Jig and test equipment

Abstract

The embodiment of the utility model provides a jig and test equipment. The jig is suitable for testing a chip module, the chip module comprises a display chip and a back plate suitable for placing the display chip, and the jig comprises a fixing piece suitable for placing the chip module; and the holding piece is connected with the back plate through adsorption force. By adopting the jig disclosed by the embodiment of the invention, the display chip and the holding piece are firmly fixed to ensure normal test and improve the reliability of a test result, meanwhile, the display chip and the holding piece are convenient to disassemble, and the risk that the display chip is damaged due to external force disassembly is avoided.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of display chip testing, and in particular to a jig and a testing device. BACKGROUND

[0002] Display chips need to be tested for various performances before being shipped, and different tests require different sizes of current and different temperature and humidity conditions to be provided to the display chips.

[0003] During the testing process, the display chips are usually fixed on a jig, and the conventional fixing method requires an external force to be applied to the display chips during fixing and dismounting, which can easily cause damage to the display chips. In addition, when the display chips are fixed by an adhesive, impurities in the adhesive can adversely affect the normal operation of the display chips.

[0004] Therefore, there is a need to develop a new jig. CONTENT OF THE INVENTION

[0005] To improve the reliability of the display chip fixing and avoid damage to the display chips during fixing and dismounting, the present disclosure provides a jig suitable for testing a chip module, the chip module comprising a display chip and a back plate, the jig comprising: a holding piece suitable for placing the chip module; the holding piece and the back plate are connected by adsorption force.

[0006] In some embodiments, the holding piece adsorbs the back plate by magnetic force, and the material of the back plate is a magnetic material.

[0007] In some embodiments, the material of the holding piece is a magnetic material.

[0008] In some embodiments, the thermal conductivity coefficient of the material of the holding piece is 5-10 W / (m·K).

[0009] In some embodiments, the material of the holding piece is a neodymium iron boron magnet.

[0010] In some embodiments, a nickel layer is formed on the surface of the neodymium iron boron magnet.

[0011] In some embodiments, the holding piece is an electromagnet assembly, and the jig is provided with an electromagnet power supply interface for supplying power to the electromagnet assembly.

[0012] In some embodiments, the jig further comprises a test circuit board suitable for driving the display chip to work, the test circuit board comprising a placement area for placing the display chip, and the holding piece is arranged in the placement area on the test circuit board.

[0013] In some embodiments, the jig further comprises a heat dissipation member for dissipating heat generated by the display chip during operation, the heat dissipation member comprising a heat dissipation layer disposed on the placement area of the test circuit board, and the holding member is adapted to be placed on the heat dissipation layer.

[0014] In some embodiments, the heat dissipation layer is further disposed on the surface of the other side opposite to the side where the placement area of the test circuit board is located, and a plurality of through holes are provided in the placement area, the through holes penetrating through the test circuit board, and the inner wall of the through holes forms the heat dissipation layer.

[0015] In some embodiments, the heat dissipation member further comprises a heat sink connected to the heat dissipation layer and disposed on the two sides of the test circuit board respectively.

[0016] In some embodiments, the material of the heat dissipation layer is copper or copper alloy.

[0017] In some embodiments, the jig further comprises an extension member adapted to extend the interface on the test circuit board to connect with the display chip.

[0018] In some embodiments, the extension member is made of a flexible circuit board.

[0019] The embodiments of the present disclosure further provide a test device for testing a chip module, the test device comprising: a plurality of any of the above jigs; and at least one adapter plate, each of the adapter plates being provided with a plurality of connection sites adapted to be connected with the jigs, and the adapter plate being provided with a chip driving signal interface for receiving chip driving signals and transmitting the chip driving signals to each of the jigs.

[0020] In some embodiments, the holding member is an electromagnet assembly, and the adapter plate is further provided with an electromagnet driving signal interface for receiving electromagnet driving signals to drive the electromagnet assembly to adsorb the back plate.

[0021] In some embodiments, the test device further comprises a support structure provided with a plurality of mounting sites adapted to fix the jigs.

[0022] In some embodiments, the connection sites are spaced apart to ensure that the spacing between a jig and an adjacent jig in a direction perpendicular to the test circuit board of the jig is greater than 50 mm.

[0023] In some embodiments, the connection sites are spaced apart to ensure that the spacing between a jig and an adjacent jig in a direction parallel to the test circuit board of the jig is greater than 20 mm.

[0024] Compared with the prior art, the technical scheme of the embodiments of the present disclosure has the following beneficial effects:

[0025] The jig of the embodiment of the present disclosure comprises a holding piece suitable for placing a chip module, the holding piece is connected with the back plate of the chip module through adsorption force, so that the display chip is firmly fixed between the holding piece, the display chip fixed in position ensures the normal test and improves the reliability of the test results; since the connection mode of adsorption force is adopted, the connection and disassembly between the chip module and the holding piece are relatively convenient, and no additional force needs to be applied, thereby avoiding the problem that the display chip is easily damaged by force in the conventional installation and disassembly mode.

[0026] Further, the thermal conductivity coefficient of the material of the holding piece is 5-10 W / (m·K), which has good heat conduction performance, so that the heat generated by the display chip during work can be quickly conducted out, preventing the temperature of the display chip from rising to affect the test results, and also avoiding damage or failure of the display chip working in an over-temperature environment.

[0027] Further, the material of the holding piece is a high-temperature-resistant neodymium iron boron magnet, which has stable magnetism and shape when the temperature rises, thereby ensuring the stability of the magnetic adsorption between the holding piece and the back plate, and avoiding the problem that the fixed position of the display chip deviates due to expansion caused by temperature rise; the neodymium iron boron magnet has good heat conduction performance, and the heat generated by the display chip during work can be quickly conducted out, thereby avoiding the influence of high temperature on the test results or damaging the display chip. In addition, the neodymium iron boron magnet as a permanent magnet can be reused, and can be used with different test circuit boards to realize the fixation and heat dissipation of the display chip. BRIEF DESCRIPTION OF DRAWINGS

[0028] Other features and advantages of the present disclosure will be better understood through the following optional embodiments described in detail in conjunction with the drawings, wherein the same reference signs represent the same or similar components, and wherein:

[0029] Figure 1 A structural schematic diagram of a jig according to an embodiment of the present disclosure is shown.

[0030] Figure 2 A structural schematic diagram of a jig according to an embodiment of the present disclosure is shown.

[0031] Figure 3 A partial enlarged schematic diagram of a plurality of through holes on a test circuit board according to an embodiment of the present disclosure is shown.

[0032] Figure 4 A structural schematic diagram of a test device according to an embodiment of the present disclosure is shown.

[0033] Figure 5 A schematic diagram of a support structure provided with a jig according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0034] Embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. In the drawings, the same or similar numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present disclosure, and are not understood as limiting the present disclosure.

[0035] Unless otherwise defined, technical terms or scientific terms used herein should be understood as having the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present disclosure.

[0036] In the process of testing the display chip, the display chip is usually fixed on a jig, so that the light-emitting area of the display chip is fixed in position during testing. On the one hand, the fixation between the display chip and the jig needs to be reliable, so that the position of the display chip does not shift due to factors such as temperature. On the other hand, the display chip needs to be protected from damage during installation and removal. A commonly used fixation method is to use silicone to fix the display chip and the jig. However, the silicone usually contains impurities, which can precipitate with increasing temperature and time, affecting the normal operation of the display chip. In addition, the bonding performance of the silicone gradually decreases with an increase in the number of bonding, and new silicone needs to be replaced at the end of its life, increasing the testing cost. Furthermore, during testing, the temperature of the display chip rises, and the heat is conducted to the silicone, causing the temperature of the silicone to rise and the silicone to easily expand and warp, thereby changing the position and angle of the display chip relative to the jig, and affecting the test results.

[0037] To solve the above problems, the present disclosure provides a jig suitable for testing a chip module, the chip module comprising a display chip and a backboard suitable for placing the display chip, the jig comprising: a holding member suitable for placing the chip module; the holding member and the backboard are connected by adsorption force.

[0038] The jig of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings.

[0039] Figure 1 A structural schematic diagram of a jig according to an embodiment of the present disclosure is shown. Referring to Figure 1The present disclosure provides a jig 1 for testing a chip module 2. The chip module 2 includes a display chip 21 and a backboard 22, and the display chip 21 is adapted to be placed on the backboard 22. The jig 1 includes a holder 11 adapted to place the chip module 2, and the holder 11 and the backboard 22 of the chip module 2 are connected by an adsorption force, so that the display chip 21 and the backboard 22 are fixed to the holder 11.

[0040] The holder 11 and the backboard 22 of the chip module 2 are connected by an adsorption force. In some embodiments, the adsorption force is implemented as magnetic adsorption, such as permanent magnetic adsorption or electromagnetic adsorption, etc.

[0041] In some embodiments, the material of the holder 11 is a magnetic material, and the material of the backboard 22 is a magnetic material. The holder 11 adsorbs the backboard 22 by magnetic force. Since the holder 11 and the backboard 22 are adsorbed by magnetic force, the installation and disassembly of the backboard 22 and the holder 11 are convenient, without the need for additional devices or additional application of force, reducing the operation time of installation and disassembly, and avoiding damage to the display chip 21 caused by additional application of force.

[0042] In some embodiments, the material of the holder 11 is a permanent magnetic material, which will not be consumed during use, has a long service life, and can be reused.

[0043] In some embodiments, the material of the holder 11 is a neodymium iron boron magnet, which has strong magnetic force and will not disappear with temperature rise and time elapse, and can firmly adsorb the backboard 22.

[0044] In some embodiments, the neodymium iron boron magnet is made of neodymium, iron and boron sintered; in some embodiments, the mass fraction of neodymium is 29% to 32.5%, the mass fraction of iron is 63.95% to 68.65%, and the mass fraction of boron is 1.1% to 1.2%.

[0045] In some embodiments, the material of the holder 11 is a neodymium iron boron magnet, and a nickel layer is formed on the surface of the neodymium iron boron magnet to prevent corrosion and ensure stable properties. In this way, no substances are precipitated from the surface of the holder 11 during use, and the holder 11 does not react with substances in the environment to produce additional by-products that affect the test environment or the performance of the display chip 21.

[0046] In some embodiments, the material of the holding member 11 can also be a non-permanent magnetic material, for example, a soft magnetic material; in some embodiments, the holding member 11 is an electromagnet assembly that generates a magnetic field when energized to attract the back plate 22 supporting the display chip 21, and after the test is completed, the holding member 11 is demagnetized to eliminate the attraction between the back plate 22 and the holding member 11, so that the chip module 2 and the jig 1 can be easily separated. In some embodiments, the jig 1 is provided with an electromagnet power supply interface for supplying power to the electromagnet assembly, and the energization control of the electromagnet assembly can be integrated with the energization control of the display chip 21, or controlled independently.

[0047] In some embodiments, the holding member 11 attracts the back plate 22 supporting the display chip 21 by magnetic force, and the connection mode of magnetic attraction is simple to operate and suitable for chip modules 2 of various sizes and specifications. According to the size of the display chip 21 and the back plate 22 of the chip module 2, the size of the holding member 11 is designed to ensure that the magnetic attraction of the holding member 11 to the back plate 22 is sufficient to fix the back plate 22.

[0048] In some embodiments, the holding member 11 is a cuboid structure, and the size of the cuboid structure is (15mm~45mm)*(10mm~30mm)*(0.5mm~1mm). In some embodiments, the surface of the back plate 22 suitable for connecting with the holding member 11 is rectangular, and the size of the rectangle is (3mm~7mm)*(4mm~7mm).

[0049] In some embodiments, one surface of the holding member 11 is in contact with and attracted to the back plate 22. According to the magnetic field line density distribution of the holding member 11, the closer to the holding member 11, the higher the magnetic field line density, so that the back plate 22 and the holding member 11 have strong magnetic attraction and are not easy to fall off.

[0050] In some embodiments, to ensure the holding force of the holding member 11 to the back plate 22 and better heat conduction of the holding member 11, the area of the surface of the holding member 11 in contact with the back plate 22 is 3~10 times the area of the surface of the back plate 22 in contact with the holding member 11.

[0051] In order to improve the overall heat dissipation effect of the jig 1 when the display chip 21 is working, in some embodiments, the material of the holding member 11 has good heat conduction performance, and the thermal conductivity coefficient of the material of the holding member 11 is 5~10 W / (m·K).

[0052] In some embodiments, the material of the holder 11 is a neodymium iron boron magnet, which has good heat conduction performance and can quickly conduct and dissipate the heat generated by the display chip 21 during operation, thereby preventing the temperature of the display chip 21 from rising and affecting the normal operation of the display chip 21; the magnetism and shape of the neodymium iron boron magnet remain stable when the temperature rises, thereby ensuring the stability of the magnetic adsorption between the holder 11 and the chip module 2 and avoiding the problem of position deviation of the display chip 21 due to temperature rise or with the passage of time.

[0053] In order to further improve the overall heat dissipation effect of the jig 1 during operation of the display chip 21, in some embodiments, the material of the back plate 22 for placing the display chip 21 has good heat conduction performance, and the thermal conductivity coefficient of the material of the back plate 22 is 5-10 W / (m·K).

[0054] The jig 1 of the present disclosure can control the volume change rate of the back plate 22 when the temperature rises to prevent the back plate 22 from expanding or warping and causing the position of the display chip 21 to deviate. In some embodiments, the material of the back plate 22 is invar steel, which is a nickel-iron alloy. In some embodiments, the mass fraction of nickel in the invar steel is 36%, the mass fraction of iron is 63.8%, and the mass fraction of carbon is 0.2%. The invar steel has a very low thermal expansion coefficient and can maintain a fixed size within a wide temperature range. At the same time, the invar steel has good heat conduction efficiency and can conduct the heat generated by the display chip 21 during operation to the holder 11 and then conduct it out of the jig, thereby avoiding the problem that the display chip 21 works at a higher temperature and causes inaccurate test results or damages the display chip 21.

[0055] In some embodiments, the jig of the present disclosure further comprises a test circuit board 12, which is adapted to be electrically connected to the display chip 21 to drive the display chip 21 to work. The test circuit board 12 comprises a placement area for placing the display chip 21, and the holder 11 is arranged in the placement area of the test circuit board 12.

[0056] The jig 1 of the present disclosure is connected and fixed with the test circuit board 12, and the fixing method can be selected in various ways, such as adhesive connection, threaded connection, buckle connection, etc. In some embodiments, the holder 11 is fixed with the test circuit board 12 by an adhesive, which can be a heat-conducting glue or a high-temperature-resistant glue, such as double-sided tape, silicone glue, silver glue, etc. In some embodiments, the adhesive can be polyimide glue, Dow Corning silicone glue, or glue containing polyimide and Dow Corning silicone glue.

[0057] In some embodiments, the test circuit board 12 is directly or indirectly connected to a power supply to provide driving signals and power supply for the display chip 21.

[0058] In some embodiments, the test circuit board 12 is a PCBA board.

[0059] In some embodiments, the surface of the test circuit board 12 is provided with at least one interface, and the display chip 21 is adapted to be electrically connected with the interface to receive the current and driving signal transmitted by the test circuit board 12; in some embodiments, the surface of the test circuit board 12 is provided with different interfaces, and the different interfaces can transmit different driving signals to the display chip 21 to drive the display chip 21 to work, so as to match the test conditions of different tests on the display chip 21, and only the display chip 21 needs to be electrically connected with the corresponding interface, so that the corresponding test can be performed without replacing the test circuit board 12, so that the jig 1 has good test compatibility and is suitable for tests on various types of display chips.

[0060] In some embodiments, the surface of the test circuit board 12 is further provided with an electromagnet power supply interface, and when the holding member 11 is an electromagnet assembly, the electromagnet assembly is powered through the electromagnetic power supply interface.

[0061] In some embodiments, one end of the test circuit board 12 is provided with an electrical connection part 18 adapted to be electrically connected with an adapter plate for controlling and transmitting the driving signal, so as to receive the driving signal to drive the display chip 21 to work; in some embodiments, the electrical connection part 18 is plate-shaped and adapted to be clamped with the adapter plate.

[0062] Continuing to refer to Figure 1 In some embodiments, the chip module 2 further includes an electrical connection member 24 and a flexible part 23, the flexible part 23 is electrically connected with the display chip 21 and the electrical connection member 24 respectively, and the electrical connection member 24 is adapted to be electrically connected with the test circuit board 12, and specifically can be electrically connected with the interface on the surface of the test circuit board 12, so that the current and the driving signal are transmitted to the display chip 21 through the electrical connection member 24 and the flexible part 23.

[0063] In some embodiments, the flexible part 23 is a flexible circuit board.

[0064] In order to realize the electrical connection between the jig 1 and various display chips 21, in some embodiments, the jig 1 further includes an extension member 13 adapted to be electrically connected with the interface on the test circuit board 12 and the display chip 21 respectively, and the setting of the extension member 13 enables the display chip 21 to be electrically connected with different interfaces on the test circuit board 21, especially in the case that the chip module 2 cannot be directly connected with the interface far away from the test circuit board 12, so as to rely on the extension member 13 to complete the power supply and transmission of the driving signal from the test circuit board 12 to the chip module 2. In some embodiments, by changing the interface type of the extension member 13, the chip module 2 with different types of electrical connection members 24 can be electrically connected, thereby increasing the compatibility of the jig 1.

[0065] In some embodiments, the extension 13 is a flexible connection. Preferably, the extension 13 is a flexible printed circuit board (FPC).

[0066] In some embodiments, to further enhance the heat dissipation effect of the jig 1, the jig 1 further comprises a heat dissipation member for improving the heat dissipation efficiency for the heat generated by the display chip 21 during operation.

[0067] Figure 2 A structural schematic diagram of a jig according to an embodiment of the present disclosure is shown. Reference is made to Figure 2 In some embodiments, the heat dissipation member of the jig 1 comprises a heat dissipation layer 14 arranged on the surface of the test circuit board 12, and the holder 11 is adapted to be placed on the heat dissipation layer 14, so that heat can be conducted from the holder 11 to the heat dissipation layer 14; the surface of the holder 11 in contact with the heat dissipation layer 14 can be partially or fully in contact with the heat dissipation layer 14.

[0068] In some embodiments, the holder 11 and the heat dissipation layer 14 are connected by an adhesive 15; in some embodiments, the adhesive can be a heat-conducting adhesive, so that the holder 11 and the heat dissipation layer 14 both have good heat conduction efficiency; in some embodiments, the adhesive has high-temperature resistance and stable performance when conducting heat and the temperature rises; in some embodiments, the holder 11 and the heat dissipation layer 14 are connected by a double-sided adhesive tape with high-temperature resistance and good heat conduction performance, such as polyimide adhesive, Dow Corning silicone adhesive, or an adhesive containing polyimide and Dow Corning silicone.

[0069] In some embodiments, the heat dissipation layer 14 is also arranged on the surface of the other side opposite to the side where the placement area 16 of the test circuit board 12 is located.

[0070] Continuing to refer to Figure 2 In some embodiments, the placement area 16 of the test circuit board 12 is provided with a plurality of through holes 141, and the plurality of through holes 141 penetrate the test circuit board 12, and air passing through the through holes 141 is conducive to carrying away heat, thereby improving the heat dissipation performance of the jig 1.

[0071] Figure 3 A partial enlarged schematic diagram of a plurality of through holes on a test circuit board according to an embodiment of the present disclosure is shown. Reference is made to Figure 3 In some embodiments, the inner wall 142 of the through hole 141 is formed with a heat dissipation layer, and the side and the opposite side of the placement area 16 of the test circuit board 12 are both provided with the heat dissipation layer 14, so as to further increase the volume of the heat-conducting material and improve the heat dissipation effect.

[0072] In some embodiments, the heat dissipation member of the jig 1 comprises not only the heat dissipation layer 14 but also a heat sink (not shown in the figure), which is connected to the heat dissipation layer 14 and used to dissipate heat into the air. In some embodiments, the heat sink is arranged on the same side of the test circuit board 12 as the holding member 11. In some embodiments, the heat sink and the holding member 11 are arranged on two opposite sides of the test circuit board 12. The holding member 11 is arranged on the side of the test circuit board 12 where the circuit and the interface are arranged to fix the display chip 21, and the heat sink is arranged on the other side of the test circuit board 12. The heat dissipation layer of the inner wall 142 of the through hole 141 extends to the other side of the test circuit board 12 and is connected to the heat sink. Such an arrangement avoids occupying the area of the side of the test circuit board 21 where the circuit or the interface is arranged, reserves more space for the connection of the holding member 11 and the chip module 2, and can guide the heat out of the other side of the test circuit board 12, which is conducive to controlling the temperature of the display chip 21 on this side of the test circuit board 12. In addition, the heat sink arranged on the other side of the test circuit board 12 can have a larger volume, thereby improving the heat dissipation effect.

[0073] In some embodiments, the heat sink and the test circuit board 12 can be connected by screwing, bonding, snap fitting or the like. In some embodiments, the side of the heat sink close to the test circuit board 12 is provided with a connecting hole, and the test circuit board 12 is provided with a through hole 17 corresponding to the position of the connecting hole of the heat sink. The heat sink and the test circuit board 12 are connected and fixed by screwing or snap fitting.

[0074] In some embodiments, the heat sink comprises a fin structure arranged on the side of the heat sink away from the test circuit board 12. The fin structure comprises a plurality of fins parallel to each other. The fins increase the contact area of the heat sink with the air, thereby improving the heat dissipation effect of the display chip 21. It should be noted that the structure of the heat sink is only illustrative and does not limit the structure of the heat sink.

[0075] In some embodiments, the material of the heat dissipation layer 14 is copper or copper alloy. The material of the heat sink is copper or copper alloy.

[0076] The jig 1 of the embodiments of the present disclosure can be used for various tests of the display chip 21. By changing the power supply and the driving signal input into the test circuit board 12 or electrically connecting the display chip 21 and different interfaces of the test circuit board 12, the temperature and the pressure of the test environment are adjusted according to the test requirements. The jig with the chip module 2 is placed in the test environment, and the power supply is turned on to drive the display chip 21 to work for testing.

[0077] The holding piece 11 of the embodiment of the present disclosure is connected with the back plate 22 on which the display chip 21 is placed through adsorption force to fix the position of the display chip 21 relative to the jig 1 to ensure the accuracy of the test, and the adsorption force connection makes it easy to separate the back plate 22 and the holding piece 11 from each other after the test, avoiding the risk of damage to the display chip 21 by external force, especially avoiding the risk of damage to the light-emitting area of the display chip 21.

[0078] In a specific embodiment, the material of the holding piece 11 is a neodymium iron boron magnet, and the material of the back plate 22 is invar steel. The holding piece 11 has strong magnetic adsorption to the back plate 22, and the connection and disconnection between the two are convenient, avoiding the problem that the display chip is easily damaged by force in the conventional connection and disconnection mode. At the same time, the neodymium iron boron magnet has good high-temperature resistance and heat conduction performance, and still maintains good magnetism and shape and size when the temperature rises, without problems such as thermal expansion or warping that causes the position of the display chip 21 to deviate. The heat generated by the display chip 21 during work can be quickly conducted to the holding piece 11 through the back plate, avoiding the problem that the temperature rise leads to inaccurate test results or even damages or failure of the display chip 21. In addition, the neodymium iron boron magnet as a permanent magnet can be reused and can be used with different test circuit boards 12 to fix and cool the display chip 21. Therefore, the holding piece 11 fixes the display chip 21 in a normal temperature range during work, and is suitable for various tests of the display chip 21.

[0079] The jig 1 of the embodiment of the present disclosure can be used for various tests that require fixing and cooling of the display chip 21. In some embodiments, the jig 1 of the embodiment of the present disclosure can be used for burn-in test of the display chip 21. In some embodiments, the jig 1 of the embodiment of the present disclosure can also be used for constant temperature and humidity test, high temperature test, normal temperature test, low temperature test, high pressure cooking test, cold and hot impact test, vibration and drop test, etc.

[0080] Correspondingly, the embodiment of the present disclosure also provides a test equipment for testing a chip module, which comprises at least one jig of any of the above embodiments, and the jig is not described here again.

[0081] In some embodiments, the test equipment further comprises at least one adapter board, and each adapter board is provided with a plurality of connection sites, which are adapted to be connected with the jig. In some embodiments, the connection sites are connected with the jig one by one. In some embodiments, the connection mode between the jig and the connection site is clamping.

[0082] In some embodiments, the adapter board is provided with a chip driving signal interface to receive chip driving signals and transmit them to each jig. By making one adapter board receive and transmit chip driving signals required by a plurality of jigs connected thereto, the utilization of space is improved.

[0083] In some embodiments, the adapter board is further provided with an electromagnet driving signal interface, and when the holding member is an electromagnet assembly, the adapter board receives an electromagnet driving signal to drive the electromagnet assembly to generate magnetism to adsorb the backboard on which the display chip is placed. By making one adapter board receive and transmit the chip driving signals and the electromagnet driving signals required by the multiple testers connected thereto, there is no need to additionally provide a circuit board for receiving the electromagnet driving, thereby improving the utilization of space.

[0084] In some embodiments, the testing device can include multiple levels of adapter boards to realize the transmission of various driving signals in multiple levels, which can be used for more types of testing and is suitable for the energization and control of the tester in testing when the holding member is a permanent magnet or an electromagnet assembly.

[0085] Figure 4 A structural schematic diagram of a testing device according to an embodiment of the present disclosure is shown. Referring to Figure 4 In some embodiments, the testing device further includes a chamber 3 adapted to accommodate the tester 1 to provide a testing environment for the chip module.

[0086] In some embodiments, according to different testing conditions, the testing environment in the chamber 3 is adjusted, for example, the temperature and pressure in the chamber are adjusted, and the current size and driving signal are adjusted, to match the testing conditions of the corresponding testing, to realize multiple performance tests on the display chip and tests on multiple types of display chips.

[0087] Figure 5 A schematic diagram of a support structure on which the tester is mounted according to an embodiment of the present disclosure is shown. Referring to Figure 5 In some embodiments, the testing device further includes a support structure 4 provided with multiple mounting positions adapted to fix the tester.

[0088] In some embodiments, the support structure 4 is arranged in the chamber 3, and the support structure 4 is used to fix the tester 1 to the mounting position. The tester 1 can be directly connected or indirectly connected to the support structure 4. In some embodiments, the tester 1 is connected to the support structure 4 through clamping connection or fastener connection, etc. In some embodiments, the adapter board is adapted to be mounted to the mounting position of the support structure 4, that is, the tester 1 is fixed to the support structure 4 through the adapter board. In some embodiments, the adapter board is adapted to be connected to the mounting position of the support structure 4 one by one.

[0089] In some embodiments, the support structure 4 can simultaneously fix multiple jigs 1 for testing, improving the testing efficiency, and each jig 1 can achieve firm and detachable fixation of the display chip and good heat dissipation performance, so that the display chip is fixed in position during testing, avoiding the influence of high temperature on testing or damaging the display chip, and improving the reliability of the test results. In some embodiments, the mounting positions of the support structure 4 are arranged in an array.

[0090] In order to ensure good heat dissipation between multiple jigs 1, a certain gap can be set between adjacent jigs 1, which can be achieved by setting a gap between the mounting positions of the support structure 4 and / or a gap between adjacent connecting positions of the adapter plate, so as to facilitate heat dissipation and prevent heat accumulation from causing the display chip to be in a high-temperature environment. In some embodiments, the gap between one jig and the adjacent jig in the direction perpendicular to the test circuit board of the jig is greater than 50 mm; in some embodiments, the gap between one jig and the adjacent jig in the direction parallel to the test circuit board of the jig is greater than 20 mm.

[0091] The test equipment of the embodiments of the present disclosure can be used for various tests on the chip. By changing the power supply and driving signal of the input circuit board, the temperature and pressure of the test environment in the chamber are adjusted to change the test conditions and perform corresponding tests. In some embodiments, the test equipment is used for aging test of the display chip; in some embodiments, the test equipment is used for constant temperature and humidity test, high temperature test, normal temperature test, low temperature test, high pressure cooking test, cold and hot impact test, vibration and drop test, etc.

[0092] Preferably, the chip module 2 provided in the present application is a Micro LED display panel. In the Micro LED display panel, each display chip 21 has a size of not more than 1 cm, preferably not more than 20 microns. The display chip 21 includes a plurality of arrayed Micro LED structures, and the resolution is 720x480, 640x480, 1920x1080, 1280x720, 2k or 4k. The diameter of the Micro LED structure is nanoscale, such as 20nm-100nm.

[0093] The display chip 21 includes a driving backplane and a Micro LED array. The Micro LED array includes a plurality of Micro LED structures. Each Micro LED structure can form a pixel on a Micro LED chip.

[0094] In some embodiments, the driving backplane can be electrically connected to each Micro LED structure of the Micro LED array by a separate metal interconnection. In some embodiments, each Micro LED can be individually driven and controlled by the driving backplane. In some embodiments, the driving backplane can be electrically connected to the electrodes of the Micro LED chip by a metal interconnection. In some embodiments, a dielectric layer is formed in the gap between adjacent Micro LEDs.

[0095] In some embodiments, each Micro LED structure of the Micro LED array can include a micro-mesa structure. In some embodiments, the micro-mesa structure can include, from bottom to top, a first type of epitaxial layer, a light emitting layer, and a second type of epitaxial layer. That is, among the three layers, the first type of epitaxial layer is closest to the driving backplane; the light emitting layer is on top of the first type of epitaxial layer and away from the driving backplane; and the second type of epitaxial layer is on top of the light emitting layer and is farthest from the driving backplane. In some embodiments, the light emitting layer is composed of a plurality of stacked quantum well layers, in particular, superlattice stacked quantum well layers. Preferably, the superlattice of the stacked quantum well layers includes a plurality of pairs of quantum well layers stacked with quantum barrier layers. In some embodiments, the first type of epitaxial layer is a semiconductor material with a first conductivity type and includes a number of semiconductor layers. The bulk material of the first type of epitaxial layer can be composed of, but is not limited to, Ga, N, As, P, In, or Al base materials, etc.

[0096] In addition, the first type of epitaxial layer can include, from top to bottom, but not limited to, a waveguide layer, a confinement layer, a transition layer, and a window layer; in addition, an ohmic contact layer can be formed under the window layer. In some embodiments, the second type of epitaxial layer is a semiconductor material with a second conductivity type and includes a number of semiconductor layers. The bulk material of the second type of epitaxial layer can be composed of, but is not limited to, Ga, N, As, P, In, or Al base materials, etc. In addition, the first type of epitaxial layer can include, from top to bottom, but not limited to, a confinement layer and a waveguide layer; in addition, an ohmic contact layer can be formed on the confinement layer in some embodiments.

[0097] In some embodiments, a top conductive layer can be formed on the top surface of the Micro LED array. In some embodiments, the top conductive layer can be shared by all Micro LED structures in the Micro LED array. In some embodiments, the light emitting layer can include at least one quantum well layer. In some embodiments, the Micro LED array can include single-layer Micro LED structures. In some embodiments, the Micro LED array can include multi-layer vertically stacked Micro LED structures.

[0098] In some embodiments, the Micro LED array can include blue Micro LEDs. In some embodiments, the pitch of the Micro LED array, i.e., the minimum center-to-center distance between the Micro LEDs, can range from about 2 pm to about 50 pm. In some embodiments, the number of pixels in a Micro LED chip can range from several thousands to several million or more.

[0099] The driving backplane can obtain signals such as image data from the outside world, and can control the corresponding Micro LED structure to emit light or not to emit light. The driving backplane is a TFT (Thin Film Transistor) plate or an IC (Integrated Circuit) plate. For example, the driving backplate of the micro display panel described above has a frame buffer, a column driving circuit, and a row driving circuit integrated therein. The frame buffer includes a first pixel storage area, and the Micro LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of the frame buffer to the second pixel storage area of the Micro LED array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different gray scales. When driving the plurality of Micro LED pixels in the Micro LED array, either a single pixel independent driving mode or a plurality of pixel unit independent driving mode can be adopted, and the specific driving mode should not be considered as a limitation to the present application.

[0100] The above description is only exemplary embodiments adopted for explaining the principles of the present disclosure, and is not intended to limit the protection scope of the present disclosure. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also within the protection scope of the present disclosure.

Claims

1. A fixture adapted to test a chip module, the chip module comprising a display chip and a backplane adapted to hold the display chip, wherein, The tool comprises: a holding member adapted to hold the chip module; the holding member and the back plate are connected by adsorption force.

2. The jig of claim 1, wherein The holding member adsorbs the back plate by magnetic force, and the material of the back plate is magnetic material.

3. The jig of claim 2, wherein The material of the holding member is magnetic material.

4. The jig of claim 2, wherein The thermal conductivity coefficient of the material of the holding member is 5-10 W / (m·K).

5. The jig of claim 2, wherein The material of the holding member is neodymium iron boron magnet.

6. The jig of claim 5, wherein, The surface of the neodymium iron boron magnet is formed with a nickel layer.

7. The tool of claim 2, wherein The holding member is an electromagnet assembly, and the tool is provided with an electromagnet power supply interface for supplying power to the electromagnet assembly.

8. The tool of claim 1, wherein, The tool further comprises a test circuit board adapted to drive the display chip to work, the test circuit board comprising a placement area for placing the display chip, and the holding member is arranged in the placement area on the test circuit board.

9. The tool of claim 8, wherein, The tool further comprises a heat dissipation member for dissipating heat generated by the display chip when working, and the heat dissipation member comprises a heat dissipation layer arranged in the placement area of the test circuit board, and the holding member is adapted to be placed on the heat dissipation layer.

10. The tool of claim 9, wherein, The heat dissipation layer is further arranged on the surface of the other side opposite to the side where the placement area of the test circuit board is located, a plurality of through holes are arranged in the placement area, the plurality of through holes penetrate the test circuit board, and the inner wall of the through hole is formed with the heat dissipation layer.

11. The tool of claim 10, wherein, The heat dissipation member further comprises a heat sink connected with the heat dissipation layer and arranged on both sides of the test circuit board respectively.

12. The tool of any one of claims 9 to 11, wherein, The material of the heat dissipation layer is copper or copper alloy.

13. The tool of claim 8, wherein, Further comprising: an extension member adapted to extend the interface on the test circuit board to connect with the display chip.

14. The tool of claim 13, wherein, The extension member is prepared by flexible circuit board.

15. A test apparatus for testing a chip module, characterized by comprising: Comprising: a plurality of tools according to any one of claims 1-14; at least one adapter plate, each adapter plate being provided with a plurality of connection sites adapted to connect with the tools, and the adapter plate being provided with a chip driving signal interface for receiving chip driving signals and transmitting the chip driving signals to each tool.

16. The test apparatus of claim 15, wherein, The holding member is an electromagnet assembly, and the adapter plate is further provided with an electromagnet driving signal interface for receiving electromagnet signals to drive the electromagnet assembly to adsorb the back plate.

17. The test apparatus of claim 15, wherein, Further comprising: a support structure provided with a plurality of mounting sites adapted to fix the tools.

18. The test apparatus of claim 15, wherein, The adjacent connection sites have a spacing to ensure that the spacing between a tool and an adjacent tool in the direction perpendicular to the test circuit board of the tool is greater than 50 mm.

19. The test apparatus of claim 15, wherein, The adjacent connection sites have a spacing to ensure that the spacing between a tool and an adjacent tool in the direction parallel to the test circuit board of the tool is greater than 20 mm.

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