TFT FPC (Thin Film Transistor Flexible Printed Circuit) capable of being flexibly bent
By designing stress dispersion grooves in the bending area of the TFT FPC, the TFT MURA defect caused by springback stress was solved, achieving flexible bending and stable performance.
Patent Information
- Application Number
- CN202423069648.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-12
AI Technical Summary
During the bending process, conventional TFT FPCs are prone to defects such as TFT MURA (spots) due to the large springback stress.
Stress dispersion grooves are designed in the bending area of the TFT FPC, including rectangular and arc-shaped parts. The combination of these parts forms an elliptical stress dispersion groove, which reduces the rigidity of the bending area, improves flexibility, and disperses stress.
It effectively reduces TFT MURA defects caused by stress concentration after bending, improves flexible bending performance, and avoids overall tearing and performance impact.
Smart Images
Figure CN223681255U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to TFT technical field, especially, a kind of TFT FPC of flexible bending can be carried out. BACKGROUND
[0002] Color liquid crystal screen is abbreviated as TFT, which means that each liquid crystal pixel point is driven by thin film transistor integrated behind the pixel point, so that high speed, high brightness, high contrast display screen information can be achieved, it is one of the best LCD color display devices, and its effect is close to CRT display, it is the mainstream display device on notebook computer and desktop computer.
[0003] As Figure 7 As shown, conventional TFT FPC 1-1 needs to be bent to the back of TFT 1-2 during assembly process, and is connected with the connector on the mainboard, since TFT FPC 1-1 has certain rebound stress after bending, if the rebound stress is relatively large, TFT MURA (light spot, etc.) defects are easily caused, therefore, a TFT FPC capable of flexible bending is proposed. UTILITY MODEL CONTENT
[0004] Therefore, it is necessary to provide a TFT FPC capable of flexible bending, a stress dispersion groove is designed at the bending area of TFT FPC, so as to reduce the rigidity of the whole bending area and improve flexibility, so as to reduce the problem of stress concentration causing TFT MURA (light spot, etc.) defects after bending.
[0005] In order to solve the above technical problems, the utility model adopts the following technical scheme:
[0006] A TFT FPC capable of flexible bending, comprising a TFT module, a binding position is arranged at the bottom of the front face of the TFT module, the TFT module is connected with the TFT FPC through the binding position, the end of the TFT FPC has a binding area, a first binding end is arranged on the binding area, and the TFT FPC is bound to the TFT module through the first binding end and the binding position.
[0007] The surface of the TFT FPC is provided with a bending area close to the first binding end, a stress dispersion groove is arranged in the bending area, and the stress dispersion groove can realize the flexibility of the TFT FPC by dispersing stress when the bending area is bent.
[0008] Further, a pin pinout area is arranged in the binding area except the first binding end.
[0009] Further, a wiring area is arranged in the bending area except the stress dispersion groove, and the wiring area and the pin foot wiring leading-out area cooperate to form the pin foot wiring leading-out.
[0010] Further, the stress dispersion groove comprises a rectangular part and arc-shaped parts arranged at both ends of the rectangular part, and the two arc-shaped parts and the rectangular part jointly form an elliptical stress dispersion groove.
[0011] Further, the stress dispersion groove is provided in plurality, and the plurality of stress dispersion grooves are arranged on the bending area at equal intervals.
[0012] Further, the stress dispersion groove is provided in seven.
[0013] Further, the TFT FPC further comprises a leading-out part arranged below the bending area.
[0014] Further, the leading-out part is provided with a second binding end at the end.
[0015] Further, the TFT module comprises upper and lower glass sheets arranged in mutual adhesion, and the outer side of the upper glass sheet is attached with an upper polarizing sheet, and the outer side of the lower glass sheet is attached with a lower polarizing sheet.
[0016] Further, the binding position is arranged at the bottom of the lower glass sheet, and the TFT FPC is bound to the lower glass sheet.
[0017] Compared with the prior art, the TFT FPC provided by the present application has the following beneficial effects:
[0018] The TFT FPC provided by the present application is provided with a stress dispersion groove at the bending area of the TFT FPC, so as to reduce the rigidity of the bending area as a whole, improve the flexibility, and reduce the problem of TFT MURA (light spot) defects caused by high stress after bending.
[0019] Through the design of the rectangular part and the arc-shaped part, the corner of the stress dispersion groove can be processed in a circular arc, so as to disperse the locally concentrated stress after bending, and avoid the problem of overall tearing.
[0020] Through the design of the pin foot wiring leading-out area and the wiring area, the TFT PFC can be arranged in a wiring direction while meeting the requirement of bending and improving the flexibility, and the overall performance is not affected. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 The structure diagram of the TFT FPC provided by the present application is shown in the figure.
[0022] Figure 2 A side view structural schematic diagram of the TFT FPC capable of flexible bending is provided in the utility model.
[0023] Figure 3 A TFT FPC structural schematic diagram of the TFT FPC capable of flexible bending is provided in the utility model.
[0024] Figure 4 A stress dispersion groove structural schematic diagram of the TFT FPC capable of flexible bending is provided in the utility model.
[0025] Figure 5 A rectangular part and arc part structural schematic diagram of the TFT FPC capable of flexible bending is provided in the utility model.
[0026] Figure 6 A stress dispersion groove structural schematic diagram of the TFT FPC capable of flexible bending is provided in the utility model. Figure 2 An enlarged structural schematic diagram of A in the utility model.
[0027] Figure 7 A structural schematic diagram of a conventional TFT FPC in the background technology is provided in the utility model.
[0028] The mark in the drawing is explained as follows:
[0029] TFT module 1, binding position 11, upper sheet glass 12, lower sheet glass 13, upper polaroid 14, lower polaroid 15;
[0030] TFT FPC 2, binding area 21, first binding end 22, bending area 23, pin pinout area 24, wire area 25, lead-out part 26, second binding end 27;
[0031] Stress dispersion groove 3, rectangular part 31, arc part 32. Specific implementation
[0032] In order for the personnel in the technical field to better understand the utility model scheme, the technical scheme in the utility model embodiments will be described clearly and completely in the following by combining the drawings in the utility model embodiments. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the personnel in the field without creative labor should belong to the protection range of the utility model.
[0033] As described in the background technology, as Figure 7As shown, the conventional TFT FPC1-1 needs to be bent to the back of the TFT1-2 during the assembling process, and is connected with the connector on the mainboard, and since the TFT FPC1-1 has a certain rebound stress after being bent, if the rebound stress is relatively large, the TFT MURA (light spot, etc.) defect is easily caused.
[0034] In order to solve the technical problem, the utility model provides a TFT FPC which can be flexibly bent, and is applied to a TFT display screen.
[0035] Specifically, referring to Figures 1-7 , the TFT FPC which can be flexibly bent specifically comprises a TFT module 1, the TFT module 1 is provided with a binding position 11 at the bottom of the front face, the TFT module 1 is connected with a TFT FPC2 through the binding position 11, the end of the TFT FPC2 is provided with a binding area 21, the binding area 21 is provided with a first binding end 22, and the TFT FPC2 is bound to the TFT module 1 through the binding position 11 through the first binding end 22.
[0036] Wherein, the surface of the TFT FPC2 is provided with a bending area 23 close to the first binding end 22, and a stress dispersion groove 3 is arranged in the bending area 23, so that the stress dispersion groove 3 can realize the flexibility of the TFT FPC2 by dispersing stress when the bending area 23 is bent.
[0037] The TFT FPC which can be flexibly bent is provided with the stress dispersion groove 3 at the bending area 23 of the TFT FPC2, so that the rigidity of the bending area 23 as a whole is reduced, the flexibility is improved, and the problem of the TFT MURA (light spot, etc.) defect caused by high stress after bending is reduced.
[0038] In order to make the personnel in the technical field better understand the utility model scheme, the technical scheme in the embodiment of the utility model will be clearly and completely described below in combination with the drawings.
[0039] It should be noted that, in the case of no conflict, the embodiments in the utility model and the features and technical solutions in the embodiments can be combined with each other.
[0040] It should be noted that: similar labels and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0041] Embodiment one
[0042] Please refer to Figures 1-7The application discloses a flexible bending TFT FPC, which comprises a TFT module 1, a binding position 11 is arranged at the bottom of the front face of the TFT module 1, a TFT FPC 2 is connected to the TFT module 1 through the binding position 11, the end of the TFT FPC 2 is provided with a binding area 21, a first binding end 22 is arranged on the binding area 21, and the TFT FPC 2 is bound to the TFT module 1 through the first binding end 22 and the binding position 11.
[0043] As shown in the drawings, Figure 3 The surface of the TFT FPC 2 is provided with a bending area 23 close to the first binding end 22, a stress dispersion groove 3 is arranged in the bending area 23, the bending area 23 can be bent under the action of the stress dispersion groove 3 to realize the flexibility of the TFT FPC 2 by dispersing stress, the actual height of the bending area 23 is designed according to the thickness of the bending of the TFT FPC 2, if the width of the required bending is relatively large, the corresponding height of the bending area 23 also needs to be designed to be higher, and the actual size is adaptively adjusted according to different application scenarios.
[0044] As shown in the drawings, Figure 4 The pin wire leading-out area 24 is arranged in the binding area 21 except the first binding end 22, the design of the pin wire leading-out area 24 can provide the PIN of the first binding end 22 of the TFT FPC 2 with sufficient wire area for the wire of the plurality of PINs of the first binding end 22.
[0045] As shown in the drawings, Figure 4 The wire area 25 is arranged in the bending area 23 except the area of the stress dispersion groove 3, the wire area 25 and the pin wire leading-out area 24 are matched to form the wire leading-out of the pin, the wire area 25 is used for leading out the wire of the PIN through the interval area between the stress dispersion grooves 3, and in the actual design process, a certain interval is left between the wire and the stress dispersion grooves 3 to ensure the application stability of the wire body itself.
[0046] The TFT FPC 2 is further provided with a leading-out part 26 below the bending area 23, the end of the leading-out part 26 is provided with a second binding end 27, after the first binding end 22 of the TFT FPC 2 is bound to the TFT module 1 through the binding area 21, the bending area 23 of the TFT FPC 2 is bent after the TFT FPC 2 is turned over, and then the second binding end 27 is bound and connected to the external mainboard connector.
[0047] In this embodiment, the stress dispersion groove 3 is designed at the bending area 23 of the TFT FPC 2, so as to reduce the rigidity of the bending area 23 as a whole, improve the flexibility, make the bending area more flexible after bending, reduce the stress intensity of the two ends, and disperse the stress to reduce the problem of TFT MURA (light spot, etc.) defects caused by high intensity.
[0048] Embodiment Two
[0049] The TFT FPC provided in Embodiment One is further optimized, and specifically, as shown in Figure 4 The stress dispersion groove 3 includes a rectangular portion 31 and arc-shaped portions 32 distributed at both ends of the rectangular portion 31, and the two arc-shaped portions 32 and the rectangular portion 31 together form an elliptical stress dispersion groove 3.
[0050] As shown in Figure 5 By the cooperation between the arc-shaped portions 32 and the rectangular portion 31, the inner side of the stress dispersion groove 3 as a whole is designed to be smoothly transitioned, so that when local bending is performed, the stress in the area can be effectively dispersed, the softness is met, and the problem of easy tearing caused by excessive stress concentration is avoided, and the binding effect of the TFT FPC 2 is further improved. The size and spacing of the arc-shaped portions 32 should meet the requirements of bending of the bending area 23 without breaking.
[0051] As shown in Figure 5 The stress dispersion groove 3 has a plurality of stress dispersion grooves 3 arranged on the bending area 23 at equal intervals.
[0052] Specifically, the stress dispersion groove 3 used in this embodiment is seven. The purpose of using seven stress dispersion grooves 3 in this embodiment is that, first, there is enough space in the area of the bending area 23 except the stress dispersion groove 3 for the wiring of the PIN pin wiring lead-out area 24 to be led out, so as to ensure the stability of the wiring, but also to ensure that the wiring demand is met, and the problem of easy breaking caused by too narrow spacing between adjacent stress dispersion grooves 3 is avoided, and the effective use area of the TFT FPC 2 in the bending area 23 is reduced to reduce the rigidity as a whole, improve the flexibility, realize that the bending area 23 is more attached after bending, and avoid the problem of TFT MURA (light spot, etc.) defects caused by the high rigidity acting on the TFT module 1.
[0053] When different sizes of TFT FPC 2 are applied, the number of stress dispersion grooves 3 can be reasonably increased or decreased while meeting the above wiring area, and the actual situation is adjusted.
[0054] Embodiment Three
[0055] The TFT FPC provided by the embodiment one or two can be further optimized as follows, Figure 6 As shown in the figure, the TFT module 1 comprises the upper glass 12 and the lower glass 13 which are attached to each other, the outer side of the upper glass 12 is attached with the upper polarizer 14, the outer side of the lower glass 13 is attached with the lower polarizer 15, the binding position 11 is located at the bottom of the lower glass 13, and the TFT FPC 2 is bound to the lower glass 13, since the binding area 21 on the TFT FPC 2 needs to be bound and connected with the binding position 11 on the TFT module 1, the first binding end 22 needs to be designed on the binding area 21, and therefore when the stress dispersion groove 3 is opened, the area for leading out the PIN pin of the first binding end 22 needs to be fully considered, that is, the top of the stress dispersion groove 3 and the lower side of the first binding end 22 need to have enough space for the wire leading.
[0056] The use process of the TFT FPC provided by the embodiment is as follows: the stress dispersion groove 3 is designed on the TFT FPC 2, and a plurality of stress dispersion grooves 3 are reasonably arranged, then the PIN pin on the first binding end 22 is led out through the PIN pin wire leading-out area 24, then the PIN pin is led into the leading-out part 26 through the wire leading area 25, then the first binding end 22 on the TFT FPC 2 is bound to the surface of the binding position 11 on the TFT module 1, the TFT FPC 2 is turned over to make the bending area 23 bend, at this time, the stress of the bending area 23 can be dispersed through the stress dispersion groove 3, and the strength of the area is reduced, then the second binding end 27 is bound to the connector on the mainboard.
[0057] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated, can be mechanical connection, also can be electric connection or each other can communicate, can be direct connection, also can indirectly connect through intermediate medium, can be the communication or the interaction relationship of two elements of two elements, unless another definite limitation. For ordinary skilled in the art, the above terms can be understood according to the specific meaning of the utility model in the specific circumstances.
[0058] Obviously, the above-described embodiments are only a part of the embodiments of the present application, rather than all the embodiments, and the preferred embodiments of the present application are given in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or equivalently replace some of the technical features. Any equivalent structure made by using the content of the present application specification and drawings, directly or indirectly used in other related technical fields, is also within the patent protection scope of the present application.
Claims
1. A TFT FPC capable of flexible bending, comprising a TFT module (1) having a binding position (11) at the bottom of the front face of the TFT module (1), and a TFT FPC (2) connected to the TFT module (1) by the binding position (11), characterized in that, The end of the TFT FPC (2) has a binding area (21), and a first binding end (22) is arranged on the binding area (21), so that the TFT FPC (2) is bound to the TFT module (1) through the binding position (11) through the first binding end (22). The surface of the TFT FPC (2) near the first binding end (22) has a bending area (23), and a stress dispersion groove (3) is arranged in the bending area (23), so that the bending area (23) can realize stress dispersion when bending, and the flexibility of the TFT FPC (2) is realized. 2.The TFT FPC capable of flexible bending according to claim 1, wherein, The pin foot wiring lead-out area (24) is arranged in the binding area (21) except the first binding end (22). 3.The TFT FPC capable of flexible bending according to claim 1, wherein, The wiring area (25) is arranged in the bending area (23) except the area of the stress dispersion groove (3), and the wiring area (25) and the pin foot wiring lead-out area (24) cooperate to form the wiring lead-out of the pin foot.
4. The flexible bendable TFT FPC according to claim 1, wherein, The stress dispersion groove (3) includes a rectangular part (31) and an arc-shaped part (32) distributed at both ends of the rectangular part (31), and the two arc-shaped parts (32) and the rectangular part (31) together form an elliptical stress dispersion groove (3).
5. The flexible bendable TFT FPC according to claim 4, wherein, The stress dispersion groove (3) has a plurality of stress dispersion grooves (3) arranged at equal intervals on the bending area (23).
6. The flexible bendable TFT FPC according to claim 5, wherein, The stress dispersion groove (3) has seven stress dispersion grooves (3).
7. The flexible bendable TFT FPC according to claim 1, wherein, The TFT FPC (2) further has a lead-out part (26) below the bending area (23). 8.The flexible-bendable TFT FPC according to claim 7, wherein, The end of the lead-out part (26) has a second binding end (27). 9.The flexible-bendable TFT FPC according to claim 1, wherein, The TFT module (1) includes an upper glass (12) and a lower glass (13) designed to be attached to each other, and the outer side of the upper glass (12) is attached with an upper polarizing plate (14), and the outer side of the lower glass (13) is attached with a lower polarizing plate (15). 10.The flexible-bendable TFT FPC according to claim 9, wherein, The binding position (11) is located at the bottom of the lower glass (13), and the TFT FPC (2) is bound to the lower glass (13).