and 5 / 5 positions of the five equal parts of the electrode length of the first effective electrode pattern area 231a, respectively. The second lead-out portions 232b are located at the 2 / 5 and 4 / 5 positions of the five equal parts of the electrode length of the second effective electrode pattern area 232a. Figure 12 In another embodiment, as shown in FIG. 8, the number of the first lead-out portions 231b is three, and the second lead-out portions 232b include two and are staggered and arranged on the same side of the stack 210. The first lead-out portions 231b are located at the 1 / 6, 3 / 6, and 5 / 6 positions of the six equal parts of the electrode length of the first effective electrode pattern area 231a, respectively. The second lead-out portions 232b are located at the 2 / 6 and 4 / 6 positions of the six equal parts of the electrode length of the second effective electrode pattern area 232a.

[0078] Figure 13 ​​As shown, the first lead-out portions 231b and the second lead-out portions 232b each include three and are staggered on the same side of the laminate 210. The first lead-out portions 231b are located at 1 / 6, 3 / 6, and 5 / 6 of the six equal parts of the electrode length of the first effective electrode pattern area 231a, respectively; and the second lead-out portions 232b are located at 2 / 6, 4 / 6, and 6 / 6 of the six equal parts of the electrode length of the second effective electrode pattern area 232a, respectively.

[0079] As shown in FIG. 2, in one embodiment, the first lead-out portions 231b include four and the second lead-out portions 232b include three and are staggered on the same side of the laminate 210. The first lead-out portions 231b are located at 1 / 8, 3 / 8, 5 / 8, and 7 / 8 of the eight equal parts of the electrode length of the first effective electrode pattern area 231a, respectively; and the second lead-out portions 232b are located at 2 / 8, 4 / 8, 6 / 8, and 8 / 8 of the eight equal parts of the electrode length of the second effective electrode pattern area 232a, respectively. Figure 14 As shown in FIG. 2, in one embodiment, the first lead-out portions 231b include four and the second lead-out portions 232b include three and are staggered on the same side of the laminate 210. The first lead-out portions 231b are located at 1 / 8, 3 / 8, 5 / 8, and 7 / 8 of the eight equal parts of the electrode length of the first effective electrode pattern area 231a, respectively; and the second lead-out portions 232b are located at 2 / 8, 4 / 8, 6 / 8, and 8 / 8 of the eight equal parts of the electrode length of the second effective electrode pattern area 232a, respectively.

[0080] As shown in FIG. 2, in one embodiment, the first lead-out portions 231b include four and the second lead-out portions 232b include three and are staggered on the same side of the laminate 210. The first lead-out portions 231b are located at 1 / 8, 3 / 8, 5 / 8, and 7 / 8 of the eight equal parts of the electrode length of the first effective electrode pattern area 231a, respectively; and the second lead-out portions 232b are located at 2 / 8, 4 / 8, 6 / 8, and 8 / 8 of the eight equal parts of the electrode length of the second effective electrode pattern area 232a, respectively. Figure 15 As shown in FIG. 2, in one embodiment, the first lead-out portions 231b include four and the second lead-out portions 232b include three and are staggered on the same side of the laminate 210. The first lead-out portions 231b are located at 1 / 8, 3 / 8, 5 / 8, and 7 / 8 of the eight equal parts of the electrode length of the first effective electrode pattern area 231a, respectively; and the second lead-out portions 232b are located at 2 / 8, 4 / 8, 6 / 8, and 8 / 8 of the eight equal parts of the electrode length of the second effective electrode pattern area 232a, respectively.

[0081] As shown in FIG. 2, in one embodiment, the first lead-out portions 231b include four and the second lead-out portions 232b include three and are staggered on the same side of the laminate 210. The first lead-out portions 231b are located at 1 / 8, 3 / 8, 5 / 8, and 7 / 8 of the eight equal parts of the electrode length of the first effective electrode pattern area 231a, respectively; and the second lead-out portions 232b are located at 2 / 8, 4 / 8, 6 / 8, and 8 / 8 of the eight equal parts of the electrode length of the second effective electrode pattern area 232a, respectively. Figure 16 As shown in FIG. 2, in one embodiment, the first lead-out portions 231b include four and the second lead-out portions 232b include three and are staggered on the same side of the laminate 210. The first lead-out portions 231b are located at 1 / 8, 3 / 8, 5 / 8, and 7 / 8 of the eight equal parts of the electrode length of the first effective electrode pattern area 231a, respectively; and the second lead-out portions 232b are located at 2 / 8, 4 / 8, 6 / 8, and 8 / 8 of the eight equal parts of the electrode length of the second effective electrode pattern area 232a, respectively.

[0082] In other embodiments, the number of the first lead-out portions 231b and the second lead-out portions 232b can also include more, which refers to the staggered arrangement in FIG. 1. Figure 16 Preferably, on the basis of the above embodiments, the portions where the plurality of first lead-out portions 231b and the second lead-out portions 232b intersect the side edges of the first effective electrode pattern area 231a and the second effective electrode pattern area 232a can be provided as the first arc-shaped transition portions 231c and the second arc-shaped transition portions 232c.

[0083] Preferably, on the basis of the above embodiments, the external electrode 240 can be a single-layer external electrode structure, and the external electrode is made of copper, silver, palladium or silver-palladium alloy, etc. After the chamfering of the MLCC, copper paste, silver paste, palladium paste, silver-palladium alloy paste, etc. are adhered to the two ends of the MLCC, and after the sintering, the external electrode is formed by copper, silver, palladium or silver-palladium alloy, etc.

[0084] Preferably, the external electrode 240 can be a double-layer external electrode structure, and the external electrode structure can be composed of nickel, copper (silver or gold): the nickel can be adhered to the two ends of the capacitor green body by nickel paste, and after sintering, the basic external electrode is formed, and then a layer of copper (silver or gold) is sintered or electroplated on the outside of the basic external electrode to form a nickel-copper (silver or gold) double-layer external electrode structure. Alternatively, the external electrode structure can be composed of copper, copper (silver or gold): the basic external electrode is adhered to the two ends of the MLCC after chamfering by copper paste, and after sintering the copper layer, the basic external electrode is formed, and then a layer of copper is electroplated or a layer of silver or gold is sintered on the outside of the basic external electrode to form a copper-copper (silver or gold) double-layer external electrode structure. Alternatively, the external electrode structure can be composed of copper, high molecular resin: the basic external electrode is adhered to the two ends of the MLCC after chamfering by copper paste, and after sintering the copper layer, the basic external electrode is formed, and then a layer of high molecular resin is adhered on the outside of the basic external electrode to form a two-layer structure composed of copper and high molecular resin.

[0085] Preferably, the external electrode 240 can be a three-layer external electrode structure, which can be formed by copper, nickel, tin (silver or gold): the base external electrode is adhered to the copper paste on both ends of the MLCC after chamfering, and after the copper layer is burned and adhered, the base external electrode is formed, and then a nickel layer and a tin (silver or gold) layer are electroplated outside the base external electrode, forming a copper-nickel-tin (silver or gold) three-layer external electrode structure. Alternatively, the external electrode structure can be formed by copper, copper, tin (silver or gold): the base external electrode is adhered to the copper paste on both ends of the MLCC after chamfering, and after the copper layer is burned and adhered, the base external electrode is formed, and then a copper layer and a tin (silver or gold) layer are electroplated outside the base external electrode, forming a copper-copper-tin (silver or gold) three-layer external electrode structure. Alternatively, the external electrode structure can be formed by copper, resin silver paste (copper paste), tin (or silver or gold): the base external electrode is adhered to the copper paste on both ends of the MLCC after chamfering, and after the copper layer is burned and adhered, the base external electrode is formed, and then a layer of resin silver paste (copper paste) is adhered outside the base external electrode and solidified, and then a tin (silver or gold) layer is electroplated outside the external electrode, forming a copper-resin silver paste-tin (or silver or gold) three-layer external electrode structure. Alternatively, the external electrode structure can be formed by copper, copper, high molecular resin: the base external electrode is adhered to the copper paste on both ends of the MLCC after chamfering, and after the copper layer is burned and adhered, the base external electrode is formed, and then a copper layer is burned and adhered or electroplated outside the base external electrode, and then a high molecular resin layer is adhered outside the copper layer, forming a copper-copper-high molecular resin three-layer external electrode structure.

[0086] Preferably, the external electrode 240 can be a four-layer external electrode structure, which can be formed by nickel, copper, nickel, tin: the base external electrode is adhered to the nickel paste on both ends of the MLCC green body, and then sintering is performed to form the base external electrode, and then a copper paste is adhered outside the base external electrode, and after the copper layer is burned and adhered, a nickel layer and a tin layer are electroplated on the copper layer, forming a nickel-copper-nickel-tin four-layer external electrode structure. Alternatively, the external electrode structure can be formed by copper, high molecular resin, nickel, tin: the base external electrode is adhered to the copper paste on both ends of the MLCC after chamfering, and after the copper layer is burned and adhered, the base external electrode is formed, and then a layer of high molecular resin is adhered outside the base external electrode, and then a nickel layer and a tin layer are electroplated, forming a copper-high molecular resin layer-nickel-tin three-layer external electrode structure. Alternatively, the external electrode structure can be formed by copper, resin silver paste (or copper paste), nickel, tin: the base external electrode is adhered to the copper paste on both ends of the MLCC after chamfering, and after the copper layer is burned and adhered, the base external electrode is formed, and then a layer of resin silver paste (or copper paste) is adhered outside the base external electrode and solidified, and then a nickel layer and a tin layer are electroplated on the surface of the resin silver paste (or copper paste), forming a copper-resin silver paste (or copper paste)-nickel-tin four-layer external electrode structure. Alternatively, the external electrode structure can be formed by copper, tin, nickel, tin: the base external electrode is adhered to the copper paste on both ends of the MLCC after chamfering, and after the copper layer is burned and adhered, the base external electrode is formed, and then a tin layer, a nickel layer and a tin layer are electroplated in sequence outside the base external electrode, forming a copper-tin-nickel-tin four-layer external electrode structure.

[0087] Preferably, the external electrode 240 can be a five-layer external electrode structure, which can be formed by copper, soft copper, soft pad, nickel, tin; the base external electrode is formed after sintering after the copper paste is attached to the two ends of the MLCC green body, and then the soft copper and soft pad are attached to the outside of the base external electrode, and then the nickel layer and the tin layer are electroplated on the soft pad after solidification, thereby forming a copper-soft copper-soft pad-nickel-tin five-layer external electrode structure.

[0088] Preferably, the external electrode 240 can be a six-layer external electrode structure, which can be formed by copper, soft copper, soft pad, nickel, copper (tin), and a polymer layer; the base external electrode is formed after sintering after the copper paste is attached to the two ends of the MLCC green body, and then the soft copper and soft pad are attached to the outside of the base external electrode, and then the nickel layer and the copper (tin) layer are electroplated on the soft pad after solidification, and then a polymer layer is wrapped outside the electroplated copper layer, thereby forming a copper-soft copper-soft pad-nickel-copper (tin)-polymer six-layer external electrode structure.

[0089] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present disclosure.

[0090] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the utility model patent. It should be noted that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these are within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims, and the description can be used to explain the content of the claims.

Claims

1. A chip multi-terminal multilayer ceramic filter comprising a laminate and external electrodes, characterized in that: the laminate comprises laminated dielectric layers, and first and second internal electrode layers alternately arranged between the dielectric layers and not coinciding with edges of the dielectric layers, the dielectric layers being rectangular in shape; the first internal electrode layer comprises a first effective electrode pattern area and at least two first lead-out portions, the first effective electrode pattern area being rectangular in shape, and the first lead-out portions being led out from a side of the first effective electrode pattern area and extending to edges of the dielectric layers in a direction perpendicular to the side; the second internal electrode layer comprises a second effective electrode pattern area and at least one second lead-out portion, the second effective electrode pattern area overlapping a projection of the first effective electrode pattern area in a lamination direction, and the second lead-out portion being led out from a side of the second effective electrode pattern area and extending to edges of the dielectric layers in a direction perpendicular to the side; the second lead-out portion is arranged alternately with the first lead-out portion on the same side of the laminate and does not overlap a projection of the first lead-out portion; and the external electrodes comprise first and second external electrodes formed on a side surface of the laminate, the first external electrodes covering corresponding first lead-out portions, and the second external electrodes covering second lead-out portions. 2.The chip multi-terminal multilayer ceramic filter according to claim 1, characterized in that: the number of the first lead-out portions is the same as that of the second lead-out portions, or the number of the first lead-out portions is one more than that of the second lead-out portions. 3.The chip multi-terminal multilayer ceramic filter according to claim 2, characterized in that: the first lead-out portions comprise two, the second lead-out portions comprise one, the first lead-out portions are arranged at 1 / 3 and 3 / 3 of a three equal division of an electrode length, and the second lead-out portion is arranged at 2 / 3 of a three equal division of an electrode length of the second effective electrode pattern area. 4.The chip multi-terminal multilayer ceramic filter according to claim 2, characterized in that: the number of the first lead-out portions and the number of the second lead-out portions are both equal to or greater than two, the total number of the first lead-out portions and the second lead-out portions is n, where n is an integer equal to or greater than 4, and the first lead-out portions and the second lead-out portions are alternately arranged at each of n equal divisions of an electrode length of the first effective electrode pattern area or the second effective electrode pattern area. 5.The chip multi-terminal multilayer ceramic filter according to claim 3 or 4, characterized in that: for a side of the first lead-out portion, a first arc-shaped transition portion is formed between the side and a side led out from the first effective electrode pattern area, or the side is located on a same straight line with an adjacent side led out from the first effective electrode pattern area; and for a side of the second lead-out portion, a second arc-shaped transition portion is formed between the side and a side led out from the second effective electrode pattern area, or the side is located on a same straight line with an adjacent side led out from the second effective electrode pattern area. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 6. The multi-terminal multilayer ceramic filter according to claim 5, wherein: the first and second arc-shaped transition sections have an angle of 10° to 30° and a radius of curvature of 0.01 mm to 0.5 mm.

7. The multi-terminal multilayer ceramic filter according to claim 5, wherein: the first and second effective electrode pattern regions do not form a third arc-shaped transition section with the corners of the dielectric layer.

8. The multi-terminal multilayer ceramic filter according to claim 5, wherein: the long side direction of the first effective electrode pattern region is the same as the long side direction of the dielectric layer.

9. The multi-terminal multilayer ceramic filter according to claim 8, wherein: the first lead-out section is led out from the long side of the first effective electrode pattern region and extends to the short side edge of the dielectric layer in the short side direction thereof, and the second lead-out section is led out from the long side of the second effective electrode pattern region and extends to the short side edge of the dielectric layer in the short side direction thereof.

10. The chip multiterminal multilayer ceramic filter according to claim 5, characterized in that, the external electrode structure is selected from any one of: a one-layer external electrode structure, a two-layer external electrode structure, a three-layer external electrode structure, a four-layer external electrode structure, a five-layer external electrode structure, and a six-layer external electrode structure.

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