Jig for copper deposition of circuit board

Abstract

The utility model relates to a jig for copper deposition of a circuit board, which comprises a substrate, the substrate is provided with a first through hole, a boss is formed on the side wall of the first through hole, the boss is used for placing the circuit board to be subjected to copper deposition, at least one fixing structure is arranged adjacent to the first through hole, the fixing structure comprises a rotating shaft and a fixing part, and the rotating shaft and the fixing part are arranged on the substrate. And the fixing part can rotate around the rotating shaft so as to fix the circuit board on the boss. According to the utility model, the stability of the circuit board in the copper deposition process can be improved, and the problem of non-uniform copper deposition caused by displacement or deformation is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board copper deposition technical field, specifically, a kind of jig for circuit board copper deposition. BACKGROUND

[0002] In the circuit board manufacturing industry, copper deposition process is one of the key steps to ensure the conductivity and reliability of circuit board. In the traditional copper deposition process, the circuit board is usually directly placed in the copper deposition tank, and the copper layer is deposited on the surface of the circuit board by chemical method. However, this direct placement method is easy to cause the circuit board to move or deform in the copper deposition liquid, resulting in uneven copper deposition, affecting the conductivity and reliability of the circuit board. SUMMARY

[0003] The utility model aims at providing a kind of jig for circuit board copper deposition, improve the stability of circuit board in the process of copper deposition, avoid the problem of uneven copper deposition caused by displacement or deformation.

[0004] A kind of jig for circuit board copper deposition, including substrate, the substrate is equipped with first through-hole, the side wall of the first through-hole is formed with boss, the boss is used to place the circuit board to be deposited, the first through-hole is equipped with at least one fixed structure adjacent, the fixed structure includes shaft and fixed part, the fixed part can rotate around the shaft, to fix the circuit board on the boss.

[0005] In the above technical solution, the boss formed on the side wall of the first through-hole provides a stable placement platform for the circuit board, and the first through-hole allows the chemical solution in the copper deposition process to pass through to ensure that the circuit board can be uniformly subjected to copper deposition treatment. The first through-hole is equipped with at least one fixed structure adjacent, and the fixed structure includes shaft and fixed part. The shaft serves as the rotation center of the fixed part, allowing the fixed part to rotate within a certain range. When the circuit board is placed on the boss, the fixed part can be rotated to make the fixed part abut against the circuit board, ensuring that the circuit board can be firmly fixed on the boss. Using this jig can improve the stability of the circuit board in the copper deposition process, avoiding the problem of uneven copper deposition caused by displacement or deformation.

[0006] Further, the size of the boss matches the size of the circuit board.

[0007] In the above technical solution, the design of matching the size of the boss with the size of the circuit board ensures that the circuit board will not be displaced or shaken due to external force (such as impact force generated by liquid flow) during copper deposition, which helps to improve the uniformity and consistency of copper deposition.

[0008] Further, the rotation angle of the fixed part is less than or equal to 180°.

[0009] In the above technical solution, the fixed part rotates through the rotating shaft, and the rotating angle is limited within 180°, so that the fixed part can firmly clamp the circuit board.

[0010] Further, one end of the fixed part is provided with a buckle, and the substrate is provided with a clamping groove, and the buckle can extend into the clamping groove.

[0011] In the above technical solution, the cooperation of the buckle and the clamping groove provides an additional locking mechanism for the fixed part. When the fixed part rotates to the preset position, the buckle can extend into the clamping groove on the substrate, avoiding the movement of the fixed part, and significantly enhancing the stability of the circuit board during the copper plating process.

[0012] Further, the thickness of the substrate is 1.5mm-5mm.

[0013] In the above technical solution, the thickness of the substrate is between 1.5mm and 5mm, which can ensure that the substrate has sufficient strength and rigidity to support and fix the circuit board, preventing deformation or damage due to external force (such as impact force generated by liquid flow) during the copper plating process.

[0014] Further, the first through hole is rectangular.

[0015] In the above technical solution, the rectangular first through hole is easier to process and manufacture. Using standard mechanical processing equipment and technology, the rectangular first through hole can be quickly cut, thereby improving manufacturing efficiency and reducing production cost.

[0016] Further, the substrate is also provided with a plurality of second through holes with the same diameter.

[0017] In the above technical solution, the second through hole not only helps to reduce the weight of the jig, but also can be used as a flow channel for the copper plating liquid, improving the copper plating efficiency.

[0018] Further, the second through holes are uniformly distributed on the substrate.

[0019] In the above technical solution, the uniform distribution of the second through holes makes the flow of the copper plating liquid on the substrate more uniform and stable, which helps to improve the quality and repeatability of the copper plating process

[0020] Compared with the prior art, the utility model discloses the beneficial effect is: the boss formed on the side wall of first through -hole provides a stable placement platform for circuit board, and first through -hole can allow the chemical solution in the copper deposition process to pass through to ensure that the circuit board can evenly receive the copper deposition treatment. First through -hole is equipped with at least one fixed structure adjacently, and the fixed structure includes the pivot and the fixed part, and the pivot is as the rotation center of fixed part, and allows fixed part to rotate in a certain range, when circuit board is placed to the boss, can rotate fixed part to make fixed part and circuit board abut, ensure that circuit board can be firmly fixed on the boss. Use this tool, can improve the stability of circuit board in the copper deposition process, avoided the problem of uneven copper deposition caused by displacement or deformation. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the structural schematic diagram of the tool for the circuit board copper deposition of the utility model embodiment.

[0022] Figure 2 It is another structural schematic diagram of the tool for the circuit board copper deposition of the utility model embodiment.

[0023] Figure 3 It is the structural schematic diagram of fixed part of the utility model embodiment.

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 1, base plate;101, first through -hole;1011, boss;102, clamping groove;103, second through -hole;

[0026] 2, fixed structure;201, pivot;202, fixed part;2021, buckle. DETAILED DESCRIPTION

[0027] The tool for the circuit board copper deposition of the utility model will be described further in detail below in conjunction with specific embodiments and drawings. The preferred embodiment of the utility model is given in the drawings. However, the utility model can be realized in many different forms, and is not limited to the embodiments described herein.

[0028] Please refer to Figure 1 And Figure 2 , in a preferred embodiment, the tool for the circuit board copper deposition of the utility model, including base plate 1, base plate 1 is equipped with first through -hole 101, and the side wall of first through -hole 101 is formed with boss 1011, and boss 1011 is used to place the circuit board to be deposited with copper, and first through -hole 101 is equipped with at least one fixed structure 2 adjacently, and fixed structure 2 includes pivot 201 and fixed part 202, and fixed part 202 can rotate around pivot 201 to fix the circuit board on boss 1011.

[0029] Specifically, the boss 1011 formed on the sidewall of the first through hole 101 provides a stable placement platform for the circuit board, and the first through hole 101 can allow the chemical solution in the copper plating process to pass through to ensure that the circuit board can uniformly receive the copper plating treatment. The first through hole 101 is provided with at least one fixing structure 2 adjacent to the first through hole 101, and the fixing structure 2 comprises a rotating shaft 201 and a fixing portion 202, the rotating shaft 201 serving as the rotation center of the fixing portion 202, allowing the fixing portion 202 to rotate within a certain range. When the circuit board is placed on the boss 1011, the fixing portion 202 can be rotated so that the fixing portion 202 abuts against the circuit board, ensuring that the circuit board can be firmly fixed on the boss 1011. Using this jig, the stability of the circuit board during the copper plating process can be improved, and the problem of uneven copper plating caused by displacement or deformation can be avoided.

[0030] When using the jig, first, the circuit board to be plated with copper needs to be placed on the boss 1011, and then the position and angle of the fixing portion 202 are adjusted to firmly fix the circuit board on the boss 1011. Next, the jig can be placed in the copper plating equipment for copper plating. The jig of the present application can well fix the circuit board, and ensure that the circuit board is not affected by factors such as air swing and power in the copper plating equipment. The circuit board is very convenient to take and place, the operation is simple, the production efficiency is high, and the cost is low.

[0031] It should be noted that the circuit board of the present application can be a finished product or a scrap circuit board. For example, the substrate 1 of the present application uses a copper-free substrate, and then a drill is used to drill the first through hole 101 and the boss 1011 on the copper-free substrate; then a scrap board after drilling is selected, and a plurality of test boards are drilled from the scrap board for standby. After installing the test board on the jig, the jig is set in the copper plating device, and after the copper plating is completed, the test board is taken out for slicing and sampling, and then the sample board is placed in the observation equipment for observation to determine the backlight level data. The use of scrap boards can reduce the loss of scrap boards caused by backlight slicing, reduce unnecessary loss of manufacturing materials, and improve the profit rate of the company.

[0032] In actual use, the size of the boss 1011 matches the size of the circuit board. The design that the size of the boss 1011 matches the size of the circuit board ensures that the circuit board will not be displaced or shaken due to external forces (such as impact force generated by liquid flow) during the copper plating process, which helps to improve the uniformity and consistency of the copper plating. That is, the size of the boss 1011 matches the size of the circuit board, so that the circuit board is tightly attached to the boss 1011 and will not shake or displace due to size mismatch.

[0033] In some embodiments of the present application, the rotation angle of the fixed part 202 is less than or equal to 180°. The fixed part 202 is rotated by the rotating shaft 201, and the rotation angle is limited within 180° to ensure that the fixed part 202 can firmly clamp the circuit board.

[0034] Please refer to Figure 3 One end of the fixed part 202 is provided with a buckle 2021, and the base plate 1 is provided with a clamping groove 102, and the buckle 2021 can extend into the clamping groove 102. The cooperation of the buckle 2021 and the clamping groove 102 provides an additional locking mechanism for the fixed part 202. When the fixed part 202 is rotated to the preset position, the buckle 2021 can extend into the clamping groove 102 on the base plate 1, avoiding the movement of the fixed part 202, and significantly enhancing the stability of the circuit board during the copper plating process. In some embodiments of the present application, the clamping groove 102 is parallel to one of the edges of the boss 1011, that is, when the fixed part 202 is rotated by 180°, the buckle 2021 can extend into the clamping groove 102.

[0035] In some embodiments of the present application, the thickness of the base plate 1 is 1.5mm-5mm. The thickness of the base plate 1 is between 1.5mm and 5mm, which can ensure that the base plate 1 has sufficient strength and rigidity to support and fix the circuit board, preventing deformation or damage due to external force (such as impact force generated by liquid flow) during the copper plating process. Of course, appropriate size can also be selected independently, and this paper will not be described in detail.

[0036] Please refer to Figure 1 The first through hole 101 is rectangular. The rectangular first through hole 101 is easier to process and manufacture. Using standard mechanical processing equipment and technology, the rectangular first through hole 101 can be quickly cut, thereby improving manufacturing efficiency and reducing production cost.

[0037] Further, the base plate 1 is also provided with a plurality of second through holes 103 of the same diameter. The second through hole 103 not only helps to reduce the weight of the jig, but also can be used as a flow channel for the copper plating liquid, improving the copper plating efficiency.

[0038] Specifically, the second through holes 103 are uniformly distributed on the base plate 1. The uniform distribution of the second through holes 103 makes the flow of the copper plating liquid on the base plate 1 more uniform and stable, which helps to improve the quality and repeatability of the copper plating process.

[0039] In the description of the utility model, it is understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0040] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0041] In the utility model, unless otherwise expressly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or integrated; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium; can be the communication or interaction relationship between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0042] Although the description of the utility model is combined with the above specific embodiments, it is obvious that many substitutions, modifications and changes can be made according to the above content for the person skilled in the art. Therefore, all such substitutions, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. A fixture for copper plating on circuit boards, characterized in that, The application relates to a substrate provided with a first through hole, a boss formed on the sidewall of the first through hole, the boss being used for placing a circuit board to be copper-plated, at least one fixing structure being provided adjacent to the first through hole, the fixing structure comprising a rotating shaft and a fixing part, the fixing part being rotatable around the rotating shaft to fix the circuit board on the boss.

2. The jig for copper plating of a circuit board according to claim 1, wherein The boss has a size matching that of the circuit board.

3. The jig for copper plating of a circuit board according to Claim 1, wherein The rotating angle of the fixing part is less than or equal to 180 DEG.

4. The jig for copper plating of a circuit board according to Claim 1, wherein One end of the fixing part is provided with a buckle, and the substrate is provided with a clamping groove, the buckle being capable of extending into the clamping groove.

5. The jig for copper plating of a circuit board according to Claim 1, wherein The thickness of the substrate is 1.5-5 mm.

6. The jig for copper plating of a circuit board according to Claim 1, wherein The first through hole is rectangular.

7. The jig for copper plating of a circuit board according to Claim 1, wherein The substrate is further provided with a plurality of second through holes with the same diameter.

8. The circuit board copper plating jig according to claim 7, wherein The second through holes are uniformly distributed on the substrate.

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