FTTR gateway equipment

Abstract

The utility model belongs to the technical field of gateway equipment, and particularly relates to FTTR gateway equipment, which comprises a shell, a circuit board, a power supply module, a network interface chip and an external interface, an installation cavity is arranged in the shell, the circuit board, the power supply module and the network interface chip are all installed in the installation cavity, and the external interface is arranged in the installation cavity. The power supply module and the network interface chip are connected with the circuit board, the external interface is connected with the network interface chip, the external interface is exposed out of the shell, the shell is defined by a bottom wall, a top wall, a front side wall, a rear side wall, a left side wall and a right side wall, the rear side wall is provided with rear side heat dissipation holes, and the left side wall is provided with rear side heat dissipation holes. The top wall is provided with top heat dissipation holes, the left side wall is provided with left side heat dissipation holes, and the right side wall is provided with right side heat dissipation holes. The temperature rise in the mounting cavity can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to gateway equipment technical field especially relates to a FTTR gateway equipment. BACKGROUND

[0002] The FTTR gateway equipment is used for extending the optical fiber from the communication base station to every corner in the home indoor, thereby providing the high-speed internet access service for the home user.

[0003] The existing FTTR gateway equipment includes the casing, the circuit board, the network interface chip, the wireless local area chip, the storage chip, the security chip and the power module, the circuit board is installed in the casing, the power module, the network interface chip, the wireless local area chip, the storage chip and the security chip are connected on the circuit board, the interface is arranged on the network interface chip, the interface is exposed to the casing, is used for being connected with the optical fiber of outside, the wireless local area network chip is used for providing the wireless network connection, the security chip provides the network security function, and the security chip is used for storing the configuration file, the log and other system data.

[0004] However, the existing FTTR gateway equipment, the heat generated by each chip when working will accumulate in the casing, resulting in the temperature rise in the casing is larger, the service life of FTTR gateway equipment is affected. SUMMARY

[0005] The utility model relates to a FTTR gateway equipment that solves the problem that the heat generated by each chip when working will accumulate in the casing, resulting in the temperature rise in the casing is larger for the existing FTTR gateway equipment.

[0006] To solve the above technical problem, the utility model embodiment provides a FTTR gateway equipment, including casing, circuit board, power module, network interface chip and external interface, be equipped with installation cavity in the casing, the circuit board the power module the network interface chip all are installed in the installation cavity, the power module and the network interface chip are connected with the circuit board, the external interface is connected with the network interface chip, the external interface is exposed to the casing;

[0007] The casing is surrounded by a bottom wall, a top wall, a front side wall, a rear side wall, a left side wall and a right side wall, the rear side wall is provided with a rear side heat dissipation hole, the top wall is provided with a top heat dissipation hole, the left side wall is provided with a left side heat dissipation hole, and the right side wall is provided with a right side heat dissipation hole.

[0008] Optionally, the rear side heat dissipation hole is provided with multiple layers, and the multiple layers of rear side heat dissipation holes are spaced apart on the rear side wall in the up-down direction of the casing. Each layer of rear side heat dissipation holes is provided with a plurality of rear side heat dissipation holes spaced apart in the left-right direction of the casing.

[0009] Optionally, the rear side heat dissipation holes are in an elliptical shape.

[0010] Optionally, the rear side heat dissipation holes of adjacent two layers are staggered in the left-right direction of the shell.

[0011] Optionally, the left side heat dissipation holes are provided in multiple layers, and the left side heat dissipation holes in each layer are arranged in the front-rear direction of the shell.

[0012] The right side heat dissipation holes are provided in multiple layers, and the right side heat dissipation holes in each layer are arranged in the front-rear direction of the shell.

[0013] Optionally, the left side heat dissipation holes are long holes extending in the up-down direction.

[0014] The right side heat dissipation holes are long holes extending in the up-down direction.

[0015] Optionally, the number of layers of the left side heat dissipation holes is the same as that of the right side heat dissipation holes, and the number of the left side heat dissipation holes in each layer of the left side heat dissipation holes is the same as that of the right side heat dissipation holes in each layer of the right side heat dissipation holes.

[0016] Optionally, the top heat dissipation holes are provided in multiple layers, and the top heat dissipation holes in each layer are arranged in the front-rear direction of the shell.

[0017] The top heat dissipation holes are long holes extending in the left-right direction of the shell.

[0018] Optionally, the FTTR gateway device further comprises a heat conduction plate located in the mounting cavity, the heat conduction plate being connected with the circuit board, and the heat conduction plate being used for dissipating the heat generated by the heat generating elements on the circuit board to the outside through the shell.

[0019] Optionally, the heat conduction plate comprises a front plate body and a rear plate body, the front plate body being located between the front side wall and the circuit board, the rear plate body being located between the rear side wall and the circuit board, and the front side wall being connected with the rear plate body.

[0020] According to the FTTR gateway device provided in the embodiment of the present application, the cold air outside the shell can enter the mounting cavity from the rear side heat dissipation holes on the rear side wall, the left side heat dissipation holes of the left side wall and the right side heat dissipation holes of the right side wall, the air entering the mounting cavity is heated by the heat accumulated in the mounting cavity, which leads to the increase of the temperature of the air in the mounting cavity, under the effect of thermal expansion and cold contraction, the hot air in the mounting cavity is heated and expanded, which leads to the decrease of the density, so that the hot air can be discharged from the top heat dissipation holes of the top wall, so that the flowing air flow is formed in the mounting cavity, and the components in the mounting cavity are further cooled, compared with the prior art, the temperature rise in the mounting cavity can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The structure schematic diagram of the FTTR gateway device provided in the embodiment of the present application is shown in the figure.

[0022] Figure 2 The structure schematic diagram of the FTTR gateway device provided in the embodiment of the present application is shown in the figure. Figure 1 The structure schematic diagram of the FTTR gateway device provided in the embodiment of the present application is shown in the figure.

[0023] Figure 3 The structure schematic diagram of the FTTR gateway device provided in the embodiment of the present application is shown in the figure.

[0024] Figure 4 The structure schematic diagram of the FTTR gateway device provided in the embodiment of the present application is shown in the figure. Figure 3 The structure schematic diagram of the FTTR gateway device provided in the embodiment of the present application is shown in the figure.

[0025] Figure 5 The structure schematic diagram of the FTTR gateway device provided in the embodiment of the present application is shown in the figure. Figure 4 The structure schematic diagram of the FTTR gateway device provided in the embodiment of the present application is shown in the figure.

[0026] The reference signs in the specification are as follows: 1, shell; 2, front side wall; 3, rear side wall; 4, rear side heat dissipation hole; 5, bottom wall; 6, top wall; 7, top heat dissipation hole; 8, left side wall; 9, left side heat dissipation hole; 10, support seat; 11, right side wall; 12, right side heat dissipation hole; 13, mounting cavity; 14, circuit board; 15, network interface chip; 16, external interface; 17, heat conduction plate; 18, front side plate body; 19, rear side plate body; 20, second connecting hole; 21, connecting lug; 22, first connecting hole; 23, connecting column; 24, large diameter section; 25, small diameter section; 26, stop step; 27, third connecting hole. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical schemes and beneficial effects solved by the present application more clear and understandable, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0028] As Figures 1 to 5As shown, the utility model embodiment provides a kind of FTTR gateway equipment, including shell 1, circuit board 14, power module (not shown in figure), network interface chip 15 and external interface 16, installation cavity 13 is equipped in the shell 1, the circuit board 14, the power module, the network interface chip 15 are all installed in the installation cavity 13, the power module and the network interface chip 15 are connected with the circuit board 14, the external interface 16 is connected with the network interface chip 15, the external interface 16 is exposed to the shell 1.

[0029] The shell 1 is surrounded by bottom wall 5, top wall 6, front side wall 2, rear side wall 3, left side wall 8 and right side wall 11, the rear side wall 3 is equipped with rear side heat dissipation hole 4, the top wall 6 is equipped with top heat dissipation hole 7, the left side wall 8 is equipped with left side heat dissipation hole 9, and the right side wall 11 is equipped with right side heat dissipation hole 12.

[0030] Specifically, the front, rear, left, right, up and down directions in the figure are only used for convenient description, and do not constitute limitation to the actual use direction of the FTTR gateway equipment. The FTTR gateway equipment further includes various working chips with different functions arranged in the installation cavity 13. Each working chip (not shown in the figure), the circuit board 14, the power module and the network interface chip 15 are all installed in the installation cavity 13. When the FTTR gateway equipment is working, each working chip, the power module and the network interface chip 15 will generate heat. The cold air outside the shell 1 can enter the installation cavity 13 from the rear side heat dissipation hole 4 on the rear side wall 3, the left side heat dissipation hole 9 of the left side wall 8 and the right side heat dissipation hole 12 of the right side wall 11. The air entering the installation cavity 13 will be heated by the heat accumulated in the installation cavity 13, causing the temperature of the air in the installation cavity 13 to rise. Under the action of thermal expansion and contraction, the hot air in the installation cavity 13 expands due to heating, causing the density to decrease, so that it can be discharged from the top heat dissipation hole 7 of the top wall 6 upward, thereby forming a flowing air current in the installation cavity 13, and further cooling each component in the installation cavity 13, thereby reducing the temperature rise in the installation cavity 13.

[0031] In an embodiment, the rear side heat dissipation hole 4 is provided with multiple layers. The multiple layers of rear side heat dissipation holes 4 are spaced apart on the rear side wall 3 in the up-down direction of the shell 1. Each layer of rear side heat dissipation holes 4 is equipped with a plurality of rear side heat dissipation holes 4 spaced apart in the left-right direction of the shell 1.

[0032] Specifically, the plurality of rear side heat dissipation holes 4 are arranged in layers on the rear side wall 3, each layer of the rear side heat dissipation holes 4 is provided with a plurality of rear side heat dissipation holes 4, and the rear side heat dissipation holes 4 in the same layer are arranged in layers, which can increase the number of the rear side heat dissipation holes 4 on the rear side wall 3 and improve the heat dissipation effect. In operation, low-temperature air can also enter the mounting cavity 13 from the lower rear side heat dissipation holes 4, and high-temperature air in the mounting cavity 13 can also be discharged from the upper rear side heat dissipation holes 4.

[0033] In an embodiment, the rear side heat dissipation holes 4 are elliptical, and a plurality of rear side heat dissipation holes 4 of adjacent two layers are staggered along the left-right direction of the shell 1. Specifically, the rear side heat dissipation holes 4 are elliptical, which are small-length hole structures, and the rear side heat dissipation holes 4 between any two adjacent layers are staggered on the rear side wall 3. The staggered arrangement means that the rear side heat dissipation hole 4 of the upper layer is located between the two adjacent rear side heat dissipation holes 4 of the lower layer along the left-right direction of the rear side wall 3, which can make full use of the space of the rear side wall 3 and further increase the number of the rear side heat dissipation holes 4.

[0034] In an embodiment, the plurality of rear side heat dissipation holes 4 further include circular rear side heat dissipation holes 4, and the plurality of circular rear side heat dissipation holes 4 are arranged in layers around the part of the rear side wall 3 where the elliptical rear side heat dissipation holes 4 are arranged.

[0035] In an embodiment, the left side heat dissipation holes 9 are arranged in layers, and the plurality of layers of the left side heat dissipation holes 9 are arranged in layers on the left side wall 8 along the up-down direction of the shell 1, and each layer of the left side heat dissipation holes 9 is provided with a plurality of left side heat dissipation holes 9 arranged in layers along the front-rear direction of the shell 1.

[0036] The right side heat dissipation holes 12 are arranged in layers, and the plurality of layers of the right side heat dissipation holes 12 are arranged in layers on the right side wall 11 along the up-down direction, and each layer of the right side heat dissipation holes 12 is provided with a plurality of right side heat dissipation holes 12 arranged in layers along the front-rear direction of the shell 1.

[0037] Specifically, the plurality of left side heat dissipation holes 9 are arranged in layers on the left side wall 8, each layer of the left side heat dissipation holes 9 is provided with a plurality of left side heat dissipation holes 9, and the left side heat dissipation holes 9 in the same layer are arranged in layers, which can increase the number of the left side heat dissipation holes 9 on the left side wall 8 and improve the heat dissipation effect. In operation, low-temperature air can also enter the mounting cavity 13 from the lower left side heat dissipation holes 9, and high-temperature air in the mounting cavity 13 can also be discharged from the upper left side heat dissipation holes 9.

[0038] The multiple layers of right side heat dissipation holes 12 are arranged on the right side wall 11 in an up-down interval. Each layer of the right side heat dissipation holes 12 is provided with multiple right side heat dissipation holes 12. The right side heat dissipation holes 12 in the same layer are arranged in an interval. The number of the right side heat dissipation holes 12 on the right side wall 11 can be increased, and the heat dissipation effect can be improved. In the working process, the low-temperature air can also enter the installation cavity 13 from the right side heat dissipation holes 12 at the lower part, and the high-temperature air in the installation cavity 13 can also be discharged from the right side heat dissipation holes 12 at the higher part.

[0039] In an embodiment, the left side heat dissipation hole 9 is a long hole, and the left side heat dissipation hole 9 extends in the up-down direction. Specifically, the left side heat dissipation hole 9 is long and has a large length. The left side heat dissipation holes 9 arranged opposite to each other between any adjacent two layers on the left side wall 8 can facilitate the manufacturing and increase the number of the left side heat dissipation holes 9.

[0040] The right side heat dissipation hole 12 is a long hole, and the right side heat dissipation hole 12 extends in the up-down direction. The right side heat dissipation hole 12 is long and has a large length. The right side heat dissipation holes 12 arranged opposite to each other between any adjacent two layers on the right side wall 11 can facilitate the manufacturing and increase the number of the right side heat dissipation holes 12.

[0041] In an embodiment, the number of layers of the left side heat dissipation hole 9 is the same as the number of layers of the right side heat dissipation hole 12. The number of the left side heat dissipation holes 9 in each layer of the left side heat dissipation hole 9 is the same as the number of the right side heat dissipation holes 12 in each layer of the right side heat dissipation hole 12.

[0042] In an embodiment, the top heat dissipation hole 7 is provided with multiple layers. The multiple layers of the top heat dissipation hole 7 are arranged on the top wall 6 in an interval in the front-rear direction of the shell 1. Each layer of the top heat dissipation hole 7 is provided with at least two top heat dissipation holes 7 arranged in an interval. The top heat dissipation hole 7 is a long hole, and the top heat dissipation hole 7 extends in the left-right direction of the shell 1.

[0043] Specifically, the multiple layers of the top heat dissipation hole 7 are arranged on the top wall 6 in an interval in the front-rear direction. Each layer of the top heat dissipation hole 7 is provided with two top heat dissipation holes 7. The two top heat dissipation holes 7 are arranged on the left side and the rear side of the top wall 6, respectively. The number of the top heat dissipation holes 7 on the top wall 6 can be increased. The top heat dissipation hole 7 is long and has a large length. The right side heat dissipation holes 12 arranged opposite to each other between any adjacent two layers on the top wall 6 can facilitate the manufacturing and increase the number of the top heat dissipation holes 7, thereby improving the heat dissipation effect.

[0044] In an embodiment, the FTTR gateway device further comprises a heat conduction plate 17 located in the installation cavity 13. The heat conduction plate 17 is connected with the circuit board 14. The heat conduction plate 17 is used for dissipating the heat generated by the heating elements on the circuit board 14 to the outside through the shell 1.

[0045] The heat-conducting plate 17 comprises a front plate body 18 and a rear plate body 19, the front plate body 18 is located between the front side wall 2 and the circuit board 14, the rear plate body 19 is located between the rear side wall 3 and the circuit board 14, and the front side wall 2 is connected with the rear plate body 19.

[0046] Specifically, the circuit board 14 is bolted with the front side wall 2, the heat-conducting plate 17 comprises the front plate body 18 and the rear plate body 19, the front plate body 18 is located between the circuit board 14 and the front side wall 2, and the side of the front plate body 18 facing the circuit board 14 is in contact with the heat-generating elements on the front plate surface of the circuit board 14, the rear plate body 19 is located between the circuit board 14 and the rear side wall 3, and the side of the rear plate body 19 facing the circuit board 14 is in contact with the heat-generating elements on the rear plate surface of the circuit board 14. The heat-generating elements refer to the power supply module, the network interface chip 15 and various working chips connected with the circuit board 14. In this embodiment, the specific types of the heat-generating elements arranged on the front plate surface and the rear plate surface of the circuit board 14 are not limited.

[0047] The front plate body 18 is provided with a connecting lug 21, the connecting lug 21 is provided with a first connecting hole 22, the circuit board 14 is provided with a second connecting hole 20, the side of the rear plate body 19 facing the circuit board 14 is provided with a connecting column 23, the connecting column 23 comprises a large-diameter section 24 and a small-diameter section 25, the small-diameter section 25 is located between the large-diameter section 24 and the circuit board 14, the small-diameter section 25 is provided with a third connecting hole 27, a stop step 26 is formed between the large-diameter section 24 and the small-diameter section 25, and the first connecting hole 22, the second connecting hole 20 and the third connecting hole 27 are arranged opposite to each other.

[0048] During installation, the small-diameter section 25 is inserted into the second connecting hole 20, the stop step 26 is stopped at the rear side of the circuit board 14, and the connecting lug 21 is stopped at the front side of the circuit board 14. By threading bolts in the first connecting hole 22 and the third connecting hole 27, the circuit board 14 is clamped between the connecting lug 21 and the stop step 26, so as to realize the connection of the front plate body 18, the circuit board 14 and the rear plate body 19. During work, the heat generated by the heat-generating elements is transferred to the front plate body 18 and the rear plate body 19. The arrangement of the front plate body 18 and the rear plate body 19 increases the heat dissipation area. The airflow flowing in the installation cavity 13 can take away the heat on the front plate body 18 and the rear plate body 19, so as to realize heat dissipation.

[0049] In an embodiment, the FTTR gateway device further comprises a support seat 10 connected with the bottom wall 5 for supporting the entire FTTR gateway device.

[0050] The working principle of the FTTR gateway device is as follows: when the FTTR gateway device works, the heat-generating element connected with the circuit board 14 generates heat, the heat is transferred to the front side plate body 18 and the rear side plate body 19, the cold air outside the shell 1 can enter the mounting cavity 13 from the rear side heat dissipation hole 4 at the lower part of the rear side wall 3, the left side heat dissipation hole 9 at the lower part of the left side wall 8 and the right side heat dissipation hole 12 at the lower part of the right side wall 11, the air entering the mounting cavity 13 is heated by the heat accumulated in the mounting cavity 13, so that the temperature of the air in the mounting cavity 13 is increased, under the action of thermal expansion and cold contraction, the hot air in the mounting cavity 13 is heated and expanded, so that the density is reduced, so that the shell 1 can be discharged from the top heat dissipation hole 7 of the top wall 6, the rear side heat dissipation hole 4 at the higher part of the rear side wall 3, the left side heat dissipation hole 9 at the higher part of the left side wall 8 and the right side heat dissipation hole 12 at the higher part of the right side wall 11, so that a flowing air flow is formed in the mounting cavity 13, and then the components in the mounting cavity 13 are cooled, and the temperature rise in the mounting cavity 13 can be reduced.

[0051] According to the FTTR gateway device, the cold air outside the shell 1 can enter the mounting cavity 13 from the rear side heat dissipation hole 4 of the rear side wall 3, the left side heat dissipation hole 9 of the left side wall 8 and the right side heat dissipation hole 12 of the right side wall 11, the air entering the mounting cavity 13 is heated by the heat accumulated in the mounting cavity 13, so that the temperature of the air in the mounting cavity 13 is increased, under the action of thermal expansion and cold contraction, the hot air in the mounting cavity 13 is heated and expanded, so that the density is reduced, so that the shell 1 can be discharged from the top heat dissipation hole 7 of the top wall 6, the rear side heat dissipation hole 4 at the higher part of the rear side wall 3, the left side heat dissipation hole 9 at the higher part of the left side wall 8 and the right side heat dissipation hole 12 at the higher part of the right side wall 11, so that a flowing air flow is formed in the mounting cavity 13, and then the components in the mounting cavity 13 are cooled, and the temperature rise in the mounting cavity 13 can be reduced.

[0052] The above is only a preferred embodiment of the utility model, and is not used to limit the utility model, any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. An FTTR gateway device, characterized by, It includes a shell (1), a circuit board (14), a power module, a network interface chip (15) and an external interface (16), the shell (1) is equipped with an installation cavity (13), the circuit board (14), the power module, the network interface chip (15) are all installed in the installation cavity (13), the power module and the network interface chip (15) are connected with the circuit board (14), the external interface (16) is connected with the network interface chip (15), the external interface (16) is exposed to the shell (1); The shell (1) is surrounded by bottom wall (5), top wall (6), front side wall (2), rear side wall (3), left side wall (8) and right side wall (11), the rear side wall (3) is equipped with rear side heat dissipation hole (4), the top wall (6) is equipped with top heat dissipation hole (7), the left side wall (8) is equipped with left side heat dissipation hole (9), the right side wall (11) is equipped with right side heat dissipation hole (12).

2. The FTTR gateway device of claim 1, wherein, The rear side heat dissipation hole (4) is provided with multiple layers, and multiple rear side heat dissipation holes (4) are distributed on the rear side wall (3) in the up-down direction of the shell (1), and multiple rear side heat dissipation holes (4) are arranged in each layer of the rear side heat dissipation hole (4) in the left-right direction of the shell (1).

3. The FTTR gateway device of claim 2, wherein, The rear side heat dissipation hole (4) is oval.

4. The FTTR gateway device of claim 2, wherein, The multiple rear side heat dissipation holes (4) of adjacent two layers of the rear side heat dissipation hole (4) are staggered arranged in the left-right direction of the shell (1).

5. The FTTR gateway device of claim 1, wherein, The left side heat dissipation hole (9) is provided with multiple layers, and multiple left side heat dissipation holes (9) are distributed on the left side wall (8) in the up-down direction of the shell (1), and multiple left side heat dissipation holes (9) are arranged in each layer of the left side heat dissipation hole (9) in the front-rear direction of the shell (1). The right side heat dissipation hole (12) is provided with multiple layers, and multiple right side heat dissipation holes (12) are distributed on the right side wall (11) in the up-down direction, and multiple right side heat dissipation holes (12) are arranged in each layer of the right side heat dissipation hole (12) in the front-rear direction of the shell (1).

6. The FTTR gateway device of claim 4, wherein, The left side heat dissipation hole (9) is a long hole, and the left side heat dissipation hole (9) extends in the up-down direction. The right side heat dissipation hole (12) is a long hole, and the right side heat dissipation hole (12) extends in the up-down direction.

7. The FTTR gateway device of claim 6, wherein, The number of layers of the left side heat dissipation hole (9) and the number of layers of the right side heat dissipation hole (12) are same, and the number of the left side heat dissipation hole (9) in each layer of the left side heat dissipation hole (9) and the number of the right side heat dissipation hole (12) in each layer of the right side heat dissipation hole (12) are same.

8. The FTTR gateway device of claim 1, wherein, The top heat dissipation hole (7) is provided with multiple layers, and multiple top heat dissipation holes (7) are distributed on the top wall (6) in the front-rear direction of the shell (1), and at least two top heat dissipation holes (7) are arranged in each layer of the top heat dissipation hole (7). The top heat dissipation hole (7) is a long hole, and the top heat dissipation hole (7) extends in the left-right direction of the shell (1).

9. The FTTR gateway device of any of claims 1-3, wherein, The FTTR gateway device further comprises a heat-conducting plate (17) located in the mounting cavity (13), the heat-conducting plate (17) is connected with the circuit board (14), and the heat-conducting plate (17) is used for dissipating heat generated by the heat-generating elements on the circuit board (14) to the outside through the shell (1).

10. The FTTR gateway device of claim 9, wherein, The heat-conducting plate (17) comprises a front plate body (18) and a rear plate body (19), the front plate body (18) is located between the front side wall (2) and the circuit board (14), and the rear plate body (19) is located between the rear side wall (3) and the circuit board (14), and the front side wall (2) is connected with the rear plate body (19).

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